CN218069822U

CN218069822U - Wafer cooling device

Info

Publication number: CN218069822U
Application number: CN202222011759.2U
Authority: CN
Inventors: 吴承岩; 杨锋
Original assignee: HRG International Institute for Research and Innovation
Current assignee: HRG International Institute for Research and Innovation
Priority date: 2022-07-29
Filing date: 2022-07-29
Publication date: 2022-12-16
Anticipated expiration: 2032-07-29

Abstract

The utility model provides a wafer cooling device, which comprises a supporting mechanism, a platform and feather pieces; at least one layer of object placing platform is arranged on the supporting frame; the object placing platform is arranged in a step manner; feather pieces are arranged on each layer of ladder of the object placing platform; the end face of the feather piece close to the wafer is provided with a plurality of grooves, the non-groove part of the feather piece is provided with at least three supporting pins at intervals, the contact end of the supporting pins and the wafer is in a conical shape, and the wafer is stably arranged above the supporting pins. The utility model discloses be provided with supporting mechanism, platform, feather piece in wafer cooling device for the device can not only cool off the more wafer of quantity simultaneously, can carry out all-round heat dissipation to the wafer again, and then effectively improves the cooling efficiency of wafer.

Description

Wafer cooling device

Technical Field

The utility model relates to a semiconductor chip technical field specifically is a wafer cooling device.

Background

The semiconductor chip is mainly to weld and assemble electronic elements on the basis of a semiconductor wafer so as to obtain a finished chip, and when the semiconductor wafer is assembled and produced, the residual temperature on the surface of the wafer is different due to different distribution densities of the electronic elements on the wafer, so that the temperature is required to be cooled so as to enable the temperature to reach normal room temperature in order to prevent the temperature from influencing the installation work of different electronic elements and facilitate the subsequent processing and production.

The cooling device in the prior art has the advantages that the number of wafers cooled by the cooling device is small, the structure of the feather pieces in the cooling device is unreasonable, the heat dissipation effect is not ideal, and the overall cooling efficiency of the cooling device is low; in addition, the cooling device is complicated in structure, process, and control, making it difficult to install in large quantities.

SUMMERY OF THE UTILITY MODEL

The utility model aims to solve the technical problem that a wafer cooling device is provided to solve the problem that wafer cooling efficiency is low among the prior art.

The utility model discloses a following technical means realizes solving above-mentioned technical problem:

a wafer cooling device comprises a supporting mechanism (1), a platform (2) and a feather piece (3); at least one layer of object placing platform (2) is arranged on the supporting frame (12); the object placing platform (2) is arranged in a stepped manner; each layer of ladder of the object placing platform (2) is provided with a feather piece (3); the end face, close to the wafer, of the feather piece (3) is provided with a plurality of grooves, the non-groove part of the feather piece (3) is provided with at least three supporting pins (33) at intervals, the contact end of the supporting pins (33) and the wafer is in a conical shape, and the wafer is stably arranged above the supporting pins (33).

Has the beneficial effects that: through the arrangement of the supporting mechanism and the object placing platform, a large number of wafers can be cooled simultaneously; through the arrangement of the supporting pins and the grooves, the wafer after heat treatment can be kept stand and cooled on each feather piece almost in a zero-contact mode, the wafer can be subjected to all-dimensional heat dissipation, and the cooling efficiency of the wafer is further improved.

Furthermore, feather piece (3) are including brace table (31), first recess (311) have been seted up in the place ahead of brace table (31) roof, and second recess (312) have been seted up to the rear of brace table (31) roof.

Has the beneficial effects that: through the arrangement of the first groove and the second groove; the first groove is used for heat dissipation of the front wafer; the manipulator lifts the wafer from the lower part of the wafer in the process of putting in and taking out the wafer, so that the manipulator has a lifting action, the second groove can reserve a movable space for the wafer, and in addition, the second groove can also be used for heat dissipation of the wafer at the rear part.

