CN218006588U

CN218006588U - Flexible circuit board and display module

Info

Publication number: CN218006588U
Application number: CN202220618569.4U
Authority: CN
Inventors: 贺建文
Original assignee: Zhejiang Lianxinkang Technology Co ltd
Current assignee: Zhejiang Lianxinkang Technology Co ltd
Priority date: 2022-03-21
Filing date: 2022-03-21
Publication date: 2022-12-09
Anticipated expiration: 2032-03-21

Abstract

The utility model provides a flexible circuit board and display module assembly, flexible circuit board includes the simplex region, a lateral margin on simplex region is equipped with the joining region, the joining region is used for connecting the display, be provided with a plurality of first holes of digging on the simplex region, first hole along the axis direction interval distribution of extension joining region of digging, a conducting layer has been laid on the surface on simplex region, seted up on the conducting layer with first hole corresponding second of digging digs the hole. A plurality of first digging holes are formed in the single layer area, and a plurality of second digging holes corresponding to the first digging holes are formed in the conducting layer, so that the rebound stress generated when the flexible circuit board is bent is further reduced, the bending resistance of the single layer area is effectively improved, and the technical problem that the bending resistance of the FPC is poor in the prior art is solved.

Description

Flexible circuit board and display module

Technical Field

The utility model relates to a FPC technical field, in particular to flexible circuit board and display module assembly.

Background

The backlight module, the LCD module and the FPC module are main components of the LCM, and the FPC module of the current LCM is usually bent at a certain angle with the LCD module, so that the requirement on the bending resistance of the FPC in the production of the modern LCM is higher.

However, in the prior art, in order to improve the anti-interference capability of the FPC after grounding, the conductive material is additionally attached to the bending area, so that the thickness of the bending area is increased to a certain extent, and the stress of the bending area is further increased, thereby resulting in that the bending requirement of the LCM module production cannot be well met.

SUMMERY OF THE UTILITY MODEL

Based on this, the utility model aims at providing a flexible circuit board and display module assembly for solve FPC's anti bending performance poor technical problem among the prior art.

The utility model provides a flexible circuit board, including the single layer district, a lateral margin on single layer district is equipped with the joining region, the joining region is used for connecting the display, be provided with a plurality of first holes of digging on the single layer district, the first axis direction interval distribution along the extension joining region of digging the hole, a conducting layer has been laid on the surface on single layer district, seted up on the conducting layer with the first hole corresponding second that digs the hole.

According to the flexible circuit board, the plurality of first digging holes are formed in the single layer region, and the plurality of second digging holes corresponding to the first digging holes are formed in the conducting layer, so that the rebound stress generated when the flexible circuit board is bent is further reduced, the bending resistance of the single layer region is effectively improved, and the technical problem that the bending resistance of an FPC (flexible printed circuit) in the prior art is poor is solved.

Further, one end, far away from the connection area, of the single layer area is connected with a double layer area, an element area is arranged on the surface of the double layer area, a reinforcing steel sheet is arranged on one surface, back to the element area, of the double layer area, and the reinforcing steel sheet is arranged corresponding to the element area.

Further, a connection surface is formed between the single-layer region and the double-layer region, and an obtuse angle is formed between the connection surface and the double-layer region.

Further, the flexible circuit board, wherein, the first hole of digging is any one in rectangular shape, oval or square.

Further, the flexible circuit board, wherein the number of the first holes is 3,3, the size of the opening of each first hole gradually decreases from the left end to the right end of the connection area, and the distance between two adjacent first holes gradually increases.

Further, the single-layer region comprises a base layer, an upper covering layer covering the upper surface of the base layer, a copper foil layer covering the lower surface of the base layer, and a lower covering layer covering the lower surface of the copper foil layer, wherein a windowing region is arranged on the upper covering layer.

Further, the flexible circuit board, wherein, the conducting layer is the ground connection copper sheet.

The utility model discloses another aspect still provides a display module assembly, display module assembly adopts technical scheme in the flexible circuit board.

Drawings

Fig. 1 is a schematic structural view of the back side of a flexible printed circuit board according to the present invention;

fig. 2 is an exploded view of the back structure of the flexible printed circuit board according to the present invention;

fig. 3 is a partial side view of a flexible circuit board according to the present invention;

FIG. 4 is a schematic view of the layered structure of a single story region in the present invention;

description of the main element symbols:

single layer area	10	Connecting region	20
				First hole digging	11	Conductive layer	40
Second digging hole	41	Double-layer area	30
				Device region	50	Reinforced steel sheet	60
Connecting surface	70	Base layer	111
				An upper cladding layer	112	Copper foil layer	113
Lower covering layer	114	Area of window opening	115

The following detailed description of the invention will be further described in conjunction with the above-identified drawings.

Detailed Description

In order to facilitate understanding of the present invention, the present invention will be described more fully hereinafter with reference to the accompanying drawings. Several embodiments of the invention are given in the accompanying drawings. The invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.

