CN218087870U - Compatible silicon wafer conveying device and detection device - Google Patents
Compatible silicon wafer conveying device and detection device Download PDFInfo
- Publication number
- CN218087870U CN218087870U CN202221753842.0U CN202221753842U CN218087870U CN 218087870 U CN218087870 U CN 218087870U CN 202221753842 U CN202221753842 U CN 202221753842U CN 218087870 U CN218087870 U CN 218087870U
- Authority
- CN
- China
- Prior art keywords
- conveying belt
- adjusting
- conveying
- support plate
- detection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model discloses a compatible silicon chip conveyor and detection device, compatible silicon chip conveyor include transport structure, guide structure and bearing structure, wherein: the conveying structure comprises a supporting plate and a conveying belt, the supporting plate is arranged on the supporting structure, and the supporting plate is used for supporting the conveying surface of the conveying belt; the guide structure is arranged on the support structure and located below the support plate, the conveying belt winds the warp support plate and the guide structure to form a closed loop, an accommodating space is formed between the support plate and the conveying belt of the winding guide structure and used for accommodating detection equipment, and the detection equipment is used for irradiating laser beams onto silicon wafers borne on the conveying belt. The accommodating space is formed by winding the conveying belt around the guide structure, so that laser beams of detection equipment can be avoided from the lower side of the conveying belt, and detection on silicon wafers of different sizes is facilitated. The detection device comprises a silicon wafer detection mechanism, and the transverse position of the detection assembly can be adjusted through the adjusting mechanism, so that the detection device is convenient to adapt to detection work of silicon wafers with different sizes.
Description
Technical Field
The utility model belongs to the technical field of the battery is made, especially, relate to a compatible silicon chip conveyor and detection device.
Background
With the continuous change of the silicon wafer size, the whole wafer size on the market has different sizes such as 166mm, 182mm, 210mm and 230mm, and with the continuous rich and diversified silicon wafer sizes and the appearance of multi-piece such as half silicon wafers and three-part silicon wafers, the current silicon wafer conveying device can not be compatible with the silicon wafers with different sizes when the thickness of the silicon wafers is detected.
In the prior art, only two belts corresponding to thickness detection are provided, but when the belts are compatible to multiple slices to a whole slice, the installation density of the conveying belt is compact under the condition of setting four belts, and a laser path emitted by a laser of detection equipment can be blocked, so that laser can not normally reach the surface of a silicon wafer, and the detection result is influenced.
SUMMERY OF THE UTILITY MODEL
In order to solve the problems in the related art, the application provides a compatible silicon wafer conveying device and detection device which can not generate interference on laser emitted by a laser in a compact installation mode.
The technical scheme is as follows:
in a first aspect, the present application provides a compatible silicon wafer conveying device, which includes a conveying structure, a guiding structure and a supporting structure, wherein: the conveying structure comprises a supporting plate and a conveying belt, the supporting plate is arranged on the supporting structure, and the supporting plate is used for supporting the conveying surface of the conveying belt; the guide structure is installed on the support structure and located below the support plate, the conveying belt winds the warp support plate and the guide structure to form a closed loop, an accommodating space is formed between the support plate and the conveying belt of the winding guide structure and used for accommodating detection equipment, and the detection equipment is used for hitting laser beams onto silicon wafers borne on the conveying belt.
The accommodating space is formed by winding the conveying belt through the guide structure, so that the laser beam of the detection equipment can be avoided below the conveying belt, and the detection of silicon wafers with different sizes is facilitated.
Optionally, the conveyer belt includes first conveyer belt, second conveyer belt, third conveyer belt and fourth conveyer belt, wherein: the third conveyer belt, the first conveyer belt, the second conveyer belt and the fourth conveyer belt are arranged in parallel at intervals; the first conveying belt and the second conveying belt are configured to convey first-type silicon wafers, and the side length of each first-type silicon wafer along the conveying direction is larger than that of each first-type silicon wafer perpendicular to the conveying direction; the third conveyor belt and the fourth conveyor belt are configured to convey a second type of silicon wafer, and the side length of the second type of silicon wafer in the conveying direction is less than or equal to the side length perpendicular to the conveying direction.
The silicon wafers with various sizes can be adapted to the multiple groups of parallel conveying belts, and when the silicon wafers with different sizes and specifications are compatible, different conveying belts can be selected to be combined to complete conveying of the silicon wafers.
