CN218068204U - Scattering parameter measuring circuit and radio frequency testing machine - Google Patents
Scattering parameter measuring circuit and radio frequency testing machine Download PDFInfo
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- CN218068204U CN218068204U CN202222195522.4U CN202222195522U CN218068204U CN 218068204 U CN218068204 U CN 218068204U CN 202222195522 U CN202222195522 U CN 202222195522U CN 218068204 U CN218068204 U CN 218068204U
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Abstract
The application provides a scattering parameter measurement circuit and radio frequency test machine, scattering parameter measurement circuit includes: the system comprises a coupler, a first switch module, a second switch module and a signal analyzer; the coupler is respectively connected with the first switch module and the second switch module and used for receiving incident signals and transmitting the incident signals to an incident port of the chip to be tested through the first switch module; the coupler is also used for coupling a reflection signal provided by a reflection port of the chip to be tested through the first switch module to generate a coupling reflection signal and transmitting the coupling reflection signal to the second switch module; the signal analyzer is connected with the second switch module and used for calculating scattering parameters according to the power of the coupling reflected signal and the power of the incident signal provided by the second switch module. The circuit has a simple structure, reduces cost, improves the consistency and reliability of channel characteristics, reduces switching devices, reduces path loss and can obtain a larger power range.
Description
Technical Field
The application relates to the technical field of semiconductor measurement, in particular to a scattering parameter measuring circuit and a radio frequency testing machine.
Background
In the field of wireless communication, the performance hardness index of a radio frequency chip or a radio frequency module is very important, and affects the overall performance and stability of a product, wherein a scattering parameter S is one of the basic and extremely important performance indexes, a reverse transmission coefficient is represented, and the index is one of the necessary tests for the radio frequency chip to leave a factory.
The current general measurement method uses a network analyzer which is large in size and high in cost to carry out testing, the network analyzer adopts a mode of adding a coupler at a measurement port to realize S parameter measurement, when a multi-port chip is measured, the function is realized by using a plurality of couplers, incident power and back power are obtained through measurement, and a formula RL (dB) =10lg (incident power/reflected power) is used for calculating a scattering parameter S of each port.
The above-described method requires a coupler to be provided on each channel, which causes the following problems: the occupied area of a hardware board card is large, the layout design difficulty is large for a test machine product, the reliability is insufficient, and the implementation is difficult; the cost of the coupler is high; it is difficult to ensure consistency per channel characteristic.
SUMMERY OF THE UTILITY MODEL
An object of the application is to provide a scattering parameter measurement circuit and radio frequency test machine, coupler through setting up on the incident channel, can be with the reflected signal coupling that the incident signal that inputs to the chip that awaits measuring corresponds and generate coupling reflected signal, so that the signal analysis appearance calculates the scattering parameter according to coupling reflected signal's power and incident signal's power, compare in prior art, circuit structure is simple, improve channel characteristic uniformity and reliability when reduce cost, and the switching device has been reduced, the path loss has been reduced, can obtain bigger power range.
In a first aspect, an embodiment of the present application provides a scattering parameter measurement circuit, including: the system comprises a coupler, a first switch module, a second switch module and a signal analyzer; the coupler is respectively connected with the first switch module and the second switch module and used for receiving incident signals and transmitting the incident signals to an incident port of the chip to be tested through the first switch module; the coupler is also used for coupling a reflection signal provided by a reflection port of the chip to be tested through the first switch module to generate a coupling reflection signal and transmitting the coupling reflection signal to the second switch module; the signal analyzer is connected with the second switch module and used for calculating scattering parameters according to the power of the coupling reflected signal and the power of the incident signal provided by the second switch module.
In a preferred embodiment of the present application, the coupler is configured to: and generating a coupling reflection signal when the incident port of the chip to be detected is the same as the reflection port of the chip to be detected.
In a preferred embodiment of the present invention, when the incident port of the chip to be tested is different from the reflection port of the chip to be tested, the second switch module is connected to the first switch module, and is configured to receive the reflection signal and provide the reflection signal to the signal analyzer; the signal analyzer is also used for calculating scattering parameters according to the power of the reflected signal and the power of the incident signal.
