CN218018916U - Circuit board stamping device - Google Patents
Circuit board stamping device Download PDFInfo
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- CN218018916U CN218018916U CN202222572893.XU CN202222572893U CN218018916U CN 218018916 U CN218018916 U CN 218018916U CN 202222572893 U CN202222572893 U CN 202222572893U CN 218018916 U CN218018916 U CN 218018916U
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- circuit board
- frame
- punching press
- punching
- waste material
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working
Abstract
The utility model relates to a technical field of circuit board, especially, relate to a circuit board stamping device, which comprises a frame, be provided with workstation and punching press subassembly in the frame, punching press subassembly is including setting up the punching machine in the frame, the mould and the punching press lower mould of setting on the workstation are gone up in the punching press of setting at the punching machine output, the mould is provided with towards the needle in the punching press, the punching press lower mould is provided with and dashes needle complex pinhole, be provided with the collection box in the frame, be provided with the waste material export on the workstation, the opening intercommunication of waste material export and collection box, be provided with the jet-propelled pipe of high pressure that is used for clearing up the circuit board in the frame, blow the waste material to the waste material export discharge during the jet-propelled pipe action of high pressure. This application blows waste material and dust particle to the waste material export through high-pressure jet-propelled pipe, then discharges the collection box from the waste material export to make the surface of punching press lower mould keep clean, reduce the risk that the in-process of a circuit board punching press appeared the waste material and scrapes colored circuit board or even fracturing circuit board, improve the yields of circuit board.
Description
Technical Field
The application relates to the technical field of circuit boards, in particular to a circuit board stamping device.
Background
At present, the pin hole needs to go out through the punch press punching press at the in-process of producing by the circuit board, and the waste material of the in-process circuit board of punching press and the dust granule of punching press formation can fall on stamping die, if waste material and dust granule are not handled in time, the risk of scraping colored circuit board or even fracturing circuit board will appear at the in-process of next circuit board punching press, leads to the yields of circuit board to reduce, remains to further improve this condition.
SUMMERY OF THE UTILITY MODEL
In order to clear up the waste material, improve the yields, this application provides a circuit board stamping device, adopts following technical scheme:
the utility model provides a circuit board stamping device, includes the frame, be provided with workstation and punching press subassembly in the frame, the punching press subassembly is including setting up punching machine in the frame, setting are in mould and setting are in the punching press of punching machine output the punching press lower mould on the workstation, the mould is provided with towards the needle in the punching press, the punching press lower mould be provided with towards needle complex pinhole, be provided with the collection box in the frame, be provided with the waste material export on the workstation, the waste material export with the opening of collection box is aimed at mutually, be provided with the jet-propelled pipe of high pressure that is used for clearing up the circuit board in the frame, the spout of the jet-propelled pipe of high pressure is aimed at the punching press lower mould, blow the waste material to during the jet-propelled pipe action of high pressure waste material export discharges.
By adopting the technical scheme, the pin holes are punched on the circuit board by matching the punching needle of the upper punching die and the pin hole of the lower punching die, waste materials of the circuit board and dust particles formed by punching can fall on the punching die in the punching process, large punched waste materials can directly enter a waste material outlet from the pin hole and then fall into a recovery box, and the dust particles formed in the punching process are blown to the waste material outlet through a high-pressure air injection pipe and then are discharged into the recovery box; this application blows waste material and dust particle to the waste material export through high-pressure jet-propelled pipe, then discharges to the collection box in from the waste material export to make the surface of punching press lower mould keep clean, thereby reduce the in-process of a circuit board punching press down and appear the risk that the waste material scraped colored circuit board or even fracturing circuit board, improve the yields of circuit board.
Optionally, a powder blocking plate is arranged on the workbench and surrounds the waste outlet.
Through adopting above-mentioned technical scheme, when the high-pressure jet pipe blows powder particle to the waste material export, some powder particles can be blown off the workstation, fly away and cause environmental pollution in the air, through setting up the fender powder board around the waste material export, when the powder particle is blown away, can strike on fender powder board and fall into the waste material export along fender powder board, reduce environmental pollution.
Optionally, the stamping die further comprises a material returning assembly, the material returning assembly comprises a driving part arranged on the stamping machine and a material returning plate connected to the output end of the driving part, and the driving part drives the material returning plate to move to separate the circuit board from the stamping upper die.
Through adopting above-mentioned technical scheme, after stamping die carries out the punching press to the circuit board, the circuit board can the chucking on dashing the needle, through setting up material returned subassembly, makes the driving piece drive material returned board and release the circuit board, makes the mould separation in circuit board and the punching press, is convenient for collect the circuit board.
Optionally, the lateral wall of workstation is provided with the guide bar, the slip is provided with support piece on the guide bar, high-pressure gas ejector pipe can dismantle connect in support piece.
