CN218047453U

CN218047453U - Epoxy AB glue preparation device

Info

Publication number: CN218047453U
Application number: CN202220856787.1U
Authority: CN
Inventors: 高伟清; 杨俊�; 敬文平; 韩玮; 邓国平; 施蕾; 唐迎春
Original assignee: Dongguan Dongyuyang Electronic Technology Development Co ltd
Current assignee: Dongguan Dongyuyang Electronic Technology Development Co ltd
Priority date: 2022-04-13
Filing date: 2022-04-13
Publication date: 2022-12-16
Anticipated expiration: 2032-04-13

Abstract

The utility model discloses an epoxy AB glue preparation device, glue storage unit, drive assembly, stirring portion and stirred tank including mounting bracket, A, B, A glue storage unit with B glues the storage unit and locates respectively the mounting bracket, A glues the storage unit and is equipped with first opening and first discharge gate, B glues the storage unit and is equipped with second opening and second discharge gate, drive assembly warp respectively first opening gets into A glues storage unit and warp the second opening gets into B glues storage unit for order about simultaneously the A agent warp of A gluey storage unit first discharge gate with the B agent warp of B gluey storage unit the second discharge gate flows in the stirred tank, stirring portion is used for right A agent and B agent in the stirred tank stir. This epoxy AB glue preparation device simple structure, ratio are accurate, and can realize the stirring.

Description

Epoxy AB glue preparation device

Technical Field

The utility model relates to a preparation technical field that epoxy AB glued, more specifically relates to a device is prepared to epoxy AB glue.

Background

The epoxy resin AB glue is a two-component high-temperature-resistant adhesive taking epoxy resin as a base, and is mainly suitable for the glue joint of high-temperature-resistant metal, ceramic and the like. When the epoxy resin AB glue is used, the epoxy resin AB glue is prepared and then used, specifically, the glue A and the glue B are mixed and need to be fully and uniformly stirred so as to avoid incomplete curing, and the cured adhesive has high bonding strength, good hardness and certain toughness; the condensate has good acid and alkali resistance, good moisture, water, oil and dust resistance, and good damp and heat resistance and atmospheric aging resistance; has good electrical and physical properties such as insulation, compression resistance, high bonding strength and the like.

At present, the epoxy resin AB glue is mixed manually, 2 units of A glue is poured into a measuring container, 1 unit of B glue is poured into the measuring container, the A/B glue in the container is uniformly stirred by a rod, the resin is poured into a container for fixing components, and the A/B glue is cured. However, the artificial preparation of the epoxy resin A/B adhesive has the following disadvantages: 1. time and labor are consumed; 2. the epoxy resin A/B glue has inaccurate proportion; 3. the epoxy A/B paste may not be uniformly stirred, resulting in poor curing effect.

Therefore, it is necessary to provide an epoxy AB glue dispensing device that can replace manual dispensing of resin to solve the above-mentioned drawbacks.

SUMMERY OF THE UTILITY MODEL

The utility model aims at providing a simple structure, the epoxy AB glue of ratio accurate, stirring prepare the device to improve artifical epoxy AB glue of preparing consuming time power, epoxy AB glue the ratio inaccurate, epoxy AB glue the stirring probably inhomogeneous problem that leads to the solidification effect not good of consuming time.

In order to realize the above-mentioned purpose, the utility model discloses an epoxy AB glue prepares device, glue storage unit, B glue storage unit, drive assembly, stirring portion and stirred tank including mounting bracket, A glue storage unit with B glues the storage unit and locates respectively the mounting bracket, A glues the storage unit and is equipped with first opening and first discharge gate, B glues the storage unit and is equipped with second opening and second discharge gate, drive assembly gets into through first opening respectively A glues the storage unit and gets into through the second opening B glues the storage unit for order about simultaneously A agent that A glued the storage unit through first discharge gate with B agent that B glued the storage unit flows in through the second discharge gate the stirred tank, stirring portion is used for right A agent and B agent in the stirred tank stir.

