CN217984060U

CN217984060U - Semiconductor laser packaging structure

Info

Publication number: CN217984060U
Application number: CN202221768713.9U
Authority: CN
Inventors: 魏依; 胡磊; 邵崇国
Original assignee: Wuhan Shengshi Optical Communication Technology Co ltd
Current assignee: Wuhan Shengshi Optical Communication Technology Co ltd
Priority date: 2022-07-07
Filing date: 2022-07-07
Publication date: 2022-12-06
Anticipated expiration: 2032-07-07

Abstract

The utility model relates to the technical field of laser packaging, and provides a semiconductor laser packaging structure, which relates to a laser, comprising a casing and a packaging plate detachably arranged at the opening end of the casing, wherein the laser is arranged in the casing, and two side walls of the casing are respectively provided with a positioning mechanism for blocking the laser from moving; the positioning mechanism comprises a limiting rod which is elastically and telescopically arranged on the side wall of the casing in a penetrating mode through a spring, stop blocks are respectively arranged on the two side walls of the laser, and the stop blocks can be compressed along with the movement of the laser to pass through the limiting rod and then form limiting fit with the limiting rod.

Description

Semiconductor laser packaging structure

Technical Field

The utility model relates to a laser instrument encapsulation technical field, concretely relates to semiconductor laser instrument packaging structure.

Background

The laser instrument needs to be dismantled from packaging structure, it is convenient to overhaul heat abstractor, when using the laser instrument, need install the laser instrument on packaging structure, the installation of laser instrument adopts the bolt fastening, thereby realize installing the laser instrument on packaging structure, every installation dismantlement all needs to use the screwdriver to twist earlier and moves the screw between a plurality of laser instruments and the packaging structure, then still need twist the screw on a plurality of apron, it is longer to part laser instrument and packaging structure or fixed spend time, and the laser instrument is installed behind packaging structure's inside, because the position of laser instrument is not fixed a position completely, make small skew can appear in packaging structure's inside in the laser instrument, and then influence the use precision of laser instrument.

Therefore, the present invention proposes a semiconductor laser package structure to solve the above problems.

SUMMERY OF THE UTILITY MODEL

For overcoming prior art's defect, the utility model aims to provide a packaging structure that can install semiconductor laser.

In order to achieve the purpose, the technical scheme of the utility model is realized like this: a semiconductor laser packaging structure relates to a laser, and comprises a casing and a packaging plate which is detachably arranged at the opening end of the casing, wherein the laser is arranged in the casing, and two side walls of the casing are respectively provided with a positioning mechanism for blocking the laser to move; the positioning mechanism comprises a limiting rod which is elastically and telescopically arranged on the side wall of the casing in a penetrating manner through a spring, stop blocks are respectively arranged on the two side walls of the laser, and the stop blocks can be compressed along with the movement of the laser to pass through the limiting rod and be driven by the limiting rod to form limiting matching with the limiting rod.

Preferably, the spring housing is arranged on the limiting rod, a mounting groove for accommodating the spring is formed in the side wall of the casing, and a baffle located in the mounting groove and used for compressing the spring is arranged on the limiting rod.

Preferably, the positioning mechanism further comprises a knob fixed at the end of the limiting rod, the knob is close to the positioning rod fixedly connected to the surface of the casing, and two rod grooves matched with the positioning rod are formed in the outer surface of the casing.

Preferably, the rod groove comprises a first rod groove and a second rod groove, and the groove depth dimension of the first rod groove is larger than that of the second rod groove; when the positioning rod is clamped in the first limiting groove, the stop block is abutted against the limiting rod; when the positioning rod is positioned in the second rod groove, one end of the stop block close to the limiting rod is far away from the limiting rod.

Preferably, two sets of chutes are formed in the top and the bottom of the laser, two chutes are formed in each set of chutes, and the chutes are connected with sliding blocks arranged on the casing in a sliding mode.

Preferably, the packaging plate is provided with a locking mechanism for mounting the packaging plate on the laser, the locking mechanism comprises an elastic sheet fixed on the inner surface of the packaging plate, the top of the elastic sheet is provided with a locking pin for locking, a locking groove clamped with the locking pin is arranged above the locking pin, and the locking groove is arranged on the groove wall of the notch.

