CN218039147U

CN218039147U - Wafer carrying platform

Info

Publication number: CN218039147U
Application number: CN202222101805.8U
Authority: CN
Inventors: 张呈阳; 林志阳; 吴泽斌
Original assignee: Xiamen Teyi Technology Co ltd
Current assignee: Xiamen Teyi Technology Co ltd
Priority date: 2022-08-10
Filing date: 2022-08-10
Publication date: 2022-12-13
Anticipated expiration: 2032-08-10

Abstract

The utility model relates to a wafer microscope carrier, it includes: and (7) mounting the platform. The leveling seat is provided with a cavity for avoiding the grabbing tool and at least one inlet and outlet, and the inlet and outlet are communicated with the cavity; the upper end opening position of cavity is equipped with the standing groove with wafer appearance looks adaptation. And the rotating mechanism is used for driving the leveling seat to rotate. The utility model discloses a cavity and exit of grabbing tool are dodged in the setting, and the wafer is placed in the standing groove of cavity top, and grabbing tool can realize that the wafer is placed the standing groove through the lower surface of lifting or adsorbing the wafer, and through the restriction of standing groove, grabbing tool can not drive the wafer when uninstalling the wafer and remove, can guarantee the roughness that the wafer was placed, the loading of the wafer of also being convenient for simultaneously. In addition, the rotating mechanism drives the leveling seat to rotate, so that the posture of the wafer on the leveling seat can be adjusted to adapt to subsequent processing. Furthermore, the utility model discloses simple structure, it is small, be convenient for installation and existing equipment's transformation.

Description

Wafer carrying platform

Technical Field

The utility model relates to a wafer processing equipment technical field especially relates to a wafer microscope carrier.

Background

The wafer carrying platform is used for positioning and placing a wafer, and is usually required to be used in processing procedures such as wafer etching, photoetching and the like, and has higher requirements on the flatness of the wafer to be placed. With the improvement of the automation degree of the equipment, automatic loading and unloading of the wafer on the wafer carrying platform have been realized at present, and a common method is to use a gripping tool to grip the wafer, for example, use a vacuum chuck to adsorb the upper surface of the wafer, and then move the wafer onto the wafer carrying platform by matching with a moving tool such as a manipulator.

In order to ensure the flatness requirement for wafer placement, the wafer stage is usually designed as a fixed structure to provide a reference. Since some wafers have short sides, such wafers need to be placed on the wafer stage in a uniform posture, and although the wafers can be adjusted to a uniform posture in the preliminary stage, it is difficult to avoid the problem of short side deviation during the transportation. In addition, when the wafer is desorbed from the vacuum chuck to the wafer stage, the vacuum chuck easily drives the wafer to generate a small displacement due to friction or residual vacuum, thereby causing the flatness of the wafer to be poor or the short side to be deviated.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a wafer carrying platform, its loading that can be convenient for the wafer guarantees the roughness that the wafer was placed, can also adjust the gesture of wafer.

In order to achieve the above object, the utility model discloses a wafer carrier, it includes:

and (7) mounting the platform.

The leveling seat is rotatably connected to the mounting platform, a cavity for avoiding a grabbing tool and at least one inlet and outlet are formed in the leveling seat, and the inlet and outlet are communicated with the cavity; and a placing groove matched with the shape of the wafer is arranged at the opening position at the upper end of the cavity.

And the rotating mechanism is arranged on the mounting platform and used for driving the leveling seat to rotate.

Preferably, the leveling device further comprises a collar, and the leveling seat is rotatably connected to the mounting platform through the collar; the mounting platform is provided with an outer limiting groove matched with the outer ring of the shaft collar, and the adjusting seat is provided with an inner limiting groove matched with the inner ring of the shaft collar.

Preferably, the mounting platform is provided with a limiting ring, the limiting ring is detachably fixed on the mounting platform, and the limiting ring and the mounting platform are matched to form an outer limiting groove.

Preferably, the leveling seat comprises a rotating ring, a fixing ring, a plurality of elastic pieces and a plurality of equal-height limiting assemblies, the rotating ring is rotatably connected with the mounting platform, and the placing groove is formed in the fixing ring; the elastic piece is compressed between the rotating ring and the fixing ring, and the rotating ring is connected with the fixing ring through the equal-height limiting assemblies.