Compared with the prior art, the epoxy resin AB glue preparation device has the advantages that the agent A is filled into the agent A storage part through the first opening part, the agent B is filled into the agent B storage part through the second opening part, the agent A in the agent A storage part is driven to flow into the stirring tank through the first discharge hole and the agent B in the agent B storage part through the second discharge hole by means of the driving assembly, the agent A and the agent B in the stirring tank are stirred by the stirring part, the agent A and the agent B start to be heated after being mixed, when the temperature reaches the set induction stop temperature, the stirring is stopped, the preparation is completed, and the prepared epoxy resin AB is obtained. This epoxy AB glue preparation device simple structure, ratio are accurate, and can realize the stirring.

Preferably, the driving assembly includes a driving part disposed on the mounting frame, and a first driving part and a second driving part mounted on the driving part, the driving part is operated to move up and down along the mounting frame, the first driving part enters and exits the adhesive storage part a through the first opening part, and the second driving part enters and exits the adhesive storage part B through the second opening part.

Preferably, the first driving member includes a first driving shaft connected to the driving part and a first pressure plate detachably connected to a bottom of the first driving shaft, and the second driving member includes a second driving shaft connected to the driving part and a second pressure plate detachably connected to a bottom of the second driving shaft.

Preferably, the stirring portion includes a support connected to the mounting bracket, a rotating portion connected to the support, and a stirring assembly connected to the rotating portion, the rotating portion drives the stirring assembly to rotate, and the stirring tank is located below the stirring assembly.

Preferably, the support includes connecting portion and lift portion, connecting portion realize the lift portion with the mounting bracket links to each other, the lift portion for connecting portion can reciprocate, the rotating part with the lift portion links to each other.

Preferably, the connecting portion includes a first portion, a second portion and a third portion, one end of the first portion is connected to the mounting bracket, one end of the second portion is connected to the mounting bracket, the third portion is located between the other end of the first portion and the other end of the second portion, and the lifting portion is located in the third portion.

Preferably, the stirring assembly includes a first stirring rod, a second stirring rod and a cross rod, the cross rod is connected with the output end of the rotating part, and the first stirring rod and the second stirring rod are respectively arranged at intervals on the cross rod.

Preferably, the mounting bracket includes work platform and interval locate work platform's first support frame and second support frame, A glues memory part and locates first support frame, B glues memory part and locates the second support frame, the stirred tank is located work platform.

Preferably, the epoxy AB glue preparation device further comprises a temperature sensor located at the stirring portion.

Preferably, the glue storage part A and the glue storage part B are detachably arranged on the mounting frame respectively.

Drawings

Fig. 1 is a perspective view of the epoxy AB glue preparing device of the present invention.

Fig. 2 is a perspective view of a driving assembly in the epoxy AB glue dispensing apparatus shown in fig. 1.

Fig. 3 is a perspective view of a stirring part in the epoxy resin AB glue preparing apparatus shown in fig. 1.

Description of the symbols:

the device comprises a mounting frame 10, a working platform 11, a first support frame 13, a second support frame 15, an A glue storage part 20, a first opening part 21, a B glue storage part 30, a second opening part 31, a driving assembly 40, a driving part 41, a first driving part 43, a first driving shaft 431, a first pressure plate 433, a second driving part 45, a second driving shaft 451, a second pressure plate 453, a stirring part 50, a support 51, a connecting part 511, a first part 5111, a second part 5113, a third part 5115, a lifting part 513, a rotating part 53, a stirring assembly 55, a first stirring rod 551, a second stirring rod 553, a cross rod 555, a stirring groove 60 and a central processing unit 70.

Detailed Description

In order to explain technical contents, structural features, and objects and effects of the present invention in detail, the following description is given in conjunction with the embodiments and the accompanying drawings.

