CN218003216U - Novel high-efficient integrated circuit paster tin cream adhesion's check out test set - Google Patents
Novel high-efficient integrated circuit paster tin cream adhesion's check out test set Download PDFInfo
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- CN218003216U CN218003216U CN202221415438.2U CN202221415438U CN218003216U CN 218003216 U CN218003216 U CN 218003216U CN 202221415438 U CN202221415438 U CN 202221415438U CN 218003216 U CN218003216 U CN 218003216U
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- test block
- mounting panel
- integrated circuit
- mounting bracket
- mounting
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- 238000012360 testing method Methods 0.000 title claims abstract description 84
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 title claims abstract description 11
- 239000006071 cream Substances 0.000 title claims abstract description 11
- 229910000679 solder Inorganic materials 0.000 claims description 19
- 230000002146 bilateral effect Effects 0.000 claims description 6
- 238000001514 detection method Methods 0.000 claims description 6
- 230000007306 turnover Effects 0.000 claims description 2
- 238000003825 pressing Methods 0.000 abstract description 6
- 230000000694 effects Effects 0.000 abstract description 4
- 238000002474 experimental method Methods 0.000 abstract description 2
- 230000001915 proofreading effect Effects 0.000 abstract 2
- 238000000926 separation method Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 3
- 230000008859 change Effects 0.000 description 2
- 230000006835 compression Effects 0.000 description 2
- 238000007906 compression Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 150000003071 polychlorinated biphenyls Chemical class 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
- 239000013008 thixotropic agent Substances 0.000 description 1
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- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The utility model discloses a novel check out test set of high-efficient integrated circuit paster tin cream adhesion, which comprises a mounting bracket, the upper surface of mounting bracket is provided with the cylinder, the piston rod of cylinder runs through the mounting bracket top and is provided with the mounting panel, the lower surface of going up the mounting panel is provided with the tensiometer, the couple department of tensiometer lower extreme is provided with down the mounting panel, the below of mounting panel is equipped with test block and fixture down, through setting up the locating rack, can place the test block down inside the rectangle region who encloses between locating rack and assembly plate, and locating rack cooperation assembly plate presss from both sides the fastening to lower test block and fixes, plays the effect of proofreading down the test block, through setting up flip, can pass the upper surface of pressing sleeve from top to bottom placing test block down on the test block after turning over a book flip, plays the effect of proofreading up the test block for the position unanimity of test block and lower test block adhesion on the multiunit, the variable of control contrast experiment improves the accuracy that the adhesion detected.
Description
Technical Field
The utility model belongs to the technical field of the tin cream production facility, concretely relates to novel check out test set of high-efficient integrated circuit paster tin cream adhesion.
Background
Solder paste, which is a novel welding material produced along with SMT, is a paste mixture formed by mixing solder powder, soldering flux, other surfactants, thixotropic agents and the like, and is mainly used for welding electronic components such as surface resistors, capacitors, ICs and the like of PCBs in the SMT industry, and the solder paste needs to be subjected to adhesion testing in the production process.
The existing solder paste adhesion force detection equipment is generally used for smearing solder paste on the contact surface of an upper test block and a lower test block, measuring the tensile force required by the separation of the upper test block and the lower test block, comparing a contrast group with qualified solder paste quality, and detecting the adhesion force of the solder paste.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a novel check out test set of high-efficient integrated circuit paster tin cream adhesion to solve the problem that proposes in the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a novel check out test set of high-efficient integrated circuit paster tin cream adhesion, includes the mounting bracket, the upper surface of mounting bracket is provided with the cylinder, the piston rod of cylinder runs through the mounting bracket top and is provided with the mounting panel, the lower surface of going up the mounting panel is provided with the tensiometer, the couple department of tensiometer lower extreme is provided with down the mounting panel, the below of mounting panel is equipped with test block and fixture down, bottom surface in the mounting bracket is provided with the assembly plate, the right side wall of assembly plate is equipped with down the test block, the outside cover of test block is equipped with the locating rack down, the left end of locating rack runs through the assembly plate lateral wall and extends to the left side of assembly plate, the upper surface of assembly plate articulates there is flip, the center department of flip upper surface is provided with position sleeve, and the position sleeve cover establishes the outside of test block under.
