CN217985368U

CN217985368U - Electronic component structure and wireless earphone

Info

Publication number: CN217985368U
Application number: CN202222428935.2U
Authority: CN
Inventors: 何世友; 苏顺清; 陈涛; 付少齐
Original assignee: Shenzhen Baseus Technology Co Ltd
Current assignee: Shenzhen Baseus Technology Co Ltd
Priority date: 2022-09-14
Filing date: 2022-09-14
Publication date: 2022-12-06
Anticipated expiration: 2032-09-14

Abstract

The utility model provides an electronic component structure and wireless earphone relates to wireless earphone technical field. The electronic assembly structure includes a housing, a flexible circuit board, and a microphone. The shell is provided with a containing cavity and a sound outlet cavity which are communicated with each other, the cavity wall of the sound outlet cavity is provided with a connecting piece, the connecting piece is respectively provided with a clamping groove and an avoiding groove, the direction of a notch of the clamping groove is vertical to that of a notch of the avoiding groove, and the clamping groove is communicated with the containing cavity through the avoiding groove; one part of the flexible circuit board is arranged in the accommodating cavity, the other part of the flexible circuit board is arranged in the sound outlet cavity, the flexible circuit board comprises a clamping part, at least part of the flexible circuit board is positioned in the avoiding groove, and the clamping part is clamped with the clamping groove; the microphone is arranged on the clamping portion and located in the clamping groove, and the microphone is electrically connected with the flexible circuit board. The utility model provides an electronic component structure for flexible circuit board and microphone pile up the space restriction because of the structure and also can install well in the draw-in groove of connecting piece, have promoted the aesthetic property of product.

Description

Electronic component structure and wireless earphone

Technical Field

The utility model relates to a wireless headset technical field especially relates to an electronic component structure and wireless headset.

Background

At present, with the development of science and technology, electronic equipment is more and more popular, people can use electronic equipment for communication, working, watching videos and listening to music in work and life, and earphones become one of standard accessories of the electronic equipment, particularly true wireless earphones, and become indispensable carry-on equipment of people.

The microphone of wireless earphone among the prior art sets up in the play sound mouth pipeline of casing front chamber mostly, places the microphone in the draw-in groove structure of play sound mouth pipeline through the mode in the same direction as down to beat and glue fixedly, the notch of draw-in groove structure is towards the casing back cavity, draw-in groove structure, casing front chamber and casing back cavity can be through the back cavity mould integrated into one piece of loosing core to one side this moment. However, when the front cavity of the casing cannot be used for obliquely pulling the rear cavity die due to the product structure, the sound outlet pipe of the front cavity of the casing needs to be obliquely pulled for molding through the front cavity die, so that the microphone cannot be placed in the clamping groove structure in a downward mode, the stacking space of the structure is insufficient or the appearance size is modified, and the product attractiveness is affected.

SUMMERY OF THE UTILITY MODEL

In view of this, the present invention provides an electronic assembly structure and a wireless earphone for overcoming the deficiencies in the prior art.

The utility model provides a following technical scheme:

an electronic assembly structure comprising:

the loudspeaker comprises a shell, a sound outlet cavity and a sound outlet cavity, wherein the shell is provided with a containing cavity and the sound outlet cavity which are mutually communicated, the cavity wall of the sound outlet cavity is provided with a connecting piece, the connecting piece is respectively provided with a clamping groove and an avoiding groove, the direction of a notch of the clamping groove is vertical to that of the avoiding groove, and the clamping groove is communicated with the containing cavity through the avoiding groove;

the flexible circuit board is arranged in the accommodating cavity, the other part of the flexible circuit board is arranged in the sound outlet cavity, the flexible circuit board comprises a clamping part, at least part of the flexible circuit board is positioned in the avoiding groove, and the clamping part is clamped with the clamping groove;

the microphone is arranged on the clamping portion and located in the clamping groove, and the microphone is electrically connected with the flexible circuit board.

In some embodiments of the present application, the electronic assembly structure further includes a capacitance sensing element disposed in the accommodating cavity and electrically connected to the flexible circuit board.

