CN217985045U

CN217985045U - Module structure with communication conversion function

Info

Publication number: CN217985045U
Application number: CN202222080624.1U
Authority: CN
Inventors: 罗杰
Original assignee: Shenzhen Huazhong Automation Engineering Co ltd
Current assignee: Shenzhen Huazhong Automation Engineering Co ltd
Priority date: 2022-08-08
Filing date: 2022-08-08
Publication date: 2022-12-06
Anticipated expiration: 2032-08-08

Abstract

The utility model discloses a modular structure with communication conversion function, shell and module lower shell on modular structure, the module, the upper end of shell is provided with shell on the module under the module, the inside upper end of shell is provided with modular structure under the module, be provided with telescopic link structure between the inside bottom of shell under modular structure and the module, telescopic link structure's surface is provided with the spring, the upper surface both ends of shell all are provided with the shock attenuation board on the module, the equal sliding connection in inside both ends of shock attenuation board has the slider, the utility model discloses a shock attenuation spring and telescopic link structure that set up, modular structure sliding connection is in the inside of shell under the module during use, installs behind modular structure's upper surface through detachable connecting block, when modular structure receives the vibrations power, on the shock attenuation spring of shock attenuation power conduction to between two sliders through the connecting rod to play absorbing effect to modular structure through shock attenuation spring.

Description

Module structure with communication conversion function

Technical Field

The utility model relates to the technical field of modules, especially, relate to a module structure with communication conversion function.

Background

Modular programming technology is a structured programming technology that emerged in the 60's of the 20 th century. The technology is based on the principles of 'decomposition' and 'modularization' to control the complexity of large software. The module structure refers to that a program or a system is divided into a plurality of modules with certain independence and size according to functions or other principles, and each module has certain functions.

When present modular structure installs and uses on equipment, receive external slight shaking force when equipment, can lead to modular structure to touch the protective housing in the modular structure outside, cause the electric elements on modular structure surface to damage, lead to modular structure to use, have certain limitation when using.

Therefore, the prior art is not sufficient and needs to be improved.

SUMMERY OF THE UTILITY MODEL

To the defect that above-mentioned prior art exists, the utility model aims to provide a module structure with communication conversion function.

For the purpose of the foregoing, the utility model provides a modular structure with communication conversion function, shell under shell and the module on modular structure, module, the upper end of shell is provided with shell on the module under the module, the inside upper end of shell is provided with modular structure under the module, be provided with telescopic link structure under modular structure and the module between the inside bottom of shell, telescopic link structure's surface is provided with the spring, the upper surface both ends of shell all are provided with the shock attenuation board on the module, the equal sliding connection in inside both ends of shock attenuation board has the slider, the inboard surface of slider is provided with damping spring, just the lower extreme of slider is provided with detachable connecting block through the connecting rod, the lower extreme of connecting rod rotates the side surface of connecting at detachable connecting block, the upper end of connecting rod rotates the side surface of connecting at the slider.

Preferably, the sliding tray has all been seted up on the inside both sides surface of shell under the module, the inside sliding connection of sliding tray has the sliding block, the sliding block is provided with two, two the sliding block is fixed connection respectively on the both sides surface of modular structure.

Preferably, a plurality of pins are arranged between the module upper shell and the module lower shell.

Preferably, the surfaces of the upper module shell and the lower module shell are provided with heat dissipation nets, and the surfaces of the heat dissipation nets are provided with a plurality of heat dissipation holes.

Preferably, the module upper shell, the module lower shell and the device body are fixedly connected with each other through long screws, and the long screws penetrate through the module upper shell and the module lower shell.

Preferably, the module structure is internally provided with a communication receiver, a microprocessor, a communication converter, a signal amplifier, a microcontroller and an acousto-optic signal transmitter respectively.

Preferably, the communication receiver and the microprocessor are electrically connected with each other, the microprocessor and the communication converter are electrically connected with each other, the communication converter and the signal amplifier are electrically connected with each other, the signal amplifier and the microcontroller are electrically connected with each other, and the microcontroller and the acousto-optic signal transmitter are electrically connected with each other.