Optionally, the guiding structure includes a first guiding wheel, a second guiding wheel, a third guiding wheel and a fourth guiding wheel, wherein: the first guide wheel and the second guide wheel are arranged below the support plate in the opposite direction; the third guide wheel is arranged below the first guide wheel in an inclined manner, and the fourth guide wheel is arranged below the second guide wheel in an inclined manner; the conveying belt sequentially passes through the first guide wheel, the third guide wheel, the fourth guide wheel and the second guide wheel; an accommodating space is formed between the supporting plate and the conveying belt which passes around the first guide wheel, the third guide wheel, the fourth guide wheel and the second guide wheel; the containing space is arranged below the conveying surface of the conveying belt.
The conveying belts are guided to avoid the supporting plates through the multiple groups of guide wheels, accommodating spaces are formed for accommodating detection equipment, and the conveying belts are prevented from blocking detected laser light paths.
Optionally, be provided with in the backup pad and dodge the groove, wherein: the avoidance groove is formed along the laser light path direction of the laser beam, and the laser beam enters the avoidance groove from the first end of the avoidance groove and strikes the silicon wafer borne on the conveying belt from the second end of the avoidance groove.
The avoidance groove is arranged to form an avoidance area on the support plate, so that the situation that the too thick part of the support plate blocks a laser light path for detection is avoided.
Optionally, in a direction from the first end of the avoidance groove to the second end of the avoidance groove, the size of the notch of the avoidance groove gradually increases.
The avoidance groove can increase avoidance space by adopting the structure, and meanwhile, the avoidance groove is convenient to arrange and process.
Optionally, the support plate includes a first support plate and a second support plate, and the first support plate and the second support plate are located on the same horizontal plane; the supporting structure is provided with an adjusting frame, the adjusting frame is provided with an adjusting wheel capable of adjusting the installation position, and the conveying belt is wound around the adjusting wheel; the second support plate may be mounted toward or away from the first support plate, or the second support plate may be movable toward or away from the first support plate to change the length of the conveying face of the conveyor belt; the adjusting wheel is used for compensating the length variation of the conveying surface of the conveying belt.
The length of the conveying surface of the conveying belt is changed by adjusting the distance between the first supporting plate and the second supporting plate, and the length of the conveying surface can be correspondingly extended or contracted according to the size of the conveyed silicon wafer, so that the conveying belt can be better connected with the subsequent equipment.
Optionally, the compatible silicon wafer conveying device further comprises a fixed support plate, a first adjusting support plate and a second adjusting support plate, the first adjusting support plate and the second adjusting support plate are respectively arranged on two sides of the fixed support plate, the first conveying belt and the second conveying belt are mounted on the fixed support plate, the third conveying belt is mounted on the first adjusting support plate, and the fourth conveying belt is mounted on the second adjusting support plate; the first adjusting support plate and the second adjusting support plate are arranged on the support structure in a lifting manner; the first adjusting support plate is used for adjusting the height of the third conveying belt; the second adjusting support plate is used for adjusting the height of the fourth conveying belt.
The height that sets up the first regulation backup pad and the second regulation backup pad of liftable can change third conveyer belt and fourth conveyer belt further improves the effect that blocks that the laser light path received, improves and detects the suitability.
Optionally, the conveying structure further comprises a driving device, a first compensation assembly and a second compensation assembly, and a driving end of the driving device is in transmission connection with the first conveying belt and the second conveying belt; the first conveying belt winds through the first compensation assembly, and the first compensation assembly is in transmission connection with the third conveying belt through the first conveying belt; the second conveying belt winds through a second compensation assembly, and the second compensation assembly is in transmission connection with the fourth conveying belt through the second conveying belt; the first adjusting support plate and the second adjusting support plate respectively drive the first compensation assembly and the second compensation assembly to synchronously lift when lifting so as to drive the compensation section of the first conveying belt and the compensation section of the second conveying belt to lift; the compensating section of the first conveying belt is a part wound by the first compensating component; the compensating section of the second conveyor belt is a part wound by the second compensating assembly.
By providing the first and second compensating assemblies, length compensation can be provided for the first and second conveyor belts when the third and fourth conveyor belts are adjusted in height.
In a second aspect, the present application provides a detection apparatus, which includes a silicon wafer detection mechanism and a compatible silicon wafer conveying apparatus, wherein: the silicon wafer detection mechanism comprises a first detection assembly, a second detection assembly, a third detection assembly, a fourth detection assembly, a vertical plate, a first adjusting mechanism and a second adjusting mechanism; the first detection assembly and the second detection assembly are slidably arranged on the first side of the vertical plate; the third detection assembly and the fourth detection assembly are slidably mounted on a second side of the vertical plate, which is opposite to the first side; the first adjusting mechanism is arranged on the first side of the vertical plate and used for synchronously adjusting the first detection assembly and the second detection assembly to face or be far away from the conveying belt; the second adjusting mechanism is installed on the second side of the vertical plate and used for synchronously adjusting the third detection assembly and the fourth detection assembly to face or be far away from the conveying belt.
