CN218037916U - Computer processor heat dissipation device adopting fan without fan blades - Google Patents

Computer processor heat dissipation device adopting fan without fan blades Download PDF

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Publication number
CN218037916U
CN218037916U CN202221909502.2U CN202221909502U CN218037916U CN 218037916 U CN218037916 U CN 218037916U CN 202221909502 U CN202221909502 U CN 202221909502U CN 218037916 U CN218037916 U CN 218037916U
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water
fan
box body
filler
processor
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CN202221909502.2U
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Chinese (zh)
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胡建杭
马超维
张凯歌
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Kunming University of Science and Technology
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Kunming University of Science and Technology
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Abstract

The utility model discloses a computer processor heat dissipation device adopting a fan without fan blades, which comprises a processor arranged in a computer, and a case shell, wherein the side wall of the case shell is provided with an air inlet hole, and the top surface of the case shell is provided with an air outlet hole; the processor is arranged in the inner cavity of the chassis shell; the fan without fan blades is arranged on one side of the processor; the box body is arranged in the case shell, the side wall of the box body is uniformly provided with vent holes, the bottom of the box body is provided with water outlet holes, and the box body is internally provided with water spraying filler; the sprinkling mechanism is used for sprinkling water flow to the water spraying filler; the utility model discloses in, make the air current in the chassis exterior to flow through flabellum-free fan, rivers can form the one deck water film on trickle filler surface when flowing on the trickle filler, and most entering into the air current to the chassis exterior in all can contact with the trickle filler, and the cooling water through trickle filler surface carries out the heat exchange, reduces the air current temperature, and the air current after the cooling contacts with the treater, takes away the temperature on its surface, reaches the radiating effect of cooling.

