CN218041633U - Mainboard mounting structure and terminal equipment - Google Patents
Mainboard mounting structure and terminal equipment Download PDFInfo
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- CN218041633U CN218041633U CN202222386289.8U CN202222386289U CN218041633U CN 218041633 U CN218041633 U CN 218041633U CN 202222386289 U CN202222386289 U CN 202222386289U CN 218041633 U CN218041633 U CN 218041633U
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- heat
- main board
- guide rail
- mainboard
- middle frame
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Abstract
The utility model discloses a mainboard mounting structure and terminal equipment, wherein, mainboard mounting structure includes the casing, mainboard and guide rail structure, the casing includes the center and locates two lids of two openings parts at center both ends, the internal face of center is including being two installation wall of relative setting and being two heat dissipation wall of relative setting, at least one of them is for pasting the heat dissipation wall of two heat dissipation walls, be equipped with heat-conducting glue on the mainboard, guide rail structure includes sideslip guide rail structure and lifting guide rail structure, sideslip guide rail structure locates on two installation wall of center, in inserting the center with the guide mainboard, lifting guide rail structure locates on two lids, it connects the heat dissipation wall activity to be close to pasting with two tip of guide mainboard, so that heat-conducting glue can be close to pasting the heat dissipation wall, through sideslip guide rail structure and lifting guide rail structure, existing be favorable to installing heat-conducting glue in predetermineeing the position, again can arrive before predetermineeing the position at heat-conducting glue, make heat-conducting glue not contact with the internal face of center.
Description
Technical Field
The utility model relates to a terminal equipment technical field, in particular to mainboard mounting structure and terminal equipment.
Background
Customer end Equipment (Customer Premise Equipment, CPE) is a wireless broadband access Equipment, along with terminal Equipment such as router towards high performance, integrate, frivolousization direction is constantly upgraded, make terminal Equipment's calorific capacity increase by a wide margin, for this reason, through setting up heat-conducting glue at the mainboard in the current product, and heat-conducting glue pastes with the casing and connects, make the heat on the mainboard can transmit through the casing and give off, so that satisfy the heat dissipation requirement of mainboard under the prerequisite that reduces the casing size, but when installing the mainboard in the casing, heat-conducting glue on the mainboard can not contact with the casing, only when heat-conducting glue is in corresponding default position, heat-conducting glue just can paste with the casing, so how prevent in the mainboard installation that heat-conducting glue and casing contact be a problem that needs to solve urgently.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing a mainboard mounting structure and terminal equipment aims at solving the problem that how to prevent to conduct heat in the mainboard installation and glue and the contact of casing.
In order to achieve the above object, the utility model provides a mainboard mounting structure, include:
the heat dissipation device comprises a shell, a heat dissipation device and a control device, wherein the shell comprises a middle frame and two cover bodies arranged at two openings at two ends of the middle frame, the inner wall surface of the middle frame comprises two installation wall surfaces which are oppositely arranged and two heat dissipation wall surfaces which are oppositely arranged, and at least one of the two heat dissipation wall surfaces is an attached heat dissipation wall surface;
the main board is provided with heat conducting glue; and the number of the first and second groups,
the guide rail structure comprises a transverse moving guide rail structure and a lifting guide rail structure, the transverse moving guide rail structure is arranged on two installation walls of the middle frame to guide the mainboard to be inserted into the middle frame, the lifting guide rail structure is arranged on the cover body to guide the two end parts of the mainboard to be close to the pasting heat dissipation wall surfaces to move, so that the heat conducting glue can be close to the pasting heat dissipation wall surfaces.
Optionally, the traverse guide structure includes two first guide rails provided on the two mounting wall surfaces, respectively, and the first guide rails extend in the extending direction of the middle frame.
Optionally, the lifting guide rail structure includes a second guide rail disposed on the cover body, the second guide rail is provided with a lifting inclined plane disposed in an inclined manner, and the inclined direction of the second guide rail is from the inner side of the cover body to the outer side of the cover body, toward the direction of the attached heat dissipation wall surface.
Optionally, a slot for inserting the motherboard is formed in one side of the cover body facing the middle frame.
Optionally, the lid orientation center one side interval is provided with two card muscle, the mainboard card is located two between the card muscle.
Optionally, two the card muscle is the one-to-one and sets up to the joint group, the joint group sets up a plurality ofly, and is a plurality of the joint group interval is located the lid.
Optionally, a limiting rib is arranged on the inner wall surface of the middle frame in a protruding mode, and the limiting rib is used for being abutted to the main board.
