CN218071945U

CN218071945U - Self-locking semiconductor device convenient for circuit board assembly

Info

Publication number: CN218071945U
Application number: CN202220821124.6U
Authority: CN
Inventors: 王辉
Original assignee: Xi'an Yingran Semiconductor Technology Co ltd
Current assignee: Xi'an Yingran Semiconductor Technology Co ltd
Priority date: 2022-04-11
Filing date: 2022-04-11
Publication date: 2022-12-16
Anticipated expiration: 2032-04-11

Abstract

The utility model relates to a from locking type semiconductor device convenient to circuit board equipment, from locking type semiconductor device convenient to circuit board equipment includes: the semiconductor packaging structure comprises a plate body and guide latch teeth which are fixedly arranged on the plate body and symmetrically arranged, wherein a semiconductor body is further arranged on the plate body, fixed latch teeth are fixed on the semiconductor body, and the fixed latch teeth are clamped with the guide latch teeth; the semiconductor body is provided with guide mechanisms symmetrically arranged, the semiconductor body is further provided with an adjusting assembly, the plate body is provided with a clamping mechanism connected with the guide mechanisms and the adjusting assembly, the guide mechanisms are matched with the clamping mechanism and fix the semiconductor body, the semiconductor body is driven by manpower to move towards the plate body direction and enable the fixing clamping teeth to be clamped with the guide clamping teeth, and at the moment, the guide mechanisms are connected with the clamping mechanism and fixed through the clamping mechanism.

Description

Self-locking semiconductor device convenient for circuit board assembly

Technical Field

The utility model relates to a semiconductor field specifically is a self-locking type semiconductor device convenient to circuit board equipment.

Background

The semiconductor is a material with conductivity between a conductor and an insulator at normal temperature, the semiconductor is a material with controllable conductivity ranging from the insulator to the conductor, the semiconductor is widely applied to the medical field, and the semiconductor can be applied to the industrial field even in daily life, so the technology has very important development prospect.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a from lock type semiconductor device convenient to circuit board equipment to solve the problem that proposes in the above-mentioned background art.

In order to achieve the above purpose, the utility model provides a following technical scheme:

a self-locking type semiconductor device for facilitating circuit board assembly, the self-locking type semiconductor device for facilitating circuit board assembly comprising:

the semiconductor packaging structure comprises a plate body and guide latch teeth which are fixedly arranged on the plate body and symmetrically arranged, wherein a semiconductor body is also arranged on the plate body, and fixed latch teeth are fixed on the semiconductor body and are clamped with the guide latch teeth;

the semiconductor device comprises a semiconductor body and is characterized in that guide mechanisms symmetrically arranged are arranged on the semiconductor body, an adjusting assembly is further arranged on the semiconductor body, clamping mechanisms connected with the guide mechanisms and the adjusting assembly are arranged on a plate body, and the guide mechanisms are matched with the clamping mechanisms and fix the semiconductor body.

As a further aspect of the present invention: the guiding mechanism comprises connecting rods hinged to the semiconductor body and symmetrically arranged, supporting plates hinged to the connecting rods, and supporting assemblies arranged on the semiconductor body and connected with the supporting plates, and the supporting assemblies are connected with the adjusting assemblies and the clamping mechanisms.

As a further aspect of the present invention: the supporting component comprises a hollow rod fixedly mounted on the supporting plate, a sliding groove and a through groove are formed in the hollow rod, the sliding groove is connected with the adjusting component, and the through groove is connected with the clamping mechanism.

As a further aspect of the present invention: the adjusting part comprises a movable rod movably arranged in the hollow rod, a protrusion clamped with the sliding groove is fixed on the movable rod, a first spring fixedly connected with the movable rod is fixed on the clamping mechanism, the first spring is arranged in the hollow rod, and the movable rod is connected with the clamping mechanism.