In some embodiments of the present application, a first placing groove adapted to the shape of the capacitive sensing element is disposed on a wall of the accommodating cavity, and the first placing groove is used for placing the capacitive sensing element.

In some embodiments of the present application, the electronic component structure further includes a first adhesive layer, and the first adhesive layer is located between the capacitive sensing element and a groove wall of the first placement groove.

In some embodiments of the present application, a second placing groove adapted to the shape of the flexible circuit board is disposed on a cavity wall of the accommodating cavity, and the second placing groove is used for placing the flexible circuit board.

In some embodiments of the present application, the electronic assembly structure further includes a second adhesive layer between the clamping portion and the microphone.

In some embodiments of the present application, the electronic component structure further includes a third adhesive layer between the microphone and a groove wall of the card slot.

In some embodiments of the present application, a reinforcing plate is disposed on a side of the clamping portion plate facing away from the microphone.

In some embodiments of the present application, the flexible circuit board includes a connecting portion, the connecting portion with the joint portion is connected, the width of joint portion is greater than the width of connecting portion, dodge the groove and be used for dodging connecting portion.

There is also provided in a second aspect of the present application a wireless headset comprising the electronics assembly structure described in any of the embodiments above.

The embodiment of the utility model has the following advantage:

the application provides an electronic component structure and a wireless earphone. The electronic component structure comprises a shell, a flexible circuit board and a microphone, wherein the shell is provided with an accommodating cavity and a sound outlet cavity which are communicated with each other, one part of the flexible circuit board is arranged in the accommodating cavity, and the other part of the flexible circuit board is arranged in the sound outlet cavity. The microphone electrically connected with the flexible circuit board is installed on the clamping portion of the flexible circuit board, so that the microphone and the flexible circuit board are integrated, the microphone and the clamping portion of the flexible circuit board are integrally installed in the clamping groove of the connecting piece, the assembling mode is simple, the operation is convenient, and the assembling efficiency is improved.

Through set up the connecting piece on the chamber wall in a sound chamber, the draw-in groove has been seted up respectively to the connecting piece and has been dodged the groove, and the notch orientation of draw-in groove is perpendicular with the notch orientation of dodging the groove, and the draw-in groove through dodging the groove with hold the chamber intercommunication, at least partial flexible circuit board is located and dodges the inslot. Make the joint portion of flexible circuit board can install in the draw-in groove like this, and the flexible circuit board can wear to locate to keep away the groove setting and holding the intracavity with the part that joint portion is connected to make the microphone in the joint portion of flexible circuit board install in the draw-in groove firmly, improved installation stability and convenience.

Specifically, in the installation, wear to establish the sound chamber from holding the chamber with the joint portion of flexible circuit board down earlier, treat joint portion and cross the notch position of draw-in groove after, aim at the notch of draw-in groove with joint portion, pull back flexible circuit board is reverse again, make joint portion block completely in the draw-in groove to make the microphone in the joint portion of flexible circuit board can install in the draw-in groove firmly. The clamping portion of the flexible circuit board is penetrated out and pulled back reversely, so that the flexible circuit board and the microphone can be well installed in the clamping groove of the connecting piece due to the limitation of the stacking space of the structure, the attractiveness of a product is improved, the problem that the appearance size needs to be modified and increased in the prior art, and the influence on the attractiveness of the product is caused is solved.

In order to make the aforementioned and other objects, features and advantages of the present invention more comprehensible, preferred embodiments accompanied with figures are described in detail below.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention, and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.

FIG. 1 illustrates a first perspective view of a wireless headset in some embodiments of the present application;

FIG. 2 shows an enlarged schematic view of the part A of FIG. 1;

FIG. 3 shows a schematic cross-sectional view of an electronic assembly structure in some embodiments of the present application;

FIG. 4 illustrates a second perspective view of a wireless headset in some embodiments of the present application;

FIG. 5 illustrates a first perspective view of an electronic assembly structure in some embodiments of the present application;

FIG. 6 illustrates a second perspective view of the structure of an electronic assembly in some embodiments of the present application;

fig. 7 illustrates a third perspective view of an electronic assembly structure in some embodiments of the present application.

