CN218039138U - Wafer bearing and transferring mechanism - Google Patents

Wafer bearing and transferring mechanism Download PDF

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Publication number
CN218039138U
CN218039138U CN202222348777.XU CN202222348777U CN218039138U CN 218039138 U CN218039138 U CN 218039138U CN 202222348777 U CN202222348777 U CN 202222348777U CN 218039138 U CN218039138 U CN 218039138U
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China
Prior art keywords
slide rail
moving mechanism
wafer
plane moving
synchronous
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CN202222348777.XU
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Chinese (zh)
Inventor
刘全益
胡敬祥
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Shenzhen Mengqi Semiconductor Equipment Co ltd
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Shenzhen Mengqi Semiconductor Equipment Co ltd
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Abstract

The utility model discloses a wafer bears transport mechanism. The wafer bearing and transferring mechanism comprises two bearing frames for receiving the wafers and a transferring mechanism for transferring the wafers on the bearing frames to the next station; transport mechanism is including the charging tray that is used for getting the wafer, the plane moving mechanism that is used for driving the charging tray and removes, be used for driving the lift cylinder that the plane moving mechanism goes up and down and be used for driving lift cylinder pivoted revolving cylinder, the charging tray is installed on the plane moving mechanism, the plane moving mechanism is installed on the lift cylinder, the lift cylinder is installed on the revolving cylinder, the plane moving mechanism drives can extend or shorten the length of plane moving mechanism when the charging tray removes, the revolving cylinder drive the lift cylinder rotates, the lift cylinder drives the plane moving mechanism rotates. The utility model discloses wafer bearing and transferring mechanism can adapt to the wafer transportation in narrow space.