As the utility model discloses further scheme again: the block mechanism comprises a fixed plate fixedly mounted in the hollow rod, an elastic latch fixedly mounted on the fixed plate, and a limiting disc fixedly mounted on the elastic latch and intermittently abutted against the movable rod, wherein a limiting component is arranged on the plate body and connected with the hollow rod, and is clamped with the elastic latch, and the fixed plate is fixedly connected with a spring.

As the utility model discloses further scheme again: the limiting assembly comprises a limiting sleeve fixedly mounted on the plate body, a second spring abutted against the hollow rod is fixed on the limiting sleeve, and a clamping groove clamped with the elastic clamping tooth is formed in the limiting sleeve.

Compared with the prior art, the beneficial effects of the utility model are that: the utility model relates to a novelty, when using, the manpower drive semiconductor body moves towards plate body direction, and make fixed latch and direction latch block, at this moment, be connected guiding mechanism and block mechanism, and drive semiconductor body towards plate body direction motion, thereby drive guiding mechanism motion, move to with the plate body butt when the semiconductor body, guiding mechanism and block mechanism cooperation, and it is fixed with the semiconductor body, when needs take out the semiconductor body, the manpower drive adjusting part motion this moment, make guiding mechanism and block mechanism separate, thereby take out the semiconductor body.

Drawings

Fig. 1 is a schematic structural diagram of an embodiment of a self-locking semiconductor device for facilitating circuit board assembly.

Fig. 2 is an enlarged schematic view of the structure at a in fig. 1.

Fig. 3 is a schematic diagram of a further embodiment of a self-locking semiconductor device for facilitating circuit board assembly.

Fig. 4 is a schematic diagram showing the connection relationship of the guiding mechanism, a part of the adjusting assembly and a part of the engaging mechanism in an embodiment of the self-locking semiconductor device for facilitating the assembly of the circuit board.

Fig. 5 is a schematic view of a partially exploded structure of an embodiment of a self-locking semiconductor device for facilitating assembly of a circuit board.

In the figure: 1. a plate body; 2. a semiconductor body; 3. a guide latch; 4. fixing the latch; 5. a connecting rod; 6. a support plate; 7. a hollow stem; 8. a chute; 9. a movable rod; 10. a protrusion; 11. a through groove; 12. a fixing plate; 13. elastic latch; 14. a limiting disc; 15. a first spring; 16. a limiting sleeve; 17. a second spring; 18. a clamping groove.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts all belong to the protection scope of the present invention.

In addition, an element of the present invention may be said to be "secured to" or "disposed on" another element, either directly on the other element or with intervening elements present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only and do not represent the only embodiments.

Referring to fig. 1 to 5, in an embodiment of the present invention, a self-locking semiconductor device for facilitating circuit board assembly includes:

referring to fig. 1 and 3, a plate body 1 and guide latches 3 that are symmetrically arranged and fixedly mounted on the plate body 1 are further disposed on the plate body 1, a fixed latch 4 is fixed on the semiconductor body 2, the fixed latch 4 is engaged with the guide latch 3, and when the guide latch 3 is engaged with the fixed latch 4, the guide latch 2 guides the movement track of the semiconductor body 2, and when the guide latch 3 is engaged with the fixed latch 4, the friction between the guide latch 3 and the fixed latch 4 is large, and the semiconductor body 2 can be driven to move toward the plate body 1 by applying a certain external force to the semiconductor body 2.

Be provided with the guiding mechanism who is the symmetry and sets up on semiconductor body 2, guiding mechanism is including articulating connecting rod 5 that just is the symmetry and sets up on semiconductor body 2, articulate backup pad 6 on connecting rod 5, setting are in semiconductor body 2 go up and with the supporting component that backup pad 6 is connected, supporting component with adjusting part with block mechanism connects, wherein, supporting component includes fixed mounting and is in cavity pole 7 in backup pad 6, seted up spout 8 on the cavity pole 7 and led to groove 11, spout 8 with adjusting part connects, lead to groove 11 with block mechanism connects.