Description of the main element symbols:

100-electronic component structure; 10-a housing; 101-a containment chamber; 1011-a first placing groove; 1012-a second placing groove; 102-a sound outlet cavity; 1021-a connector; 10211-card slot; 10212-avoidance slot; 20-a flexible circuit board; 201-a clamping part; 202-a connecting portion; 30-a microphone; 40-a capacitive sensing element; 50-a stiffening plate; 1000-wireless headset.

Detailed Description

Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present invention, and should not be construed as limiting the present invention.

It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. In contrast, when an element is referred to as being "directly on" another element, there are no intervening elements present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only.

In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," and "fixed" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically limited otherwise.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the description of the templates is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

As shown in fig. 1 to 6, the present application provides an electronic component structure 100, which is mainly used in a wireless headset 1000. The electronic assembly structure 100 includes a housing 10, a flexible circuit board 20, and a microphone 30.

The housing 10 is provided with an accommodating cavity 101 and a sound outlet cavity 102 which are communicated with each other, a connecting piece 1021 is arranged on the cavity wall of the sound outlet cavity 102, the connecting piece 1021 is provided with a clamping groove 10211 and an avoiding groove 10212 respectively, the direction of the notch of the clamping groove 10211 is perpendicular to the direction of the notch of the avoiding groove 10212, and the clamping groove 10211 is communicated with the accommodating cavity 101 through the avoiding groove 10212. One part of the flexible circuit board 20 is arranged in the accommodating cavity 101, the other part is arranged in the sound outlet cavity 102, the flexible circuit board 20 comprises a clamping portion 201, at least part of the flexible circuit board 20 is located in the avoiding groove 10212, and the clamping portion 201 is clamped with the clamping groove 10211.

Referring to fig. 7, the microphone 30 is disposed on the card connecting portion 201 and located in the card slot 10211, and the microphone 30 is electrically connected to the flexible circuit board 20.

In the electronic component structure 100 provided in the embodiment of the present application, the housing 10 has an accommodating chamber 101 and a sound emitting chamber 102 that are communicated with each other. One part of the flexible circuit board 20 is disposed in the accommodating cavity 101, and the other part is disposed in the sound outlet cavity 102, and the disposing manner may be bonding or clamping.

Specifically, the microphone 30 electrically connected to the flexible circuit board 20 is mounted on the clamping portion 201 of the flexible circuit board 20, and the mounting manner can be bonding or welding, so that the microphone 30 and the flexible circuit board 20 are integrated, the microphone 30 and the clamping portion 201 of the flexible circuit board 20 are conveniently and integrally mounted in the clamping groove 10211 of the connecting part 1021, the assembling manner is simple, the operation is convenient, and the assembling efficiency is improved.

By arranging the connecting part 1021 on the cavity wall of the sound outlet cavity 102, the connecting part 1021 and the cavity wall of the sound outlet cavity 102 can be integrally formed, the connecting part 1021 is respectively provided with a clamping groove 10211 and an avoiding groove 10212, the direction of the notch of the clamping groove 10211 is perpendicular to that of the notch of the avoiding groove 10212, the clamping groove 10211 is communicated with the accommodating cavity 101 through the avoiding groove 10212, and at least part of the flexible circuit board 20 is positioned in the avoiding groove 10212. Make the joint portion 201 of flexible circuit board 20 can install in draw-in groove 10211 like this, and the part that flexible circuit board 20 and joint portion 201 are connected can wear to locate to dodge groove 10212 and set up in holding chamber 101 to make microphone 30 on the joint portion 201 of flexible circuit board 20 can install in draw-in groove 10211 firmly, improved installation stability and convenience.

In the installation, wear to establish out sound chamber 102 from holding chamber 101 with the joint portion 201 of flexible circuit board 20 earlier, treat that joint portion 201 crosses behind the notch position of draw-in groove 10211, aim at the notch of draw-in groove 10211 with joint portion 201, pull back flexible circuit board 20 is reverse again, make joint portion 201 block completely in draw-in groove 10211 to make microphone 30 on the joint portion 201 of flexible circuit board 20 can install firmly in draw-in groove 10211. The clamping portion 201 of the flexible circuit board 20 is threaded out downwards and pulled back reversely, so that the flexible circuit board 20 and the microphone 30 can be well installed in the clamping groove 10211 of the connecting piece 1021 due to structural stacking space limitation, the attractiveness of a product is improved, and the technical problem that the attractiveness of the product is affected due to the fact that the appearance size needs to be modified and increased in the prior art is solved.