The transverse position of the detection assembly can be adjusted through the adjusting mechanism, and the detection device is convenient to adapt to detection work of silicon wafers with different sizes.
Optionally, the detection device further includes a first sliding plate and a second sliding plate, the first detection assembly and the second detection assembly are fixedly mounted on the first sliding plate, and the first sliding plate is slidably mounted on the vertical plate; the third detection assembly and the fourth detection assembly are fixedly arranged on the second sliding plate, and the second sliding plate is slidably arranged on the vertical plate; the first adjusting mechanism and the second adjusting mechanism are identical in structure and comprise adjusting bolts, the first ends of the adjusting bolts are fixedly connected with the first sliding plate or the second sliding plate, and the second ends of the adjusting bolts are in threaded connection with the vertical plate.
The first sliding plate and the second sliding plate are pushed by rotating the adjusting bolts, so that the four groups of detection assemblies are driven to move, and the detection positions of the detection assemblies can be conveniently and accurately adjusted.
It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the invention as claimed.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present invention and, together with the description, serve to explain the principles of the invention.
Fig. 1 is a schematic structural view of a conveying device of the present invention;
fig. 2 is a position structure diagram of the first compensation assembly of the present invention;
FIG. 3 is a schematic view of the structure of the fixing support plate of the present invention;
FIG. 4 is a schematic view of the structure of the avoidance groove of the present invention;
fig. 5 is a schematic view of the position of the driving device of the present invention;
fig. 6 is a schematic structural view of the first support plate and the second support plate of the present invention;
FIG. 7 is a schematic view of the structure of the detecting device of the present invention;
FIG. 8 is a schematic view of the first type A of silicon wafers conveyed and detected by the present invention;
FIG. 9 is a schematic view of a second type of silicon wafer B conveyed and detected by the present invention;
fig. 10 is another embodiment of the evasion groove of the present invention.
Fig. 1 to 7 include: 11. fixing the support plate; 12. a first adjustment support plate; 13. a second adjustment support plate; 21. a drive device; 22. a first compensation component; 31. a first support plate; 32. a second support plate; 33. an adjusting frame; 34. an adjustment wheel; 35. an avoidance groove; 41. a first conveyor belt; 42. a second conveyor belt; 43. a third conveyor belt; 44. a fourth conveyor belt; 51. a first guide wheel; 52. a second guide wheel; 53. a third guide wheel; 54. a fourth guide wheel; 611. a first detection assembly; 612. a second detection assembly; 613. a third detection assembly; 614. a fourth detection component; 62. a vertical plate; 63. a first adjustment mechanism; 64. a second adjustment mechanism; 65. a first slide plate; 66. a second slide plate; a first type silicon wafer A; and a second type of silicon wafer B.
Detailed Description
Reference will now be made in detail to the exemplary embodiments, examples of which are illustrated in the accompanying drawings. The following description refers to the accompanying drawings in which the same numbers in different drawings represent the same or similar elements unless otherwise indicated. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present invention. Rather, they are merely examples of apparatus and methods consistent with certain aspects of the invention, as detailed in the appended claims.
The utility model provides a compatible silicon chip conveyor, compatible silicon chip conveyor includes transport structure, guide structure and bearing structure, wherein: the conveying structure comprises a supporting plate and a conveying belt, the supporting plate is arranged on the supporting structure, and the supporting plate is used for supporting the conveying surface of the conveying belt; the guide structure is arranged on the support structure and located below the support plate, the conveying belt winds the warp support plate and the guide structure to form a closed loop, an accommodating space is formed between the support plate and the conveying belt of the winding guide structure and used for accommodating detection equipment, and the detection equipment is used for irradiating laser beams onto silicon wafers borne on the conveying belt.
The silicon chip is transported to the conveying surface of the conveying belt from the previous working procedure, a part of the conveying belt is kept away from a certain space through the guide structure and is used for placing the detection equipment, and when the silicon chip passes through the detection point on the conveying belt, the detection equipment irradiates the silicon chip through the laser beam and detects the thickness of the silicon chip. In the prior art, only two conveying belts are corresponding to thickness detection, and more conveying belts are needed to be arranged for being compatible with silicon wafers of various sizes, but the installation density of the conveying belts is increased; if the conveyer belt is not avoided through the guide structure, the conveyer belts at the detection point are too compact, so that the laser beams cannot normally reach the surface of the silicon wafer, and the detection result is influenced.
The accommodating space is formed by winding the conveying belt through the guide structure, so that the laser beam of the detection equipment can be avoided below the conveying belt, and the detection of silicon wafers with different sizes is facilitated.