In a preferred embodiment of the present invention, the first switch module includes: a switching unit configured to: the first end of the first switch module is connected with the through output end of the coupler, and the second end of the first switch module is connected with the input end of the second switch module; a switch array configured to: and the third end of the switch unit and the chip to be tested are connected.
In a preferred embodiment of the present invention, the switch unit includes: a coupling switch configured to: the first end is connected with the through output end of the coupler, and the second end is connected with the switch array; a reflected signal switch configured to: the first end is connected with the switch array, and the second end is connected with the input end of the second switch module.
In a preferred embodiment of the present invention, the switch array includes a plurality of port switches, and the number of the port switches is the same as the number of the ports of the chip to be tested.
In a preferred embodiment of the present invention, the port switch, the coupling switch, the reflection signal switch and the second switch module are all single-pole multi-throw switches.
In a preferred embodiment of the present invention, the scattering parameter measuring circuit further includes: a signal generator configured to: is connected to the input of the coupler for providing an incident signal to the coupler.
In a preferred embodiment of the present invention, the scattering parameter measuring circuit further includes: and the controller is used for providing a switch control signal for the first switch module and the second switch module.
In a second aspect, an embodiment of the present application further provides a radio frequency tester, including: a scattering parameter measurement circuit as claimed in the first aspect.
In the scattering parameter measurement circuit and the radio frequency testing machine provided by the embodiment of the application, the scattering parameter measurement circuit includes: the system comprises a coupler, a first switch module, a second switch module and a signal analyzer; the coupler is respectively connected with the first switch module and the second switch module and used for receiving incident signals and transmitting the incident signals to an incident port of the chip to be tested through the first switch module; the coupler is also used for coupling a reflection signal provided by a reflection port of the chip to be tested through the first switch module to generate a coupling reflection signal and transmitting the coupling reflection signal to the second switch module; the signal analyzer is connected with the second switch module and used for calculating scattering parameters according to the power of the coupling reflected signal and the power of the incident signal provided by the second switch module. The embodiment of the application can generate the coupling reflection signal by coupling the reflection signal corresponding to the incident signal input to the chip to be tested through the coupler arranged on the incident channel, so that the signal analyzer calculates the scattering parameter according to the power of the coupling reflection signal and the power of the incident signal.
Drawings
In order to more clearly illustrate the detailed description of the present application or the technical solutions in the prior art, the drawings needed to be used in the detailed description of the present application or the prior art description will be briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative efforts.
FIG. 1 is a circuit diagram of a scattering parameter measurement circuit of a 4-port chip in the prior art;
fig. 2 is a block diagram of a scattering parameter measurement circuit according to an embodiment of the present disclosure;
fig. 3 is a block diagram of another scattering parameter measurement circuit according to an embodiment of the present disclosure;
fig. 4 is a block diagram of another scattering parameter measurement circuit according to an embodiment of the present disclosure;
fig. 5 is a block diagram of another scattering parameter measurement circuit according to an embodiment of the present disclosure;
fig. 6 is a block diagram of another scattering parameter measurement circuit according to an embodiment of the present disclosure;
fig. 7 is a block diagram of another scattering parameter measurement circuit according to an embodiment of the present disclosure;
fig. 8 is a block diagram of a radio frequency tester according to an embodiment of the present application.
Detailed Description
The technical solutions of the present application will be described clearly and completely with reference to the following embodiments, and it should be understood that the described embodiments are some, but not all embodiments of the present application. All other embodiments obtained by a person of ordinary skill in the art based on the embodiments in the present application without making any creative effort belong to the protection scope of the present application.
