CN217985273U - Intelligent home gateway with optimized heat dissipation - Google Patents

Abstract

The utility model discloses an intelligent home gateway that heat dissipation is optimized, include: casing, display screen and the main control PCB board of arranging the casing inside in, display screen surface and housing face parallel and level, casing are including the center that is located the display screen rear side to and be located the metal backplate of center rear side, and in the center was located to main control PCB board, one side of display screen was kept away from to the main control PCB board, and the electricity is connected with power module, voice module, host system, wireless communication module. Utilize the utility model discloses the scheme adopts the good heat conduction material of heat-conduction of metal as the backplate, leads the heat of mainboard to the metal backplate for the heat all shifts backward, reduces the local concentrated heating of display screen, reaches the condition in the display screen with the mainboard heat.

Description

Intelligent home gateway with optimized heat dissipation

Technical Field

The utility model relates to the field of communication, especially, relate to an intelligent home gateway that heat dissipation is optimized.

Background

The integration, the integrity and the convenience of the intelligent home system can greatly improve the living standard and the living quality of people, and with the development and continuous innovation of the intelligent home industry, the further development of the intelligent home terminal equipment is promoted.

At present, intelligent household terminal equipment is various in flowers and varieties, but a single wireless communication technology is adopted, a mature and unified bottom protocol standard is not formed, and a cloud interface protocol and a docking scheme between platforms are not unified. Therefore, building developers need to select the modular products of multiple different manufacturers to integrate so as to meet the diversified demands of consumers, but the interfaces or protocols of the modular products of different manufacturers are different, and the firmware of the equipment is different, so that the equipment manufacturers need to adapt and develop the cloud of each platform, and meanwhile, the integration difficulty of the developers is increased, and therefore an intelligent home gateway supporting multiple communication protocols needs to be provided, and the integration difficulty is reduced.

However, the intelligent home gateway contains modules with different protocols, which leads to larger power consumption, and the heat productivity of the intelligent home gateway is also obviously increased, thus aggravating the heating condition of the main board and the display screen. The existing intelligent home gateway product is difficult to break through the heat dissipation problem, and part of intelligent home gateways increase the thickness of the whole machine to improve the heat dissipation problem so as to improve the heating problem of a display screen and the whole machine; in order to ensure the appearance thickness of the whole intelligent home gateway (for example, the thickness is not more than 10 mm), the heat dissipation problem is not considered, and the display screen generates heat seriously under the condition that the display screen is lightened for a long time.

SUMMERY OF THE UTILITY MODEL

The utility model provides an intelligent home gateway that heat dissipation was optimized aims at solving under the unchangeable prerequisite of assurance complete machine outward appearance thickness, carries out the problem of heat dissipation optimization. The technical scheme is as follows:

this intelligent home gateway includes: casing, display screen and the inside master control PCB board of casing is arranged in, display screen surface and housing face parallel and level, and the casing is including the center that is located the display screen rear side to and be located the metal backplate of center rear side, and in the center was located to master control PCB board, one side of display screen was kept away from to master control PCB board, and the electricity is connected with power module, voice module, host system, wireless communication module.

Preferably, a heat-conducting silica gel pad is attached to the main heating functional module on the main control PCB, and heat is conducted to the metal back plate through the heat-conducting silica gel pad; the main heating function module comprises a power module, a voice module and a main control module.

Preferably, the display screen comprises a front surface and a back surface, the back surface is one side close to the main control PCB, and the back surface of the display screen is pasted with the heat conducting graphite sheet.

Preferably, a shielding cover covers the main control chip electrically connected to the main control PCB, heat-conducting silica gel pads are attached to the main control chip and the shielding cover, and the heat-conducting silica gel pads on the shielding cover are in contact with the metal back plate; the main control chip comprises a wireless communication module and a CPU chip.

Preferably, the wireless communication chip comprises a chip of a WiFi/BLE module.

Preferably, the wireless communication chip comprises a chip of a ZIGBEE module.

Preferably, the backlight area of the display screen is pasted with a heat conduction silica gel pad.

Preferably, the main control PCB board is electrically connected with a communication serial port and a power module, and the main control module is electrically connected with the WiFi/BLE module and the ZIGBEE module through the communication serial port respectively, and is used for being connected with different electrical equipment.

Preferably, the material of the middle frame is plastic.

Preferably, the appearance thickness of the intelligent home gateway is less than or equal to 10mm.

The utility model has the advantages that: utilize the utility model discloses the scheme adopts the good heat conduction material of heat-conduction of metal as the backplate, leads the heat of mainboard to the metal backplate for the heat all shifts backward, reduces the local concentrated heating of display screen, reaches the condition in the display screen with the mainboard heat.