As shown in fig. 1:
in this embodiment, the conveyor belts include a first conveyor belt 41, a second conveyor belt 42, a third conveyor belt 43, and a fourth conveyor belt 44, wherein: the third conveyor belt 43, the first conveyor belt 41, the second conveyor belt 42 and the fourth conveyor belt 44 are arranged in parallel at intervals; the first conveyor belt 41 and the second conveyor belt 42 are configured to convey a first type of silicon wafer a having a larger side length in the conveying direction than a side length perpendicular to the conveying direction; the third and fourth conveyor belts 43 and 44 are configured to convey the second type of silicon wafers B having a side length in the conveying direction smaller than or equal to a side length perpendicular to the conveying direction.
The first conveying belt 41, the second conveying belt 42, the third conveying belt 43 and the fourth conveying belt 44 are arranged in parallel, when the first type of silicon wafers A are conveyed, the width of the silicon wafers A is smaller in the conveying direction, and therefore the first conveying belt 41 and the second conveying belt 42 in the middle part are responsible for carrying and conveying; when the second type of silicon wafer B is conveyed, the width of the second type of silicon wafer B is larger in the conveying direction, so that the first conveying belt 41, the second conveying belt 42, the third conveying belt 43 and the fourth conveying belt 44 all bear and convey the silicon wafers, or the heights of the third conveying belt 43 and the fourth conveying belt 44 are adjusted to be higher than those of the first conveying belt 41 and the second conveying belt 42, the size of the second type of silicon wafer B is ensured to be compatible, the density of the conveying belts is reduced, and negative influences such as light path blocking and the like on the detection equipment are avoided.
The multiple groups of side-by-side conveying belts can adapt to silicon wafers of various sizes, and the detection work of the detection equipment is not influenced by shielding by changing the direction of the silicon wafers placed on the conveying belts.
As shown in fig. 1:
in this embodiment, the guiding structure comprises a first guide wheel 51, a second guide wheel 52, a third guide wheel 53 and a fourth guide wheel 54, wherein: the first guide wheel 51 and the second guide wheel 52 are oppositely arranged below the supporting plate; the third guide wheel 53 is arranged obliquely below the first guide wheel 51, and the fourth guide wheel 54 is arranged obliquely below the second guide wheel 52; the conveying belt sequentially passes through a first guide wheel 51, a third guide wheel 53, a fourth guide wheel 54 and a second guide wheel 52; an accommodating space is formed between the supporting plate and the conveying belt which passes around the first guide wheel 51, the third guide wheel 53, the fourth guide wheel 54 and the second guide wheel 52; the accommodation space is arranged below the conveying surface of the conveying belt.
The first guide wheel 51, the second guide wheel 52, the third guide wheel 53 and the fourth guide wheel 54 sequentially form a path profile of the conveying belt, the conveying belt is guided to be far away from the supporting plate below the supporting plate and wound to form an accommodating space, and the detection equipment is arranged in the accommodating space, so that the conveying belt above the detection equipment is only provided with one conveying surface layer, the density of the conveying belt at the detection position is greatly reduced, and a laser light path can better reach the surface of a silicon wafer.
The conveying belts are guided to avoid the supporting plates through the multiple groups of guide wheels, accommodating spaces are formed for accommodating detection equipment, and the conveying belts are prevented from blocking detected laser light paths.
As shown in fig. 3:
in this embodiment, an avoidance groove 35 is provided on the support plate, wherein: the avoiding groove 35 is formed along the laser path direction of the laser beam, and the laser path enters the avoiding groove 35 from the first end of the avoiding groove 35 and is hit to the silicon wafer carried on the conveying belt from the second end of the avoiding groove 35.
The avoiding groove 35 is arranged at the detection position, and at certain detection angles, the laser light path can be blocked due to the fact that the supporting plate is too thick, and at the moment, the laser beam can reach the silicon wafer through the avoiding groove 35; the avoiding groove 35 can be opened on the surface layer of the support plate, so that the advancing path of the laser light path is not blocked, and the support plate can keep enough structural strength.
The avoidance groove 35 is arranged to form an avoidance area on the support plate, so that the situation that the too thick part of the support plate blocks a laser light path for detection is avoided.
Fig. 3 shows an embodiment of the avoiding groove 35 of the present application, and besides this embodiment, the avoiding groove 35 of the present application may also be the embodiment shown in fig. 10, as shown in fig. 10, the avoiding groove 35 formed on the supporting plate is a through groove, and the supporting plate is cut into two parts, so that the avoiding groove 35 has a larger volume, and is more convenient for passing through the laser path.