Preferably, the swivel comprises a first swivel and a second swivel, the first swivel and the second swivel are detachably fixed, and the first swivel and the second swivel are matched to enclose an inner limiting groove.

Preferably, the rotary ring further comprises a plurality of guide posts, guide holes matched with the guide posts are formed in the rotary ring and the fixing ring, and the guide posts are connected in the guide holes in a sliding mode; the elastic piece is a spring, and the spring is sleeved on the guide post.

Preferably, the equal-height limiting assembly comprises an equal-height screw and a limiting plate, and the equal-height screw sequentially penetrates through the limiting plate and the fixing ring and then is in threaded connection with the rotating ring; the fixing ring is provided with a limiting hole matched with the limiting plate.

Preferably, the rotating mechanism comprises a connecting piece, a nut block, a screw rod and a motor, the motor is rotatably connected to the mounting platform, the screw rod is in transmission connection with an output shaft of the motor, and the screw rod is in threaded connection with the nut block; the nut block is rotatably connected to the connecting piece, and the connecting piece is fixedly connected with the leveling seat.

Preferably, a plurality of adsorption grooves are uniformly distributed in the placing groove along the circumferential direction, air passages which are in one-to-one correspondence with the adsorption grooves and communicated with the adsorption grooves are arranged on the leveling seat, and the air passages are communicated with external vacuum-pumping equipment.

Preferably, the device further comprises a vacuum measuring element for detecting the vacuum degree of the air passages, and the vacuum measuring elements are in one-to-one correspondence with the air passages.

The utility model discloses following beneficial effect has:

the utility model discloses a cavity and the exit of snatching tool are dodged in the setting, and the wafer is placed in the standing groove of cavity top, and snatching tool can realize moving the wafer to the standing groove through the lower surface of lifting or adsorbing the wafer, and through the restriction of standing groove, snatching tool can not drive the wafer when uninstalling the wafer and remove, can guarantee the roughness that the wafer was placed, the loading of the wafer of also being convenient for simultaneously. In addition, the leveling seat is rotatably connected to the mounting platform, and after the grabbing tool leaves, the rotating mechanism drives the leveling seat to rotate, so that the posture of the wafer on the leveling seat can be adjusted to adapt to subsequent processing. Furthermore, the utility model discloses simple structure, it is small, the installation platform does not have the part to interfere moreover down, the installation of being convenient for, the transformation of the existing equipment of can also being convenient for.

Drawings

Fig. 1 is a schematic view of the present invention.

Fig. 2 is a schematic view of another view angle of the present invention.

Fig. 3 is a sectional view taken along the direction a in fig. 2.

Fig. 4 is a sectional view taken along the direction B in fig. 2.

Fig. 5 is an enlarged view of the portion C in fig. 2.

Description of the main part symbols:

the mounting platform 10, the through hole 11, the limiting ring 12 and the collar 13;

the rotary ring 21, the first rotary ring 211, the second rotary ring 212, the fixed ring 22, the inlet and outlet 221, the placing groove 222, the adsorption groove 223, the air passage 224, the joint 225, the guide column 23, the elastic piece 24, the equal-height screw 251 and the limiting plate 252;

a motor 31, a screw rod 32, a nut block 33 and a connecting piece 34;

a wafer 40.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments.

As shown in fig. 1-5, the utility model discloses a wafer 40 loading platform, it includes: mounting platform 10, leveling seat and slewing mechanism.

The leveling seat comprises a rotating ring 21, a fixing ring 22, a plurality of guide posts 23, a plurality of elastic pieces 24 and a plurality of equal-height limiting components. The rotating ring 21 is rotatably connected with the mounting platform 10, and the upper ring surface of the rotating ring 21 is parallel to the table surface of the mounting platform 10. In order to ensure that the rotation of the rotary ring 21 does not change the flatness of the rotary ring relative to the mounting platform 10, the following design is carried out: the swivel 21 is connected with the mounting platform 10 through a collar 13 in a rotating manner, a circular through hole 11 is arranged on the mounting platform 10, a first notch is arranged at the edge of the through hole 11, meanwhile, a limiting ring 12 is arranged right above the through hole 11, and the limiting ring 12 is detachably fixed on the mounting platform 10 through a bolt. The limiting ring 12 is provided with a second notch matched with the first notch, the first notch and the second notch form an outer limiting groove matched with the outer ring of the collar 13, the outer limiting groove limits the collar 13 at the periphery of the collar 13, and meanwhile, the collar 13 can rotate in the outer limiting groove. The swivel 21 includes a first swivel 211 and a second swivel 212, and the first swivel 211 and the second swivel 212 are detachably fixed by bolts. The first rotating ring 211 is provided with a third notch, the second rotating ring 212 is provided with a fourth notch matched with the third notch, the third notch and the fourth notch enclose an inner limiting groove matched with the inner ring of the shaft collar 13, and the rotating ring 21 is rotatably connected with the shaft collar 13 through the inner limiting groove.

