CN218041738U - Echo eliminating structure of bone conduction earphone - Google Patents

Echo eliminating structure of bone conduction earphone Download PDF

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Publication number
CN218041738U
CN218041738U CN202222114679.XU CN202222114679U CN218041738U CN 218041738 U CN218041738 U CN 218041738U CN 202222114679 U CN202222114679 U CN 202222114679U CN 218041738 U CN218041738 U CN 218041738U
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bone conduction
earphone
sound
echo cancellation
hole
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CN202222114679.XU
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Chinese (zh)
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毛华生
马浩
盖伟东
黄顺意
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Dongguan Liesheng Electronic Co Ltd
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Dongguan Liesheng Electronic Co Ltd
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Abstract

The utility model discloses a structure is eliminated to bone conduction headset's echo, include: earphone core, this earphone core includes: casing and oscillator unit, the casing include the holding cavity that is formed by protecgulum and back lid mutually supporting, the oscillator unit install in the holding cavity, the oscillator unit turns into mechanical vibration with the signal of telecommunication, makes the contact area who is located earphone core front surface produce the bone conduction sound under the oscillator unit effect, the rear surface of back lid on set up the sound receiving hole with the outside intercommunication of earphone core, the inner wall shaping of back lid has a mounting groove that communicates with the sound receiving hole, a sound receiving unit is fixed through sealed encapsulation and is in the mounting groove. The utility model adopts the above technical scheme after, can effectual reduction echo noise.