Description

Wafer bearing and transferring mechanism
Technical Field
The utility model relates to a wafer processing technology field especially relates to a wafer bears transport mechanism.
Background
When the wafer needs chamfering, the processing position of the wafer chamfering device is placed into the wafer by the feeding mechanism, the wafer chamfering device only with the chamfering function can be directly placed in place by the mechanical arm, the wafer chamfering device integrating the cleaning function and the thinning function is required to be thinned and cleaned after the wafer is chamfered, and due to the fact that the thinning device and the cleaning device occupy space, the space position is insufficient, and the feeding cannot be achieved by the existing mechanical arm.
SUMMERY OF THE UTILITY MODEL
The to-be-solved technical problem of the utility model is to provide a wafer that can receive feed mechanism and send and shift the wafer of receipt to next station bears transport mechanism.
In order to solve the above problems, the present invention provides a wafer carrying and transferring mechanism, which includes two bearing frames for receiving wafers and a transferring mechanism for transferring the wafers on the bearing frames to the next station; transport mechanism is including the charging tray that is used for getting the wafer, the plane moving mechanism that is used for driving the charging tray and removes, be used for driving the lift cylinder that the plane moving mechanism goes up and down and be used for driving lift cylinder pivoted revolving cylinder, the charging tray is installed on the plane moving mechanism, the plane moving mechanism is installed on the lift cylinder, the lift cylinder is installed on the revolving cylinder, the plane moving mechanism drives can extend or shorten the length of plane moving mechanism when the charging tray removes, the revolving cylinder drive the lift cylinder rotates, the lift cylinder drives the plane moving mechanism rotates.
Furthermore, the plane moving mechanism comprises a bottom plate, a driving motor, a first slide rail, a first synchronization assembly, a second slide rail, a second synchronization assembly and a slider, the bottom plate is fixed on the lifting cylinder, the first slide rail, the driving motor and the mounting plate are all fixed on the bottom plate, the second slide rail is slidably arranged on the first slide rail, the driving motor drives the second slide rail to move on the first slide rail through the first synchronization assembly, the second synchronization assembly is mounted on the second slide rail, the slider is slidably arranged on the second slide rail, the slider is connected with the second synchronization assembly, the second slide rail moves on the first slide rail and can drive the second synchronization assembly to move, and the second synchronization assembly moves to drive the slider to move on the second slide rail.
Furthermore, the first synchronizing assembly comprises two first synchronizing wheels and a first synchronizing belt, a mounting plate is arranged on the bottom plate, the first synchronizing wheels are fixed on the mounting plate, the first synchronizing belt is wound on the two first synchronizing wheels, the first synchronizing wheels at the rear end of the first sliding rail are connected with an output shaft of the driving motor, and the second sliding rail is connected with the first synchronizing belt.
Furthermore, a first connecting piece is arranged on the second sliding rail and connected with the first synchronous belt.
Further, the second synchronizing assembly comprises two second synchronizing wheels, a second synchronous belt and a transmission gear, the second synchronizing wheels are arranged on the second sliding rail, the second synchronous belt is wound on the second synchronizing wheels, the sliding block is connected with the second synchronous belt, the transmission gear passes through the transmission shaft, the second synchronizing wheels are connected, a rack is arranged on the first sliding rail, and the transmission gear is meshed with the rack.
Furthermore, a second connecting piece is installed on the sliding block and connected with the second synchronous belt.
Furthermore, the middle part is equipped with the holding tank on the second slide rail, the holding tank is used for holding drive gear.
Furthermore, the plane moving mechanism further comprises a limit baffle, the limit baffle is arranged on the bottom plate and is located at the rear end of the first sliding rail, and the limit baffle is used for limiting the movement of the second sliding rail.
Further, bear the frame including the loading board that is used for bearing the weight of the wafer and the supporting legs that are used for supporting the loading board, be equipped with on the loading board and get the material breach, be equipped with on the loading board and be curved air channel, the air channel with get material breach intercommunication.
Furthermore, a central support sheet is arranged on the bearing plate, an avoiding notch is arranged at the front end of the material taking plate, and the avoiding notch is matched with the central support sheet.
The utility model discloses wafer bears transport mechanism utilizes plane moving mechanism to drive the charging tray and removes, and the charging tray is when moving towards getting material position or unloading position simultaneously, and plane moving mechanism can extend or shorten, and the narrow and small space of adaptation that can be fine has realized mechanical transportation wafer.
Drawings