Compared with the prior art, the beneficial effects of the utility model are that:

through damping spring and the telescopic link structure that sets up, the inside of module structure sliding connection shell under the module during use, install behind module structure's upper surface through detachable connecting block, when module structure receives the vibrations power, conduct vibrations power to the damping spring between two sliders through the connecting rod, thereby play absorbing effect to module structure through damping spring, current module structure has been avoided effectively when installing on equipment and has been used, receive external slight vibrations power when equipment, can lead to module structure to touch the protective housing in the module structure outside, cause the electric elements on module structure surface to damage, lead to module structure to be unable, the problem that has certain limitation during the use.

Through sliding tray and the sliding block that sets up, slide from top to bottom in the inside of sliding tray through the sliding block, thereby drive modular structure and can slide from top to bottom in the inside upper end of shell under the module, and can not popped out the inside of shell under the module, through the radiator-grid that sets up, can play radiating effect to the module under the shell and the module on the inside modular structure surface's of shell electrical component on the module through the louvre on the radiator-grid during use, the heat that prevents the module surface's of long-time operation electrical component to produce can't obtain effectual giving off, cause the problem that influences modular structure life.

Through the long screw that sets up, use shell fixed connection on the module and module on the equipment body through the long screw during use, through the communication receiver who sets up, receive communication signal through communication receiver, through the communication converter that sets up, can realize modular structure's communication conversion function through communication converter, through the signal amplifier who sets up, enlarge the signal of receiving through signal amplifier, through the reputation signal transmission ware that sets up, can transmit the signal.

Drawings

In order to illustrate the embodiments of the present invention more clearly, the drawings used in the description of the embodiments of the present invention will be briefly described below, and it is obvious that the drawings in the description below are some embodiments of the present invention, and those skilled in the art can also obtain other drawings without creative efforts.

Fig. 1 is a schematic structural diagram of a module structure with a communication conversion function according to the present invention.

Fig. 2 is a cross-sectional view of an upper housing and a lower housing of a module in a modular structure with a communication conversion function according to the present invention.

Fig. 3 is an enlarged view at a in fig. 2.

Fig. 4 is a system block diagram inside a module structure with a communication conversion function according to the present invention.

Description of the reference numerals:

1. an upper module housing; 2. a module lower housing; 3. a heat-dissipating mesh; 4. a long screw; 5. a pin; 6. an apparatus body; 7. a telescopic rod structure; 8. a sliding groove; 9. a slider; 10. a detachable connecting block; 11. a connecting rod; 12. a damper plate; 13. a slider; 14. a damping spring; 15. a communication receiver; 16. a microprocessor; 17. a communication converter; 18. a signal amplifier; 19. a microcontroller; 20. an acoustic-optic signal transmitter; 21. and (5) a module structure.

Detailed Description

The following detailed description of the preferred embodiments of the present invention will be provided in conjunction with the accompanying drawings, so as to enable those skilled in the art to more easily understand the advantages and features of the present invention, and thereby define the scope of the invention more clearly and clearly. It is obvious that the described embodiments are only some of the embodiments of the present invention, and not all of them. Based on the embodiments of the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.

The terms "including" and "having," and any variations thereof in the description and claims of the invention and the description of the figures appended hereto, are intended to cover non-exclusive inclusions. The terms "first," "second," and the like in the description and claims of the present invention or in the above-described drawings are used for distinguishing between different objects and not for describing a particular sequential order.