Description

Echo eliminating structure of bone conduction earphone
The technical field is as follows:
the utility model relates to a bone conduction earphone product technical field refers in particular to an echo elimination structure of bone conduction earphone.
Background art:
as shown in fig. 1, current bone conduction headsets generally include: the mobile phone comprises a machine core part 10, a control part 11 and a rear hook 13, wherein the machine core part 10 is connected with the control part 11 through an ear hook part 12. The ear-hook part 12 not only plays a role of connection, but also is internally provided with a control circuit for realizing circuit connection between the machine core part 10 and the control part 11. The core part 10 is used as a core part of the bone conduction earphone, a vibrator unit is arranged in the core part, the front end of the core part 10 is provided with a contact area 100 contacted with the skin of the head of a user, when the earphone is used, the ear-hang part 12 of the contact area 100 forms a clamping force to be contacted with the skin of the head of a human body, the vibrator unit converts an audio frequency electric signal into mechanical vibration, the vibration generated by the vibrator unit is conducted to the user through the contact area 20, so that bone conduction sound is generated, and the user finally receives corresponding sound through bone conduction.
What has been described above is the principle of the output sound of the bone conduction headset, the received sound of which is still received directly by the microphone. Generally, an acoustic hole is formed in the core 10, a microphone is disposed in the inner space of the core 10, and external sound is received by the microphone after passing through the acoustic hole. Since the vibration generated by the vibrator unit inevitably generates sound wave vibration when the bone conduction earphone works, and since the microphone for sound reception and the vibrator unit are both installed in the inner cavity of the machine core part 10, the microphone can easily receive the sound wave generated by the vibrator unit, so that a user can listen to not only the sound of a call object but also own sound to generate echo noise when the bone conduction earphone is used for communication.
In order to overcome the echo noise of the bone conduction headset, manufacturers have adopted various methods to cancel the echo, such as processing through various algorithms. See the Chinese patent literature number: CN113676816A discloses "an echo cancellation method for bone conduction earphones", in which a main microphone and an auxiliary microphone are disposed in the bone conduction earphones, and echo noise is cancelled by a certain algorithm.
The existing common technologies for eliminating echo through an algorithm mostly adopt An Echo Cancellation (AEC) technology and a Noise Reduction (NR) technology, and for eliminating echo on a structural level, the technology is limited by the internal space of a core in a bone conduction headset, so that the improvement is not great, and the echo cancellation effect is not good. In view of the above, the present inventors propose the following technical solutions by reasonably designing the internal structure of the bone conduction movement.
The utility model has the following contents:
the utility model aims to solve the technical problem that the echo cancellation structure of bone conduction earphone is provided, which is not enough to overcome the prior art.
In order to solve the technical problem, the utility model adopts the following technical scheme: an echo cancellation structure of a bone conduction headset, comprising: earphone core, this earphone core includes: casing and oscillator unit, the casing include the holding cavity that is formed by protecgulum and back lid mutually supporting, the oscillator unit install in the holding cavity, the oscillator unit turns into mechanical vibration with the signal of telecommunication, makes the contact area who is located earphone core front surface produce the bone conduction sound under the oscillator unit effect, the rear surface of back lid on set up the sound receiving hole with the outside intercommunication of earphone core, the inner wall shaping of back lid has a mounting groove that communicates with the sound receiving hole, a sound receiving unit is fixed through sealed encapsulation and is in the mounting groove.
Further, in the above technical solution, the rear cover includes: a main body part matched with the front cover and a connecting part connected with other parts of the earphone, wherein the connecting part is provided with a connecting pipe for inserting the earphone lead group.
Furthermore, in the above technical solution, the accommodating cavity is formed by matching the main body part and the front cover.
Further, in the above technical solution, the sound receiving hole is opened in the connecting portion.
Further, in the above technical solution, the mounting groove is located in the connecting pipe of the connecting portion.
Further, in the above technical solution, the lead group includes: the device comprises a vibrator wire harness connected with the vibrator unit and a radio wire harness connected with the radio unit, wherein the vibrator wire harness and the radio wire harness are independent from each other and adopt multi-core shielding wire harnesses.
Furthermore, in the above technical solution, a plastic layer is disposed outside the rear cover, an outer through hole is disposed on the plastic layer at a position corresponding to the sound outlet hole, and a sealing ring is disposed in the interlayer between the plastic layer and the rear cover, around the outer through hole and the sound outlet hole.
Further, in the above technical solution, the sound receiving unit includes: microphone, circuit board, baffle and the cotton subassembly of bubble, microphone electric connection in circuit board below, baffle and the cotton subassembly of bubble superpose in proper order and are located the circuit board top to the cotton subassembly of bubble is pasted and is leaned on the inner wall at the receipts hole, offers the through-hole that corresponds with the receipts hole on circuit board and the baffle.
Further, in the above technical solution, the foam assembly includes: the foam body, an upper clamping plate and a lower clamping plate which clamp the foam body up and down are provided with through holes corresponding to the sound receiving holes.
Further, in the above technical solution, the circuit board is an FPC flexible circuit board.
After the technical scheme is adopted, compared with the prior art, the utility model has following beneficial effect:
at first, the utility model discloses rational design earphone core's inner space separately places oscillator unit and radio reception unit, and the two all has relatively independent space, keeps apart the two from the space, avoids the radio reception unit to receive the interference of oscillator unit.
Secondly, the utility model is used for the mounting groove of installation radio reception unit is covered after by and is used for earphone wire group to stretch into the connecting portion in, and its cavity apart from the oscillator unit is far away to whole radio reception unit is encapsulated in the mounting groove, forms effective isolation with the oscillator unit. In addition, this use is novel still to carry out effectual sealed processing to radio reception hole department, ensures the gas tightness of whole radio reception unit.