The fixed ring 22 is arranged above the rotating ring 21, guide holes matched with the guide posts 23 are formed in the fixed ring 22 and the rotating ring 21, the guide posts 23 are connected in the guide holes in a sliding mode, and the fixed ring 22 can stably move relative to the rotating ring 21 through the guide of the guide posts 23. The elastic member 24 is preferably a spring, which is fitted over the guide post 23. The equal-height limiting assembly comprises an equal-height screw 251 and a limiting plate 252, the equal-height screw 251 sequentially penetrates through the limiting plate 252 and the fixing ring 22 and then is in threaded connection with the rotating ring 21, and a limiting hole matched with the limiting plate 252 is formed in the fixing ring 22. The elastic element 24 is compressed between the fixing ring 22 and the rotating ring 21 and limited by the equal-height limiting components, so that the elastic element 24 keeps a compressed state, and under the elastic force of the elastic element 24, the fixing ring 22 abuts against the limiting plate 252, thereby ensuring the flatness of the fixing ring 22 relative to the rotating ring 21. The guide posts 23 and the equal-height limiting assemblies are uniformly distributed in the circumferential direction of the rotating ring 21 so as to ensure leveling and uniform stress.

The core of the fixing ring 22 is a cavity for avoiding the grasping tool, and at the same time, the fixing ring 22 is further provided with at least one inlet/outlet 221 for avoiding the grasping tool, the inlet/outlet 221 is communicated with the cavity, and a placing groove 222 adapted to the shape of the wafer 40 is arranged at the upper end opening position of the cavity. By providing the cavity and the access opening 221, the fork arm of the gripping tool can extend into the cavity through the access opening 221, thereby facilitating the placement of the wafer 40 into the placement slot 222 or the removal of the wafer 40 from the placement slot 222. Compare in the mode of snatching of current vacuum chuck absorption wafer 40 upper surface, the utility model discloses snatch wafer 40 from wafer 40's lower surface, after placing standing groove 222, be subject to standing groove 222 in wafer 40 counterpoint, wafer 40 can more conveniently separate with the grabbing tool, realizes the uninstallation of wafer 40, and the uninstallation action of grabbing tool can not drive wafer 40 moreover and take place the displacement, guarantees the roughness that wafer 40 placed. To the snatching mode of adsorbing the wafer 40 upper surface, need overcome the problem that friction or residual vacuum etc. drove the displacement of wafer 40 easily, and the utility model discloses the mode of snatching wafer 40 from the lower surface of wafer 40 does not have this aspect of puzzlement, and the position of wafer 40 in standing groove 222 (drive wafer 40 and move down, make its tank bottom that can laminate standing groove 222) can further be stabilized to the phenomenon of friction even and residual vacuum. Furthermore, the utility model discloses also can the adaptation adsorb the mode of snatching of wafer 40 upper surface.

In order to prevent the wafer 40 from moving in the placing groove 222, a plurality of adsorption grooves 223 are uniformly distributed in the placing groove 222 along the circumferential direction, air passages 224 which are in one-to-one correspondence and communication with the adsorption grooves 223 are arranged on the leveling seat, and the air passages 224 are communicated with external vacuum-pumping equipment to adsorb the wafer 40 in a vacuum-pumping mode. In addition, each air channel 224 is correspondingly provided with a vacuum measuring element, such as a vacuum gauge, and after the wafer 40 is placed in the placing groove 222 and the external vacuum pumping equipment is operated, the fit degree between the wafer 40 and the placing groove 222 can be well fed back by reading the measured value of the vacuum measuring element, so that the monitoring effect is achieved. A fitting 225 may be provided at the gas port of the gas passage 224 remote from the adsorption tank 223 to facilitate piping connection.