Through adopting above-mentioned technical scheme, be provided with the guide bar on the lateral wall of workstation, the slip is provided with support piece on the guide bar, and the jet-propelled pipe of high pressure can be dismantled and connect in support piece to be convenient for carry out the dismouting to the jet-propelled pipe of high pressure, can adjust the jet-propelled position of the jet-propelled pipe of high pressure through removing support piece simultaneously.
Optionally, the high-pressure gas ejector pipe is provided with a plurality of, and is a plurality of the high-pressure gas ejector pipe jets the air to the upper and lower surface of circuit board simultaneously.
By adopting the technical scheme, the upper surface and the lower surface of the circuit board are sprayed with air simultaneously through the plurality of high-pressure air spraying pipes, so that the cleanliness is higher.
Optionally, a slide rail is arranged on the rack, slide blocks matched with the slide rail are arranged on two sides of the recovery box, and the recovery box is connected to the rack in a sliding mode.
Through adopting above-mentioned technical scheme, through the cooperation of slide rail and slider, make collection box sliding connection in the frame, be convenient for retrieve and clean the collection box to the waste material in the collection box.
Optionally, a lamp which faces the lower stamping die and is used for highlighting the waste on the lower stamping die is arranged on one side of the workbench.
Through adopting above-mentioned technical scheme, the waste material on the setting messenger punching press lower mould of lamps and lanterns is more obvious, makes things convenient for operating personnel to observe the cleanliness of punching press lower mould to and clear up piling up the waste material that is not handled totally at punching press lower mould upper surface with appurtenance such as tweezers, further reduce the influence that the waste material brought the die-cut quality of circuit board.
Optionally, a control console is arranged on one side of the rack, a switch button for controlling the punching machine and the high-pressure jet pipe to be started is arranged on the control console, and a frame is arranged on the periphery of the switch button.
Through adopting above-mentioned technical scheme, shift knob is used for controlling punching machine and high-pressure jet-propelled pipe and starts, sets up the frame through week side at shift knob, makes shift knob be difficult for being touched, has reduced operating personnel mistake and has bumped shift knob and make the punching machine start suddenly and cause the phenomenon of incident.
Optionally, a rubber pad is arranged at the bottom of the frame.
Through adopting above-mentioned technical scheme, the rubber pad can increase the frictional force between frame and the ground, makes the frame place more stably, prevents to produce when punching press the circuit board and removes.
In summary, the present application includes at least one of the following beneficial technical effects:
1. according to the circuit board punching machine, the high-pressure air injection pipe is arranged, so that waste materials and dust particles on the upper surface of the lower punching die can be blown to the waste material outlet when the high-pressure air injection pipe injects air, and then the waste materials and the dust particles are discharged into the recovery box from the waste material outlet, so that the surface of the lower punching die is kept clean, the risk that the waste materials scrape circuit boards or even fracture the circuit boards in the punching process of the next circuit board is reduced, and the yield of the circuit boards is improved;
2. through setting up the material returned subassembly, make the driving piece drive the material returned board and release the circuit board, make the circuit board after the punching press and mould separation in the punching press, be convenient for collect the circuit board.
Drawings
Fig. 1 is a schematic structural diagram of a circuit board stamping device according to an embodiment of the present application;
FIG. 2 is an enlarged view of portion A of FIG. 1;
fig. 3 is a cross-sectional view of a circuit board stamping device according to an embodiment of the present application.
Description of reference numerals: 1. a frame; 11. a blanking channel; 12. a slide rail; 13. a rubber pad; 2. a work table; 21. a waste outlet; 22. a powder baffle plate; 23. a light fixture; 3. a stamping assembly; 31. a punch press; 32. stamping an upper die; 321. punching a needle; 33. stamping a lower die; 331. a pinhole; 4. a high-pressure gas injection pipe; 5. a console; 51. a switch button; 52. a frame; 6. a guide bar; 61. a support member; 611. connecting blocks; 612. erecting a rod; 613. a clamping member; 7. a recycling bin; 71. a slider; 8. a material returning component; 81. a drive member; 82. and a material returning plate.
Detailed Description
The present application is described in further detail below with reference to figures 1-3.
The terms "first" and "second" and the like in the specification and drawings of the present application are used for distinguishing different objects or different processes of the same object, and are not used for describing a specific order of the objects.
Furthermore, the terms "including" and "having," and any variations thereof, as referred to in the description of the present application, are intended to cover non-exclusive inclusions. For example, a process, method, system, article, or apparatus that comprises a list of steps or elements is not limited to only those steps or elements but may alternatively include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.