As shown in fig. 5, fig. 6 and fig. 7, in an embodiment of the present application, optionally, the electronic component structure 100 further includes a capacitance sensing element 40, and the capacitance sensing element 40 is disposed in the accommodating cavity 101 and electrically connected to the flexible circuit board 20.

In the present embodiment, the capacitance sensing element 40 is disposed in the accommodating cavity 101, and the capacitance sensing element 40 is electrically connected to the flexible circuit board 20. Specifically, the capacitance sensing element 40 is attached to the cavity wall of the accommodating cavity 101, so that the capacitance sensing element 40 is located on the inner side wall of the casing 10 of the wireless headset 1000, and the sensing point of the capacitance sensing element 40 is in contact with the skin on the side wall of the ear of the human body, so as to achieve the function of sensing and touching the ear of the wireless headset 1000.

It can be understood that, through setting up electric capacity sensing element 40 in holding chamber 101, increased with the area of human ear skin response contact to promoted the sensitivity, and do not occupy and pile up the space, make its wireless headset 1000 that can the adaptation space is narrow and small, the narrow and small wireless headset 1000 in space has good lightness and aesthetic property.

As shown in fig. 5, 6 and 7, in the above embodiment of the present application, optionally, the cavity wall of the accommodating cavity 101 is provided with a first placing groove 1011 adapted to the external shape of the capacitive sensing element 40, and the first placing groove 1011 is used for placing the capacitive sensing element 40.

In this embodiment, a first placing groove 1011 adapted to the external shape of the capacitance sensing element 40 is disposed on the cavity wall of the accommodating cavity 101, so as to implement the function of placing the capacitance sensing element 40.

Specifically, the cell wall of capacitive sensing element 40 and first standing groove 1011 can be connected through gum bonding or joint, realizes firm the connection, has improved the stability of connecting for capacitive sensing element 40 is difficult to the pine and takes off, has promoted the stability in use of wireless earphone 1000 income ear response function.

In the above embodiments of the present application, optionally, the electronic component structure 100 further includes a first adhesive layer (not shown), and the first adhesive layer is located between the capacitive sensing element 40 and the groove wall of the first placing groove 1011.

In this embodiment, by providing the first adhesive layer between the capacitive sensing element 40 and the wall of the first placing groove 1011, the capacitive sensing element 40 is stably mounted on the first placing groove 1011, so that the capacitive sensing element 40 is stably attached to the wall of the cavity containing the cavity 101, the capacitive sensing element 40 is not easy to loosen, and the stability of the wireless headset 1000 in use with the ear sensing function is improved.

As shown in fig. 5 and fig. 6, in an embodiment of the present application, optionally, the cavity wall of the accommodating cavity 101 is provided with a second placing groove 1012 adapted to the external shape of the flexible circuit board 20, and the second placing groove 1012 is used for placing the flexible circuit board 20.

In this embodiment, the cavity wall that holds chamber 101 is provided with the second standing groove 1012 with flexible circuit board 20 appearance looks adaptation, for flexible circuit board 20 provides the position of placing to the function that the flexible circuit board 20 was placed in the realization, makes flexible circuit board 20 be difficult to take place the displacement, realizes firm the connection, has improved the stability of connecting.

Exemplarily, a fixing column can be arranged on a groove wall of the second placing groove 1012, and the flexible circuit board 20 is provided with a through hole matched with the fixing column, so as to realize the function of limiting the flexible circuit board 20, so that the flexible circuit board 20 is not easy to displace, and the connection stability is improved. This allows the flexible circuit board 20 to be accurately and stably mounted on the second placement groove 1012, improving the mounting accuracy and mounting efficiency.

In an embodiment of the present application, optionally, the electronic component structure 100 further includes a second adhesive layer (not shown), and the second adhesive layer is located between the clip portion 201 and the microphone 30.