Description

Computer processor heat dissipation device adopting fan without fan blades
Technical Field
The utility model relates to a computer heat dissipation technical field especially relates to an adopt computer processor heat abstractor of no flabellum fan.
Background
The computer adopts the working principle of solving the heat dissipation problem of the processor by an air cooling method, namely, a metal radiating fin is arranged on the processor, and a small fan is arranged on the radiating fin, so that the heat generated when the processor works is taken away by air through forced convection. The single fan is usually and simply adopted for radiating the processor in the computer, the radiating effect is poor in the mode, and dust in the air can be in large contact with the processor, so that the performance and safety of the processor are affected, and the use requirements of people in production and life cannot be met.
SUMMERY OF THE UTILITY MODEL
A primary object of the present invention is to provide a computer processor heat sink employing a fan without fan blades, which solves the problem of poor heat dissipation.
In order to achieve the above object, the utility model provides a computer processor heat dissipation device using a fan without fan blades, which comprises a processor installed in a computer and a fan blade,
the side wall of the case shell is provided with an air inlet hole, and the top surface of the case shell is provided with an air outlet hole;
the processor is arranged in the inner cavity of the chassis shell;
the fan without fan blades is arranged on one side of the processor;
the box body is arranged in the case shell, the side wall of the box body is uniformly provided with vent holes, the bottom of the box body is provided with water outlet holes, and the box body is internally provided with water spraying filler;
the sprinkling mechanism is used for sprinkling water flow to the sprinkling filler;
the air flow before passing through the fan without fan blades contacts with the water flow sprayed on the water spraying filler to reduce the temperature and then contacts with the processor.
Furthermore, the water spraying filler is close to the inner wall of the box body and forms an included angle with the vertical surface, and the included angle ranges from 0 degree to 90 degrees.
Further, the water spraying filler is formed by mutually overlapping a plurality of layers of corrugated paper.
Furthermore, the water collecting tank is arranged at the bottom of the inner cavity of the chassis shell and discharges water flow outwards through the water outlet pipe.
Furthermore, a slow flow baffle plate used for reducing the flow velocity of water flow is uniformly arranged in the water collecting tank.
Furthermore, the slow flow baffle is of a V-shaped structure, and water holes are uniformly formed in the surface of the slow flow baffle.
Furthermore, the water outlet end of the water spraying mechanism is vertically downward and is opposite to the water spraying filler, and the water spraying mechanism supplies water through the water inlet pipe.
Furthermore, the water inlet pipe, the water outlet pipe and external circulating equipment form a water circulating system.
Furthermore, a frame plate for fixing the water spraying filler is arranged in the box body.
Further, the processor is fixedly arranged on the mounting plate.
The beneficial effects of the utility model are embodied in:
the utility model discloses in, make the air current in the chassis exterior to flow through no flabellum fan, outside air current passes through the fresh air inlet entering of chassis exterior lateral wall, water spray mechanism continuously sprays rivers on packing to the trickle, rivers can form the one deck water film on the trickle filler surface when flowing on the trickle filler, most air current that enters into in the chassis exterior all can pack with the trickle and contact, the cooling water through trickle filler surface carries out the heat exchange, reduce the air current temperature, then the air that passes the trickle filler can be discharged under the drive of no flabellum fan, air current and treater contact after the cooling, take away the temperature on its surface, reach the radiating effect of cooling.
Drawings
FIG. 1 is a schematic sectional view of the structure of the present invention;
FIG. 2 is a schematic sectional view of the inner cavity of the box structure of the present invention;
fig. 3 is a schematic view of the supporting plate composed of the structure of the slow flow baffle of the present invention.
Description of reference numerals:
100. a chassis housing; 101. a processor; 102. mounting a plate; 200. a fan without fan blades; 300. a box body; 301. a water inlet pipe; 302. a watering mechanism; 303. water spraying and filling; 304. a frame plate; 400. a water collection tank; 401. a water outlet pipe; 402. a slow flow baffle plate; 4021. and water passing holes.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. The embodiments and features of the embodiments in the present application may be combined with each other without conflict. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
It should be noted that, if directional indications (such as up, down, left, right, front, back, 8230; \8230;) are provided in the embodiments of the present invention, the directional indications are only used to explain the relative position relationship between the components, the motion situation, etc. in a specific posture (as shown in the attached drawings), and if the specific posture is changed, the directional indications are correspondingly changed.
Referring to fig. 1 and 2, the computer processor heat dissipation device using a fan without fan blades of the present invention includes a processor 101 installed in a computer, a plurality of heat dissipation fins are disposed around the processor 101, and a chassis housing 100 having an air inlet hole formed in a side wall thereof and an air outlet hole formed in a top surface thereof; the height of the air inlet is lower than the installation height of the fan 200 without fan blades.
A bladeless fan 200 disposed on one side of the processor 101; the bladeless fan 200 can be arranged on any side except the upper side of the processor 101, and the air outlet end of the bladeless fan 200 is ensured to be arranged opposite to the processor 101;
the box body 300 is arranged in the case shell 100, the box body 300 is made of rigid plastic and provides a good structural support effect, vent holes are uniformly formed in the side wall (air flow entering the case shell 100 can enter the box body 300 and contact with the water pouring filler 303), water outlet holes are formed in the bottom of the box body, and the water pouring filler 303 is arranged inside the box body; the water-spraying filler 303 is disposed in the inner cavity of the box 300 along the inner side wall thereof in a surrounding manner.
A sprinkling mechanism 302 for sprinkling water flow to the water sprinkling filler 303; the water spraying mechanism 302 is a structure composed of a water guide pipe and a plurality of nozzles, and sprays water onto the water spraying filler 303.