The embodiment of the application discloses circuit board stamping device. Referring to fig. 1 and 2, the circuit board stamping device includes a frame 1, a workbench 2 and a stamping assembly 3 are arranged on the frame 1, the stamping assembly 3 includes a stamping machine 31 arranged on the frame 1, an upper stamping die 32 arranged at the output end of the stamping machine 31 and a lower stamping die 33 arranged on the workbench 2, the upper stamping die 32 is provided with a stamping pin 321, the lower stamping die 33 is provided with a pinhole 331 matched with the stamping pin 321, and the device is matched with the pinhole 331 of the lower stamping die 33 through the stamping pin 321 of the upper stamping die 32 so as to stamp out pin holes on the circuit board.
In the process of punching pin holes on the circuit board, the waste material of the circuit board and dust particles formed by punching can fall on the punching component 3 and need to be cleaned in time.
Referring to fig. 1, a high pressure gas injection pipe 4 is arranged on a rack 1, a nozzle of the high pressure gas injection pipe 4 is aligned with a lower stamping die 33, and after a circuit board is stamped, the high pressure gas injection pipe 4 injects gas to blow away waste materials on the surface of the lower stamping die 33.
Control cabinet 5 is installed to the front end of frame 1, is provided with the shift knob 51 of control punching machine 31 and high-pressure jet pipe 4 start on the control cabinet 5, and shift knob 51's week side is provided with frame 52 to make shift knob 51 be difficult for being touched, reduced operating personnel mistake and bumped shift knob 51 and make punching machine 31 start suddenly and cause the phenomenon of incident.
Referring to fig. 1, a guide bar 6 is provided on a side wall of the table 2, a support member 61 is slidably provided on the guide bar 6, and the high-pressure gas injection pipe 4 is detachably connected to the support member 61. Specifically, the supporting member 61 includes a connecting block 611 slidably connected to the guide rod 6, an upright rod 612 is disposed on the connecting block 611, a clamping member 613 is connected to the upright rod 612, the high-pressure gas injection pipe 4 is clamped to the upright rod 612 by the clamping member 613, and the connecting block 611 slides along the guide rod 6, so that the gas injection position of the high-pressure gas injection pipe 4 is adjustable. Support piece 61 is provided with a plurality ofly, and the high-pressure gas ejector pipe 4 that corresponds also is provided with a plurality ofly, and when the clearance, the gas ejector pipe 4 of a plurality of high pressures is jet-propelled simultaneously, all plays clean effect to the upper and lower surface of circuit board, and the cleanliness is higher.
Referring to fig. 3, frame 1 middle part is provided with unloading passageway 11, and the below of unloading passageway 11 is provided with collection box 7, and collection box 7 has seted up waste material export 21 on the workstation 2, and waste material export 21 aligns with the opening of collection box 7, and when the jet-propelled pipe 4 of high pressure was jet-propelled, with the waste material on punching press lower mould 33 surface blow to waste material export 21 to discharge through waste material export 21 and retrieve in the collection box 7.
Referring to fig. 2, a powder baffle 22 is arranged on the working table 2, and the powder baffle 22 is arranged around the waste material outlet 21, so that powder particles can impact on the powder baffle 22 and fall into the waste material outlet 21 along the powder baffle 22 when being blown away, and the environmental pollution is reduced.
Referring to fig. 1, a slide rail 12 is arranged on the frame 1, slide blocks 71 matched with the slide rail 12 are arranged on two sides of the recycling bin 7, and the recycling bin 7 is slidably connected to the frame 1 through the matching of the slide rail 12 and the slide blocks 71, so that waste materials in the recycling bin 7 can be recycled and the recycling bin 7 can be cleaned conveniently. In particular, the bottom of the recycling bin 7 is further provided with rolling wheels (not shown in the figures) to facilitate removal of the recycling bin 7.
Referring to fig. 2, the circuit board stamping device further includes a material returning assembly 8, the material returning assembly 8 includes a driving member 81 and a material returning plate 82, the driving member 81 is disposed on a side wall of the stamping press 31, the material returning plate 82 is connected to an output end of the driving member 81, and the driving member 81 drives the material returning plate 82 to move to separate the circuit board from the upper stamping die 32 when acting. Specifically, the driving member 81 is a driving cylinder.
The upper surface of the workbench 2 is provided with a lamp 23, the lamp 23 is arranged towards the lower stamping die 33 and used for illuminating the lower stamping die 33 so as to highlight the waste on the lower stamping die 33, so that an operator can observe the cleanliness of the lower stamping die 33 conveniently, and the waste which is accumulated on the upper surface of the lower stamping die 33 and is not processed cleanly is cleaned by auxiliary tools such as tweezers, and the influence of the waste on the punching quality of the circuit board is further reduced.
Further, in order to increase the friction between the frame 1 and the ground, so that the frame 1 is placed more stably, and the frame 1 is prevented from moving when the circuit board is punched, in the embodiment, the bottom of the frame 1 is provided with a rubber pad 13.