Referring to a circuit diagram of a scattering parameter measurement circuit of a 4-port chip shown in fig. 1, in the measurement circuit, a test machine SG is required to generate a single-tone signal as an excitation source, configure and output reasonable power to obtain incident power, echo power is required to be detected through coupling of 4 couplers at four ports (such as port1, port2, port3, and port 4), scattering parameters are calculated, and corresponding S11, S22, S33, and S44 parameters are tested and calculated. This approach requires a coupler to be configured on each channel, which leads to the following three problems:
1. the occupied area of a hardware board card is large, the layout design difficulty is large for a test machine product, the reliability is insufficient, and the implementation is difficult;
2. the cost of the coupler is high;
3. since the coupler provided at each port is required to be used when obtaining the strength of the reflected signal of each channel, the performance characteristics of each coupler have a certain difference, and thus it is difficult to ensure the uniformity of the characteristics of each channel.
Based on this, the embodiment of the application provides a scattering parameter measurement circuit and radio frequency test machine, through the coupler that sets up on incident channel, can couple the reflection signal that the incident signal that inputs to the chip that awaits measuring corresponds and generate the coupling reflection signal to make signal analyzer calculate the scattering parameter according to the power of coupling reflection signal and the power of incident signal, compare in prior art, circuit structure is simple, improve channel characteristic uniformity and reliability when reducing cost, reduced switching device moreover, reduced the path loss, can obtain bigger power range.
Referring to fig. 2, an embodiment of the present application provides a scattering parameter measurement circuit, including: a coupler 11, a first switch module 12, a second switch module 13 and a signal analyzer 14; the coupler 11 is connected to the first switch module 12 and the second switch module 13, respectively, and the signal analyzer 14 is connected to the second switch module 13.
The coupler 11 is configured to receive an incident signal and transmit the incident signal to an incident port of the chip to be tested via the first switch module 12; the coupler 11 is further configured to couple a reflection signal provided by a reflection port of the chip to be tested via the first switch module 12 to generate a coupling reflection signal, and transmit the coupling reflection signal to the second switch module 13; the signal analyzer 14 is configured to calculate a scattering parameter based on the power of the coupled reflected signal and the power of the incident signal provided by the second switching module 13.
In the embodiment of the present application, the coupler 11 has two functions, first: coupling out the incident signal to the first switch module 12 when there is no reflected signal; secondly, the method comprises the following steps: upon receiving the reflected signal, the reflected signal is coupled out to the second switch module 13. The power of the incident signal is stored in the signal analyzer 14 in advance, and the signal analyzer 14 receives only the reflected signal without receiving the incident signal.
The incident signal may be a single tone signal sent by the signal generator to the coupler 11. After an incident signal is transmitted to an incident port of a chip to be detected through the coupler 11 and the first switch module 12, a reflection signal is fed back by a reflection port of the chip to be detected, the reflection signal reaches the coupler 11 through the first switch module 12, the coupler 11 further couples according to the reflection signal to generate a coupling reflection signal, the coupling reflection signal is transmitted to the second switch module 13, the second switch module 13 transmits the coupling reflection signal to the signal analyzer 14, the signal analyzer 14 stores the power of the incident signal in advance, and after the coupling reflection signal fed back by the second switch module 13 is received, a scattering parameter can be calculated according to the power of the coupling reflection signal and the power of the incident signal.
In the scattering parameter measurement circuit that this application embodiment provided, through coupler 11 that sets up on the incident channel, can generate coupling reflection signal with the reflection signal coupling that the incident signal that inputs to the chip that awaits measuring corresponds, so that signal analyzer calculates the scattering parameter according to coupling reflection signal's power and incident signal's power, compare in prior art, circuit structure is simple, improve channel characteristic uniformity and reliability when reduce cost, and switching device has been reduced, the path loss has been reduced, can obtain bigger power range.
The embodiment of the present application further provides another scattering parameter measurement circuit, which is implemented on the basis of the previous embodiment, in this embodiment, the coupler 11 is configured to: when the incident port of the chip to be tested is the same as the reflection port of the chip to be tested, a coupling reflection signal is generated, for example, if the incident signal reaches the incident port1 of the chip to be tested, the incident port1 is simultaneously used as the reflection port to send out a reflection signal, and in this case, the S parameter determined based on the coupling reflection signal generated by the coupler 11 is the scattering parameter (or the return loss) S11; the process of determining parameters such as S22, S33, and S44 corresponding to other ports of the chip to be tested is the same, and will not be described herein again.