The water filtering cotton can be installed at the air inlet end of the bladeless fan 200, the position of the air inlet end is related to the installation position of the bladeless fan, the bladeless fan 200 can be divided into an air inlet end (one end of the air flow entering the bladeless fan 200 from other places) and an air outlet end (one end of the air flow passing through the bladeless fan 200 and outputting outwards) according to the flow path of the air flow, and the water filtering cotton is specifically installed at one end of the air flow entering the bladeless fan 200 and used for adsorbing more moisture in the air flow to be in contact with the processor 101.
The air flow before passing through the bladeless fan 200 contacts the water flow sprayed onto the trickle fill 303 to reduce the temperature and then contacts the processor 101. Namely, the air flow contacts with the water flow on the water spraying filler 303 and then contacts with the processor 101 through the bladeless fan 200.
The bladeless fan 200 based on the air multiplier principle is internally provided with a micro fan, so that air flows out at a high speed after reaching an air outlet of an annular fan frame, the flow direction of the high-speed flowing air is changed due to the coanda effect, peripheral air is driven to flow forwards, negative pressure is generated at the rear part when the air flow is discharged forwards, and the rear air also flows forwards under the action of the negative pressure, so that the effect of increasing the air flow is achieved. Moreover, the fan 200 without fan blades is arranged to discharge air through multiple holes, and can be fully contacted with the heat dissipation fins arranged around the processor 101, so that the heat dissipation effect of each point of the processor 101 is improved.
The airflow in the case shell 100 flows through the bladeless fan 200, external airflow enters through an air inlet hole in the side wall of the case shell 100, the water spraying mechanism 302 continuously sprays water flow onto the water spraying filler 303, when the water flow flows on the water spraying filler 303, a layer of water film is formed on the surface of the water spraying filler 303, the heat exchange area of the air and the water is increased, after the external airflow enters, because the bladeless fan 200 drives the surrounding airflow to move at a high speed, most of the airflow entering the case shell 100 can be in contact with the water spraying filler 303, heat exchange is performed through cooling water on the surface of the water spraying filler 303, the temperature of the airflow is reduced, then the air passing through the water spraying filler 303 can be discharged under the driving of the bladeless fan 200, the cooled airflow is in contact with the processor 101, the temperature on the surface of the processor is taken away, and the effect of cooling and heat dissipation is achieved. And when the external air flow contacts with the water film on the surface of the water spraying filler 303, the dust in the external air flow can be further adsorbed.
In one embodiment, referring to fig. 2, the water-spraying filler 303 is close to the inner wall of the box 300 and forms an included angle with the vertical plane, and the included angle ranges from 0 to 90 °. The flow rate of the water flow sprayed from the sprinkler mechanism 302 is slowed down, and the noise generated when the water flow falls is reduced.
In one embodiment, the packing 303 is formed by laminating a plurality of layers of corrugated paper. Therefore, when water flows on the water spraying packing 303, a layer of water film is formed on the surface of the water spraying packing 303, and the heat exchange area between air and water can be increased.
In an embodiment, please refer to fig. 1, further comprising a water collecting tank 400 disposed at the bottom of the inner cavity of the chassis housing 100, wherein the water collecting tank 400 discharges water outwards through a water outlet pipe 401. The water flow falling from the water spraying filler 303 is collected through the water collecting tank 400, and after passing through the water spraying filler 303, the water flow falls to the bottom of the inner cavity of the box body 300, falls into the water collecting tank 400 through a water outlet hole formed in the bottom surface of the box body 300, and is finally discharged outwards.
In one embodiment, referring to fig. 1, a flow slowing baffle 402 is uniformly disposed in the water collection tank 400 for reducing the flow rate of the water flow. The adjacent slow flow baffles 402 are closely arranged, so that potential safety hazards caused by the fact that water falling out of the box body 300 flows in the water collecting tank 400 too fast are avoided.
In an embodiment, referring to fig. 2 and 3, fig. 3 is a schematic diagram of a support plate formed by a slow flow baffle 402, the slow flow baffle 402 is integrally formed by two support plates, the slow flow baffle 402 is in a V-shaped structure, and water passing holes 4021 are uniformly formed in the surface of the slow flow baffle 402. The arrangement of the water through holes 4021 can prevent potential safety hazards caused by over-fast flow of water.
In one embodiment, the water outlet end of the water spraying mechanism 302 is vertically downward and directly opposite to the water spraying packing 303, so that the sprayed water can completely act on the water spraying packing 303; and the water spray mechanism 302 supplies water through the water inlet pipe 301.
In one embodiment, the water inlet pipe 301, the water outlet pipe 401 and the external circulation device form a water circulation system. The external circulating equipment can adopt a circulating water pump and is externally connected with a water tank, and the circulating water can adopt cooling water; with inlet tube 301 and outlet pipe 401 intercommunication, realize the rivers circulation for there is rivers all the time on the trickle filler 303, and then keeps with the contact strength of air current, continuously cools down the heat dissipation to treater 101.
In an embodiment, referring to fig. 1, a frame plate 304 for fixing the water spraying packing 303 is disposed in the box 300. The setting of frame plate 304 is convenient for improve the stability that the trickle packed 303, avoids leading to the problem that the trickle packed 303 shifted because of the reason that sprays rivers, therefore leads to local trickle to pack 303 surface and can not form the water film, and then reduces the area of contact's with the air current problem.
In one embodiment, referring to fig. 1, the processor 101 is fixed on the mounting plate 102, and the mounting plate 102 stably mounts the processor 101.
The above description is only a preferred embodiment of the present invention, and should not be taken as limiting the invention, and any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims (10)