Fig. 1 is a schematic structural diagram of a wafer carrying and transferring mechanism according to a preferred embodiment of the present invention.
Fig. 2 is a schematic view of a transfer mechanism.
Fig. 3 is a rear view of the transfer mechanism.
Fig. 4 is a schematic structural diagram of the material taking disc.
Fig. 5 isbase:Sub>A cross-sectional viewbase:Sub>A-base:Sub>A of fig. 3.
Fig. 6 is a sectional view of B-B in fig. 3.
Fig. 7 is a bottom view of the loading ledge.
The meaning of the reference symbols in the drawings is:
the device comprises a bearing frame A, a bearing plate 1, a material taking notch 11, a vent groove 12, a central support sheet 13 and support legs 2;
the device comprises a transfer mechanism B, a material taking disc 3, an avoiding notch 31, a vent hole 32, a plane moving mechanism 4, a bottom plate 41, a mounting plate 42, a limit baffle 43, a driving motor 44, a first slide rail 45, a first synchronizing assembly 46, a first synchronous wheel 461, a first synchronous belt 462, a second slide rail 47, a first connecting sheet 471, an accommodating groove 472, a second synchronizing assembly 48, a second synchronous wheel 481, a second synchronous belt 482, a transmission gear 483, a sliding block 49, a second connecting sheet 491, a lifting cylinder 5 and a rotating cylinder 6;
a frame 7.
Detailed Description
The present invention will be further explained with reference to the accompanying drawings.
As shown in fig. 1 to 3, a preferred embodiment of the wafer carrying and transferring mechanism B of the present invention includes two carriers a for receiving wafers and a transferring mechanism B for transferring the wafers on the carriers a to the next station. Bear a frame A and transport mechanism B and all establish on frame 7 of chamfer device, two bear a frame A and be located transport mechanism B's both sides, when being convenient for one bear a frame A and receive the wafer, another bears a frame A and is used for transport mechanism B to transport the wafer to improve transportation efficiency.
Referring to fig. 7, the carrier a includes a carrier plate 1 for carrying a wafer and supporting legs 2 for supporting the carrier plate 1, and the supporting legs 2 are fixed on a bottom surface of the carrier plate 1. The loading plate 1 is provided with a material taking notch 11, the wafer is placed on the loading plate 1, the material taking notch 11 is covered by the wafer, and the transferring mechanism B takes the wafer away from the material taking notch 11. The top surface of loading board 1 is equipped with and is curved air channel 12, air channel 12 with get material breach 11 intercommunication, the wafer is placed on loading board 1, and the below of wafer can have the gas circulation, can prevent that the bottom surface of wafer from bonding with the top surface of loading board 1, so transport mechanism B when taking away the wafer, the wafer can be light leave loading board 1, can not damage the wafer. The loading plate 1 is provided with a central supporting sheet 13, the central supporting sheet 13 is positioned at the material taking notch 11, and the center of the vent groove 12 is positioned on the central supporting sheet 13, so that a support can be provided for the center of a wafer, and the wafer can be placed more stably.
As shown in fig. 1 to 6, the transfer mechanism B includes a material taking tray 3 for taking a wafer, a planar moving mechanism 4 for driving the material taking tray 3 to move in a specific direction, a lifting cylinder 5 for driving the planar moving mechanism 4 to lift, and a rotating cylinder 6 for driving the lifting cylinder 5 to rotate, the material taking tray 3 is mounted on the planar moving mechanism 4, the planar moving mechanism 4 is mounted on the lifting cylinder 5, and the lifting cylinder 5 is mounted on the rotating cylinder 6; the direction that the plane moving mechanism 4 drives the material taking plate 3 to move depends on the rotating direction of the rotating cylinder, and the plane moving mechanism drives the material taking plate 3 to move and simultaneously can extend or shorten the length of the plane moving mechanism 4, so that the device can be suitable for positions with smaller space. The rotary cylinder 6 drives the lifting cylinder 5 to rotate, the lifting cylinder 5 drives the plane moving mechanism 4 to rotate, the plane moving mechanism 4 rotates to drive the material taking plate 3 to rotate, and the material taking plate 3 is rotated to the material taking direction or the material discharging direction. When the material taking disc 3 is located in the material taking notch 11, the lifting cylinder 5 drives the plane moving mechanism 4 to ascend, the plane moving mechanism 4 drives the material taking disc 3 to ascend, and the material taking disc 3 takes the wafer down from the bearing plate 1.
The front end of the material taking plate 3 is provided with an avoiding notch 31, the avoiding notch 31 is matched with the central supporting sheet 13, so that the center of a wafer can be supported when the material taking plate 3 obtains the wafer, and the wafer is ensured not to topple over. The front end of the material taking disc 3 is also provided with an arc-shaped vent hole 32, so that the wafer cannot be bonded on the material taking disc 3 when the material taking disc 3 is unloaded.