Referring to fig. 1, the present application discloses an epoxy AB adhesive preparation device, which includes a mounting frame 10, an a adhesive storage portion 20, a B adhesive storage portion 30, a driving assembly 40, a stirring portion 50 and a stirring tank 60, the a adhesive storage portion 20 and the B adhesive storage portion 30 are respectively disposed on the mounting frame 10, the a adhesive storage portion 20 is provided with a first opening portion 21 and a first discharge port (not shown), the B adhesive storage portion 30 is provided with a second opening portion 31 and a second discharge port (not shown), the driving assembly 40 respectively enters the a adhesive storage portion 20 through the first opening portion 21 and enters the B adhesive storage portion 30 through the second opening portion 31, the driving assembly is configured to simultaneously drive an a agent of the a adhesive storage portion 20 to flow into the stirring tank 60 through the first discharge port and a B agent of the B adhesive storage portion 30 through the second discharge port, and the stirring portion 50 is configured to stir the a agent and the B agent in the stirring tank 60. According to the epoxy resin AB glue preparation device, the agent A is filled into the agent A storage part 20 through the first opening part 21, the agent B is filled into the agent B storage part 30 through the second opening part 31, the agent A of the agent A storage part 20 is driven to flow into the stirring tank 60 through the first discharge hole and the agent B of the agent B storage part 30 through the second discharge hole by means of the driving assembly 40, the agent A and the agent B in the stirring tank 60 are stirred by the stirring part 50, the agent A and the agent B start to heat up after being mixed, when the temperature reaches the set induction stop temperature, the stirring is stopped, the preparation is completed, and the prepared epoxy resin AB is obtained. This epoxy AB glue preparation device simple structure, ratio are accurate, and can realize the stirring.

Referring to fig. 1, the mounting frame 10 includes a working platform 11, a first supporting frame 13 and a second supporting frame 15 disposed on the working platform 11 at an interval, an a glue storage portion 20 disposed on the first supporting frame 13, a b glue storage portion 30 disposed on the second supporting frame 15, and a stirring tank 60 disposed on the working platform 11. In this embodiment, the first support frame 13 and the second support frame 15 are arranged on the working platform 11 in parallel and at intervals, the a glue storage part 20 is arranged on the first support frame 13, the B glue storage part 30 is arranged on the second support frame 15, the a glue storage part 20 and the B glue storage part 30 are arranged between the first support frame 13 and the second support frame 15, and the stirring part 50 is arranged on one of the first support frame 13 and the second support frame 15. The agitation tank 60 is located below the agitation portion 50. Preferably, the stirring tank 60 is detachably mounted on the working platform 11, so that the stirring tanks 60 with different diameters can be replaced conveniently, and the application range is widened.

Referring to fig. 2, the driving assembly 40 includes a driving part 41 disposed on the mounting frame 10, and a first driving part 43 and a second driving part 45 mounted on the driving part 41, wherein the driving part 41 is operated to move up and down along the mounting frame 10, the first driving part 43 enters and exits the a glue storage part 20 through the first opening part 21, and the second driving part 45 enters and exits the B glue storage part 30 through the second opening part 31. In this embodiment, the driving part 41 is located between the first support frame 13 and the second support frame 15, the driving part 41 can move up and down between the first support frame 13 and the second support frame 15, and the driving part 41 synchronously drives the first driving part 43 and the second driving part 45 to respectively extend into or withdraw from the a glue storage part 20 and the B glue storage part 30 because the first driving part 43 and the second driving part 45 are arranged at the driving part 41 at intervals. Further, the first driving member 43 includes a first driving shaft 431 connected to the driving part 41 and a first pressure plate 433 detachably connected to a bottom of the first driving shaft 431, and the second driving member 45 includes a second driving shaft 451 connected to the driving part 41 and a second pressure plate 453 detachably connected to a bottom of the second driving shaft 451. It is understood that the first platen 433 is sized to fit the a-paste reservoir 20, and the second platen 453 is sized to fit the B-paste reservoir 30. And the first pressure plate 433 is detachably connected with the first driving shaft 431, and the second pressure plate 453 is detachably connected with the second driving shaft 451, so that the pressure plates are convenient to replace. Preferably, the material of the first pressure plate 433 and the second pressure plate 453 is a rubber material, but is not limited thereto.