For the measurement of the scattering parameters between the ports of the chip to be measured, such as S parameters S12, S21, S32, etc., the following method is implemented in this embodiment:
as shown in fig. 3, when the incident port of the chip to be tested is different from the reflection port of the chip to be tested, the second switch module 13 is connected to the first switch module 12, and the second switch module 13 is configured to receive the reflection signal and provide the reflection signal to the signal analyzer 14; the signal analyzer 14 is also configured to calculate a scattering parameter S based on the power of the reflected signal and the power of the incident signal. For example, the incident signal reaches the incident port1 of the chip to be tested, the port2 of the chip to be tested outputs a reflection signal as a reflection port, the reflection signal passes through the first switch module 12 and the second switch module 13 to reach the signal analyzer 14, and the signal analyzer 14 determines the S12 parameter based on the power of the reflection signal and the power of the incident signal.
The circuit structure of the first switch module 12 in the embodiment of the present application is described in detail below:
referring to fig. 4, the first switch module 12 includes: a switch unit 121 and a switch array 122; the switching unit 121 is configured to: the first end is connected with the through output end of the coupler 11, and the second end is connected with the input end of the second switch module 13; the switch array 122 is configured to: and the third terminal of the switch unit 121 and the chip to be tested are connected. The switch unit 121 is configured to communicate the switch array and the coupler to realize transmission of a reflected signal at the same port, so that the coupler generates a coupled reflected signal; or the switch array and the second switch module are communicated to realize the transmission of the reflected signals of different ports.
Referring to fig. 5, the switching unit 121 includes: a coupling switch 1211 and a reflected signal switch 1212; coupling switch 1211 is configured to: a first terminal is connected to the through output terminal of the coupler 11 and a second terminal is connected to the switch array 122; the reflected signal switch 1212 is configured to: the first terminal is connected to the switch array 122, and the second terminal is connected to the input terminal of the second switch module 13.
The switch array 122 includes a plurality of port switches, and the number of the port switches is the same as the number of the ports of the chip to be tested. For example, the number of ports of the chip to be tested is 4, the number of port switches included in the switch array 122 is also 4, and one port switch is connected to one port of the chip to be tested. The port switch, the coupling switch 1211, the reflection signal switch 1212 and the second switch module 13 are all single-pole multi-throw switches, such as single-pole four-throw switches.
Referring to fig. 6, the scattering parameter measuring circuit further includes: a signal generator 15; the signal generator 15 is configured to: is connected to an input of coupler 11 for providing an incident signal to coupler 11.
In a preferred embodiment of the present invention, the scattering parameter measuring circuit further includes: a controller (not shown); the controller is used for providing a switch control signal for the first switch module and the second switch module. The controller may include, but is not limited to, an FGPA chip or a PC, and is configured to control gating of the active terminal of each single-pole multi-throw switch, that is, which path each switch needs to be connected during S parameter measurement is controlled by a switch signal sent by the controller.
In the embodiment of the application, a coupler is added on a common transmitting path corresponding to a plurality of ports of a chip to be measured, so that the detection of a reflected signal is realized, a scattering parameter is calculated according to the power relation between the power of the reflected signal and the power of an incident signal, the S parameter of each port of the chip to be measured can be measured, and the measurement of more ports and more chips to be measured can be expanded according to requirements. The scattering parameter measuring circuit provided by the embodiment of the application can be conveniently designed into a function expansion board of a radio frequency testing machine.
In the scattering parameter measurement circuit provided in the embodiment of the present application, this compares with the circuit in prior art fig. 1, only set up a coupler on the public incident reflection path that a plurality of ports correspond, through the coupler, the incident path is realized to first switch module, realize the reflection path through first switch module, second switch module, through first switch module, coupler and second switch module, realize the coupling reflection path, through setting up a coupler, can make the channel uniformity of a plurality of ports obtain fine assurance, and coupler and switching device have been reduced, on the one hand, the cost is reduced, on the other hand, the path loss has been reduced, according to output = input power-path loss, so can obtain bigger power range.
