CN218003281U - Double-vision detection mechanism and scribing machine - Google Patents
Double-vision detection mechanism and scribing machine Download PDFInfo
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- CN218003281U CN218003281U CN202221958956.9U CN202221958956U CN218003281U CN 218003281 U CN218003281 U CN 218003281U CN 202221958956 U CN202221958956 U CN 202221958956U CN 218003281 U CN218003281 U CN 218003281U
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Abstract
The utility model discloses a two vision detection mechanism and scribing machine, include: the assembling seat is connected with the main shaft supporting block; the protective cover is arranged on the assembling seat; the low-power vision component and the high-power vision component are vertically arranged in the protective cover and connected with the assembling seat, and the bottom of the protective cover is provided with a detection port corresponding to the low-power vision component and the high-power vision component; the driving piece is arranged on one side of the bottom of the protective cover and used for providing transverse horizontal driving force; and the shielding plate is arranged at the detection port and connected with the driving piece. The utility model provides a low power vision subassembly can be used to the solitary chip granule and the cutting street of examining on the wafer entirely, and the high power vision subassembly can be clear be used for the local chip granule on the wafer, the detection of enlargeing of cutting street and mar, and the camera lens adopts the tight shot need not frequent zooming, not only can effectively promote the alignment effect in the course of the work, moreover can be clear show chip granule and cutting street and mar.
Description
Technical Field
The utility model relates to a scribing equipment field especially relates to a two vision detection mechanism and scribing machine.
Background
In the working process of the scribing machine, the vision system is needed to observe, align and adjust, and the vision system of the scribing machine directly influences the scribing quality of products. At present, a single group of visual components are generally adopted in an existing visual system, when the single group of visual components are used, complete detection and partial amplification detection of a product need to be carried out by means of a zoom lens in the visual components, and in the using process, due to the fact that the zoom lens is frequently used, damage is easily caused, the phenomena of poor aligning effect, fuzzy cutting path, tool mark offset and the like in the working process are caused, and even the product is scratched. In this regard, we provide a dual vision detection mechanism.
SUMMERY OF THE UTILITY MODEL
In order to overcome the above disadvantages, an object of the present invention is to provide a dual vision inspection mechanism, which has the advantages of being able to individually inspect chip particles and scribe lines on a wafer and detect local chip particles, scribe lines and scratches on the wafer.
In order to achieve the above purpose, the utility model discloses a technical scheme is:
a dual vision inspection mechanism comprising: the assembling seat is connected with the main shaft supporting block; the protective cover is arranged on the assembling seat; the low-power vision component and the high-power vision component are vertically arranged in the protective cover and connected with the assembling seat, and the bottom of the protective cover is provided with a detection port corresponding to the low-power vision component and the high-power vision component; the driving piece is arranged on one side of the bottom of the protective cover and used for providing transverse horizontal driving force; and the shielding plate is arranged at the detection port and connected with the driving piece, and the shielding plate is driven by the transverse horizontal driving force provided by the driving piece to open or close the detection port.
Realize above-mentioned technical scheme, the installation that is used for visual inspection mechanism of mount pad design is fixed, and low power vision subassembly and high power vision subassembly are used for detecting chip granule and cutting street on the wafer surface completely and are used for the enlarged detection of local chip granule and cutting street on the wafer surface respectively, the protection casing is used for protecting low power vision subassembly and high power vision subassembly, the design of shielding plate is used for sheltering from on the detection mouth of low power vision subassembly and high power vision subassembly bottom, in order to prevent that the scribing machine from leading to the aqueous vapor to enter into the protection casing when the scribing, and influence the use of low power vision subassembly and high power vision subassembly.
As an optimal scheme of this application, low power visual component with high power visual component includes the CCD camera and locates the camera lens of CCD camera bottom, the below of camera lens is provided with the correspondence the annular light source of detection mouth.
According to the technical scheme, the CCD camera detects the wafer below through the detection port below the lens, the annular light source irradiates the surface of the wafer through designed LED light, the whole wafer or a small area of the wafer is illuminated in a diffuse reflection mode, when the working distance is 10-80mm, the light source can highlight the edge and height changes of the wafer, highlight the part which is difficult to see originally, and is an ideal choice for edge, chip particle, cutting channel and cutting mark detection and lettering and damage detection of the metal surface.