Optionally, a plurality of the main boards are arranged at intervals, and the plurality of the main boards comprise heating main boards;
the heat conducting glue is arranged on the heating main board.
Optionally, the cover body is detachably mounted to the middle frame.
Furthermore, the utility model also provides a terminal equipment, a serial communication port, terminal equipment includes foretell mainboard mounting structure.
The technical scheme of the utility model in, through center and two the lid to form a confined installation cavity, for the mainboard installation, through setting up sideslip guide rail structure, so that the mainboard is placed in under the action of gravity sideslip guide rail structure, just sideslip guide rail structure with the distance that pastes the heat dissipation wall is greater than the mainboard with the thickness that the heat conduction was glued, in order to avoid with the mainboard inserts the casing in-process, the heat conduction glue with the internal face contact of casing simultaneously through setting up lifting guide rail structure, so that the mainboard is close to paste the heat dissipation wall reduces the heat conduction glue with paste the distance that connects the heat dissipation wall, so that the heat conduction glue removes to predetermineeing the position, and when the heat conduction glue removes to predetermined position top, overturn the casing, so that the mainboard can paste under the effect of gravity connect the heat dissipation wall again, thereby will the mainboard install in the casing, so pass through sideslip guide rail structure with, both do benefit to with the heat conduction glue install in predetermineeing the position, so that the mainboard, heat conduction glue reachs and predetermineeing before predetermineeing the position, the internal face contact with the heat conduction frame is not installed in the casing, thereby the heat conduction glue the prerequisite can not contact with the mainboard.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the embodiments or the prior art descriptions will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
Fig. 1 is a schematic perspective view of an embodiment of a motherboard mounting structure provided in the present invention;
FIG. 2 is a schematic top view of the motherboard mounting structure of FIG. 1;
FIG. 3 isbase:Sub>A schematic cross-sectional view of the motherboard mounting structure of FIG. 2 taken along the direction A-A;
FIG. 4 is a schematic cross-sectional view of the motherboard mounting structure of FIG. 2 taken along the direction B-B;
FIG. 5 is a schematic perspective view of the middle frame in FIG. 1;
FIG. 6 is a cross-sectional structural view of the middle frame in FIG. 1;
fig. 7 is a schematic perspective view of the cover in fig. 1;
fig. 8 is a schematic front view of the cover in fig. 1;
fig. 9 is a schematic cross-sectional structure view of the cover in fig. 1.
The reference numbers illustrate:
| reference numerals | Name (R) | Reference numerals | Name(s) |
| 100 | |
22 | Mounting post |
| 1 | Shell body | 3 | |
| 11 | |
31 | Sideslip |
| 111 | Heat |
311 | |
| 112 | |
32 | Lifting |
| 12 | |
321 | |
| 121 | |
4 | Clamping |
| 122 | Via |
5 | |
| 2 | |
6 | Heat-conducting |
| 21 | |
7 | Fixing frame |
The objects, features and advantages of the present invention will be further described with reference to the accompanying drawings.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
It should be noted that, if the present invention relates to a directional indication, the directional indication is only used to explain the relative position relationship between the components, the motion situation, etc. in a specific posture, and if the specific posture is changed, the directional indication is changed accordingly.
In addition, if there is a description relating to "first", "second", etc. in the embodiments of the present invention, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, the technical solutions in the embodiments may be combined with each other, but it must be based on the realization of those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should not be considered to exist, and is not within the protection scope of the present invention.
Customer end Equipment (Customer Premise Equipment, CPE) is a wireless broadband access Equipment, along with terminal Equipment like the router towards high performance, integrate, frivolousization direction is constantly upgraded, make terminal Equipment's calorific capacity increase by a wide margin, for this reason, through setting up the heat conduction glue at the mainboard in the current product, and the heat conduction glue connects with the casing subsides, make the heat on the mainboard can transmit and give off through the casing, so that satisfy the heat dissipation requirement of mainboard under the prerequisite that reduces the casing size, nevertheless when installing the mainboard in the casing, heat conduction glue on the mainboard can not contact with the casing, only when heat conduction glue in corresponding predetermined position, heat conduction glue just can connect with the casing subsides.
In view of this, the utility model provides a mainboard mounting structure aims at solving the problem that how to prevent in the mainboard installation process heat-conducting glue and casing contact. Fig. 1 to 9 are schematic structural diagrams of an embodiment of the motherboard mounting structure provided by the present invention.