Preferably, fixture includes the supporting rod, and the supporting rod bilateral symmetry is equipped with two, two the supporting rod all articulates the lower surface at the mounting panel down, the mounting groove has been seted up to mounting panel lateral wall bilateral symmetry down, two the inside wall of mounting groove all rotates and is connected with electric telescopic handle, two electric telescopic handle's lower extreme articulates respectively two the lateral wall of supporting rod, two the lower extreme of supporting rod all offsets with the lateral wall of last test block.
Preferably, the left end front and back symmetry of locating rack is provided with the folded plate, and all is provided with reset spring and direction telescopic link between two folded plates and the assembly plate, reset spring cover establishes the outside at the direction telescopic link.
Preferably, the right side of test block down is equipped with and compresses tightly the cover, the draw-in groove has all been seted up to locating rack and flip's right side wall, two the draw-in groove is all established in the left end outside that compresses tightly the cover.
Preferably, a gap is reserved between the turnover cover and the upper surface of the lower test block, and the lower end of the upper test block is abutted against the upper surface of the lower test block.
Preferably, the inside wall of mounting bracket is provided with high-speed camera, high-speed camera is located the tensiometer panel board directly behind, the front of mounting bracket is provided with the controller, electric telescopic handle and high-speed camera all with controller wire connection.
Compared with the prior art, the beneficial effects of the utility model are that:
(1) This novel check out test set of high-efficient integrated circuit paster tin cream adhesion, through setting up the locating rack, can place down the test block behind the rectangular area inside that encloses between locating rack and assembly plate, locating rack cooperation assembly plate presss from both sides the clamp fixedly to lower test block, play the effect of correcting test block down, through setting up flip, can be after turning over flip, pass the upper surface of placing test block under from the top down of compression sleeve with last test block, play the effect of correcting the test block, make the position of test block and test block adhesion unanimous on the multiunit, be convenient for control the variable of experiment, improve the accuracy that the adhesion detected.
(2) This novel check out test set of high-efficient integrated circuit paster tin cream adhesion through setting up fixture, can drive the lower extreme of two supporting rods and be close to each other when two electric telescopic handle synchronous extensions, carries out the centre gripping to the lower test block that lies in between two supporting rod lower extremes and fixes.
Drawings
Fig. 1 is a schematic perspective view of the present invention;
fig. 2 is a front sectional view of the present invention;
fig. 3 is a cross-sectional top view of the present invention;
fig. 4 is an enlarged view of the structure of the position a in fig. 2.
In the figure: 1. a mounting frame; 2. a cylinder; 3. an upper mounting plate; 4. a tension meter; 5. a lower mounting plate; 6. loading a test block; 7. a clamping mechanism; 701. a clamping rod; 702. mounting grooves; 703. an electric telescopic rod; 8. a test block is put down; 9. assembling a plate; 10. a positioning frame; 11. a return spring; 12. a cover is turned; 13. a compression sleeve; 14. a card slot; 15. positioning the sleeve; 16. a high-speed camera; 17. and a controller.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Please refer to fig. 1-4, the utility model provides a novel high-efficient integrated circuit paster tin cream adhesion's check out test set, including mounting bracket 1, the upper surface of mounting bracket 1 is provided with cylinder 2, the piston rod of cylinder 2 runs through mounting bracket 1 top and is provided with mounting panel 3, the lower surface of going up mounting panel 3 is provided with tensiometer 4, the couple department of tensiometer 4 lower extreme is provided with down mounting panel 5, the below of lower mounting panel 5 is equipped with test block 6 and fixture 7, bottom surface in the mounting bracket 1 is provided with assembly plate 9, the right side wall of assembly plate 9 is equipped with test block 8 down, the outside cover of test block 8 is equipped with locating rack 10 down, the left end of locating rack 10 runs through the left side of assembly plate 9 lateral wall and extends to assembly plate 9, the upper surface of assembly plate 9 articulates there is flip 12, the center department of flip 12 upper surface is provided with positioning sleeve 15, and positioning sleeve 15 covers the outside of establishing test block 8 down.