The rotating mechanism is arranged on the mounting platform 10 and close to the leveling seat and is used for driving the leveling seat to rotate. The rotating mechanism comprises a connecting piece 34, a nut block 33, a screw rod 32 and a motor 31, the motor 31 is rotatably connected to the mounting platform 10 through a bearing seat, the screw rod 32 is in transmission connection with an output shaft of the motor 31, and the screw rod 32 and the motor 31 are directly fixed in the scheme. Furthermore, the screw 32 is also screwed to the nut block 33. The nut block 33 is rotatably connected to the connecting member 34 through a bearing seat, and the connecting member 34 is fixedly connected to the fixing ring 22 through bolts. The leveling seat can rotate within a small range by the driving of the motor 31, and the small-range rotation of the leveling seat can completely meet the requirement under the condition that the wafer 40 is placed into a uniform posture in the preparation stage of the wafer 40. The motor 31 is a stepping motor 31, and the control precision is high, so that fine adjustment is facilitated.

The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope of the present invention should be covered by the present invention.

Claims

1. A wafer carrier, comprising:

mounting a platform;

the leveling seat is rotatably connected to the mounting platform, a cavity for avoiding a grabbing tool and at least one inlet and outlet are formed in the leveling seat, and the inlet and outlet are communicated with the cavity; a placing groove matched with the shape of the wafer is arranged at the opening position at the upper end of the cavity;

2. The wafer carrier of claim 1, wherein: the leveling seat is rotatably connected to the mounting platform through the shaft collar; the mounting platform is provided with an outer limiting groove matched with the outer ring of the shaft collar, and the leveling seat is provided with an inner limiting groove matched with the inner ring of the shaft collar.

3. The wafer carrier of claim 2, wherein: the mounting platform is provided with a limiting ring, the limiting ring is detachably fixed on the mounting platform, and the limiting ring and the mounting platform are matched to form an outer limiting groove in an enclosing mode.

4. The wafer stage as set forth in any one of claims 1 to 3, characterized in that: the leveling seat comprises a rotating ring, a fixing ring, a plurality of elastic pieces and a plurality of equal-height limiting assemblies, the rotating ring is rotatably connected with the mounting platform, and the placing groove is formed in the fixing ring; the elastic piece is compressed between the rotating ring and the fixing ring, and the rotating ring is connected with the fixing ring through the equal-height limiting assembly.

5. The wafer carrier as claimed in claim 4, wherein: the swivel comprises a first swivel and a second swivel, the first swivel and the second swivel are detachably fixed, and the first swivel and the second swivel are matched to enclose an inner limiting groove.

6. The wafer carrier as recited in claim 4, wherein: the rotary ring and the fixed ring are respectively provided with a guide hole matched with the guide post, and the guide posts are connected in the guide holes in a sliding manner; the elastic part is a spring which is sleeved on the guide post.

7. The wafer carrier as claimed in claim 4, wherein: the equal-height limiting assembly comprises an equal-height screw and a limiting plate, and the equal-height screw sequentially penetrates through the limiting plate and the fixing ring and then is in threaded connection with the rotating ring; the fixing ring is provided with a limiting hole matched with the limiting plate.

8. The wafer carrier of claim 1, wherein: the rotating mechanism comprises a connecting piece, a nut block, a screw rod and a motor, the motor is rotatably connected to the mounting platform, the screw rod is in transmission connection with an output shaft of the motor, and the screw rod is in threaded connection with the nut block; the nut block is rotatably connected to the connecting piece, and the connecting piece is fixedly connected with the leveling seat.

9. The wafer carrier as recited in claim 1, wherein: a plurality of adsorption tanks are uniformly distributed in the placing tank along the circumferential direction, air passages which are in one-to-one correspondence with the adsorption tanks and communicated with the adsorption tanks are arranged on the leveling seat, and the air passages are communicated with external vacuum-pumping equipment.

10. The wafer carrier of claim 9, wherein: the device also comprises vacuum measuring elements for detecting the vacuum degree of the air passages, and the vacuum measuring elements correspond to the air passages one by one.