Finally, in order to further avoid the crosstalk of signal, the utility model discloses with oscillator pencil and radio reception pencil mutual independence to adopt the shielded wire, form the shielding layer through the weaving of multicore shielded wire, avoid the signal crosstalk between oscillator pencil and the radio reception pencil, further reduce the echo noise.
To sum up, the utility model adopts the above technical scheme after, can effectual reduction echo noise, the algorithm of making an uproar that makes an uproar is eliminated and falls in the recombination echo again, reduction user conversation sound that can the at utmost.
Description of the drawings:
fig. 1 is a perspective view of a conventional bone conduction headset;
fig. 2 is a perspective view of the present invention;
FIG. 3 is a longitudinal sectional view taken along the sound outlet in FIG. 2;
fig. 4 is a perspective view of the middle and rear covers of the present invention;
FIG. 5 is a perspective view of the radio unit of the present invention;
fig. 6 is an exploded perspective view of the radio unit of the present invention.
The specific implementation mode is as follows:
the present invention will be further described with reference to the following specific embodiments and accompanying drawings.
As shown in fig. 2 to 4, the utility model relates to an echo cancellation structure of bone conduction earphone, which comprises: an earphone core 2. The earphone core 2 comprises: a housing 3 and a vibrator unit 4. The housing 3 includes a containing cavity 30 formed by a front cover 31 and a rear cover 32 which are matched with each other, and the vibrator unit 4 is installed in the containing cavity 30 through a bracket of the vibrator unit. The vibrator unit 4 converts the electrical signal into mechanical vibration, so that the contact area 20 on the front surface of the earphone core 2 generates bone conduction sound under the action of the vibrator unit 4.
The rear cover 32 of the housing 3 includes: a main body 321 and a connecting portion 322, wherein the main body 321 is used for cooperating with the front cover 31 to form the accommodating space 30. The connection part 322 is used for connecting with an ear hook component in the bone conduction headset, and the connection part 322 is provided with a connection pipe 3220 for inserting the headset wire set 7. The connecting portion 322 is tubular and may be integrally injection molded with the main body portion 321.
As shown in fig. 3 and 4, a mounting groove 320 is formed at a position of the connecting tube 3220 close to the connecting portion 322, and a sound receiving hole 21 communicated with the outside of the earphone core 2 is formed at the bottom of the mounting groove 320. The mounting groove 320 is used for mounting the sound receiving unit 5. The accommodating cavity 30 is formed by a main body 321 and a front cover 31.
The mounting groove 320 is located in the connecting portion 322 of the rear cover 32, and is relatively independent from the accommodating space 30 for accommodating the vibrator unit 4, so that the sound receiving unit 5 and the vibrator unit 4 have a longer distance, thereby reducing interference of sound waves generated by the vibrator unit 4 during operation on the sound receiving unit 5. Meanwhile, the sound receiving hole 21 is formed in the connecting part 322, and the distribution positions of the contact areas 20 of the earphone core 2 are opposite, so that the interference possibly suffered by the sound receiving hole 21 is further reduced.
In order to further ensure the air tightness of the sound receiving unit 5, and at the same time, the sound receiving unit 5 is fixed in the mounting groove 320, and the sound receiving unit 5 is directly packaged and fixed in the mounting groove 320 by sealant.
In addition, for the pleasing to the eye and the wearing comfort of product, can wrap one deck plastic layer 6 in earphone core 2's outside usually, this plastic layer 6 adopts silica gel material usually, for example on the protecgulum 31 surface of earphone, the rear side surface of back lid 32 all is provided with plastic layer 6, and outer through-hole 61 has been seted up to the position that corresponds sound hole 21 on this plastic layer 6. An interlayer space is formed between the plastic layer 6 and the outer surface of the rear cover 32 to ensure the air tightness of the whole radio unit 5, a sealing ring 60 is arranged in the interlayer between the plastic layer 6 and the rear cover 32 and around the outer through hole 61 and the sound outlet hole 21, and the air tightness between the outer through hole 61 and the sound outlet hole 21 can be effectively ensured through the sealing ring 60.
As shown in fig. 5 and fig. 6, the sound receiving unit 5 includes: the microphone comprises a microphone 51, a circuit board 52, a partition plate 53 and a foam component 54, wherein the microphone 41 is electrically connected below the circuit board 52, the partition plate 53 and the foam component 54 are sequentially superposed above the circuit board 52, the foam component 54 is attached to the inner wall of the sound receiving hole 21, and through holes corresponding to the sound receiving hole 21 are formed in the circuit board 52 and the partition plate 53.
The foam assembly 54 includes: the foam body 541, the upper clamp plate 542 and the lower clamp plate 543 for clamping the foam body 541 from top to bottom, and through holes corresponding to the acoustic holes 21 are opened on the upper and lower clamp plates. The upper and lower clamping plates can clamp and fix the foam surface body 541, and can avoid gaps formed by micropores of the foam surface body 541.
The circuit board 52 adopts an FPC flexible circuit board, and the foam component 54 and the partition plate 53 are fixedly adhered on the circuit board 52.
Through the structure, the whole sound receiving unit 5 forms a relatively independent and sealed unit, and after the sound receiving unit 5 is fixed in the mounting groove 320 through the sealant, the whole sound receiving unit 5 is packaged.
On the other hand, in order to avoid the interference among the signal transmission processes, the utility model discloses the wire group to bone conduction earphone has also been handled. As shown in fig. 3, the wire group 7 extends into the earphone core 2 from the connecting tube 3220, and the wire group 7 includes: the transducer comprises a transducer wire bundle 71 connected with the transducer unit 4 and a sound receiving wire bundle 72 connected with the sound receiving unit 5, wherein the transducer wire bundle 71 and the sound receiving wire bundle 72 are independent from each other and adopt multi-core shielding wire bundles. The shielding layer is formed by weaving the multi-core shielding wire, so that signal crosstalk between the oscillator wire harness and the radio wire harness is avoided, and echo noise is further reduced.
To sum up, the utility model adopts the above technical scheme after, can effectual reduction echo noise, the algorithm of making an uproar that makes an uproar is eliminated and falls in the recombination echo again, reduction user conversation sound that can the at utmost.
Of course, the above description is only for the specific embodiment of the present invention and is not intended to limit the scope of the present invention, and all equivalent changes or modifications made by the structure, characteristics and principles according to the claims of the present invention should be included in the claims of the present invention.