As shown in fig. 4:
in this embodiment, the size of the notch of the bypass groove 35 gradually increases in a direction from the first end of the bypass groove 35 to the second end of the bypass groove 35. The extending direction of the avoiding groove 35 is parallel to the path of the laser beam hitting the supporting plate, the size of the notch of the avoiding groove 35 is gradually increased, a larger avoiding space can be provided when the emitting position of the laser beam is changed, and the compatibility of the silicon wafers with different sizes is further enhanced.
The avoidance groove 35 with the structure can increase the avoidance space and is convenient for grooving.
As shown in fig. 6:
in this embodiment, the support plates include a first support plate 31 and a second support plate 32, and the first support plate 31 and the second support plate 32 are located on the same horizontal plane; the supporting structure is provided with an adjusting frame 33, the adjusting frame 33 is provided with an adjusting wheel 34 capable of adjusting the installation position, and the conveying belt is wound by the adjusting wheel 34; the second support plate 32 may be mounted toward or away from the first support plate 31, or the second support plate 32 may be moved toward or away from the first support plate 31 to change the length of the conveying surface of the conveyor belt; the adjustment wheel 34 is used to compensate for the variation in the length of the conveying surface of the conveyor belt.
When the second type of silicon wafers are conveyed, namely the side length of the silicon wafers along the conveying direction is smaller than that of the silicon wafers vertical to the conveying direction, the side length of the silicon wafers along the conveying direction is smaller, and the width of a gap at the joint of a conveying belt and a rear path is larger, so that the second type of silicon wafers are not beneficial to conveying; therefore, when the second silicon wafer is conveyed, the distance between the first supporting plate 31 and the second supporting plate 32 is increased, so that the conveying surface of the conveying belt is lengthened, the width of a gap at the joint with a subsequent process is reduced, and the second silicon wafer is conveniently and smoothly transferred to the subsequent process.
Since increasing the length of the conveying surface of the conveyor belt requires additional length compensation, the setting wheel 34 is provided,
the length of the conveying surface of the conveying belt is changed by adjusting the distance between the first supporting plate 31 and the second supporting plate 32, so that the silicon wafers with smaller sizes can be connected with a subsequent device in a transportation process.
As shown in fig. 1:
in this embodiment, the compatible silicon wafer conveying device further includes a fixed support plate 11, a first adjusting support plate 12 and a second adjusting support plate 13, the first adjusting support plate 12 and the second adjusting support plate 13 are respectively disposed at two sides of the fixed support plate 11, the first conveying belt 41 and the second conveying belt 42 are mounted on the fixed support plate 11, the third conveying belt 43 is mounted on the first adjusting support plate 12, and the fourth conveying belt 44 is mounted on the second adjusting support plate 13; the first adjusting support plate 12 and the second adjusting support plate 13 are arranged on the support structure in a lifting manner; the first adjusting support plate 12 is used for adjusting the height of the third conveying belt 43; the second adjusting support plate 13 is used to adjust the height of the fourth conveyor belt 44.
Due to the size of different silicon wafers, when only the fixed supporting plate 11 or only the first adjusting supporting plate 12 and the second adjusting supporting plate 13 are needed to support the silicon wafers so as to meet the advancing requirement of the laser light path, the blocking effect of the conveying belt on the laser light path can be reduced by moving the first adjusting supporting plate 12 and the second adjusting supporting plate 13 upwards or downwards, and the first adjusting supporting plate 12 and the second adjusting supporting plate 13 can also be directly detached according to actual conditions.
The first adjusting support plate 12 and the second adjusting support plate 13 move up and down on the support structure through slide rails, and are fixed through a locking device after being adjusted to proper positions.
The height of the third conveying belt 43 and the height of the fourth conveying belt 44 can be changed by arranging the liftable first adjusting support plate 12 and the liftable second adjusting support plate 13, the blocking effect of the laser light path is further improved, and the detection applicability is improved.
It should be noted that, as for the opening of the avoidance groove 35, the avoidance groove is formed in some of the fixed support plate 11, the first adjusting support plate 12 and the second adjusting support plate 13, which can be selected according to requirements, and the present application is not limited thereto.
As shown in fig. 1, 2 and 5:
in this embodiment, the conveying structure further comprises a driving device 21, a first compensation assembly 22 and a second compensation assembly, wherein the driving end of the driving device 21 is in transmission connection with a first conveying belt 41 and a second conveying belt 42; the first conveying belt 41 winds through the first compensation assembly 22, and the first compensation assembly 22 is in transmission connection with the third conveying belt 43 through the first conveying belt 41; the second conveyer belt 42 is wound by a second compensation component, and the second compensation component is in transmission connection with a fourth conveyer belt 44 through the second conveyer belt 42; the first adjusting support plate 12 and the second adjusting support plate 13 respectively drive the first compensating assembly 22 and the second compensating assembly to synchronously lift when lifting, so as to drive the compensating section of the first conveying belt 41 and the compensating section of the second conveying belt 42 to lift; the compensation segment of the first conveyor belt 41 is the part passing around the first compensation assembly 22; the compensating run of the second conveyor belt 42 is the portion that wraps around the second compensating assembly.