In this embodiment, by providing the second adhesive layer between the joint portion 201 of the flexible circuit board 20 and the microphone 30, the second adhesive layer can be a back adhesive, so that the joint portion 201 is stably connected to the microphone 30, the connection stability is improved, and the flexible circuit board 20 and the microphone 30 are integrated into a whole, so that the installation is facilitated and the installation efficiency is effectively improved.

In an embodiment of the present application, optionally, the electronic assembly structure 100 further includes a third adhesive layer (not shown), and the third adhesive layer is located between the microphone 30 and a groove wall of the card slot 10211.

In this embodiment, by providing the third adhesive layer between the walls of the microphone 30 and the slot 10211, the third adhesive layer can be disposed between the walls of the microphone 30 and the slot 10211 by gluing, so that the walls of the microphone 30 and the slot 10211 are stably connected, the connection stability is effectively improved, the microphone 30 is not easily loosened and falls off, the microphone 30 is stably installed in the sound-emitting cavity 102, the installation is facilitated, and the installation efficiency and the installation stability are effectively improved.

As shown in fig. 1, fig. 2, fig. 3 and fig. 7, in an embodiment of the present application, optionally, a reinforcing plate 50 is disposed on a side of the clamping portion 201 facing away from the microphone 30.

In this embodiment, one side of deviating from the microphone 30 through the joint portion 201 at the flexible circuit board 20 sets up the stiffening plate 50, has promoted the intensity and the reliability of joint portion 201, makes joint portion 201 install in draw-in groove 10211 more firmly through stiffening plate 50 like this to, further promoted installation effectiveness and installation stability.

As shown in fig. 1, fig. 2 and fig. 3, in an embodiment of the present application, optionally, the flexible circuit board 20 includes a connection portion 202, the connection portion 202 is connected to the clamping portion 201, a width of the clamping portion 201 is greater than a width of the connection portion 202, and the avoidance groove 10212 is used for avoiding the connection portion 202.

In this embodiment, the width through setting up card portion 201 is greater than the width of connecting portion 202, and the width of dodging groove 10212 is between the width of connecting portion 202 and the width of card portion 201, so that connecting portion 202 can wear to establish dodging groove 10212, and card portion 201 can not wear to establish dodging groove 10212, thereby make card portion 201 can the joint in draw-in groove 10211, connecting portion 202 can wear to locate to dodge the setting of groove 10212 and hold the intracavity 101.

Specifically, in the installation, wear to establish out sound chamber 102 from holding chamber 101 with the joint portion 201 of flexible circuit board 20 earlier, treat that joint portion 201 crosses behind the notch position of draw-in groove 10211, pass connecting portion 202 and dodge groove 10212 and put into draw-in groove 10211, so that the notch of draw-in groove is aimed at to joint portion 201, pull back flexible circuit board 20 backward again, make joint portion 201 block in draw-in groove 10211 completely, thereby make microphone 30 on the joint portion 201 of flexible circuit board 20 can install in draw-in groove 10211 firmly, and then make flexible circuit board 20 and microphone 30 also can install well in draw-in groove 10211 of connecting piece 1021 because of the restriction of structure stack space.

In an embodiment of the present application, optionally, the electronic component structure 100 further includes a speaker (not shown) disposed in the accommodating cavity 101 and electrically connected to the flexible circuit board 20.

In this embodiment, the speaker is disposed in the accommodating cavity 101, and the speaker is electrically connected to the flexible circuit board 20, so as to convert the electrical signal into a sound signal, thereby implementing the sound outputting function of the wireless headset 1000.

In the above-mentioned embodiment of the present application, optionally, the electronic component structure 100 further includes a fourth adhesive layer (not shown), and the fourth adhesive layer is located between the flexible circuit board 20 and the groove wall of the second placement groove 1012.

In this embodiment, by providing the fourth adhesive layer between the flexible circuit board 20 and the groove wall of the second placing groove 1012, the fourth adhesive layer can be adhesive backed or dispensed, so that the flexible circuit board 20 is stably connected to the groove wall of the second placing groove 1012, the connection stability is effectively improved, and the function of stably placing the flexible circuit board 20 is realized.