The plane moving mechanism 4 includes a bottom plate 41, a mounting plate 42, a limit baffle 43, a driving motor 44, a first slide rail 45, a first synchronizing assembly 46, a second slide rail 47, a second synchronizing assembly 48, and a slide block 49. Bottom plate 41 is fixed on the lift cylinder 5, first slide rail 45, limit baffle 43, driving motor 44 and mounting panel 42 are all fixed on bottom plate 41, limit baffle 43 is located the rear end of first slide rail 45, second slide rail 47 slides and establishes on the first slide rail 45, limit baffle 43 is used for restricting second slide rail 47 to prevent that second slide rail 47 from following first slide rail 45 removes the position. The first synchronization assembly 46 is mounted on the mounting plate 42, the second slide rail 47 is connected with the first synchronization assembly 46, and the driving motor 44 is used for driving the first synchronization assembly 46; when the driving motor 44 drives the first synchronizing assembly 46, the second slide rail 47 moves on the first slide rail 45. The second synchronous component 48 is installed on the second slide rail 47, the slider 49 slides and is established on the second slide rail 47, and the slider 49 with the second synchronous component 48 is connected, the second slide rail 47 can drive the second synchronous component 48 to move on the first slide rail 45, so that the second synchronous component 48 drives the slider 49 to move on the second slide rail 47, thereby driving the material taking disc 3 to move.
The first synchronizing assembly 46 includes two first synchronizing wheels 461 and a first synchronizing belt 462, the first synchronizing wheels 461 are fixed on the mounting plate 42, the first synchronizing belt 462 is wound on the two first synchronizing wheels 461, and the first synchronizing wheels 461 at the rear end of the first sliding rail 45 are also connected with the output shaft of the driving motor 44. A first connecting piece 471 is mounted on the second sliding rail 47, and the first connecting piece 471 is fixed with the first synchronous belt 462. When the driving motor 44 drives the first synchronizing wheel 461 to rotate, the first synchronizing wheel 461 drives the first synchronizing belt 462 to move, and the first synchronizing belt 462 drives the second slide rail 47 to move on the first slide rail 45.
The second synchronizing assembly 48 includes two second synchronizing wheels 481, a second synchronizing belt 482 and a transmission gear 483, the two second synchronizing wheels 481 are arranged on the second slide rail 47, the second synchronizing belt 482 is wound on the second synchronizing wheels 481, a second connecting piece 491 is mounted on the slide block 49, and the second connecting piece 491 is fixed with the second synchronizing belt 482. The transmission gear 483 is connected with the second synchronizing wheel 481 through a transmission shaft, a rack is arranged on the first slide rail 45, and the transmission gear 483 is meshed with the rack. When the second slide rail 47 moves on the first slide rail 45, the transmission gear 483 moves on the rack, the transmission gear 483 moves to drive the transmission shaft to rotate, the transmission shaft rotates to drive the second synchronous wheel 481 to move, the second synchronous wheel 481 rotates to drive the second synchronous belt 482 to rotate, and the second synchronous belt 482 rotates to drive the slider 49 to move.
The middle part is equipped with the holding tank 472 on the second slide rail 47, the holding tank 472 is used for holding the installation drive gear 483, establishes drive gear 483 in second slide rail 47, can effectual hidden spare part, reduces naked part, has reduced volume and occupation space simultaneously.
An external feeding device places a wafer on a bearing frame A, a rotary cylinder 6 drives a material taking plate 3 to rotate to the direction facing the bearing frame A, then a driving motor 44 drives a first synchronous wheel 461 to rotate, the first synchronous wheel 461 rotates to drive a first synchronous belt 462 to rotate, the first synchronous belt 462 rotates to drive a second sliding rail 47 to move towards the direction of the bearing frame A on a first sliding rail 45, the second sliding rail 47 drives a transmission gear 483 to move on a rack while moving, the transmission gear 483 moves to drive a second synchronous wheel 481 to rotate, the second synchronous wheel 481 rotates to drive a second synchronous belt 482 to rotate, the second synchronous belt 482 rotates to drive a sliding block 49 to move on a second sliding block 49, the sliding block 49 moves to drive the material taking plate 3 to move, when the material taking plate 3 moves to the position below a material taking notch 11, a lifting mechanism drives a plane moving mechanism 4 to lift, the plane moving mechanism 4 lifts to drive the material taking plate 3 to lift, the material taking plate 3 lifts to take off the wafer on the bearing frame A, then the driving motor 44 drives the material taking plate 3 to reset, the rotary cylinder 6 rotates to enable the material taking plate 3 to move again, and then the material taking plate 3 moves to a material discharging device to a discharging device to discharge position on the wafer. After the unloading is finished, the plane moving mechanism 4 drives the material taking disc 3 to reset, and the lifting cylinder 5 resets at the same time, so that the material is taken next time. The plane moving mechanism 4 can freely stretch out and draw back the length, and the narrow and small integrated form chamfer device in adaptation space that can be fine just only needs a power can drive, saves power device.
The above is only the embodiment of the present invention, not the limitation of the patent scope of the present invention, all the equivalent structures made by the contents of the specification and the drawings are directly or indirectly applied to other related technical fields, all the same principle is within the patent protection scope of the present invention.