Referring to fig. 1 to 4, the main board 2 mounting structure 100 includes a housing 1, a main board 2 and a rail structure 3, where the housing 1 includes a middle frame 11 and two cover bodies 12 disposed at two openings at two ends of the middle frame 11, an inner wall surface of the middle frame 11 includes two mounting wall surfaces 112 disposed oppositely and two heat dissipation wall surfaces 111 disposed oppositely, at least one of the two heat dissipation wall surfaces 111 is a bonded heat dissipation wall surface 111, the main board 2 is provided with a heat conducting adhesive 6, the rail structure 3 includes a traverse rail structure 31 and a lifting rail structure 32, the traverse rail structure 31 is disposed on the two mounting wall surfaces 112 of the middle frame 11 to guide the main board 2 to be inserted into the middle frame 11, and the lifting rail structure 32 is disposed on the two cover bodies 12 to guide two ends of the main board 2 to move close to the bonded heat dissipation wall surfaces 111, so that the heat conducting adhesive 6 can be close to the bonded heat dissipation wall surfaces 111.
The technical scheme of the utility model in, through center 11 and two lid 12 to form a confined installation cavity, for the mainboard 2 installation, through setting up sideslip guide rail structure 31, so that mainboard 2 places in under the action of gravity sideslip guide rail structure 31, just sideslip guide rail structure 31 with the distance that pastes and connect heat dissipation wall 111 is greater than mainboard 2 with the thickness of heat conduction glue 6, in order to avoid inciting somebody to action mainboard 2 inserts 1 in-process of casing, heat conduction glue 6 with the internal face contact of casing 1, simultaneously through setting up lifting guide rail structure 32, so that mainboard 2 is close to paste and connect heat dissipation wall 111, reduce heat conduction glue 6 with paste and connect the distance of heat dissipation wall 111, so that heat conduction glue 6 removes to predetermineeing the position again when heat conduction glue 6 removes to predetermined position top, overturn casing 1, so that mainboard 2 paste under the effect of gravity connect heat dissipation wall 111, thereby will mainboard 2 install in casing 1, so pass through guide rail structure 31 with heat conduction glue 32 contact is favorable to mainboard 2 contact at the internal face contact position before the heat conduction glue 6, thereby does not reach heat conduction glue 6 in mainboard 2 contact position in the casing 2, thereby the prerequisite contact heat conduction glue 6, thereby make mainboard 2 contact with heat conduction glue 6.
Further, referring to fig. 5 and 6, the traverse rail structure 31 includes two first rails 311 respectively disposed on the two mounting walls 112, the first rails 311 extend along the extending direction of the middle frame, and by disposing the two first rails 311, two sides of the main board 2 are respectively disposed on the two first rails 311, so that an operator can insert the main board 2 into the housing 1.
It can be understood that there are various molding manners of the first guide rail 311 and the middle frame 11, the first guide rail 311 and the middle frame 11 may be assembled and molded, and the first guide rail 311 and the middle frame 11 may also be integrally molded, which is not limited by the present invention.
In order to drive the main board 2 to approach the attachment heat dissipation wall surface 111, specifically, referring to fig. 7 to 9, the lifting guide rail structure 32 includes a second guide rail 321 disposed on the cover 12, the second guide rail 321 is provided with a lifting inclined surface disposed in an inclined manner, and an inclined direction of the lifting inclined surface is from the inner side of the cover 12 to the outer side of the cover 12 toward the attachment heat dissipation wall surface 111, when the main board 2 is inserted into contact with the cover 12, the main board 2 will gradually approach the attachment heat dissipation wall surface 111 upward under the effect of the lifting inclined surface, which not only helps to move the heat conduction glue 6 to a preset position, but also helps to reduce a distance between the main board 2 and an inner wall surface of the middle frame 11, and helps to reduce impact on the main board 2 when the housing 1 is turned over.
In order to position the main board 2 in the housing 1, in an embodiment, referring to fig. 7 to 9, a slot 121 for inserting the main board 2 is disposed on a side of the cover 12 facing the middle frame 11, and the main board 2 is positioned in the housing 1 by disposing the slot 121 so as to insert the main board 2 into the cover 12. In another embodiment, the cover 12 is provided with two clamping ribs 4 facing one side of the middle frame 11 at intervals, the main board 2 is clamped between the two clamping ribs 4, and the two clamping ribs 4 are arranged to clamp the main board 2 in the cover 12, so that the main board 2 is positioned in the cover 12. Further, two the card muscle 4 is the one-to-one and sets up to the joint group, the joint group sets up a plurality ofly, and is a plurality of the interval of joint group is located lid 12, so set up, through setting up a plurality of the joint group is in order to strengthen lid 12 with be connected between mainboard 2, avoid mainboard 2 with lid 12 breaks away from.