Claims (10)

1. An echo cancellation structure of a bone conduction headset, comprising: earphone core, this earphone core includes: casing and oscillator unit, the casing include the holding cavity that is mutually supported and forms by protecgulum and back lid, the oscillator unit install in the holding cavity, the oscillator unit turns into mechanical vibration with the signal of telecommunication, makes the contact area who is located earphone core front surface produce bone conduction sound, its characterized in that under the oscillator unit effect:
the earphone is characterized in that a sound receiving hole communicated with the outside of the earphone core is formed in the rear surface of the rear cover, a mounting groove communicated with the sound receiving hole is formed in the inner wall of the rear cover, and a sound receiving unit is packaged and fixed in the mounting groove through sealant.
2. The echo cancellation structure for a bone conduction earphone according to claim 1, wherein: the back cover includes: a main body part matched with the front cover and a connecting part connected with other parts of the earphone, wherein the connecting part is provided with a connecting pipe for inserting the earphone wire group.
3. The echo cancellation structure of a bone conduction headset according to claim 2, wherein: the accommodating cavity is formed by matching a main body part and a front cover.
4. The echo cancellation structure of a bone conduction headset according to claim 2, wherein: the sound receiving hole is formed in the connecting portion.
5. The echo cancellation structure for a bone conduction earphone according to claim 2, wherein: the mounting groove is positioned in the connecting pipe of the connecting part.
6. The echo cancellation structure of a bone conduction headset according to claim 2, wherein: the wire group includes: the device comprises a vibrator wire bundle connected with the vibrator unit and a sound reception wire bundle connected with the sound reception unit, wherein the vibrator wire bundle and the sound reception wire bundle are independent from each other and adopt multi-core shielding wire bundles.
7. The echo cancellation structure of a bone conduction headset according to claim 1, wherein: the back cover is externally provided with a plastic layer, an outer through hole is formed in the position, corresponding to the sound outlet hole, of the plastic layer, and a sealing ring is arranged in the interlayer between the plastic layer and the back cover, surrounds the outer through hole and the sound outlet hole.
8. The echo cancellation structure of a bone conduction headset according to any one of claims 1 to 7, wherein: the sound receiving unit comprises: microphone, circuit board, baffle and the cotton subassembly of bubble, microphone electric connection in circuit board below, baffle and the cotton subassembly of bubble superpose in proper order and are located the circuit board top to the cotton subassembly of bubble pastes and leans on the inner wall at the acoustic hole, sets up the through-hole that corresponds with the acoustic hole on circuit board and the baffle.
9. The echo cancellation structure of a bone conduction headset according to claim 8, wherein: the foam assembly comprises: the device comprises a foam body, an upper clamping plate and a lower clamping plate which clamp the foam body up and down, wherein through holes corresponding to the acoustic holes are formed in the upper clamping plate and the lower clamping plate.
10. The echo cancellation structure of a bone conduction headset according to claim 8, wherein: the circuit board adopts an FPC flexible circuit board.
CN202222114679.XU 2022-08-11 2022-08-11 Echo eliminating structure of bone conduction earphone Active CN218041738U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202222114679.XU CN218041738U (en) 2022-08-11 2022-08-11 Echo eliminating structure of bone conduction earphone

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202222114679.XU CN218041738U (en) 2022-08-11 2022-08-11 Echo eliminating structure of bone conduction earphone

Publications (1)

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CN218041738U true CN218041738U (en) 2022-12-13

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116456236A (en) * 2023-02-16 2023-07-18 东莞市猎声电子科技有限公司 Oscillator wire shielding low-echo howling type bone conduction earphone and low-echo howling method thereof

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116456236A (en) * 2023-02-16 2023-07-18 东莞市猎声电子科技有限公司 Oscillator wire shielding low-echo howling type bone conduction earphone and low-echo howling method thereof
WO2024169104A1 (en) * 2023-02-16 2024-08-22 东莞市猎声电子科技有限公司 Low-echo-howling type bone conduction earpiece using vibrator wire shielding, and low-echo-howling method thereof

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