The implementation principle of the circuit board stamping device in the embodiment of the application is as follows: through setting up high-pressure gas ejector pipe 4, can blow waste material and the dust granule of punching press lower mould 33 upper surface to waste outlet 21 when high-pressure gas ejector pipe 4 is jet-propelled, then discharge in collection box 7 from waste outlet 21 to make the surface of punching press lower mould 33 keep clean, thereby reduce the risk that the in-process of a circuit board punching press appears the waste material and scrapes colored circuit board or even fracturing circuit board down, improve the yields of circuit board.
The above embodiments are preferred embodiments of the present application, and the protection scope of the present application is not limited by the above embodiments, so: all equivalent changes made according to the structure, shape and principle of the present application shall be covered by the protection scope of the present application.
Claims (9)
1. A circuit board stamping device which characterized in that: including frame (1), be provided with workstation (2) and punching press subassembly (3) on frame (1), punching press subassembly (3) are including setting up punching machine (31), the setting in frame (1) are in mould (32) and setting are in the punching press of punching machine (31) output are in punching press lower mould (33) on workstation (2), mould (32) are provided with towards needle (321) in the punching press, punching press lower mould (33) be provided with towards needle (321) complex pinhole (331), be provided with collection box (7) on frame (1), be provided with waste outlet (21) on workstation (2), waste outlet (21) with the opening of collection box (7) is aligned mutually, be provided with high-pressure jet-propelled pipe (4) that are used for clearing up the circuit board on frame (1), the spout of high-pressure jet-propelled pipe (4) is aimed at punching press lower mould (33), blow the waste material towards when high-pressure jet-propelled pipe (4) act waste outlet (21) discharge waste material.
2. The circuit board punching device according to claim 1, wherein: and a powder blocking plate (22) is arranged on the workbench (2), and the powder blocking plate (22) surrounds the waste outlet (21).
3. The circuit board punching device according to claim 2, wherein: the punching die is characterized by further comprising a material returning assembly (8), wherein the material returning assembly (8) comprises a driving piece (81) arranged on the punching machine (31) and a material returning plate (82) connected to the output end of the driving piece (81), and the driving piece (81) drives the material returning plate (82) to move to enable the circuit board to be separated from the punching upper die (32) when acting.
4. A circuit board stamping device as defined in claim 3, wherein: the lateral wall of workstation (2) is provided with guide bar (6), it is provided with support piece (61) to slide on guide bar (6), high pressure jet-propelled pipe (4) can dismantle connect in support piece (61).
5. The circuit board stamping device according to claim 1, wherein: the high-pressure gas injection pipe (4) is provided with a plurality of high-pressure gas injection pipes (4) which simultaneously inject gas to the upper surface and the lower surface of the circuit board.
6. The circuit board stamping device according to claim 1, wherein: the machine is characterized in that a sliding rail (12) is arranged on the machine frame (1), sliding blocks (71) matched with the sliding rail (12) are arranged on two sides of the recycling box (7), and the recycling box (7) is connected to the machine frame (1) in a sliding mode.
7. The circuit board stamping device according to claim 1, wherein: and a lamp (23) which faces the lower stamping die (33) and is used for highlighting the waste on the lower stamping die (33) is arranged on one side of the workbench (2).
8. The circuit board stamping device according to claim 1, wherein: frame (1) one side is provided with control cabinet (5), be provided with control on control cabinet (5) punching machine (31) with shift knob (51) that high-pressure jet-propelled pipe (4) started, the week side of shift knob (51) is provided with frame (52).
9. The circuit board stamping device according to claim 1, wherein: the bottom of the frame (1) is provided with a rubber pad (13).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222572893.XU CN218018916U (en) | 2022-09-27 | 2022-09-27 | Circuit board stamping device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222572893.XU CN218018916U (en) | 2022-09-27 | 2022-09-27 | Circuit board stamping device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218018916U true CN218018916U (en) | 2022-12-13 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222572893.XU Active CN218018916U (en) | 2022-09-27 | 2022-09-27 | Circuit board stamping device |
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| Country | Link |
|---|---|
| CN (1) | CN218018916U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116330391A (en) * | 2023-04-04 | 2023-06-27 | 深圳市全正科技有限公司 | Die cutting machine for flexible circuit board processing |
-
2022
- 2022-09-27 CN CN202222572893.XU patent/CN218018916U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116330391A (en) * | 2023-04-04 | 2023-06-27 | 深圳市全正科技有限公司 | Die cutting machine for flexible circuit board processing |
| CN116330391B (en) * | 2023-04-04 | 2024-01-12 | 深圳市全正科技有限公司 | Die cutting machine for flexible circuit board processing |
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