Referring to fig. 1-4, a module structure with a communication conversion function, the module structure 21, an upper module housing 1 and a lower module housing 2, an upper module housing 1 is disposed on an upper end of the lower module housing 2, a module structure 21 is disposed on an upper end of an interior of the lower module housing 2, a telescopic rod structure 7 is disposed between the module structure 21 and an interior bottom of the lower module housing 2, a spring is disposed on a surface of the telescopic rod structure 7, damping plates 12 are disposed at two ends of an upper surface of the upper module housing 1, sliders 13 are slidably connected to two ends of the damping plates 12, damping springs 14 are disposed on inner side surfaces of the sliders 13, a lower end of each slider 13 is provided with a detachable connection block 10 through a connection rod 11, a lower end of each connection rod 11 is rotatably connected to a side surface of the detachable connection block 10, an upper end of each connection rod 11 is rotatably connected to a side surface of each slider 13, the damping springs 14 and the telescopic rod structure 7 are disposed, the module structure 21 is slidably connected to the interior of the lower module housing 2 during use, the module structure 21 is mounted on the upper surface of the module structure 21 through the detachable connection block structure 21, when the module structure 21 is subjected to a shock, the shock, and the module structure 21 is damaged, the module structure, and the module structure is effectively prevents a shock-induced by a shock of an external module device, and the module 21, thereby effectively preventing the shock-induced by a shock-induced damage of the module structure, and the module structure, the module 21.

Please refer to fig. 2, sliding grooves 8 have been all seted up on the inside both sides surface of shell 2 under the module, sliding groove 8's inside sliding connection has sliding block 9, sliding block 9 is provided with two, two sliding block 9 fixed connection are respectively on the both sides surface of modular structure 21, through sliding groove 8 and the sliding block 9 that set up, slide from top to bottom in sliding groove 8's inside through sliding block 9, thereby it can slide from top to bottom to drive modular structure 21 can carry out in the inside upper end of shell 2 under the module, and can not popped out the inside of shell 2 under the module.

Referring to fig. 1, a plurality of pins 5 are disposed between an upper module case 1 and a lower module case 2.

Referring to fig. 1, heat dissipation nets 3 are arranged on the surfaces of an upper module shell 1 and a lower module shell 2, a plurality of heat dissipation holes are formed in the surface of each heat dissipation net 3, and through the heat dissipation nets 3, when the heat dissipation device is used, the heat dissipation holes in the heat dissipation nets 3 can play a role in dissipating heat of electrical elements on the surfaces of a module structure 21 inside the lower module shell 2 and the upper module shell 1, so that the problem that the service life of the module structure 21 is affected due to the fact that heat generated by the electrical elements on the surfaces of the modules running for a long time cannot be effectively dissipated is solved.

Referring to fig. 1, the module upper housing 1, the module lower housing 2 and the device body 6 are fixedly connected to each other by long screws 4, the long screws 4 penetrate through the module upper housing 1 and the module lower housing 2, and the module upper housing 1 and the module lower housing 2 are fixedly connected to the device body 6 by the long screws 4 when in use.

Referring to fig. 4, a communication receiver 15, a microprocessor 16, a communication converter 17, a signal amplifier 18, a microcontroller 19 and an acousto-optic signal transmitter 20 are respectively disposed inside a module structure 21, the communication receiver 15 and the microprocessor 16 are electrically connected to each other, the microprocessor 16 and the communication converter 17 are electrically connected to each other, the communication converter 17 and the signal amplifier 18 are electrically connected to each other, the signal amplifier 18 and the microcontroller 19 are electrically connected to each other, the microcontroller 19 and the acousto-optic signal transmitter 20 are electrically connected to each other, a communication signal is received by the communication receiver 15 through the communication receiver 15, a communication conversion function of the module structure 21 can be realized by the communication converter 17 through the communication converter 17, the received signal is amplified by the signal amplifier 18 through the signal amplifier 18, and the signal can be transmitted through the acousto-optic signal transmitter 20.