Referring to fig. 3, the stirring part 50 includes a bracket 51 connected to the mounting bracket 10, a rotating part 53 connected to the bracket 51, and a stirring assembly 55 connected to the rotating part 53, wherein the rotating part 53 drives the stirring assembly 55 to rotate, and the stirring tank 60 is located below the stirring assembly 55. Further, the holder 51 includes a connection portion 511 and an elevating portion 513, the connection portion 511 connects the elevating portion 513 to the mounting frame 10, the elevating portion 513 is vertically movable with respect to the connection portion 511, and the rotation portion 53 is connected to the elevating portion 513. Still further, the connection portion 511 includes a first portion 5111, a second portion 5113, and a third portion 5115, the mounting frame 10 is connected to one end of the first portion 5111, the mounting frame 10 is connected to one end of the second portion 5113, the third portion 5115 is located between the other end of the first portion 5111 and the other end of the second portion 5113, and the lifting portion 513 is provided to the third portion 5115. The first portion 5111 and the second portion 5113 extend in the direction of the stirring tank 60, so that the rotating portion 53 and the stirring unit 55 can be easily attached, and stirring can be facilitated. It should also be understood that the lifting part 513 can drive the rotating part 53 to move up and down, and the rotating part 53 can drive the stirring component 55 to rotate, so that the lifting part 513 can drive the stirring component 55 to move up and down for uniform stirring. More preferably, the stirring assembly 55 includes a first stirring rod 551, a second stirring rod 553 and a cross bar 555, the cross bar 555 is connected to the output end of the rotating portion 53, and the first stirring rod 551 and the second stirring rod 553 are respectively arranged at intervals on the cross bar 555. The agent A and the agent B in the agitation tank 60 are agitated by the first agitation rod 551 and the second agitation rod 553 arranged in parallel, and the agitation uniformity can be improved.

Referring to fig. 1, the adhesive a storage part 20 and the adhesive B storage part 30 are detachably disposed on the mounting frame 10, respectively, so that the adhesive a storage part 20 and the adhesive B storage part 30 can be conveniently mounted and dismounted, and the cleaning and resin adding are convenient. In this embodiment, the a glue storage part 20 is detachably disposed on the first support frame 13, the B glue storage part 30 is detachably disposed on the second support frame 15, and the first discharge port and the second discharge port are disposed close to each other, so as to ensure that the a glue and the B glue can fall into the stirring tank 60 below after flowing out. Preferably, the a glue reservoir 20 has a diameter 2 times larger than the B glue reservoir 30.

Referring to fig. 1, the epoxy AB glue preparing apparatus further includes a temperature sensor (not shown) located at the stirring portion 50 for sensing a temperature below the stirring portion 50. Preferably, a temperature sensor is provided at the bottom of the rotating part 53, a sensing stop temperature is set, the agent a and the agent B start to increase in temperature after mixing, and when the temperature reaches the set sensing stop temperature, the stirring is stopped. More preferably, a central processing unit 70 is provided, and the central processing unit 70 can control the pressing amount of the driving assembly 40 and the stirring speed and time of the stirring part 50, and also can control the temperature sensor according to the set required resin capacity, thereby realizing the automatic preparation of the epoxy resin AB glue.

The working principle of the present invention is explained in detail below with reference to fig. 1 to 3:

the first pressing plate 433 and the second pressing plate 453 are driven by the driving part 41 to ascend to be away from the glue A storage part 20 and the glue B storage part 30 respectively, the agent A and the agent B are poured into the glue A storage part 20 and the glue B storage part 30 respectively, and the first pressing plate 433 and the second pressing plate 453 are driven by the driving part 41 to descend to extend into the glue A storage part 20 and the glue B storage part 30 respectively until the agent A and the agent B in the glue A storage part 20 and the glue B storage part 30 respectively flow into the stirring tank 60 below through the first discharge hole and the second discharge hole;