As a preferred solution of the present application, the lens includes a low power lens disposed in the low power vision component and a high power lens disposed in the high power vision component.
The technical scheme is realized, and the low power lens comprises the following components: the field of view is large, the passing light is large, the brightness is bright, the chip particles and the cutting channels on the whole wafer can be completely observed, and the chip particles and the cutting channels are small; high power lens: the visual field is small, the light passing through is small, the brightness is dark, the observed chip particles and cutting channels are few, and the chip particles and the cutting channels are relatively large and clear.
As a preferred scheme of the present application, the low power lens and the high power lens both use a coaxial light single-tube lens.
Realize above-mentioned technical scheme, coaxial light monocular camera lens provides more even illumination than traditional light source, can highlight the measured product surface unevenness, overcomes the interference that product surface reflection of light caused, mainly used detects bruising, fish tail, crackle and foreign matter etc. of the level and smooth surface of product.
As a preferred scheme of this application, low power camera lens adopts 0.75X coaxial light single tube lens, high power camera lens adopts 3X coaxial light single tube lens.
According to the technical scheme, the 0.75X coaxial light single-tube lens is used for completely detecting the image of the wafer, and the 3X coaxial light single-tube lens is used for locally detecting chip particles, cutting lines, tool marks and the like on the wafer.
As a preferable scheme of the present application, a vertical assembly block is disposed on a side of the assembly seat away from the main shaft support block, and a press block for fixing lenses in the low power vision assembly and the high power vision assembly is disposed on the assembly block.
The technical scheme is realized, so that the lens is vertically arranged on the assembly block and is fixed by the pressing block through screws.
As a preferred scheme of the application, the driving part adopts an air cylinder, a cylinder body of the air cylinder is fixed at the bottom of the protective cover, and a piston rod of the air cylinder is connected with the shielding plate; the shielding plate is provided with an avoiding hole for avoiding the detection port.
The technical scheme is realized, the cylinder drives the connected shielding plate through the piston rod, so that the shielding plate moves on the detection port to open or close the detection port; the avoiding hole is located between the two detection ports when the detection ports are closed by the shielding plate and is used for being overlapped with the detection port on one side of the cylinder when the detection ports are opened so as to reduce the stroke of the cylinder.
A dicing saw comprises a dicing saw body and the rapid visual inspection mechanism.
The beneficial effect of this application:
the utility model provides a low power vision subassembly can be used to solitary chip granule and the cutting street of examining on the wafer entirely, and the high power vision subassembly can be clear be used for the local chip granule on the wafer, the enlarged detection of cutting street and mar, and the camera lens adopts the tight shot and need not frequent zooming, not only can effectively promote the alignment effect in the course of the work, moreover can be clear show chip granule and cutting street and mar.
Drawings
Fig. 1 is a schematic diagram related to the present application.
Fig. 2 is a schematic view of a visual inspection mechanism according to the present application.
Fig. 3 is a schematic view of a detection port and an avoidance hole according to the present application.
In the figure: 1. assembling a seat; 2. a protective cover; 3. a low power vision component; 301. a CCD camera; 302. a lens; 303. an annular light source; 4. a high power vision component; 201. a detection port; 5. a drive member; 6. a shielding plate; 601. avoiding holes; 7. assembling the block; 701. and (7) briquetting.
Detailed Description
The following detailed description of the preferred embodiments of the present invention will be provided in conjunction with the accompanying drawings, so as to enable those skilled in the art to more easily understand the advantages and features of the present invention, and thereby define the scope of the invention more clearly and clearly.
The first embodiment is as follows:
the utility model provides a two vision detection mechanism, refer to fig. 2 and 3, including installing in the assembly seat 1 of main shaft supporting shoe, install protection casing 2 on the assembly seat 1, vertically install the low power vision subassembly 3 and the high power vision subassembly 4 of being connected with the assembly seat 1 in the protection casing 2, the detection mouth 201 that corresponds low power vision subassembly 3 and high power vision subassembly 4 is seted up to the bottom of protection casing 2, and install the shielding plate on the detection mouth 201, the shielding plate is connected with the driving piece of a side-mounting, and the driving piece is used for driving the shielding plate and carries out horizontal migration, in order to shelter from or open detection mouth 201. In this embodiment, the low power vision component 3 and the high power vision component 4 include a CCD camera 301 and a lens 302 installed at the bottom of the CCD camera 301, an annular light source 303 corresponding to the detection port 201 is installed below the lens 302, the lens 302 includes a low power lens installed at the bottom of the low power vision component 3CCD camera 301 and a high power lens installed at the bottom of the high power vision component 4CCD camera 301, and the annular light source 303 is installed on the assembly base 1 at one side through a supporting block so as to be suspended between the detection port 201 and the lens 302.