Furthermore, an installation table (3112) is integrally fixed at the front end of the first groove (311), installation holes (313) are formed in the two sides of the second groove (312) on the support table (31) and the installation table (3112), and a support pin (33) is fixed in each installation hole (313).

Furthermore, both sides of second recess (312) and mount table (3112) have all seted up fixed orifices (314) on brace table (31), three fixed orifices (314) are located the edge of brace table (31) roof.

Has the beneficial effects that: through the setting of fixed orifices for it is fixed to the platform to support the brace table.

Furthermore, the feather piece (3) further comprises a limiting plate (32), and the limiting plate (32) is integrally fixed on the supporting platform (31) and the mounting platform (3112) at a position close to the outer side of the fixing hole (314).

Further, the limiting plate (32) is arranged in a positioning slope.

Has the beneficial effects that: through the arrangement of the limiting plate and the shape of the limiting plate, the wafer can be helped to slide into a specified position more accurately in the descending and placing process.

Further, the material of the supporting pin (33) is quartz.

Has the beneficial effects that: by the arrangement of the support pin material, the quartz material is chemically stable and does not undergo unnecessary chemical reactions.

Further, the supporting mechanism (1) comprises a base (11) and a supporting frame (12); at least one support frame (12) is fixed on the base (11), a plurality of layers of storage platforms (2) are arranged on the support frame (12), the upper layer of the storage platforms (2) and the lower layer of the storage platforms (2) are arranged in a stepped mode, and each layer of the storage platforms (2) are also arranged in a stepped mode.

Further, be fixed with two support frames (12) that each other set up for the mirror image on base (11), two-layer platform (2) about being provided with on support frame (12), the upper strata the length of platform (2) is the lower floor half of platform (2) length, every layer platform (2) are the three-layer ladder setting.

Furthermore, the ladder is arranged in a high-front mode and a low-back mode, a mechanical arm (4) is arranged behind the supporting mechanism (1), the second groove (312) is arranged towards the mechanical arm (4), the shape of the first groove (311) is matched with that of the mechanical arm (4), and the mechanical arm (4) stops moving forward when touching the supporting table (31) between the first groove (311) and the second groove (312).

Has the advantages that: the manipulator is matched with the first groove and the second groove, so that the manipulator lifts the wafer from the lower part of the wafer in the wafer placing and taking processes, a lifting action is realized, and a movable space can be reserved for the second groove; the support table between the first groove and the second groove can limit the forward movement of the manipulator.

The utility model has the advantages of:

the utility model is provided with the supporting mechanism, the object placing platform and the feather pieces in the wafer cooling device, and can simultaneously cool a plurality of wafers through the arrangement of the supporting mechanism and the object placing platform; through the arrangement of the supporting pins and the grooves, the wafer after heat treatment can be kept stand and cooled on each feather piece almost in a zero-contact mode, the wafer can be subjected to all-dimensional heat dissipation, and the cooling efficiency of the wafer is further improved.

The utility model adopts the arrangement of the first groove and the second groove; the first groove is used for heat dissipation of the front wafer; the manipulator lifts the wafer from the lower part of the wafer in the process of putting in and taking out the wafer, so that the manipulator has a lifting action, the second groove can reserve a movable space for the wafer, and in addition, the second groove can also be used for heat dissipation of the wafer at the rear part.

The utility model discloses a setting of fixed orifices for on fixing a supporting bench to platform.

The utility model discloses a limiting plate and the setting of shape thereof can help the wafer place the more accurate position of the income regulation of in-process in the decline on.

The utility model discloses a setting of supporting pin material, quartz material's chemical property is stable, can not take place unnecessary chemical reaction.

The utility model has the advantages that the manipulator is matched with the first groove and the second groove, and the manipulator lifts the wafer from the lower part of the wafer in the process of putting in and taking out the wafer, so that the wafer is lifted up and down, and the second groove can reserve a moving space for the wafer; the support table between the first groove and the second groove can limit the forward movement of the manipulator.