the lifting part 513 drives the rotating part 53 and the stirring assembly 55 to descend until the first stirring rod 551 and the second stirring rod 553 stretch into the stirring tank 60 below, then the rotating part 53 drives the first stirring rod 551 and the second stirring rod 553 to rotate, the agent A and the agent B in the stirring tank 60 are stirred, the agent A and the agent B are mixed and then start to rise in temperature, when the temperature reaches the sensing stop temperature set by the temperature sensor, the rotating part 53 stops rotating, the lifting part 513 drives the rotating part 53 and the stirring assembly 55 to rise until the first stirring rod 551 and the second stirring rod 553 leave the stirring tank 60, and the complete epoxy resin AB adhesive is prepared.

The above disclosure is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the scope of the invention, therefore, the invention is not limited thereto.

Claims

1. The utility model provides an epoxy AB glues and prepares device, its characterized in that glues storage unit, B including mounting bracket, A glue storage unit, B and glues storage unit, drive assembly, stirring portion and stirred tank, A glue storage unit with B glues the storage unit and locates respectively the mounting bracket, A glues storage unit and is equipped with first opening and first discharge gate, B glues storage unit and is equipped with second opening and second discharge gate, drive assembly passes through respectively first opening gets into A glues storage unit and warp the second opening gets into B glues storage unit for order about simultaneously the A agent warp of A gluey storage unit first discharge gate with the B agent warp of B gluey storage unit the second discharge gate flows into the stirred tank, stirring portion is used for right A agent and B agent in the stirred tank stir.

2. The epoxy AB glue preparation device of claim 1, wherein the driving assembly includes a driving portion disposed on the mounting frame, and a first driving member and a second driving member mounted on the driving portion, the driving portion being operable to move up and down along the mounting frame, the first driving member passing through the first opening portion and entering and exiting the A glue storage portion, the second driving member passing through the second opening portion and exiting the B glue storage portion.

3. The epoxy AB glue dispensing apparatus of claim 2, wherein the first drive member includes a first drive shaft coupled to the drive portion and a first platen removably coupled to a bottom portion of the first drive shaft, and the second drive member includes a second drive shaft coupled to the drive portion and a second platen removably coupled to a bottom portion of the second drive shaft.

4. The epoxy AB glue preparation device of claim 1, wherein the stirring portion includes a bracket connected to the mounting bracket, a rotating portion connected to the bracket, and a stirring assembly connected to the rotating portion, the rotating portion drives the stirring assembly to rotate, and the stirring tank is located below the stirring assembly.

5. The epoxy AB glue dispensing apparatus of claim 4, wherein the stand includes a connection portion and a lifting portion, the connection portion enabling the lifting portion to be connected to the mounting bracket, the lifting portion being movable up and down relative to the connection portion, the rotation portion being connected to the lifting portion.

6. The epoxy AB glue formulation device of claim 5, wherein the connection portion includes a first portion, a second portion, and a third portion, one end of the first portion is connected to the mounting bracket, one end of the second portion is connected to the mounting bracket, the third portion is located between the other end of the first portion and the other end of the second portion, and the lifting portion is located in the third portion.

7. An epoxy AB glue preparation apparatus as in claim 4 wherein the stirring assembly includes a first stirring rod, a second stirring rod and a cross bar, the cross bar is connected to the output end of the rotating portion, and the first stirring rod and the second stirring rod are respectively disposed at intervals on the cross bar.

8. The epoxy resin AB glue preparation device of claim 1, wherein the mounting bracket includes a work platform, and a first support frame and a second support frame spaced apart from each other on the work platform, the A glue storage portion is disposed on the first support frame, the B glue storage portion is disposed on the second support frame, and the stirring tank is disposed on the work platform.

9. The epoxy AB glue dispensing apparatus of claim 1, further comprising a temperature sensor located in the stirring section.

10. The epoxy AB glue dispensing apparatus of claim 1, wherein the glue A reservoir and the glue B reservoir are each detachably mounted to the mounting bracket.