As shown in fig. 1 and 4, the present embodiment also provides a wireless headset 1000 including the electronic component structure 100 in the above embodiments.

The wireless headset 1000 has the electronic component structure 100 in any of the embodiments, so that all the advantages of the electronic component structure 100 are achieved, and the details are not repeated herein.

To sum up, the electronic component structure and the wireless earphone that this application provided. The electronic component structure comprises a shell, a flexible circuit board and a microphone, wherein the shell is provided with an accommodating cavity and a sound outlet cavity which are communicated with each other, one part of the flexible circuit board is arranged in the accommodating cavity, and the other part of the flexible circuit board is arranged in the sound outlet cavity. The microphone electrically connected with the flexible circuit board is installed on the clamping portion of the flexible circuit board, so that the microphone and the flexible circuit board are integrated, the microphone and the clamping portion of the flexible circuit board are integrally installed in the clamping groove of the connecting piece, the assembling mode is simple, the operation is convenient, and the assembling efficiency is improved.

Through set up the connecting piece on the chamber wall in a sound chamber, the draw-in groove has been seted up respectively to the connecting piece and has been dodged the groove, and the notch orientation of draw-in groove is perpendicular with the notch orientation of dodging the groove, and the draw-in groove through dodging the groove with hold the chamber intercommunication, at least part flexible circuit board is located and dodges the inslot. Make the joint portion of flexible circuit board can install in the draw-in groove like this, and the connecting portion of flexible circuit board can wear to locate to keep away the groove setting and holding the intracavity to make the microphone in the joint portion of flexible circuit board can install in the draw-in groove firmly, improved installation stability and convenience.

Specifically, in the installation, wear to establish out the sound chamber with flexible circuit board's joint portion from holding the chamber down earlier, treat that joint portion crosses behind the notch position of draw-in groove, pass connecting portion and dodge the groove and put into the draw-in groove to make joint portion aim at the notch of draw-in groove, pull back flexible circuit board backward again, make joint portion block completely in the draw-in groove, thereby make the microphone in flexible circuit board's joint portion can install in the draw-in groove firmly. The clamping portion of the flexible circuit board is sequentially pulled out and reversely pulled back, so that the flexible circuit board and the microphone can be well installed in the clamping groove of the connecting piece due to the limitation of the structure stacking space, the attractiveness of a product is improved, the problem that the appearance size needs to be modified and increased in the prior art, and the influence on the attractiveness of the product is caused is solved.

In all examples shown and described herein, any particular value should be construed as merely exemplary, and not as a limitation, and thus other examples of example embodiments may have different values.

It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.

The above-described embodiments are merely illustrative of several embodiments of the present invention, which are described in detail and specific, but not intended to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention.

Claims

1. An electronic assembly structure, comprising:

2. The electronic component structure of claim 1, further comprising a capacitive sensing element disposed within the receiving cavity and electrically connected to the flexible circuit board.

3. The electronic assembly structure according to claim 2, wherein a wall of the accommodating cavity is provided with a first placing groove adapted to an external shape of the capacitive sensing element, and the first placing groove is used for placing the capacitive sensing element.

4. The electronic component structure of claim 3, further comprising a first adhesive layer between the capacitive sensing element and a wall of the first placement pocket.

5. The electronic assembly structure according to claim 1, wherein the cavity wall of the accommodating cavity is provided with a second placing groove adapted to the shape of the flexible circuit board, and the second placing groove is used for placing the flexible circuit board.

6. The electronic component structure of claim 1, further comprising a second adhesive layer between the clip portion and the microphone.

7. The electronic component structure of claim 1, further comprising a third adhesive layer between the microphone and a slot wall of the card slot.

8. The electronic assembly structure of claim 1, wherein a side of the clip portion facing away from the microphone is provided with a stiffener.

9. The electronic assembly structure according to claim 1, wherein the flexible circuit board includes a connecting portion, the connecting portion is connected to the clamping portion, a width of the clamping portion is greater than a width of the connecting portion, and the avoiding groove is used for avoiding the connecting portion.

10. A wireless headset characterized in that it comprises an electronic assembly structure according to any one of claims 1 to 9.