Based on the scattering parameter measurement circuit provided in the above embodiment, a schematic diagram of a specific four-port scattering parameter measurement circuit is provided below, and referring to fig. 7, SG denotes a signal generator; SA denotes a signal analyzer; TX IN represents the transmit signal input; RX OUT represents the received signal output; the DUT represents a chip under test.
In this embodiment, the chip to be tested includes four ports, which are respectively: port1, port2, port3, and port4; the first switch module comprises a SW01, a SW02, a SW03, a SW04, a SW05, a SW06 and six single-pole four-throw switches; wherein the SW01, the SW02, the SW03 and the SW04 form a switch array; SW05 and SW06 constitute a switch unit, wherein SW05 is a coupling switch, and SW06 is a reflected signal switch; the second switch module includes SW07 a single pole, four throw switch.
The specific connection relation is as follows, SW01, SW02, SW03 and SW04, the immobile ends of the four single-pole four-throw switches are respectively connected with the port of the chip DUT to be tested; one movable end of each of the four single-pole four-throw switches is connected with one movable end of the SW 05; the other movable ends of the four single-pole four-throw switches are respectively connected with one movable end of the SW 06; the fixed end of the SW05 is connected with the through output end of the coupler; the fixed end of the SW06 is connected with one movable end of the SW 07; the coupling output ends (two downward ports in the figure) of the coupler are connected with the other two movable ends of the SW 07; the input end of the coupler is connected with a signal generator SG; the stationary end of SW07 is connected to a signal analyzer SA.
Based on the circuit structure shown in fig. 7, the following describes in detail the determination process of the scattering parameter S parameter, where the S parameter may include two types, one type is a scattering parameter corresponding to a single port, also called echo loss, such as S11 and S22; the other is the scattering parameter between different ports, such as S12, S24, etc.
The following description will be given by taking the determination parameter S11 as an example:
the incident path is: SG → coupler → SW05 → SW01 → port1 → DUT;
the coupling reflection path is: DUT → port1 → SW01 → SW05 → coupler → SW07 → SA.
The S11 parameter of port1 can be determined from the power in both paths.
The following description will be given by taking the determination parameter S21 as an example:
the incident path is: SG → coupler → SW05 → SW02 → port2 → DUT;
the reflection path is: DUT → port1 → SW01 → SW06 → SW07 → SA.
The S21 parameter between port2 and port1 can be determined according to the power in the two paths.
The embodiment of the application provides a measuring circuit suitable for the S parameter of an ATE tester, which reduces the number of couplers, simplifies the circuit and increases the reliability; the switches are omitted, the path loss is reduced, and a larger power range can be obtained.
As can be seen from a comparison of the schematic diagram of the four-port scattering parameter measurement circuit shown in fig. 7 and the scattering parameter measurement circuit diagram of the 4-port chip shown in fig. 1:
in the embodiment of the application, aiming at the problem that the area of a hardware board card occupied by the coupler configured on each channel is large in the prior art, the layout design difficulty is large for a test machine product, the reliability is insufficient, and the implementation is difficult, the circuit structure is simplified, each channel coupler circuit and one switch are removed firstly, a coupler is added on a common channel with four ports, the reflected signal of a port to be tested is detected, the detection can be realized only through one coupler, and the reliability is enhanced.
Aiming at the problem that the cost of configuring the coupler on each channel is high in the prior art, the embodiment of the application adopts a mode of reducing the circuit scale, combines the coupling circuits, only needs one coupler, and deletes the receiving switch of each channel, so that the cost is greatly reduced.
Aiming at the problem that the consistency of the characteristics of each channel is difficult to ensure by designing a coupler on each channel in the prior art, the coupler is designed on the public transmitting channel of each port in the embodiment of the application, so that the consistency of the channels of each port is well ensured.
Based on the foregoing embodiments of the scattering parameter measurement circuit, the present application further provides a radio frequency tester, as shown in fig. 8, where the radio frequency tester 200 includes: the scattering parameter measurement circuit 100 as described in the previous embodiments.