The first compensating assembly 22 and the second compensating assembly are both provided with an adjusting wheel set, the driving device 21 drives the first conveying belt 41 and the second conveying belt 42 to rotate, the first conveying belt 41 and the second conveying belt 42 are wound around the adjusting wheel set, and the adjusting wheel set is connected to the third conveying belt 43 and the fourth conveying belt 44 through a transmission assembly.
The first and second compensation members 22 and 44 are provided to compensate for the length of the first and second conveyor belts 41 and 42 when the third and fourth conveyor belts 43 and 44 are adjusted in height.
As shown in fig. 7:
a detection device comprises a silicon wafer detection mechanism and a compatible silicon wafer conveying device, wherein: the silicon wafer detection mechanism comprises a first detection assembly 611, a second detection assembly 612, a third detection assembly 613, a fourth detection assembly 614, a vertical plate 62, a first adjusting mechanism 63 and a second adjusting mechanism 64; the first detection assembly 611 and the second detection assembly 612 are slidably mounted on a first side of the vertical plate 62; the third detecting assembly 613 and the fourth detecting assembly 614 are slidably mounted on a second side of the vertical plate 62 opposite to the first side; the first adjusting mechanism 63 is installed on the first side of the vertical plate 62, and the first adjusting mechanism 63 is used for synchronously adjusting the first detecting assembly 611 and the second detecting assembly 612 to face or be away from the conveying belt; the second adjusting mechanism 64 is installed on the second side of the vertical plate 62, and the second adjusting mechanism 64 is used for synchronously adjusting the third detecting component 613 and the fourth detecting component 614 towards or away from the conveying belt.
When the silicon wafer thickness detection device works, the first detection component 611 and the third detection component 613 are arranged above the conveying surface of the conveying belt and emit laser beams to the upper surface of a silicon wafer, the second detection component 612 and the fourth detection component 614 are arranged below the conveying surface of the conveying belt and emit laser beams to the lower surface of the silicon wafer, when the silicon wafer thickness detection device detects the thickness of one side edge of the silicon wafer, the first detection component 611 and the second detection component 612 are matched with each other to detect the thickness of one side edge of the silicon wafer, and the third detection component 613 and the fourth detection component 614 are matched with each other to detect the thickness of the other side edge of the silicon wafer; when the size of the silicon wafer changes, the first detection assembly 611 and the second detection assembly 612 can be adjusted to be towards or away from the conveying belt; the third detecting element 613 and the fourth detecting element 614 are adjusted to face or move away from the conveyor belt, so that the laser beam can smoothly pass through the conveyor belt to reach the surface of the silicon wafer.
The transverse position of the detection assembly can be adjusted through the adjusting mechanism, and the detection device is convenient to adapt to detection work of silicon wafers of different sizes.
In this embodiment, the detecting device further includes a first sliding plate 65 and a second sliding plate 66, the first detecting assembly 611 and the second detecting assembly 612 are fixedly installed on the first sliding plate 65, and the first sliding plate 65 is slidably installed on the vertical plate 62; the third detecting assembly 613 and the fourth detecting assembly 614 are fixedly arranged on the second sliding plate 66, and the second sliding plate 66 is slidably arranged on the vertical plate 62; the first adjusting mechanism 63 and the second adjusting mechanism 64 have the same structure and both include an adjusting bolt, a first end of the adjusting bolt is fixedly connected to the first sliding plate 65 or the second sliding plate 66, and a second end of the adjusting bolt is in threaded connection with the vertical plate 62.
The second end of the adjusting bolt on the vertical plate 62 is screwed, the first end of the adjusting bolt pushes the corresponding first sliding plate 65 or second sliding plate 66, the first sliding plate 65 drives the first detecting assembly 611 and the second detecting assembly 612 to perform position adjustment, and the second sliding plate 66 drives the third detecting assembly 613 and the fourth detecting assembly 614 to perform position adjustment.
The first sliding plate 65 and the second sliding plate 66 are pushed by rotating the adjusting bolts, so that the four groups of detection assemblies are driven to move, and the detection positions of the detection assemblies can be conveniently and accurately adjusted.