It will be appreciated that, in order to facilitate the insertion of the main board 2 into the cover 12, the width of the slot 121 and the distance between the two ribs 4 are generally greater than the thickness of the main board 2.
It should be noted that, there are various molding manners of the clamping rib 4 and the cover 12, the clamping rib 4 and the cover 12 may be formed by assembling, and the clamping rib 4 and the cover 12 may also be formed integrally, which is not limited by the present invention.
In order to strengthen the connection between the main board 2 and the cover 12, in this embodiment, the cover 12 faces the middle frame 11 one side is provided with a clamping groove 121 for the main board 2 to be plugged, the cover 12 faces the middle frame 11 one side is provided with two clamping ribs 4 at intervals, two the clamping ribs 4 are respectively arranged on two sides of the clamping groove 121, so that the cover 12 is connected with the main board 2 through the clamping groove 121 and the clamping ribs 4 to strengthen the connection between the main board 2, and the cover 12 is prevented from being separated from the main board 2.
In order to prevent the heat conductive adhesive 6 from being excessively compressed, please refer to fig. 3 and 6, a limiting rib 5 is protruded from an inner wall surface of the middle frame 11, and the limiting rib 5 is used for abutting against the main board 2, so that the limiting rib 5 is arranged to abut against the main board 2 so as to control a distance between the main board 2 and the inner wall surface of the middle frame 11, and prevent the main board 2 from continuously moving towards the direction of the abutting heat dissipation wall surface 111, thereby preventing the heat conductive adhesive 6 on the main board 2 from being excessively compressed. Furthermore, two limiting ribs 5 are arranged, and the two limiting ribs 5 are arranged on the inner wall surface of the middle frame 11 at intervals so as to be respectively abutted against two ends of the main board 2.
Can set up a mainboard 2 in the casing 1, also can set up a plurality of mainboards 2, the utility model discloses not injecing this, specifically, in this embodiment, mainboard 2 sets up a plurality ofly, and is a plurality of mainboard 2 is the interval setting, and is a plurality of mainboard 2 is including the mainboard 2 that generates heat, heat-conducting glue 6 is located mainboard 2 generates heat, generally can for improving terminal equipment's performance, generally set up a plurality of mainboards 2 in the casing 1, can set up a mainboard 2 and supplementary mainboard 2 that generates heat in a plurality of mainboards 2, and wherein mainboard 2 that generates heat is main signal processing mainboard 2, can produce a large amount of heats, through set up heat-conducting glue 6 on the mainboard 2 generates heat to casing 1 to in time go out the heat dissipation, avoid the heat to be in gather in the casing 1. Further, a plurality of the main boards 2 are detachably mounted to the fixing frame 7, so that the plurality of the main boards 2 are assembled into a whole to be mounted together in the housing 1, which contributes to improving the mounting efficiency of the main boards 2.
In order to improve the signal receiving and releasing capability of the terminal device, in this embodiment, the cover 12 is provided with a via hole 122, the main board 2 includes a board body 21 and a mounting post 22 disposed at a side end of the board body 21, and the mounting post 22 extends out of the housing 1 through the via hole 122 for mounting an antenna.
The connection mode between the middle frame 11 and the cover 12 is various, one of the two covers 12, the cover 12 and the middle frame 11 may be integrally formed or may be assembled, but in order to facilitate maintenance and replacement of the motherboard 2, in this embodiment, the cover 12 is detachably mounted on the middle frame 11, so that a detachable structure is adopted to facilitate mounting and dismounting of the cover 12, so as to facilitate subsequent maintenance or replacement of the motherboard 2. It is understood that the cover 12 may be mounted to the middle frame 11 by a snap fit, or the cover 12 may be mounted to the middle frame 11 by a screw.
The mounting process of the motherboard 2 will be described below with reference to the above embodiment:
firstly, one of the two cover bodies 12, the cover body 12 and the middle frame 11 are assembled together, then the main board 2 provided with the heat-conducting glue 6 is placed on the first guide rail 311 under the action of gravity, wherein the height of the first guide rail 311 is greater than the sum of the thicknesses of the main board 2 and the heat-conducting glue 6, when the main board 2 is pushed into the housing 1, the heat-conducting glue does not contact the inner wall surface of the middle frame 11, the heat-conducting glue continues to be pushed, when the mounting post 22 on one side of the main board 2 reaches the second guide rail 321, the mounting post 22 and the main board 2 ascend along the second guide rail 321, the corresponding heat-conducting glue 6 also approaches the attachment heat-dissipation attachment surface, when the mounting base passes through the through hole 122, the main board 2 is pushed continuously, the main board 2 reaches the end point of the stroke, at this time, the housing 1 is turned over 180 degrees, the main board 2 is attached to the attachment heat-dissipation wall surface 111 under the action of gravity, then the other cover body 12 is assembled to the middle frame 11, the wall surface 4 on the cover body 12 is pressed against the heat-conducting glue 6, and the heat-conducting glue 6 is compressed and is compressed to be limited.