The implementation principle and the generated technical effects of the radio frequency tester provided in the embodiment of the present application are the same as those of the foregoing embodiments of the scattering parameter measurement circuit, and for the sake of brief description, reference may be made to the corresponding contents in the foregoing embodiments of the scattering parameter measurement circuit where no part of the embodiments of the radio frequency tester is mentioned.
In the description of the present application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present application. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
Finally, it should be noted that: the above-mentioned embodiments are only specific embodiments of the present application, and are used for illustrating the technical solutions of the present application, but not limiting the same, and the scope of the present application is not limited thereto, and although the present application is described in detail with reference to the foregoing embodiments, those skilled in the art should understand that: any person skilled in the art can modify or easily conceive the technical solutions described in the foregoing embodiments or equivalent substitutes for some technical features within the technical scope disclosed in the present application; such modifications, changes or substitutions do not depart from the spirit and scope of the exemplary embodiments of the present application, and are intended to be covered by the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.
Claims (10)
1. A scattering parameter measurement circuit, comprising: the system comprises a coupler, a first switch module, a second switch module and a signal analyzer;
the coupler is respectively connected with the first switch module and the second switch module and used for receiving an incident signal and transmitting the incident signal to an incident port of a chip to be tested through the first switch module;
the coupler is also used for coupling a reflection signal provided by a reflection port of the chip to be tested through the first switch module to generate a coupling reflection signal and transmitting the coupling reflection signal to the second switch module;
the signal analyzer is connected with the second switch module and used for calculating scattering parameters according to the power of the coupling reflected signal and the power of the incident signal, which are provided by the second switch module.
2. The scattering parameter measurement circuit of claim 1, wherein the coupler is configured to:
and generating the coupling reflection signal when the incident port of the chip to be detected is the same as the reflection port of the chip to be detected.
3. The scattering parameter measurement circuit of claim 1, wherein when the incident port of the chip under test is different from the reflection port of the chip under test, the second switch module is connected to the first switch module for receiving the reflection signal and providing the reflection signal to the signal analyzer;
the signal analyzer is further configured to calculate the scattering parameter based on the power of the reflected signal and the power of the incident signal.
4. The scatterometry parameter measurement circuit of any of claims 1-3, wherein the first switching module comprises:
a switching unit configured to: the first end of the first switch module is connected with the through output end of the coupler, and the second end of the first switch module is connected with the input end of the second switch module;
a switch array configured to: and the third end of the switch unit and the chip to be tested are connected.
5. The scattering parameter measurement circuit of claim 4, wherein the switching unit comprises:
a coupling switch configured to: the first end of the switch array is connected with the through output end of the coupler, and the second end of the switch array is connected with the switch;
a reflected signal switch configured to: the first end is connected with the switch array, and the second end is connected with the input end of the second switch module.
6. The scatterometry circuit of claim 5, wherein the switch array comprises a plurality of port switches, the number of the port switches being the same as the number of ports of the chip under test.
7. The scatterometry circuit of claim 6, wherein the port switch, the coupling switch, the reflected signal switch, and the second switch module are single-pole, multi-throw switches.
8. The scattering parameter measurement circuit of any of claims 1-3, further comprising:
a signal generator configured to: is connected to the input of the coupler for providing the coupler with the incident signal.
9. The scattering parameter measurement circuit of any of claims 1-3, further comprising:
a controller for providing a switch control signal to the first switch module and the second switch module.
10. A radio frequency tester, comprising: a scattering parameter measuring circuit as claimed in any of claims 1-9.
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN117310590A (en) * | 2023-11-27 | 2023-12-29 | 上海知白智能科技有限公司 | Verification method, system and device based on testing machine |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN117310590A (en) * | 2023-11-27 | 2023-12-29 | 上海知白智能科技有限公司 | Verification method, system and device based on testing machine |
| CN117310590B (en) * | 2023-11-27 | 2024-02-06 | 上海知白智能科技有限公司 | Verification method, system and device based on testing machine |
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