Preferably, the package board is provided with a plurality of ventilation holes for dissipating heat of the laser.

Preferably, the inner wall of the casing is provided with a wall groove for the sliding of the stop block.

The beneficial effects of the utility model embody:

the utility model can limit the position of the laser in the shell through the arranged positioning mechanism, when the laser is limited, the laser does not move in the shell, and the packaging plate is connected with the laser through the locking mechanism, thereby realizing that the packaging plate installs the laser; when the laser instrument towards the inside gliding of cover shell, the tip of gag lever post can be extruded to the dog on the laser instrument lateral wall, because the tip of dog and gag lever post all sets up to convex structure, make the gag lever post receive the extrusion back towards the direction of keeping away from the dog and remove, at this moment, the spring is compressed under the drive of baffle, the tip of dog is slided the tip of gag lever post, at this moment, the dog can not exert external force for the tip of gag lever post, the spring begins to reset, the gag lever post resets under the effect that the spring promoted the baffle, the side and the dog side of gag lever post are inconsistent, the gag lever post can be spacing to the dog, the dog can not remove, and then the laser instrument of being connected with the dog is unmovable.

Drawings

In the drawings:

fig. 1 is a schematic perspective view of the present invention;

FIG. 2 is a schematic structural view of the package board of the present invention;

FIG. 3 is an enlarged schematic view of the utility model at A in FIG. 2;

FIG. 4 is a schematic view of the positioning mechanism of the present invention;

fig. 5 is a schematic perspective view of the positioning mechanism of the present invention;

fig. 6 is a schematic structural view of the locking mechanism of the present invention;

description of the reference numerals:

1. a housing; 2. a package board; 3. a positioning mechanism; 31. a knob; 32. positioning a rod; 33. a limiting rod; 34. a baffle plate; 35. a spring; 36. mounting grooves; 37. a first rod groove; 38. a second rod groove; 4. a laser; 41. a chute; 42. a groove is opened; 43. a stopper; 44. a wall groove; 5. a locking mechanism; 51. an elastic sheet; 52. a locking pin; 53. and locking the grooves.

Detailed Description

The present invention will be described in further detail with reference to the accompanying drawings and examples, and it is to be understood that the described examples are only a part of the examples of the present invention, and not all of the examples. The embodiments and features of the embodiments in the present application may be combined with each other without conflict. Based on the embodiments in the utility model, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the utility model.

It should be noted that, if directional indications (such as up, down, left, right, front, back, 8230; etc.) are involved in the embodiments of the present invention, the directional indications are only used for explaining the relative positional relationship between the components in a specific posture (as shown in the figure), the motion situation, etc., and if the specific posture is changed, the directional indications are correspondingly changed.

In addition, "a plurality" means two or more. In addition, the technical solutions in the embodiments may be combined with each other, but it must be based on the realization of those skilled in the art, and when the technical solutions are contradictory to each other or cannot be realized, such a combination should not be considered to exist, and is not within the protection scope claimed by the utility model.

Referring to the attached drawings 1-5 of the specification, the utility model provides a semiconductor laser packaging structure, which relates to a laser 4, and comprises a casing 1 and a packaging plate 2 which is detachably arranged at the opening end of the casing 1, wherein the laser 4 is arranged in the casing 1, and two side walls of the casing 1 are respectively provided with a positioning mechanism 3 for blocking the laser 4 from moving; the positioning mechanism 3 comprises a limiting rod 33 elastically and telescopically arranged on the side wall of the casing 1 in a penetrating manner through a spring 35, two side walls of the laser 4 are respectively provided with a stop block 43, and the stop blocks 43 can be compressed through the limiting rod 33 along with the movement of the laser 4 and form limiting matching with the limiting rod 33 from the inner side of the limiting rod 33. The position of the laser 4 can be limited in the shell 1 through the arranged positioning mechanism 3, when the laser 4 is limited, the laser 4 does not move in the shell 1, and the packaging plate 2 is connected with the laser 4 through the locking mechanism 5, so that the packaging plate 2 can mount the laser 4; when the laser 4 slides towards the inside of the housing 1, the end of the limit rod 33 can be extruded by the stop block 43 on the side wall of the laser 4, and because the end of the stop block 43 and the end of the limit rod 33 are both in the arc-shaped structure, the limit rod 33 moves towards the direction far away from the stop block 43 after being extruded, at this time, the spring 35 is compressed under the driving of the baffle 34 until the end of the stop block 43 slides over the end of the limit rod 33, at this time, the stop block 43 cannot apply external force to the end of the limit rod 33, the spring 35 starts to reset, the limit rod 33 resets under the action of the spring 35 pushing the baffle 34, the side surface of the limit rod 33 is abutted against the side surface of the stop block 43, the stop block 43 can be limited by the limit rod 33, the stop block 43 cannot move, and the laser 4 connected with the stop block 43 does not move.