Drawings

Fig. 1 is a schematic diagram of an explosion structure of an embodiment of the smart home gateway of the present invention;

fig. 2 is a schematic cross-sectional view of an embodiment of the smart home gateway of the present invention;

fig. 3 is a schematic structural diagram of an embodiment of the main control PCB board of the smart home gateway of the present invention;

fig. 4 is a comparison diagram of the heat dissipation data of an embodiment of the display screen of the present invention;

fig. 5 is a comparison diagram of the heat dissipation data of an embodiment of the main control module of the present invention;

fig. 6 is a comparative diagram of heat dissipation data of an embodiment of the power module of the present invention;

fig. 7 is a comparison diagram of the heat dissipation data of an embodiment of the voice module of the present invention;

icon:

1. back plate mounting screws; 2. a metal back plate; 4. a shield case; 5. a heat-conducting silica gel pad; 6. mounting screws on the main control PCB; 7. a main control PCB board; 8. a middle frame; 9. a heat conductive graphite sheet; 10. a display screen; 701. a power supply module; 702. a voice module; 703. a WiFi/BLE module; 704. a WiFi/BLE antenna; 705. a speaker; 706. a ZIGBEE module; 707. a ZIGBEE antenna; 708. a main control module; 710. a backlight module is provided.

Detailed Description

To facilitate understanding of the present invention, the present invention will be described in more detail with reference to the accompanying drawings and specific embodiments. Preferred embodiments of the present invention are shown in the drawings. The invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.

It is to be noted that, unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.

As shown in fig. 1 and fig. 2, the utility model provides an intelligent home gateway that heat dissipation is optimized.

Fig. 1 is the utility model discloses the explosion structure schematic diagram of an intelligent home gateway embodiment, fig. 2 is the utility model discloses the section structure schematic diagram of an embodiment of intelligent home gateway can be seen from fig. 1, 2, and intelligent home gateway includes display screen 10, is located the center 8 of display screen 10 rear side to and be located the metal backplate 2 of center 8 rear side, and in the center 8 was located to the master control PCB board, one side electricity that display screen 10 was kept away from to the master control PCB board was connected with various chips and module.

Further, fig. 3 is the structural schematic diagram of an embodiment of the main control PCB board of the smart home gateway of the present invention, and it can be seen from fig. 3 that the main control PCB board is electrically connected with a power module 701, a voice module 702, a WiFi/BLE module, a WiFi/BLE antenna, a speaker 705, a ZIGBEE module, a ZIGBEE antenna, a main control module 708, and a backlight module 710. The main control module 708 is electrically connected with the WiFi/BLE module and the ZIGBEE module through communication serial ports, and is used for being connected with different electrical devices.

Adopt the good heat conduction material of heat-conduction of metal as the backplate, lead the heat of mainboard to metal backplate 2 on for the heat all shifts backward, reduces display screen 10 local concentrated generate heat, reaches the condition to the display screen 10 in with the mainboard heat.

Preferably, referring to fig. 1 and 2, a heat conducting silica gel pad 5 is attached to a main heating functional module on the main control PCB, and heat is conducted to the metal back plate 2 through the heat conducting silica gel pad 5; the main heating functional modules include a power module 701, a voice module 702, and a main control module 708.

Preferably, a shielding case 4 covers a main control chip electrically connected to the main control PCB, heat-conducting silica gel pads 5 are attached to the main control chip and the shielding case 4, and the heat-conducting silica gel pads 5 on the shielding case 4 are in contact with the metal back plate 2; the main control chip comprises a wireless communication module and a CPU chip. This is because the wireless communication module and the CPU chip may interfere with each other, the shielding case 4 is covered thereon to prevent such interference, and the heat conductive silicone pads 5 are attached to both sides of the shielding case 4, respectively, to further conduct heat to the metal back plate 2.

Preferably, the backlight area of the display screen 10 is attached with a thermally conductive silicone pad 5. This is because the backlight area of the display panel 10 is also a main heat generating point, and the heat of the backlight module 710 of the display panel 10 is conducted to the metal back plate 2, thereby reducing the heat conducted to the display panel 10.

Preferably, the display screen 10 includes a front surface and a back surface, the back surface is a side close to the main control PCB board, and the back surface of the display screen 10 is attached with the heat conductive graphite sheet 9. Through the graphite flake, with the regional heat of display screen 10 heating conduct to not heating area rapidly to on heating heat evenly distributed to whole display screen 10 to display screen 10, ensure that display screen 10 can not be qualified for the next round of competitions the local overheated condition.

Preferably, the material of the middle frame 8 is plastic. Thus, the cost can be reduced, and the heat insulation effect is achieved.

Preferably, intelligent home gateway's outward appearance thickness is less than or equal to 10mm, under the condition of guaranteeing complete machine outward appearance thickness, adopts the utility model discloses the scheme can obtain better radiating effect.