1. A computer processor heat sink employing a bladeless fan, comprising a processor (101) mounted in a computer, characterized by: also comprises the following steps of (1) preparing,
the side wall of the case shell (100) is provided with an air inlet hole, and the top surface of the case shell is provided with an air outlet hole;
a bladeless fan (200) arranged on one side of the processor (101);
the box body (300) is arranged in the case shell (100), the side wall of the box body is uniformly provided with vent holes, the bottom of the box body is provided with water outlet holes, and the interior of the box body is provided with water pouring filler (303);
a sprinkling mechanism (302) for sprinkling water flow to the sprinkling filler (303);
the airflow passing through the fan (200) is contacted with the water flow sprayed on the water spraying filler (303) to reduce the temperature and then contacted with the processor (101).
2. The heat dissipation device of claim 1, wherein the fan-less fan is configured to: the water spraying filler (303) is close to the inner wall of the box body (300) and forms an included angle with the vertical surface, and the included angle ranges from 0 degree to 90 degrees.
3. The computer processor heat sink employing a bladeless fan of claim 2, wherein: the water spraying filler (303) is formed by mutually overlapping a plurality of layers of corrugated paper.
4. The heat dissipation device of claim 1 or 3, wherein the fan-less fan is configured to: the water collecting tank (400) is arranged at the bottom of the inner cavity of the case shell (100), and water flow is discharged outwards from the water collecting tank (400) through the water outlet pipe (401).
5. The computer processor heat sink employing a bladeless fan of claim 4, wherein: the water collecting tank (400) is internally and uniformly provided with a slow flow baffle (402) for reducing the flow velocity of water flow.
6. The computer processor heat sink employing a bladeless fan of claim 5, wherein: the slow flow baffle (402) is of a V-shaped structure, and water passing holes (4021) are uniformly formed in the surface of the slow flow baffle (402).
7. The computer processor heat sink employing a bladeless fan of claim 4, wherein: the water outlet end of the water spraying mechanism (302) is vertically downward and is opposite to the water spraying filler (303), and the water spraying mechanism (302) supplies water through the water inlet pipe (301).
8. The computer processor heat sink employing a bladeless fan of claim 7, wherein: the water inlet pipe (301), the water outlet pipe (401) and external circulating equipment form a water circulating system.
9. The computer processor heat sink employing a bladeless fan of claim 1, wherein: a frame plate (304) used for fixing the water spraying filler (303) is arranged in the box body (300).
10. The heat dissipation device of claim 1, wherein the fan-less fan is configured to: the processor (101) is fixedly arranged on the mounting plate (102).
CN202221909502.2U 2022-07-25 2022-07-25 Computer processor heat dissipation device adopting fan without fan blades Active CN218037916U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202221909502.2U CN218037916U (en) 2022-07-25 2022-07-25 Computer processor heat dissipation device adopting fan without fan blades

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202221909502.2U CN218037916U (en) 2022-07-25 2022-07-25 Computer processor heat dissipation device adopting fan without fan blades

Publications (1)

Publication Number Publication Date
CN218037916U true CN218037916U (en) 2022-12-13

Family

ID=84386014

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202221909502.2U Active CN218037916U (en) 2022-07-25 2022-07-25 Computer processor heat dissipation device adopting fan without fan blades

Country Status (1)

Country Link
CN (1) CN218037916U (en)

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