In this embodiment, it is preferable, fixture 7 includes clamping rod 701, and clamping rod 701 bilateral symmetry is equipped with two, two clamping rod 701 all articulate the lower surface of mounting panel 5 under, mounting groove 702 has been seted up to lower mounting panel 5 lateral wall bilateral symmetry, the inside wall of two mounting grooves 702 is all rotated and is connected with electric telescopic handle 703, the lower extreme of two electric telescopic handle 703 articulates the lateral wall at two clamping rod 701 respectively, the lower extreme of two clamping rod 701 all offsets with the lateral wall of last test block 6, when two electric telescopic handle 703 extend in step, the lower extreme that drives two clamping rod 701 is close to each other, it is fixed to carry out the centre gripping to lower test block 8 that lies in between two clamping rod 701 lower extremes, in the same way when electric telescopic handle 703 shortens in step, it is fixed to remove clamping rod 701 to the centre gripping of test block 8 down.
In this embodiment, it is preferred, the left end front and back symmetry of locating rack 10 is provided with the folded plate, and all be provided with reset spring 11 and direction telescopic link between two folded plates and assembly plate 9, reset spring 11 cover is established in the outside of direction telescopic link, with locating rack 10 pulling right, will descend test block 8 to place inside the rectangle region that encloses between locating rack 10 and assembly plate 9, and loosen locating rack 10 afterwards, reset spring 11 kick-backs, pull locating rack 10 and remove left, locating rack 10 cooperation assembly plate 9 presss from both sides tightly fixedly to test block 8 down.
In this embodiment, preferably, the pressing sleeve 13 is arranged on the right side of the lower test block 8, the clamping grooves 14 are formed in the right side walls of the positioning frame 10 and the flip 12, the two clamping grooves 14 are all sleeved outside the left end of the pressing sleeve 13, the left end of the pressing sleeve 13 is clamped into the two clamping grooves 14, and then the separation of the right ends of the flip 12 and the positioning frame 10 is prevented, the flip 12 is prevented from being lifted in the process of upwards pulling the upper test block 6, a blocking feeling is generated between the flip 12 and the upper test block 6, and the accuracy of the tensile force measured by the tension meter 4 is influenced.
In this embodiment, preferably, a gap is left between the flip 12 and the upper surface of the lower test block 8 to prevent the flip 12 from contacting the solder paste, the lower end of the upper test block 6 abuts against the upper surface of the lower test block 8, the solder paste having sufficiently returned to the temperature is uniformly applied on the upper surface of the lower test block 8, then the upper test block 6 is placed on the upper surface of the lower test block 8, and after the solder paste is cooled, the adhesion of the solder paste is determined by measuring the tensile force separating the upper test block 6 from the lower test block 8.
In this embodiment, preferably, the inside wall of the mounting bracket 1 is provided with the high-speed camera 16, the high-speed camera 16 is located directly behind the 4 panels of the tension meter, through setting up the high-speed camera 16, can record in the shrink process of the piston rod of the cylinder 2, the change of the 4 panels of the tension meter scale, the front of the mounting bracket 1 is provided with the controller 17, electric telescopic handle 703 and high-speed camera 16 all with controller 17 connection of electric lines, operating personnel can control the flexible of electric telescopic handle 703 through the controller 17, and adjust the shooting time of the high-speed camera 16.
The utility model discloses a theory of operation and use flow: when the device is used, the positioning frame 10 is pulled rightwards, the lower test block 8 is placed in a rectangular area enclosed between the positioning frame 10 and the assembling plate 9, the positioning frame 10 is loosened afterwards, the return spring 11 rebounds, the positioning frame 10 is pulled to move leftwards, the positioning frame 10 is matched with the assembling plate 9 to clamp and fix the lower test block 8, the fully-tempered solder paste is uniformly coated on the upper surface of the lower test block 8, the flip cover 12 is turned over until the right end of the flip cover 12 is abutted to the positioning frame 10, the left end of the pressing sleeve 13 is clamped into the two clamping grooves 14, so that the separation of the flip cover 12 and the right end of the positioning frame 10 is prevented, the upper test block 6 passes through the pressing sleeve 13 and is placed on the upper surface of the lower test block 8 from top to bottom, treat solder paste cooling back, make the piston rod extension of cylinder 2, drive the lower extreme of two supporting rods 701 and descend to the outside of test block 8 down, make two electric telescopic handle 703 extend in step, drive the lower extreme of two supporting rods 701 and be close to each other, it is fixed to carry out the centre gripping to the lower test block 8 that lies in between two supporting rods 701 lower extremes, then the piston rod of cylinder 2 shortens, at the in-process with test block 6 and the separation of test block 8 down, the change of 4 panel board scales of tensiometer is shot to high-speed camera 16, with the required pulling force of measuring the separation of test block 6 with test block 8 down, and then judge the adhesion of solder paste.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (6)
1. The utility model provides a novel check out test set of high-efficient integrated circuit paster tin cream adhesion, includes mounting bracket (1), its characterized in that: the upper surface of mounting bracket (1) is provided with cylinder (2), the piston rod of cylinder (2) runs through mounting bracket (1) top and is provided with mounting panel (3), the lower surface of going up mounting panel (3) is provided with tensiometer (4), couple department of tensiometer (4) lower extreme is provided with down mounting panel (5), the below of mounting panel (5) is equipped with test block (6) and fixture (7) down, bottom surface in mounting bracket (1) is provided with mounting panel (9), the right side wall of mounting panel (9) is equipped with down test block (8), the outside cover of test block (8) is equipped with locating rack (10) down, the left end of locating rack (10) runs through mounting panel (9) lateral wall and extends to the left side of mounting panel (9), the upper surface of mounting panel (9) articulates there is flip (12), the center department of flip (12) upper surface is provided with position sleeve (15), and position sleeve (15) cover establishes the outside of test block (8) down.