Claims (10)

1. The utility model provides a wafer bears transport mechanism which characterized in that: the wafer transfer device comprises two bearing frames for receiving wafers and a transfer mechanism for transferring the wafers on the bearing frames to the next station; transport mechanism including the material taking disc that is used for getting the wafer, be used for driving the plane moving mechanism that the material taking disc removed, be used for driving the lift cylinder that plane moving mechanism goes up and down and be used for driving lift cylinder pivoted revolving cylinder, the material taking disc is installed on the plane moving mechanism, the plane moving mechanism is installed on the lift cylinder, the lift cylinder is installed on the revolving cylinder, the plane moving mechanism drives can extend or shorten the length of plane moving mechanism when the material taking disc removes, the revolving cylinder drive the lift cylinder rotates, the lift cylinder drives the plane moving mechanism rotates.
2. The wafer carrying and transferring mechanism of claim 1, wherein: the plane moving mechanism comprises a bottom plate, a driving motor, a first slide rail, a first synchronizing assembly, a second slide rail, a second synchronizing assembly and a slide block, wherein the bottom plate is fixed on the lifting cylinder, the first slide rail, the driving motor and the mounting plate are fixed on the bottom plate, the second slide rail is slidably arranged on the first slide rail, the driving motor drives the second slide rail to move on the first slide rail through the first synchronizing assembly, the second synchronizing assembly is arranged on the second slide rail, the slide block is slidably arranged on the second slide rail, the slide block is connected with the second synchronizing assembly, the second slide rail moves on the first slide rail and can drive the second synchronizing assembly to move, and the second synchronizing assembly moves to drive the slide block to move on the second slide rail.
3. The wafer carrying and transferring mechanism of claim 2, wherein: the first synchronous assembly comprises two first synchronous wheels and a first synchronous belt, a mounting plate is arranged on the bottom plate, the first synchronous wheels are fixed on the mounting plate, the first synchronous belt is wound on the two first synchronous wheels, the first synchronous wheels at the rear ends of the first sliding rails are connected with an output shaft of the driving motor, and the second sliding rails are connected with the first synchronous belt.
4. The wafer carrying and transferring mechanism of claim 3, wherein: and a first connecting piece is arranged on the second sliding rail and connected with the first synchronous belt.
5. The wafer carrying and transferring mechanism of claim 2, wherein: the second synchronous component comprises two second synchronous wheels, a second synchronous belt and a transmission gear, the second synchronous wheels are arranged on the second sliding rail, the second synchronous belts are arranged on the second synchronous wheels in a winding mode, the sliding block is connected with the second synchronous belt, the transmission gear penetrates through the transmission shaft, the second synchronous wheels are connected, a rack is arranged on the first sliding rail, and the transmission gear is meshed with the rack.
6. The wafer carrying and transferring mechanism of claim 5, wherein: and a second connecting piece is arranged on the sliding block and connected with the second synchronous belt.
7. The wafer carrying and transferring mechanism of claim 5, wherein: the middle part is equipped with the holding tank on the second slide rail, the holding tank is used for holding drive gear.
8. The wafer carrying and transferring mechanism of claim 2, wherein: the plane moving mechanism further comprises a limiting baffle, the limiting baffle is arranged on the bottom plate and is located at the rear end of the first sliding rail, and the limiting baffle is used for limiting the second sliding rail to move.
9. The wafer carrying and transferring mechanism of claim 1, wherein: the bearing frame comprises a bearing plate and supporting legs, the bearing plate is used for bearing wafers, the supporting legs are used for supporting the bearing plate, a material taking notch is formed in the bearing plate, an arc-shaped ventilation groove is formed in the bearing plate, and the ventilation groove is communicated with the material taking notch.
10. The wafer carrying and transferring mechanism of claim 9, wherein: the loading plate is provided with a central support sheet, the front end of the material taking plate is provided with an avoiding notch, and the avoiding notch is matched with the central support sheet.
CN202222348777.XU 2022-09-02 2022-09-02 Wafer bearing and transferring mechanism Active CN218039138U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202222348777.XU CN218039138U (en) 2022-09-02 2022-09-02 Wafer bearing and transferring mechanism

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202222348777.XU CN218039138U (en) 2022-09-02 2022-09-02 Wafer bearing and transferring mechanism

Publications (1)

Publication Number Publication Date
CN218039138U true CN218039138U (en) 2022-12-13

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN202222348777.XU Active CN218039138U (en) 2022-09-02 2022-09-02 Wafer bearing and transferring mechanism

Country Status (1)

Country Link
CN (1) CN218039138U (en)

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