Other embodiments of the invention will be apparent to those skilled in the art from consideration of the specification and practice of the invention disclosed herein. This application is intended to cover any variations, uses, or adaptations of the invention following, in general, the principles of the invention and including such departures from the present disclosure as come within known or customary practice within the art to which the invention pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the invention being indicated by the following claims.
It will be understood that the invention is not limited to the precise arrangements described above and shown in the drawings and that various modifications and changes may be made without departing from the scope thereof. The scope of the present invention is limited only by the appended claims.
Claims (10)
1. The utility model provides a compatible silicon chip conveyor, its characterized in that, compatible silicon chip conveyor includes transport structure, guide structure and bearing structure, wherein:
the conveying structure comprises a supporting plate and a conveying belt, the supporting plate is mounted on the supporting structure, and the supporting plate is used for supporting the conveying surface of the conveying belt;
the guide structure is installed on the supporting structure and located below the supporting plate, the conveying belt winds through the supporting plate and the guide structure to form a closed loop, an accommodating space is formed between the supporting plate and the conveying belt of the winding structure and used for accommodating detection equipment, and the detection equipment is used for emitting laser beams onto silicon wafers borne on the conveying belt.
2. The compatible silicon wafer conveying apparatus according to claim 1, wherein the conveyor belts comprise a first conveyor belt, a second conveyor belt, a third conveyor belt, and a fourth conveyor belt, wherein:
the third conveyer belt, the first conveyer belt, the second conveyer belt and the fourth conveyer belt are arranged in parallel at intervals;
the first conveying belt and the second conveying belt are configured to convey first-type silicon wafers, and the side length of each first-type silicon wafer in the conveying direction is larger than that of each first-type silicon wafer perpendicular to the conveying direction;
the third conveying belt and the fourth conveying belt are configured to convey a second type of silicon wafer, and the side length of the second type of silicon wafer along the conveying direction is smaller than or equal to the side length perpendicular to the conveying direction.
3. The compatible silicon wafer conveying device according to claim 1, wherein the guide structure comprises a first guide wheel, a second guide wheel, a third guide wheel and a fourth guide wheel, wherein:
the first guide wheel and the second guide wheel are oppositely arranged below the supporting plate;
the third guide wheel is arranged obliquely below the first guide wheel, and the fourth guide wheel is arranged obliquely below the second guide wheel;
the conveying belt sequentially passes through the first guide wheel, the third guide wheel, the fourth guide wheel and the second guide wheel in a winding manner;
an accommodating space is formed between the supporting plate and the conveying belt wound by the first guide wheel, the third guide wheel, the fourth guide wheel and the second guide wheel;
the accommodating space is arranged below the conveying surface of the conveying belt.
4. The compatible silicon wafer conveying device according to claim 1, wherein an avoiding groove is provided on the support plate, wherein:
the avoidance groove is formed along the laser light path direction of the laser beam, the laser beam enters the avoidance groove from the first end of the avoidance groove and strikes the silicon chip carried on the conveying belt from the second end of the avoidance groove.
5. The compatible silicon wafer conveying device according to claim 4, wherein the notch size of the avoiding groove gradually increases in a direction from the first end of the avoiding groove to the second end of the avoiding groove.
6. The compatible silicon wafer conveying device according to claim 1, wherein the support plate comprises a first support plate and a second support plate, and the first support plate and the second support plate are located on the same horizontal plane;
the supporting structure is provided with an adjusting frame, the adjusting frame is provided with an adjusting wheel capable of adjusting the installation position, and the conveying belt is wound by the adjusting wheel;
the second support plate may be mounted towards or away from the first support plate, or the second support plate may be moved towards or away from the first support plate to change the length of the conveying face of the conveyor belt;
the adjusting wheel is used for compensating the length variation of the conveying surface of the conveying belt.
7. The compatible silicon wafer transfer device according to claim 2,
the compatible silicon wafer conveying device further comprises a fixed supporting plate, a first adjusting supporting plate and a second adjusting supporting plate, the first adjusting supporting plate and the second adjusting supporting plate are respectively arranged on two sides of the fixed supporting plate, the first conveying belt and the second conveying belt are installed on the fixed supporting plate, the third conveying belt is installed on the first adjusting supporting plate, and the fourth conveying belt is installed on the second adjusting supporting plate;
the first adjusting support plate and the second adjusting support plate are arranged on the support structure in a lifting manner;
the first adjusting support plate is used for adjusting the height of the third conveying belt;
the second adjusting support plate is used for adjusting the height of the fourth conveying belt.