When in use, the damping spring 14 and the telescopic rod structure 7 are arranged, the module structure 21 is connected inside the lower module shell 2 in a sliding manner, the module structure 21 is arranged on the upper surface of the module structure 21 through the detachable connecting block 10, when the module structure 21 receives vibration force, the vibration force is transmitted to the damping spring 14 between the two sliding blocks 13 through the connecting rod 11, so that the damping spring 14 plays a role in damping the module structure 21, and the problem that when the current module structure 21 is arranged on equipment for use, when the equipment receives slight external vibration force, the module structure 21 touches the protective shell on the outer side of the module structure 21 to damage the electrical elements on the surface of the module structure 21, the module structure 21 is damaged, the module structure 21 cannot be used and has certain limitation when in use is effectively avoided, and through the arranged sliding groove 8 and the sliding block 9, the sliding block 9 slides up and down in the sliding groove 8, so as to drive the module structure 21 to slide up and down in the upper end of the module lower shell 2, and can not be popped out of the module lower shell 2, the heat dissipation net 3 is arranged, when in use, the heat dissipation holes on the heat dissipation net 3 can play a role in dissipating heat of the electrical elements on the surfaces of the module structure 21 in the module lower shell 2 and the module upper shell 1, thereby preventing the heat generated by the electrical elements on the surfaces of the modules running for a long time from being effectively dissipated, and causing the problem of influencing the service life of the module structure 21, through the arranged long screw 4, the module upper shell 1 and the module lower shell 2 are fixedly connected on the equipment body 6 through the long screw 4 when in use, through the arranged communication receiver 15, the communication signal is received through the communication receiver 15, through the arranged communication converter 17, the communication conversion function of the modular structure 21 can be realized by the communication converter 17, the received signal can be amplified by the signal amplifier 18 through the arranged signal amplifier 18, and the signal can be transmitted through the arranged acousto-optic signal transmitter 20.

The type of the communication receiver is TJA1043T; the model of the communication converter is MUK350-0; the signal amplifier is LKV375N; the acousto-optic signal transmitter is of the type KXH127.

The above description is only intended to illustrate the technical solution of the present invention, and not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it should be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; all the equivalent structures or equivalent flow changes made by the contents of the specification and the drawings of the utility model, or the direct or indirect application in other related technical fields, are included in the patent protection scope of the utility model.

Claims

1. A module structure with communication conversion function is characterized in that: the upper end of the lower shell is provided with the upper shell of the module, the upper end of the lower shell of the module is provided with the modular structure, a telescopic rod structure is arranged between the bottom ends of the inside of the lower shell of the modular structure and the module, the surface of the telescopic rod structure is provided with a spring, two ends of the upper surface of the upper shell of the module are provided with damping plates, two ends of the inside of each damping plate are respectively provided with a sliding block, the inner side surface of each sliding block is provided with a damping spring, the lower end of each sliding block is provided with a detachable connecting block through a connecting rod, the lower end of each connecting rod is rotatably connected to the side surface of the corresponding detachable connecting block, and the upper end of each connecting rod is rotatably connected to the side surface of the corresponding sliding block.

2. The module structure with communication conversion function according to claim 1, wherein: sliding tray has all been seted up on the inside both sides surface of shell under the module, sliding tray's inside sliding connection has the sliding block, the sliding block is provided with two, two the sliding block is fixed connection respectively on modular structure's both sides surface.

3. The module structure with communication conversion function according to claim 1, wherein: a plurality of pins are arranged between the module upper shell and the module lower shell.

4. The module structure with communication conversion function according to claim 1, wherein: the surface of the module upper shell and the surface of the module lower shell are provided with radiating nets, and the surface of each radiating net is provided with a plurality of radiating holes.

5. The module structure with communication conversion function according to claim 1, wherein: the module upper shell, the module lower shell and the equipment body are fixedly connected with each other through long screws, and the long screws penetrate through the module upper shell and the module lower shell.

6. The module structure with communication conversion function according to claim 1, wherein: the module structure is internally provided with a communication receiver, a microprocessor, a communication converter, a signal amplifier, a microcontroller and an acousto-optic signal transmitter respectively.

7. The module structure with communication conversion function according to claim 6, wherein: the communication receiver is electrically connected with the microprocessor, the microprocessor is electrically connected with the communication converter, the communication converter is electrically connected with the signal amplifier, the signal amplifier is electrically connected with the microcontroller, and the microcontroller is electrically connected with the acousto-optic signal transmitter.