Furthermore, the utility model also provides a terminal equipment, terminal equipment includes foretell mainboard 2 mounting structure 100. It should be noted that, the structure of the motherboard 2 mounting structure 100 in the terminal device may refer to the above embodiment of the motherboard 2 mounting structure 100, and details are not repeated here; because the utility model provides an above-mentioned 2 mounting structure 100 of mainboard have been used in the terminal equipment, consequently, the utility model provides a terminal equipment's embodiment includes the whole technical scheme of the whole embodiments of 2 mounting structure 100 of above-mentioned mainboard, and the technological effect that reaches is also identical, no longer gives unnecessary details here. Specifically, the terminal device includes a router.
The above only is the preferred embodiment of the present invention, not so limiting the patent scope of the present invention, all under the concept of the present invention, the equivalent structure transformation done by the contents of the specification and the drawings is utilized, or the direct/indirect application is included in other related technical fields in the patent protection scope of the present invention.
Claims (10)
1. A motherboard mounting structure, comprising:
the heat dissipation device comprises a shell, a heat dissipation device and a control device, wherein the shell comprises a middle frame and two cover bodies arranged at two openings at two ends of the middle frame, the inner wall surface of the middle frame comprises two installation wall surfaces which are oppositely arranged and two heat dissipation wall surfaces which are oppositely arranged, and at least one of the two heat dissipation wall surfaces is an attached heat dissipation wall surface;
the heat-conducting glue is arranged on the main board; and (c) a second step of,
the guide rail structure comprises a transverse moving guide rail structure and a lifting guide rail structure, the transverse moving guide rail structure is arranged on two installation wall surfaces of the middle frame to guide the mainboard to be inserted into the middle frame, and the lifting guide rail structure is arranged on two covers to guide two end portions of the mainboard to be close to the attaching heat dissipation wall surfaces to move, so that the heat conducting glue can be close to the attaching heat dissipation wall surfaces.
2. A main board mounting structure as claimed in claim 1, wherein said traverse rail structure includes two first rails provided on two of said mounting walls, respectively, said first rails extending in the extending direction of said middle frame.
3. The motherboard mounting structure as recited in claim 1, wherein said lifting rail structure comprises a second rail provided on said cover, said second rail having a lifting slope surface disposed obliquely, and the inclination direction of said second rail is inclined from the inner side of said cover to the outer side of said cover toward said heat dissipating wall surface.
4. The motherboard mounting structure as recited in claim 1, wherein a slot for the motherboard to be inserted is provided on a side of the cover body facing the middle frame.
5. The main board mounting structure according to claim 1, wherein the cover body has two ribs spaced apart from each other on a side thereof facing the center frame, and the main board is engaged between the two ribs.
6. A main board mounting structure as claimed in claim 5, wherein two of the clamping ribs are provided in a one-to-one correspondence as a plurality of clamping groups, and the plurality of clamping groups are provided at intervals on the cover body.
7. The main board mounting structure according to claim 1, wherein a stopper rib is provided to protrude from an inner wall surface of the middle frame, and the stopper rib is configured to abut against the main board.
8. The motherboard mounting structure as recited in claim 1, wherein said motherboard is provided in plurality, a plurality of said motherboards being provided at intervals, a plurality of said motherboards including a heat-generating motherboard;
the heat conducting glue is arranged on the heating main board.
9. A main board mounting structure as recited in claim 1, wherein said cover is detachably mounted to said middle frame.
10. A terminal device characterized by comprising the motherboard mounting structure as recited in any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222386289.8U CN218041633U (en) | 2022-09-07 | 2022-09-07 | Mainboard mounting structure and terminal equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222386289.8U CN218041633U (en) | 2022-09-07 | 2022-09-07 | Mainboard mounting structure and terminal equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218041633U true CN218041633U (en) | 2022-12-13 |
Family
ID=84353886
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222386289.8U Active CN218041633U (en) | 2022-09-07 | 2022-09-07 | Mainboard mounting structure and terminal equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218041633U (en) |
-
2022
- 2022-09-07 CN CN202222386289.8U patent/CN218041633U/en active Active
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