In one embodiment, please refer to fig. 2-4 of the specification, the spring 35 is sleeved on the limiting rod 33, an installation groove 36 for accommodating the spring 35 is arranged on the side wall of the casing 1, and a baffle 34 for compressing the spring 35 is arranged inside the installation groove 36 on the limiting rod 33. The positioning mechanism 3 further comprises a knob 31 fixed at the end of a limiting rod 33, the surface of the knob 31 close to the sleeve 1 is fixedly connected with a positioning rod 32, and the outer surface of the sleeve 1 is provided with two rod grooves used for being matched with the positioning rod 32. The rod grooves include a first rod groove 37 and a second rod groove 38, the groove depth dimension of the first rod groove 37 is larger than the groove depth dimension of the second rod groove 38; when the positioning rod 32 is clamped in the first limiting groove, the stop block 43 is abutted against the limiting rod 33; when the positioning rod 32 is located in the second rod groove 38, one end of the stopper 43 close to the limiting rod 33 is far away from the limiting rod 33.

When the laser 4 needs to be detached, the knob 31 is pulled, the knob 31 drives the limiting rod 33 to move, the spring 35 is compressed through the baffle 34 until the positioning rod 32 is pulled out of the inside of the first rod groove 37, the knob 31 is rotated again, the knob 31 drives the positioning rod 32 to rotate to the position of the second rod groove 38, the knob 31 is loosened, the spring 35 resets, the spring 35 enables the limiting rod 33 to generate force towards the direction of the laser 4 through the baffle 34, the positioning rod 32 is clamped inside the second rod groove 38 at the moment, the groove depth of the second rod groove 38 is smaller than that of the first rod groove 37, the end part, close to the limiting rod 43, of the limiting rod 33 is not in contact with the limiting block 43, the limiting block 43 slides on the inner wall of the casing 1 at the moment and cannot be limited by the limiting rod 33, and the laser 4 is detached from the inside of the casing 1 conveniently.

In an embodiment, with continuing reference to fig. 2 and 3 of the specification, two sets of sliding grooves 41 are formed in the top and the bottom of the laser 4, two sliding grooves 41 are formed in each set, a notch 42 communicated with each sliding groove 41 is formed in the end of each sliding groove 41, and each sliding groove 41 is connected with a sliding block arranged on the casing 1 in a sliding manner; two groups of locking mechanisms 5 on the inner surface of the packaging plate 2, wherein each locking mechanism 5 is matched with one notch 42; the inner wall of the jacket 1 is provided with a wall groove 44 for the sliding of the stop block 43. When the laser 4 is installed, the sliding block on the casing 1 is opposite to the sliding groove 41, the laser 4 is pushed, and meanwhile, the stop block 43 slides in the wall groove 44 until the stop block 43 is completely limited by the positioning mechanism 3.

In another embodiment, referring to fig. 6 of the specification, a locking mechanism 5 for mounting the package plate 2 on the laser 4 is disposed on the package plate 2, the locking mechanism 5 includes an elastic sheet 51 fixed on an inner surface of the package plate 2, a locking pin 52 for locking is disposed on a top of the elastic sheet 51, a locking groove 53 engaged with the locking pin 52 is disposed above the locking pin 52, and the locking groove 53 is opened on a groove wall of the notch 42. When the packaging plate 2 is installed, the elastic sheet 51 is only required to be aligned to the position of the notch 42 towards the laser 4 to be pushed until the elastic sheet 51 drives the locking pin 52 to be clamped with the locking groove 53, so that the packaging plate 2 can be loosened, the packaging plate 2 is installed at the end part of the laser 4, the surface of the packaging plate 2 is attached to the casing 1, and the laser 4 is packaged.