Referring to fig. 2, in the present embodiment, a CCD camera 301 detects a wafer below through a detection port 201 below a lens 302, and a ring light source 303 irradiates the surface of the wafer through designed LED light, and illuminates the whole wafer or a small area of the wafer in a diffuse reflection manner, and when the working distance is 65mm, the light source can highlight the edge and height changes of the wafer, highlight the originally hard-to-see parts, and is an ideal choice for edge, chip particle, scribe and scribe detection, and lettering and damage detection of the metal surface. In other embodiments, the working distance of the annular light source 303 may be set at 10-80mm.
Referring to fig. 2, the low power lens: the field of view is large, the passing light is large, the brightness is bright, the chip particles and the cutting channels on the whole wafer can be completely observed, and the chip particles and the cutting channels are small; high power lens: the visual field is small, the light passing through is small, the brightness is dark, the observed chip particles and cutting channels are few, and the chip particles and the cutting channels are relatively large and clear.
Referring to fig. 2, in order to detect the bruise, scratch, crack, foreign matter, etc. of the flat and smooth surface of the product. In this embodiment, low power camera lens and high power camera lens all adopt coaxial light single-tube lens, utilize coaxial light single-tube lens to provide more even illumination than traditional light source, can highlight by survey product surface unevenness, overcome the interference that product surface reflection of light caused.
Referring to fig. 2, in order to completely detect the entire image of the wafer and partially detect the chip particles, scribe lines, and tool marks on the wafer. In this embodiment, the low power lens uses a 0.75X coaxial single-tube lens, and the high power lens uses a 3X coaxial single-tube lens. In other embodiments, the high power lens may be a 1.5X, 4.5X or 6X coaxial single-cylinder lens or a 1.5X-10X zoom lens according to the size of the chip particles, the cutting lines, the cutting marks and other shapes.
Referring to fig. 2, to facilitate the installation and fixation of the low vision component 3 and the high vision component 4. In this embodiment, a vertical assembly block 7 is installed on a side of the assembly base 1 away from the main shaft support block, and a pressing block 701 for fixing the lens 302 in the low power vision component 3 and the high power vision component 4 is installed on the assembly block 7.
Referring to fig. 2 and 3, the driving member 5 is a cylinder, a cylinder body of the cylinder is fixedly installed on one side of the bottom of the protection cover 2, and a piston rod of the cylinder is connected with the shielding plate 6. In the present embodiment, the shutter 6 connected is driven by the cylinder through the piston rod, and the shutter 6 is moved on the detection port 201 to open or close the detection port.
Referring to fig. 3, the shielding plate 6 is provided with an avoidance hole 601 for avoiding the detection port 201. In the present embodiment, the avoiding hole 601 is located between the two detection ports 201 when the shielding plate 6 closes the detection ports 201, and is configured to overlap with the detection port 201 on the side of the cylinder when the detection port 201 is opened, so as to reduce the stroke of the cylinder.
Example two
A dicing saw, referring to FIG. 1, includes a dicing saw 8 and a rapid visual inspection mechanism installed in the first embodiment.
Specifically, during actual use, the mounting seat 1 is designed for mounting and fixing the visual detection mechanism, the low power visual component 3 and the high power visual component 4 are respectively used for completely detecting chip particles and cutting streets on the surface of a wafer and for amplifying and detecting local chip particles and cutting streets on the surface of the wafer, the protective cover 2 is used for protecting the low power visual component 3 and the high power visual component 4, and the shielding plate 6 is designed for shielding the detection ports 201 at the bottoms of the low power visual component 3 and the high power visual component 4 so as to prevent moisture from entering the protective cover 2 when the dicing saw is used for dicing and influencing the use of the low power visual component 3 and the high power visual component 4. When the wafer processing device is used, the X-axis driving component on the dicing saw drives the visual detection mechanism on the main shaft supporting block to rapidly move to the position above a product to be processed, the low-power visual component 3 detects chip particles on the surface of a wafer and cutting channels among the chip particles, the low-power visual component is used for correcting the position of the product, and the high-power visual component 4 can be used for clearly amplifying local chip particles on the surface of the wafer detected by the low-power visual component 3 and the cutting channels and scratches among the chip particles.