It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

Please refer to fig. 1 to 4, the flexible circuit board of the present invention includes a single layer area 10, a connection area 20 is disposed at a side edge of the single layer area 10, the connection area 20 is a gold finger horizontally disposed, the gold finger is used for welding a display in a display module, a plurality of first holes 11 are disposed on the single layer area 10, the first holes 11 are spaced apart from each other along an axis direction of the connection area 20, a conductive layer 40 is laid on a surface of the single layer area 10, and a second hole 41 corresponding to the first hole 11 is disposed on the conductive layer 40. The conductive layer 40 is specifically a grounding copper sheet, so that the grounding effect of the FPC can be further enhanced, and the anti-interference capability is improved; the first cutout hole 11 is any one of a long strip, an oval or a square. In this embodiment, a strip shape is preferably used, but not limited thereto, and may be adaptively adjusted according to different FPC design specifications.

Further, one end of the single layer region 10, which is far away from the connection region 20, is connected with a double layer region 30, an element region 50 is arranged on the surface of the double layer region 30, a reinforcing steel sheet 60 is arranged on one surface of the double layer region 30, which faces away from the element region 50, and the reinforcing steel sheet 60 is arranged corresponding to the element region 50. Therefore, when the FPC is wound and folded, due to the rigid action of the reinforcing steel sheet 60, the welding position of the component and the surface of the double-layer area 30 cannot be broken, and the stability of the welding position of the component and the FPC is improved. In addition, the welding position of the element area 50 and the surface of the double-layer area 30 is coated with adhesive, so that the welding firmness of the element and the surface of the double-layer area 30 is improved, and the stability of the welding position of the element and the FPC is further improved.

Specifically, a connection surface 70 is formed between the single-layer region 10 and the double-layer region 30, and an obtuse angle is formed between the connection surface 70 and the double-layer region 30. It can be understood that the connection surface 70 is an inclined surface, and a height difference exists between the single-layer region 10 and the double-layer region 30 due to the inconsistent thickness between the single-layer region 10 and the double-layer region 30, and by providing the connection surface 70, a transition region can be ensured to be generated between the double-layer region 30 and the single-layer region 100, so that a line is protected, and the line is prevented from being broken or broken.

In this embodiment, the number of the first holes 11 is 3,3, the opening size of the first holes 11 gradually decreases from the left end to the right end of the connection region 20, and the distance between two adjacent first holes 11 gradually increases. Thus, the flexibility of the single-layer region 10 is further improved, so that the rebound stress generated when the single-layer region 10 is bent is further reduced, and the bending resistance of the single-layer region 10 is effectively improved; and the first digging hole 11 is reasonable and ingenious in design and high in production feasibility, and compared with the design of the single-layer area 10 of the existing FPC module, the bending resistance is improved to a certain extent. It should be noted that, in practical applications, the signal lines in the single-layer region 10 need to avoid the first cut hole 11.

Specifically, the single-layer region 10 includes a base layer 111, an upper covering layer 112 covering the upper surface of the base layer 111, a copper foil layer 113 covering the lower surface of the base layer 111, and a lower covering layer 114 covering the lower surface of the copper foil layer 113, and a windowing region 115 is disposed on the upper covering layer 112.

To sum up, the utility model discloses flexible circuit board in the middle of the above-mentioned embodiment is through offering a plurality of first holes 11 of digging on individual layer district 10, offers a plurality ofly on the conducting layer 40 and digs hole 41 with the first corresponding second that digs hole 11 for flexible circuit board produced rebound stress when buckling further reduces, has improved the resistant performance of buckling of individual layer district 10 effectively, has solved the poor technical problem of FPC's anti performance of buckling among the prior art.

The utility model also provides a display module assembly, flexible circuit board among the above-mentioned technical scheme.

In the description herein, references to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

The above-mentioned embodiments only represent some embodiments of the present invention, and the description thereof is specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.

Claims

1. The flexible circuit board is characterized by comprising a single layer area, wherein a connecting area is arranged on one side edge of the single layer area and used for being connected with a display, a plurality of first digging holes are formed in the single layer area and distributed at intervals along the axis direction of the extending connecting area, a conductive layer is laid on the surface of the single layer area, and second digging holes corresponding to the first digging holes are formed in the conductive layer.

2. The flexible circuit board of claim 1, wherein a double-layer region is connected to an end of the single-layer region away from the connection region, an element region is disposed on a surface of the double-layer region, and a reinforcing steel sheet is disposed on a surface of the double-layer region facing away from the element region, the reinforcing steel sheet being disposed corresponding to the element region.

3. The flexible circuit board of claim 2, wherein a connection surface is formed between the single-layer region and the double-layer region, and an obtuse angle is formed between the connection surface and the double-layer region.

4. The flexible circuit board of claim 1, wherein the first cutout is any one of an elongated shape, an oval shape, or a square shape.

5. The flexible circuit board according to claim 1, wherein the number of the first cutouts is 3,3, and the opening size of the first cutouts is gradually decreased from the left end to the right end of the connection region, and the interval distance between two adjacent first cutouts is gradually increased.

6. The flexible circuit board of claim 1, wherein the single-layer region includes a substrate, an upper cover layer overlying an upper surface of the substrate, a copper foil layer overlying a lower surface of the substrate, and a lower cover layer overlying a lower surface of the copper foil layer, the upper cover layer having a fenestration area thereon.

7. The flexible circuit board of claim 1, wherein the conductive layer is a grounded copper sheet.

8. A display module comprising the flexible circuit board according to any one of claims 1 to 7.