8. The compatible silicon wafer transfer device according to claim 7,
the conveying structure further comprises a driving device, a first compensation assembly and a second compensation assembly, wherein the driving end of the driving device is in transmission connection with the first conveying belt and the second conveying belt;
the first conveying belt winds through the first compensation assembly, and the first compensation assembly is in transmission connection with the third conveying belt through the first conveying belt;
the second conveying belt winds through the second compensation assembly, and the second compensation assembly is in transmission connection with the fourth conveying belt through the second conveying belt;
the first adjusting support plate and the second adjusting support plate respectively drive the first compensating assembly and the second compensating assembly to synchronously lift when lifting so as to drive the compensating section of the first conveying belt and the compensating section of the second conveying belt to lift;
the compensating section of the first conveying belt is a part wound by the first compensating component;
the compensating section of the second conveyor belt is a part wound by the second compensating assembly.
9. A test apparatus comprising a wafer test mechanism and a compatible wafer transfer apparatus according to any one of claims 1 to 8, wherein:
the silicon wafer detection mechanism comprises a first detection assembly, a second detection assembly, a third detection assembly, a fourth detection assembly, a vertical plate, a first adjusting mechanism and a second adjusting mechanism;
the first detection assembly and the second detection assembly are slidably mounted on the first side of the vertical plate;
the third detection assembly and the fourth detection assembly are slidably mounted on a second side of the vertical plate, which is opposite to the first side;
the first adjusting mechanism is arranged on the first side of the vertical plate and used for synchronously adjusting the first detection assembly and the second detection assembly to face or be far away from the conveying belt;
the second adjusting mechanism is installed on the second side of the vertical plate and used for synchronously adjusting the third detection assembly and the fourth detection assembly to face or be far away from the conveying belt.
10. The detection apparatus according to claim 9, wherein the detection apparatus comprises a first sliding plate and a second sliding plate, the first detection assembly and the second detection assembly are fixedly mounted on the first sliding plate, and the first sliding plate is slidably mounted on the vertical plate; the third detection assembly and the fourth detection assembly are fixedly arranged on the second sliding plate, and the second sliding plate is slidably arranged on the vertical plate;
the first adjusting mechanism and the second adjusting mechanism are identical in structure and comprise adjusting bolts, the first ends of the adjusting bolts are fixedly connected with the first sliding plate or the second sliding plate, and the second ends of the adjusting bolts are in threaded connection with the vertical plates.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221753842.0U CN218087870U (en) | 2022-07-08 | 2022-07-08 | Compatible silicon wafer conveying device and detection device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221753842.0U CN218087870U (en) | 2022-07-08 | 2022-07-08 | Compatible silicon wafer conveying device and detection device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218087870U true CN218087870U (en) | 2022-12-20 |
Family
ID=84479320
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202221753842.0U Active CN218087870U (en) | 2022-07-08 | 2022-07-08 | Compatible silicon wafer conveying device and detection device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218087870U (en) |
-
2022
- 2022-07-08 CN CN202221753842.0U patent/CN218087870U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR100810530B1 (en) | Ceiling traveling vehicle system | |
| US6581749B2 (en) | Transfer apparatus | |
| US7562766B2 (en) | Conveyor apparatus and system | |
| US5167315A (en) | Carton aligner for two-way diverter | |
| CN112141600B (en) | Efficient circulating tracking flexible correction plate feeding machine | |
| WO2019237994A1 (en) | Flattening device, material-conveying apparatus, and processing system | |
| US9296505B2 (en) | Packaging machine with transport device | |
| CA2615142C (en) | Installation for conveying goods | |
| CN218087870U (en) | Compatible silicon wafer conveying device and detection device | |
| WO2022089120A1 (en) | Automatic tray supply apparatus, tray organization table having same, and security system | |
| CA2658731C (en) | Device for producing and/or processing panels | |
| WO2020010925A1 (en) | Conveying device and imaging detection equipment with same | |
| US3648823A (en) | Labeling machine | |
| KR102400495B1 (en) | Contactless type thickness measuring apparatus | |
| KR102432761B1 (en) | Contactless type thickness measuring apparatus | |
| US8910691B2 (en) | Glass handling assembly | |
| JP4882754B2 (en) | Plate body transport equipment | |
| CN221115497U (en) | High-rigidity long-distance belt conveying device | |
| CN217866289U (en) | Compatible silicon wafer conveying device and silicon wafer detection device | |
| KR101704357B1 (en) | Transferring apparatus with anti-rolling function | |
| CN110155761B (en) | Luggage cabinet conveying device of airport and railway dual-purpose system | |
| CN219948649U (en) | Automatic bundling device for longitudinally bundling materials on two sides of conveying line | |
| US11932488B2 (en) | Modular vertical lift system | |
| CN113635598B (en) | Feeding system of corrugated carton cutting machine | |
| CN218463971U (en) | Pushing mechanism of sealing element packaging machine |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |