CN217989915U - Transducer assembly structure - Google Patents
Transducer assembly structure Download PDFInfo
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- CN217989915U CN217989915U CN202221991055.XU CN202221991055U CN217989915U CN 217989915 U CN217989915 U CN 217989915U CN 202221991055 U CN202221991055 U CN 202221991055U CN 217989915 U CN217989915 U CN 217989915U
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Abstract
The utility model relates to a transducer technical field discloses a transducer subassembly structure, include the casing, establish the ceramic chip of bottom in the casing, be equipped with the fore-set that orders about ceramic chip's downside and the interior bottom surface of casing keep the butt in the casing, be equipped with the annular gap between the periphery of fore-set and the medial surface of casing, be equipped with the notes gluey groove that communicates with the annular gap on the up end of fore-set, it is filled with sealed glue to annotate gluey groove and annular gap intussuseption. The utility model discloses have ceramic chip location stable, beneficial effect that whole production efficiency is high.
Description
Technical Field
The utility model relates to a transducer technical field especially relates to a transducer subassembly structure.
Background
The ultrasonic transducer is a component for realizing mutual conversion between sound energy and electric energy, and the function of the ultrasonic transducer is to convert input electric power into mechanical power (namely ultrasonic wave) and transmit the mechanical power. Piezoelectric transducers are a common type of ultrasonic transducer and are also a major component of ultrasonic technology. The existing ultrasonic transducer has a very simple structure, and usually, a piezoelectric ceramic chip is directly encapsulated by glue pouring after being arranged in a shell, so that the piezoelectric ceramic chip is lack of positioning before glue pouring, and the position and the angle of the piezoelectric ceramic chip can deviate after glue pouring, thereby affecting the overall quality; in order to keep the anti-interference performance of the piezoelectric ceramic chip, the glue filling space in the shell is usually larger, the glue filling amount is also large, and the glue solidification time is longer, so that the production efficiency is influenced.
SUMMERY OF THE UTILITY MODEL
The utility model discloses a solve the above-mentioned problem that the transducer among the prior art exists, provide a stable, the high transducer subassembly structure of whole production efficiency in ceramic chip location.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
the utility model provides a transducer component structure, includes the casing, establishes the ceramic chip of bottom in the casing, be equipped with the fore-set that the downside that orders about ceramic chip and the interior bottom of casing kept the butt in the casing, be equipped with the annular gap between the periphery of fore-set and the medial surface of casing, be equipped with the notes groove of gluing with the annular gap intercommunication on the up end of fore-set, it is filled with sealed glue to glue groove and annular gap intussuseption. After the ceramic chip is arranged in the shell, the ceramic chip is tightly pressed and positioned through the support pillar, then sealant is filled into the sealant filling groove, the sealant enters the annular gap, and the support pillar and the shell are reliably bonded together after the sealant is solidified; this kind of transducer subassembly is before the encapsulating, and ceramic chip is fixed a position completely, and the setting up of fore-set makes the encapsulating volume show to reduce simultaneously, and the colloid setting time is showing and is shortening to improve production efficiency.
Preferably, a flexible gasket is arranged between the lower end of the top column and the upper side surface of the ceramic chip. The flexible gasket plays a role in protecting the ceramic chip and prevents the lower end of the top column from being directly pressed on the ceramic chip to damage the ceramic chip; meanwhile, the effect of isolating external interference can be improved.
Preferably, two sides of the top column are respectively provided with a lead groove, the upper end of each lead groove is communicated with the glue injection groove, the lower end of each lead groove is communicated with the lower end face of the top column, and two power lines on the ceramic chip are respectively led out from the lead grooves.
Preferably, the upper end opening part of casing is equipped with the shoulder hole, the upper end of fore-set is equipped with the bulge loop with shoulder hole clearance fit, form annular injecting glue chamber between the lower terminal surface of bulge loop and the ladder face of shoulder hole, annular clearance's upper end and annular injecting glue chamber intercommunication. During the encapsulating, the colloid gets into annular injecting glue intracavity and makes the protruding ring and the stable bonding between the ladder face be in the same place, strengthens joint strength and the reliability between fore-set and the casing.
Preferably, an annular boss is arranged on the outer side of the upper end of the shell, and an annular positioning groove is formed in the lower side face of the annular boss. The annular positioning groove facilitates installation and use of the transducer assembly.
Preferably, the shell and the top column are both made of PEEK materials. The PEEK material has good corrosion resistance, ageing resistance and interference resistance; enhancing the overall stability of the transducer assembly.
Therefore, the utility model discloses ceramic chip location is stable, the high beneficial effect of whole production efficiency has.
Drawings
Fig. 1 is a schematic view of the overall structure of the present invention.
Fig. 2 is an exploded view of fig. 1.
Fig. 3 is a top view of fig. 1.
Fig. 4 isbase:Sub>A cross-sectional view taken atbase:Sub>A-base:Sub>A in fig. 3.
Fig. 5 is a cross-sectional view taken at B-B in fig. 3.
In the figure: the ceramic chip comprises a shell 1, an annular boss 10, an annular positioning groove 11, a stepped hole 100, a stepped surface 101, a ceramic chip 2, a power line 20, a top column 3, an annular gap 30, a glue injection groove 31, a lead groove 32, a convex ring 33, an annular glue injection cavity 34 and a flexible gasket 4.
Detailed Description
The invention will be further described with reference to the accompanying drawings and specific embodiments:
as shown in fig. 1-5 a transducer subassembly structure, which comprises a housin 1, establish ceramic chip 2 of bottom in the casing, be equipped with the fore-set 3 that orders about ceramic chip's downside and the interior bottom surface of casing and keep the butt in the casing 1, be equipped with flexible gasket 4 between the lower extreme of fore-set and ceramic chip's the side of going up, be equipped with annular gap 30 between the periphery of fore-set 3 and the medial surface of casing, be equipped with the injecting glue groove 31 with the annular gap intercommunication on the up end of fore-set, injecting glue groove and annular gap intussuseption are filled with sealed glue.
Two sides of the top column 3 are respectively provided with a lead groove 32, the upper end of the lead groove is communicated with the glue injection groove, the lower end of the lead groove is communicated with the lower end surface of the top column, two power lines 20 on the ceramic chip 2 are respectively led out from the lead grooves, and the two power lines are collected to the central position of the glue injection groove after being led out.
A stepped hole 100 is formed in an opening at the upper end of the shell 1, a convex ring 33 in clearance fit with the stepped hole is arranged at the upper end of the top column 3, an annular glue injection cavity 34 is formed between the lower end face of the convex ring and a stepped face 101 of the stepped hole, and the upper end of the annular gap is communicated with the annular glue injection cavity; the upper end outside of casing 1 is equipped with annular boss 10, and the downside of annular boss is equipped with annular constant head tank 11.
The housing 1 and the top pillar 3 in this embodiment are both made of PEEK material.
With the attached drawings, the principle of the utility model is as follows: the ceramic chip is firstly arranged in the shell, the flexible gasket is arranged in the shell, then the top column is arranged in the shell, the upper end of the top column is tightly pressed through an external pressing block, then glue is injected into the glue injection groove, the space (annular gap, annular glue injection cavity and glue injection groove) in the shell is filled with the sealant, and the production of the transducer assembly is completed after the sealant is solidified. This kind of transducer subassembly is before the encapsulating, and ceramic chip is fixed a position completely, and the setting up of fore-set makes the encapsulating volume show to reduce simultaneously, and the colloid setting time is showing and is shortening to improve production efficiency.
The above is only a specific embodiment of the present invention, but the technical features of the present invention are not limited thereto. Any simple changes, equivalent substitutions or modifications made on the basis of the present invention to solve the same technical problems and achieve the same technical effects are all covered by the protection scope of the present invention.
Claims (6)
1. The utility model provides a transducer component structure, includes the casing, establishes the ceramic chip of bottom in the casing, characterized by, be equipped with the fore-set that orders about ceramic chip's downside and the interior bottom of casing keep the butt in the casing, be equipped with the annular gap between the periphery of fore-set and the medial surface of casing, be equipped with the notes groove of gluing with the annular gap intercommunication on the up end of fore-set, it is filled with sealed glue to glue groove and annular gap intussuseption.
2. The transducer assembly structure of claim 1 wherein a compliant gasket is provided between the lower end of the top post and the upper side of the ceramic chip.
3. The transducer assembly structure according to claim 1 or 2, wherein two sides of the top pillar are respectively provided with a lead groove, the upper end of each lead groove is communicated with the glue injection groove, the lower end of each lead groove is communicated with the lower end surface of the top pillar, and two power lines on the ceramic chip are respectively led out from the lead grooves.
4. The transducer assembly structure as claimed in claim 1, wherein a stepped hole is formed at the opening at the upper end of the housing, a protruding ring is arranged at the upper end of the top pillar, the protruding ring is in clearance fit with the stepped hole, an annular glue injection cavity is formed between the lower end face of the protruding ring and the stepped surface of the stepped hole, and the upper end of the annular gap is communicated with the annular glue injection cavity.
5. The transducer assembly structure of claim 1, wherein the outer side of the upper end of the casing is provided with an annular boss, and the lower side of the annular boss is provided with an annular positioning groove.
6. The transducer assembly structure of claim 1 wherein the housing and the top post are made of PEEK material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221991055.XU CN217989915U (en) | 2022-07-22 | 2022-07-22 | Transducer assembly structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221991055.XU CN217989915U (en) | 2022-07-22 | 2022-07-22 | Transducer assembly structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217989915U true CN217989915U (en) | 2022-12-09 |
Family
ID=84318902
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202221991055.XU Active CN217989915U (en) | 2022-07-22 | 2022-07-22 | Transducer assembly structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217989915U (en) |
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2022
- 2022-07-22 CN CN202221991055.XU patent/CN217989915U/en active Active
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