2. The novel efficient integrated circuit patch solder paste adhesion detection device of claim 1, wherein: fixture (7) are including supporting rod (701), and supporting rod (701) bilateral symmetry is equipped with two, two supporting rod (701) all articulates the lower surface of mounting panel (5) down, mounting groove (702), two have been seted up to mounting panel (5) lateral wall bilateral symmetry down the inside wall of mounting groove (702) all rotates and is connected with electric telescopic handle (703), two the lower extreme of electric telescopic handle (703) articulates respectively two the lateral wall of supporting rod (701), two the lower extreme of supporting rod (701) all offsets with the lateral wall of last test block (6).
3. The novel efficient integrated circuit patch solder paste adhesion detection device of claim 1, wherein: the left end front and back symmetry of locating rack (10) is provided with the folded plate, and all is provided with reset spring (11) and direction telescopic link between two folded plates and assembly plate (9), reset spring (11) cover is established in the outside of direction telescopic link.
4. The novel efficient integrated circuit patch solder paste adhesion detection device of claim 1, wherein: the right side of test block (8) is equipped with compresses tightly cover (13) down, draw-in groove (14) have all been seted up to the right side wall of locating rack (10) and flip (12), two draw-in groove (14) all overlap the left end outside that compresses tightly cover (13).
5. The novel and efficient integrated circuit patch solder paste adhesion detection device of claim 1, wherein: a gap is reserved between the turnover cover (12) and the upper surface of the lower test block (8), and the lower end of the upper test block (6) is abutted to the upper surface of the lower test block (8).
6. The novel high-efficiency integrated circuit patch solder paste adhesion detection device of claim 2, wherein: the inside wall of mounting bracket (1) is provided with high-speed camera (16), high-speed camera (16) are located tensiometer (4) panel board directly behind, the front of mounting bracket (1) is provided with controller (17), electric telescopic handle (703) and high-speed camera (16) all with controller (17) connection by wire.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221415438.2U CN218003216U (en) | 2022-06-08 | 2022-06-08 | Novel high-efficient integrated circuit paster tin cream adhesion's check out test set |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221415438.2U CN218003216U (en) | 2022-06-08 | 2022-06-08 | Novel high-efficient integrated circuit paster tin cream adhesion's check out test set |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218003216U true CN218003216U (en) | 2022-12-09 |
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ID=84293743
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202221415438.2U Active CN218003216U (en) | 2022-06-08 | 2022-06-08 | Novel high-efficient integrated circuit paster tin cream adhesion's check out test set |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218003216U (en) |
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2022
- 2022-06-08 CN CN202221415438.2U patent/CN218003216U/en active Active
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| Date | Code | Title | Description |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20240124 Address after: No. 503, Datong Road, Wuxi Economic Development Zone, Jiangsu 214000 Patentee after: Zhenhe Technology (Jiangsu) Co.,Ltd. Country or region after: China Address before: 230001 In the government compound of the former intersection of Hefei Shanghai Industrial Park, Liangyuan Town, Feidong County, Hefei City, Anhui Province Patentee before: Hefei Changtian Chemical Technology Co.,Ltd. Country or region before: China |