Referring to fig. 2 and 4-5, it should be noted that when the guiding latch 3 and the fixing latch 4 are engaged with each other, the semiconductor body 2 is held by a hand under the action of friction force, at this time, the hollow rod 7 is driven by a human power to move toward the engaging mechanism and drive the connecting rod 5 to rotate around the hinge point, the hollow rod 7 and the plate body 1 are in parallel, when the hollow rod 7 is connected with the engaging mechanism, the semiconductor body 2 is driven by a human power to move toward the plate body 1 and drive the connecting rod 5 to move, so as to drive the hollow rod 7 to enter the engaging mechanism, when the semiconductor body 2 moves to a position where the semiconductor body is abutted against the plate body 1, the connecting rod 5 and the hollow rod 7 are in the same horizontal plane and on the same axis, and under the action of the engaging mechanism, the hollow rod 7 is fixed with the engaging mechanism, so as to fix the semiconductor body 2.

Still be provided with adjusting part on the semiconductor body 2, adjusting part includes movable mounting at the movable rod 9 in the cavity pole 7, be fixed with on the movable rod 9 with the arch 10 of 8 blocks of spout, be fixed with in the block mechanism with movable rod 9 fixed connection's first spring 15, first spring 15 is arranged in the cavity pole 7, movable rod 9 with the block mechanism is connected.

Referring to fig. 5, further, in an initial state, the first spring 15 is in a compressed state, the movable rod 9 is located at a stroke end of the hollow rod 7 in a direction toward the semiconductor body 2, when the hollow rod 7 is fixed with the engaging mechanism, if the hollow rod 7 needs to be separated from the engaging mechanism, the manual driving protrusion 10 moves on the sliding groove 8 and drives the movable rod 9 to move in a direction away from the semiconductor body 2, so that the movable rod 9 abuts against the engaging mechanism and drives the engaging mechanism to move, thereby compressing the first spring 15 to separate the engaging mechanism from the hollow rod 7, at this time, the semiconductor body 2 can be taken out, and the movable rod 9 is reset under the action of the first spring 15, wherein one end of the movable rod 9 facing the first spring 15 is arranged in a tapered shape and can be matched with the engaging mechanism.

Be provided with on the plate body 1 with guiding mechanism with the block mechanism that adjusting part connects, guiding mechanism with the cooperation of block mechanism, and will semiconductor body 2 is fixed, block mechanism includes fixed mounting fixed plate 12, fixed mounting in the cavity pole 7 elasticity latch 13, fixed mounting on the fixed plate 12 elasticity latch 13 go up and with the spacing dish 14 of movable rod 9 intermittent type butt, be provided with on the plate body 1 with the spacing subassembly that cavity pole 7 is connected, spacing subassembly with elasticity latch 13 block, fixed plate 12 with first spring 15 fixed connection, wherein, spacing subassembly includes fixed mounting spacing sleeve 16 on the plate body 1, be fixed with on the spacing sleeve 16 with the second spring 17 of cavity pole 7 butt, seted up on the spacing sleeve 16 with the draw-in groove 18 of elasticity latch 13 block.

Referring to fig. 4-5, finally, the elastic latch 13 itself drives the elasticity and can bend to a certain extent, and the end of the elastic latch 13 away from the fixed plate 12 is disposed in a triangular shape, and the limiting plate 14 is provided with an eccentrically disposed hole, in an initial state, the elastic latch 13 passes through the through slot 11, when the hollow rod 7 is located in the limiting sleeve 16, the semiconductor body 2 is manually driven to move towards the plate body 1 and drive the hollow rod 7 into the limiting sleeve 16, when the elastic latch 13 abuts against the limiting sleeve 16, under the action of the limiting sleeve 16, the elastic latch 13 enters into the limiting sleeve 16 and drives the limiting plate 14 to move, because the eccentric hole is disposed on the limiting plate 14, the limiting plate 14 does not interfere with the movable rod 9, the hollow rod 7 abuts against the second spring 17 and compresses the second spring 17, when the elastic latch 13 moves to the position of the clamping slot 18, the elastic latch 13 will enter into the clamping slot 18, the semiconductor body 2 just abuts against the position of the plate body 1, under the action of the elastic latch 13, the elastic latch 7 is fixed in the limiting sleeve 7, and drives the hollow rod 13 to move towards the limiting sleeve 16, when the elastic latch 13 moves to move towards the limiting sleeve 18, the limiting sleeve 16, the limiting sleeve 14, the eccentric rod, the limiting sleeve 14 and the movable rod is removed, the hollow rod, at this time, the elastic latch 13 is removed, when the movable rod 14 and the movable rod is moved to move, the movable rod 14, the movable sleeve 14, the movable rod is removed, the movable rod 14, when the movable rod is removed, the movable rod is manually driven by the movable rod 14.