In an embodiment, referring to fig. 1 and 6 of the specification, the package board 2 is provided with a plurality of ventilation holes for dissipating heat of the laser 4. The package plate 2 plays a role of dust prevention and heat dissipation.

In an embodiment, referring to fig. 3 of the specification, a wall groove 44 for sliding the stopper 43 is formed on an inner wall of the casing 1. The stopper 43 can be easily slid by providing a wall groove 44.

When the packaging plate 2 is dismounted, the handles at the upper end and the lower end of the packaging plate 2 only need to be pulled, and after the locking mechanism 5 is pulled, the locking pin 52 can be separated from the locking groove 53, so that the packaging plate 2 can be dismounted from the end part of the laser 4.

The above description is only a preferred embodiment of the present invention, and should not be taken as limiting the invention, and any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A semiconductor laser packaging structure relates to a laser (4) and is characterized by comprising a casing (1) and a packaging plate (2) which is detachably arranged at the opening end of the casing (1), wherein the laser (4) is arranged in the casing (1), and two side walls of the casing (1) are respectively provided with a positioning mechanism (3) for blocking the laser (4) from moving;

positioning mechanism (3) include wear to establish through spring (35) elasticity telescopically gag lever post (33) on the lateral wall of cover shell (1), be provided with dog (43) on the both sides wall of laser instrument (4) respectively, dog (43) can be along with the removal of laser instrument (4) is compressed and is passed through gag lever post (33) and follow the inboard of gag lever post (33) with gag lever post (33) form spacing cooperation.

2. The semiconductor laser package structure according to claim 1, wherein the spring (35) is sleeved on the limiting rod (33), a mounting groove (36) for accommodating the spring (35) is formed in a side wall of the housing (1), and a baffle (34) for compressing the spring (35) is arranged inside the mounting groove (36) and is arranged on the limiting rod (33).

3. The semiconductor laser package structure according to claim 2, wherein the positioning mechanism (3) further comprises a knob (31) fixed at an end of the limiting rod (33), a positioning rod (32) is fixedly connected to a surface of the knob (31) close to the housing (1), and two rod grooves for engaging with the positioning rod (32) are formed on an outer surface of the housing (1).

4. A semiconductor laser package according to claim 3, wherein the rod grooves include a first rod groove (37) and a second rod groove (38), the first rod groove (37) having a groove depth dimension greater than a groove depth dimension of the second rod groove (38); when the positioning rod (32) is clamped in the first limiting groove, the stop block (43) is abutted against the limiting rod (33); when the positioning rod (32) is positioned in the second rod groove (38), one end, close to the limiting rod (33), of the stop block (43) is far away from the limiting rod (33).

5. The semiconductor laser packaging structure according to claim 1, wherein two sets of sliding grooves (41) are formed in the top and the bottom of the laser (4), two sliding grooves are formed in each set of sliding grooves (41), and the sliding grooves (41) are slidably connected with sliding blocks arranged on the casing (1).

6. A semiconductor laser package structure according to claim 5, wherein the package plate (2) has a locking mechanism (5) for mounting the package plate (2) on the laser (4), the locking mechanism (5) comprises an elastic sheet (51) fixed on the inner surface of the package plate (2), a locking pin (52) for locking is disposed on the top of the elastic sheet (51), a locking groove (53) engaged with the locking pin (52) is disposed above the locking pin (52), and the locking groove (53) is opened on the groove wall of the opening groove (42).

7. The semiconductor laser package structure according to claim 1, wherein the package board (2) is provided with a plurality of ventilation holes for dissipating heat of the laser (4).

8. A semiconductor laser package according to claim 1, wherein the inner wall of the casing (1) is provided with a wall groove (44) for sliding the stopper (43).