Drawings

Fig. 1 is a perspective view of a wafer cooling apparatus according to an embodiment of the present invention;

fig. 2 is a top view of a wafer cooling apparatus according to an embodiment of the present invention;

FIG. 3 is an initial assembly drawing of a feather piece in a wafer cooling device according to an embodiment of the present invention;

FIG. 4 is an assembly view of a process of assembling peacock feather pieces in a wafer cooling device according to an embodiment of the present invention;

fig. 5 is a front cross-sectional view of a feather piece in a wafer cooling device according to an embodiment of the present invention.

Detailed Description

To make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the embodiments of the present invention are combined to clearly and completely describe the technical solution in the embodiments of the present invention, and obviously, the described embodiments are some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by a person skilled in the art without making creative efforts belong to the protection scope of the present invention.

Example one

As shown in fig. 1, the embodiment provides a wafer cooling device, which includes a supporting mechanism 1, a platform 2, and a feather piece 3.

As shown in fig. 2, a robot 4 is provided behind the wafer cooling device to transfer the wafer onto the feather piece 3.

As shown in fig. 1 and 2, the supporting mechanism 1 includes a base 11, at least one supporting frame 12; at least one supporting frame 12 is fixed on the base 11, in the example of the embodiment, two supporting frames 12 which are arranged in a mirror image mode are fixed on the base 11, multiple layers of object placing platforms 2 are arranged on the supporting frames 12, two or more layers of object placing platforms 2 are arranged in an allowed plane space and are all adjusted to be horizontal, the distance does not interfere with the manipulator 4, the distance between the highest layer and the lowest layer is within the lifting travel range of the manipulator 4, each layer of object placing platform 2 is arranged in a stepped mode, in the example of the embodiment, two layers of object placing platforms 2 are arranged on the supporting frames 12, the length of each upper layer of object placing platform 2 is half of the length of each lower layer of object placing platform 2, each layer of object placing platform 2 is provided with three steps, and the steps are arranged in a mode of being high in the front and low in the rear; the feather pieces 3 are fixed on each layer of steps of each layer of the placing platform 2, and the number of the feather pieces 3 is 18 in the embodiment example.

As shown in fig. 2, 3, 4 and 5, the fletching piece 3 includes a support table 31, a limit plate 32 and a support pin 33; the supporting table 31 is arranged in a circular shape, a first groove 311 is formed in the front of the top wall of the supporting table 31, a second groove 312 is formed in the rear of the top wall of the supporting table 31, the second groove 312 is arranged towards the mechanical arm 4, the shape of the first groove 311 is matched with that of the mechanical arm 4, in the embodiment, the cross section of the first groove 311 is in a U shape, the cross section of the second groove 312 is in an M shape, the U-shaped groove is located in the middle position in front of the M-shaped groove, the mechanical arm 4 stops advancing when touching the bottom of the U shape, the first groove 311 is used for heat dissipation of a front wafer, the mechanical arm 4 lifts the wafer from the lower side in the process of putting in and taking out the wafer, therefore, a lifting action is achieved, a movable space can be reserved for the second groove 312, and in addition, the second groove 312 can also be used for heat dissipation of a rear wafer; a mounting table 3112 is integrally fixed at the front end position of the first groove 311; mounting holes 313 and fixing holes 314 are formed in two sides of the second groove 312 on the support table 31 and the mounting table 3112, a support pin 33 is fixed in each mounting hole 313, the support pin 33 can horizontally support against the edge of the wafer, the contact end of the support pin 33 with the wafer is arranged in a conical shape, the conical shape is as small as possible to reduce the contact area with the wafer, the wafer after heat treatment can be placed still and cooled on each feather piece 3 almost in a zero contact mode, the only rest contact point is the support pin 33, the support pin 33 is made of quartz materials with stable chemical properties, and unnecessary chemical reactions cannot occur; three fixing holes 314 are formed at the edge of the top wall of the supporting platform 31 for fixing the supporting platform 31 to the object platform 2; the supporting table 31 and the mounting table 3112 are integrally fixed with a limiting plate 32 at a position close to the outer side of the fixing hole 314, and the limiting plate 32 is provided with a positioning slope, which can help the wafer slide into a specified position more accurately in the descending and placing process.