The above embodiments are only for illustrating the technical concept and features of the present invention, and the purpose of the above embodiments is to let the person skilled in the art understand the contents of the present invention and implement the present invention, which can not limit the protection scope of the present invention, and all equivalent changes or modifications made according to the spirit of the present invention should be covered in the protection scope of the present invention.
Claims (8)
1. A dual vision detection mechanism, comprising:
an assembly seat (1) connected to the main shaft supporting block;
the protective cover (2) is arranged on the assembling seat (1);
the visual inspection device comprises a low-power visual component (3) and a high-power visual component (4) which are vertically arranged in the protective cover (2) and connected with the assembling seat (1), wherein the bottom of the protective cover (2) is provided with an inspection opening (201) corresponding to the low-power visual component (3) and the high-power visual component (4);
the driving piece (5) is arranged on one side of the bottom of the protective cover (2) and is used for providing a transverse horizontal driving force; and the number of the first and second groups,
the shielding plate (6) is arranged at the detection port (201) and connected with the driving piece (5), and the shielding plate (6) is driven by the driving piece (5) to open or close the detection port (201) through the transverse horizontal driving force.
2. A dual vision detection mechanism according to claim 1, wherein the low power vision component (3) and the high power vision component (4) comprise a CCD camera (301) and a lens (302) arranged at the bottom of the CCD camera (301), and an annular light source (303) corresponding to the detection port (201) is arranged below the lens (302).
3. A dual vision detection mechanism according to claim 2, wherein the lens (302) comprises a low power lens provided in the low power vision component (3) and a high power lens provided in the high power vision component (4).
4. A dual vision detecting mechanism according to claim 3, wherein said low power lens and said high power lens are coaxial single-tube lenses.
5. A dual vision detecting mechanism according to claim 4, wherein said low power lens is a 0.75X coaxial single cylinder lens, and said high power lens is a 3X coaxial single cylinder lens.
6. A double vision detection mechanism according to claim 1, characterized in that a vertical assembly block (7) is arranged on a side of the assembly base (1) facing away from the main shaft support block, and a pressing block (701) for fixing the lens (302) in the low power vision component (3) and the high power vision component (4) is arranged on the assembly block (7).
7. A double vision detecting mechanism according to claim 1, characterized in that the driving member (5) is a cylinder, the cylinder body of the cylinder is fixed on the bottom of the protective cover (2), and the piston rod of the cylinder is connected with the shielding plate (6); and an avoiding hole (601) for avoiding the detection port (201) is formed in the shielding plate (6).
8. A dicing saw comprising a dicing saw and the rapid visual inspection mechanism of any one of claims 1-7.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221958956.9U CN218003281U (en) | 2022-07-28 | 2022-07-28 | Double-vision detection mechanism and scribing machine |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221958956.9U CN218003281U (en) | 2022-07-28 | 2022-07-28 | Double-vision detection mechanism and scribing machine |
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| Publication Number | Publication Date |
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| CN218003281U true CN218003281U (en) | 2022-12-09 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202221958956.9U Active CN218003281U (en) | 2022-07-28 | 2022-07-28 | Double-vision detection mechanism and scribing machine |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116190285A (en) * | 2023-04-28 | 2023-05-30 | 江西省兆驰光电有限公司 | Screening and packaging technology for improving reliability of Mini LED device |
| CN117428351A (en) * | 2023-12-21 | 2024-01-23 | 珠海市申科谱工业科技有限公司 | Wafer cutting method and device, electronic equipment and medium |
-
2022
- 2022-07-28 CN CN202221958956.9U patent/CN218003281U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116190285A (en) * | 2023-04-28 | 2023-05-30 | 江西省兆驰光电有限公司 | Screening and packaging technology for improving reliability of Mini LED device |
| CN117428351A (en) * | 2023-12-21 | 2024-01-23 | 珠海市申科谱工业科技有限公司 | Wafer cutting method and device, electronic equipment and medium |
| CN117428351B (en) * | 2023-12-21 | 2024-03-15 | 珠海市申科谱工业科技有限公司 | Wafer cutting method and device, electronic equipment and medium |
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