Further, aiming at the heating problem of the main board and the display screen 10, the heating effect of the same model machine is tested under different heat dissipation conditions, and the following test and analysis are completed:

specifically, refer to fig. 4-7, fig. 4 is a heat dissipation data contrast diagram of an embodiment of the display screen 10 of the present invention, fig. 5 is a heat dissipation data contrast diagram of an embodiment of the host module 708 of the present invention, fig. 6 is a heat dissipation data contrast diagram of an embodiment of the power module 701 of the present invention, and fig. 7 is a heat dissipation data contrast diagram of an embodiment of the voice module 702 of the present invention.

Description of a prototype:

1. model machine A- -original version model machine, the display screen 10 inputs the current 20mA, the plastic backplate;

2. model machine B- -improve the model machine, on the basis of model machine A, change the plastic back plate into the metal back plate 2, and increase the heat-conducting silica gel pad 5 and heat-conducting graphite flake 9, other do not modify;

3. model C- -improve the model machine, on the basis of B model machine, reduce the 10 electric currents of display screen to 15mA, other do not modify, the screen luminance is 240cd/m2 after regulating the voltage;

4. model machine D- -improve the model machine, on the basis of model machine C, adjust the luminance of the display screen 10 to 350cd/m2;

5. model machine E, improvement model machine, on the basis of model machine D, remove the heat-conducting silica gel pad 5 in the area that the display screen 10 is shaded;

6. model F- -improve the model, on the basis of model F, change the metal backplate 2 into the plastic backplate.

From the above tests it can be seen that:

1. the back plate is changed from plastic to metal, and under the same condition, the heating condition of the whole machine and the display screen 10 is effectively reduced;

2. after the current of the display screen 10 is reduced, under the same condition, the heating condition of the whole machine and the display screen 10 is effectively reduced.

The utility model has the advantages that: through the good heat conduction effect of metal heat conduction, heat of the wireless communication module, the main control module, the power supply module, the voice module, the display screen backlight module and the like on the main control PCB is conducted to the metal back plate, so that the heat generated on the main control PCB is conducted backwards to the metal back plate as far as possible, and the heat conducted to the display screen is reduced; the heat of the heating area of the display screen is rapidly conducted to the non-heating area through the graphite sheet, so that the heating heat of the display screen is uniformly distributed on the whole display screen, and the situation that the display screen is locally overheated due to outgoing lines is avoided; on the premise of ensuring that the appearance thickness of the equipment is not more than 10mm, the local high heat productivity of the display screen is reduced, and the touch screen operation hand feeling of a user is improved; by reducing the heat productivity of the intelligent home gateway with the multi-module protocol, the service life of a heating device is prolonged, and the service life of a product is prolonged.

Claims (9)

1. The utility model provides an intelligent home gateway that heat dissipation is optimized which characterized in that includes: casing, display screen and arrange the inside main control PCB board of casing in, the display screen surface with housing face parallel and level, the casing is including the center that is located the display screen rear side to and be located the metal backplate of center rear side, the main control PCB board is located in the center, the main control PCB board is kept away from one side of display screen, the electricity is connected with power module, voice module, host system, wireless communication module.

2. The intelligent home gateway of claim 1, wherein a heat-conducting silica gel pad is attached to the functional module which mainly generates heat on the main control PCB, and heat is conducted to the metal back plate through the heat-conducting silica gel pad; the main heating function module comprises a power module, a voice module and a main control module.

3. The intelligent home gateway of claim 1, wherein the display screen comprises a front surface and a back surface, the back surface is one side close to the main control PCB, and a heat conducting graphite sheet is attached to the back surface of the display screen.

4. The intelligent home gateway of claim 1, wherein a shielding case covers a main control chip electrically connected to the main control PCB, heat-conducting silica gel pads are attached to the main control chip and the shielding case, and the heat-conducting silica gel pads on the shielding case are in contact with the metal back plate; the main control chip comprises a wireless communication module and a CPU chip.

5. The smart home gateway of claim 4, wherein the wireless communication chip comprises a chip of a WiFi/BLE module and/or a ZIGBEE module.

6. The intelligent home gateway of claim 1, wherein the backlight area of the display screen is attached with a heat-conducting silica gel pad.

7. The intelligent home gateway of claim 5, wherein the main control PCB is electrically connected with a communication serial port and a power module, and the main control module is electrically connected with the WiFi/BLE module and/or the ZIGBEE module through the communication serial port respectively and is used for being connected with different electrical equipment.

8. The intelligent home gateway of claim 1, wherein the middle frame is made of plastic.

9. The intelligent home gateway of claim 1, wherein the thickness of the appearance of the intelligent home gateway is less than or equal to 10mm.

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