When the wafer cooling device is used, a wafer is placed on the supporting pin 33 fixed on the supporting table 31 through the manipulator 4, the supporting pin 33 is almost in zero contact with the wafer, grooves are formed in the front and the rear of the supporting table 31, and therefore the wafer can be subjected to all-dimensional heat dissipation to improve the cooling efficiency of the wafer, and the wafer can be helped to slide into a specified position more accurately in the descending and placing process through the limiting plate 32; after the wafer is cooled, the robot 4 can extend into the second groove 312 to take out the wafer.

The above embodiments are only used to illustrate the technical solution of the present invention, and not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it should be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications and substitutions do not depart from the spirit and scope of the present invention in its corresponding aspects.

Claims

1. A wafer cooling device is characterized by comprising a supporting mechanism (1), a placement platform (2) and a feather piece (3);

the supporting mechanism (1) comprises a supporting frame (12);

at least one layer of object placing platform (2) is arranged on the supporting frame (12);

the article placing platform (2) is arranged in a step manner;

each layer of ladder of the object placing platform (2) is provided with a feather piece (3);

the end face, close to the wafer, of the feather piece (3) is provided with a plurality of grooves, the non-groove part of the feather piece (3) is provided with at least three supporting pins (33) at intervals, the contact end of the supporting pins (33) and the wafer is in a conical shape, and the wafer is stably arranged above the supporting pins (33).

2. The wafer cooling apparatus of claim 1, wherein: the feather piece (3) comprises a supporting platform (31), a first groove (311) is formed in the front of the top wall of the supporting platform (31), and a second groove (312) is formed in the rear of the top wall of the supporting platform (31).

3. The wafer cooling apparatus of claim 2, wherein: an installation table (3112) is integrally fixed at the front end of the first groove (311), installation holes (313) are formed in the two sides of the second groove (312) on the support table (31) and the installation table (3112), and a support pin (33) is fixed in each installation hole (313).

4. A wafer cooling apparatus as claimed in claim 3, wherein: both sides of second recess (312) on brace table (31) and mount table (3112) all seted up fixed orifices (314), three fixed orifices (314) are located the edge of brace table (31) roof.

5. The wafer cooling apparatus of claim 4, wherein: the feather piece (3) further comprises a limiting plate (32), and the limiting plate (32) is integrally fixed on the supporting platform (31) and the mounting platform (3112) at the position close to the outer side of the fixing hole (314).

6. The wafer cooling apparatus of claim 5, wherein: the limiting plate (32) is arranged in a positioning slope.

7. A wafer cooling apparatus as claimed in any one of claims 1 to 6, wherein: the material of the supporting pin (33) is quartz.

8. The wafer cooling apparatus of claim 2, wherein: the supporting mechanism (1) further comprises a base (11); at least one support frame (12) is fixed on the base (11), a plurality of layers of storage platforms (2) are arranged on the support frame (12), the storage platforms (2) on the upper layer and the lower layer are arranged in a stepped mode, and each layer of the storage platforms (2) is also arranged in a stepped mode.

9. The wafer cooling apparatus of claim 8, wherein: be fixed with two support frames (12) that each other set up for the mirror image on base (11), be provided with two-layer storage platform (2) about being provided with on support frame (12), the upper strata the length of storage platform (2) is the lower floor half of storage platform (2) length, every layer storage platform (2) are the setting of three-layer ladder.

10. A wafer cooling apparatus as claimed in claim 8 or 9, wherein: the ladder is high before and low after, the rear of supporting mechanism (1) is provided with manipulator (4), second recess (312) set up towards manipulator (4), the shape and manipulator (4) looks adaptation of first recess (311), manipulator (4) touch brace table (31) between first recess (311) and second recess (312) and stop promptly advancing.