It is obvious to a person skilled in the art that the invention is not restricted to details of the above-described exemplary embodiments, but that it can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.

Claims

1. A self-locking semiconductor device for facilitating circuit board assembly, the self-locking semiconductor device for facilitating circuit board assembly comprising:

the semiconductor packaging structure comprises a plate body (1) and guide latch teeth (3) which are fixedly arranged on the plate body (1) and symmetrically arranged, wherein a semiconductor body (2) is further arranged on the plate body (1), a fixing latch tooth (4) is fixed on the semiconductor body (2), and the fixing latch tooth (4) is clamped with the guide latch teeth (3);

the semiconductor device is characterized in that guide mechanisms symmetrically arranged are arranged on the semiconductor body (2), an adjusting assembly is further arranged on the semiconductor body (2), a clamping mechanism connected with the guide mechanisms and the adjusting assembly is arranged on the plate body (1), and the guide mechanisms are matched with the clamping mechanism and fix the semiconductor body (2).

2. The self-locking semiconductor device convenient for circuit board assembly according to claim 1, wherein the guiding mechanism comprises connecting rods (5) hinged on the semiconductor body (2) and symmetrically arranged, a supporting plate (6) hinged on the connecting rods (5), and a supporting component arranged on the semiconductor body (2) and connected with the supporting plate (6), and the supporting component is connected with the adjusting component and the clamping mechanism.

3. The self-locking semiconductor device convenient for circuit board assembly according to claim 2, wherein the supporting assembly comprises a hollow rod (7) fixedly mounted on the supporting plate (6), the hollow rod (7) is provided with a sliding slot (8) and a through slot (11), the sliding slot (8) is connected with the adjusting assembly, and the through slot (11) is connected with the clamping mechanism.

4. A self-locking semiconductor device for facilitating circuit board assembly according to claim 3, wherein said adjustment assembly comprises a movable rod (9) movably mounted in said hollow rod (7), said movable rod (9) being fixed with a protrusion (10) engaging with said sliding slot (8), said engaging mechanism being fixed with a first spring (15) fixedly connected with said movable rod (9), said first spring (15) being disposed in said hollow rod (7), said movable rod (9) being connected with said engaging mechanism.

5. The self-locking semiconductor device convenient for circuit board assembly according to claim 4, wherein the locking mechanism comprises a fixing plate (12) fixedly mounted in the hollow rod (7), an elastic latch (13) fixedly mounted on the fixing plate (12), and a limiting plate (14) fixedly mounted on the elastic latch (13) and intermittently abutted against the movable rod (9), the plate body (1) is provided with a limiting component connected with the hollow rod (7), the limiting component is locked with the elastic latch (13), and the fixing plate (12) is fixedly connected with the first spring (15).

6. The self-locking semiconductor device convenient for circuit board assembly according to claim 5, wherein the limiting component comprises a limiting sleeve (16) fixedly mounted on the board body (1), a second spring (17) abutted against the hollow rod (7) is fixed on the limiting sleeve (16), and a clamping groove (18) clamped with the elastic latch (13) is formed in the limiting sleeve (16).