CN217973462U

CN217973462U - Plating bath

Info

Publication number: CN217973462U
Application number: CN202222339399.9U
Authority: CN
Inventors: 不公告发明人
Original assignee: Wenzhou Taiyu New Material Technology Co ltd
Current assignee: Wenzhou Taiyu New Material Technology Co ltd
Priority date: 2022-09-01
Filing date: 2022-09-01
Publication date: 2022-12-06
Anticipated expiration: 2032-09-01

Abstract

The utility model discloses a plating bath, which comprises a bath body and a dispersing device; wherein, the dispersing device comprises a bubble generating device and an ultrasonic generating device; on one hand, bubbles are generated by the bubble generating device to push the electroplating solution to flow; on the other hand, bubbles are broken through an ultrasonic generating device, and local micro-oscillation stirring is carried out on the electroplating solution; the electroplating solution can be stirred and the overall stability of the electroplating solution can be ensured; and the bubble output direction of the bubble generating device is intersected with the ultrasonic wave transmitting direction of the ultrasonic wave generating device, so that the ultrasonic wave generating device can break bubbles in time, and the bubbles are prevented from being stirred to other areas.

Description

Plating bath

Technical Field

The utility model relates to an electroplate technical field, especially relate to an electroplating bath.

Background

In the manufacturing process of the electrical contact conductor, graphene and metal salt are usually mixed in the same electroplating solution for electroplating, and a mixed coating of graphene and electroplating metal is formed on the surface of the electrical contact conductor so as to enrich the performance of the coating.

In the conventional electroplating technology, the uniform mixing of the electroplating solution is promoted by adopting a mechanical stirring or ultrasonic vibration mode; however, during the electroplating process, the stability of the electroplating solution needs to be maintained, and the simple adoption of mechanical stirring or ultrasonic vibration can cause the flowability of the electroplating solution to be too high, so that the electroplating quality on the cathode is poor; and the uniformity of the plating solution after mechanical stirring is poor.

Therefore, how to ensure the stability of the plating solution while improving the dispersion uniformity of the plating solution becomes a problem that needs to be improved in the prior art.

SUMMERY OF THE UTILITY MODEL

The application aims at providing a plating bath to solve the problem of how to guarantee the stationarity of plating solution under the condition of improving the dispersion homogeneity of plating solution.

The following solutions are adopted in the present application to solve the above technical problems.

In a first aspect, the present application provides a plating cell comprising:

the tank body is used for containing electroplating liquid;

the dispersing device comprises a bubble generating device and an ultrasonic generating device; the bubble generating device and the ultrasonic wave generating device are arranged in the tank body, and at least part of the bubble generating device and the ultrasonic wave generating device is used for immersing into the electroplating solution;

wherein the bubble generating device is disposed adjacent to the ultrasonic wave generating device.

In some embodiments of the present application, the bubble output direction of the bubble generation device intersects with the ultrasonic wave emission direction of the ultrasonic wave generation device.

In some embodiments of the present application, the dispersing device further includes a control device, and the control device is in communication connection with the bubble generating device and the ultrasonic wave generating device, and is configured to control the opening/closing of the bubble generating device and the ultrasonic wave generating device.

In some embodiments of the present application, the bubble generating device and the ultrasonic wave generating device are both disposed near a bottom of the tank.

In some embodiments of the present application, the bubble generating device includes a first bubble generator and a second bubble generator, the first bubble generator and the second bubble generator are respectively located at positions different from the tank bottom of the tank body in height, and the ultrasonic wave emitting direction of the ultrasonic wave generating device is respectively intersected with the respective bubble output directions of the first bubble generator and the second bubble generator.

In some embodiments of this application, the distance of ultrasonic wave generating device apart from the tank bottom of cell body is in first bubble generator is apart from the distance of the tank bottom of cell body with second bubble generator is apart from between the distance of the tank bottom of body, first bubble generator's bubble output direction with second bubble generator's bubble output direction is carried on the back mutually, and all faces ultrasonic wave generating device.

In some embodiments of the present application, the bubble output direction of the first bubble generator faces the bottom of the tank, and the bubble output direction of the second bubble generator faces the opening of the tank.

In some embodiments of the present application, the first bubble generator and the second bubble generator overlap each other in an orthogonal projection of the ultrasonic wave generator on the bottom of the tank, and are spaced from each other in an orthogonal projection of the ultrasonic wave generator on the bottom of the tank.

In some embodiments of the present application, the tank body is further configured to place an anode and a cathode for electroplating, and the bubble generation device and the ultrasonic generation device are configured to be disposed between the anode and the cathode, and enable the ultrasonic generation device to be located between the bubble generation device and the cathode.

In some embodiments of the present application, the inside of the tank body is provided with an anode and a cathode for electroplating, the bubble generation device and the ultrasonic generation device are arranged between the anode and the inner side wall of the tank body close to the anode, and the ultrasonic generation device is arranged between the bubble generation device and the anode.

The application provides an electroplating bath, which comprises a bath body and a dispersing device; wherein, the dispersing device comprises a bubble generating device and an ultrasonic generating device; on one hand, bubbles are generated by the bubble generating device to push the electroplating solution to flow; on the other hand, bubbles are broken through an ultrasonic generating device, and local micro-oscillation stirring is carried out on the electroplating solution; the electroplating solution can be stirred and the overall stability of the electroplating solution can be ensured; and the bubble output direction of the bubble generating device is intersected with the ultrasonic wave transmitting direction of the ultrasonic wave generating device, so that the ultrasonic wave generating device can break bubbles in time, and the bubbles are prevented from being stirred to other areas.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.

FIG. 1 is a schematic view of the main structure of an electroplating bath according to the present invention;

fig. 2 is a schematic structural view of an electroplating bath according to an embodiment of the present invention;

fig. 3 is a schematic structural view of a bubble generation device and an ultrasonic wave generation device in an embodiment of the present invention;

FIG. 4 is a schematic view of a plating bath according to another embodiment of the present invention;

fig. 5 is a schematic structural view of a plating tank according to still another embodiment of the present invention.

Description of the main element symbols:

100-a groove body, 110-an anode, 120-a cathode, 130-electroplating liquid, 140-a groove bottom, 200-a bubble generating device, 210-bubbles, 220-a first bubble generator, 221-a first bubble outlet, 230-a second bubble generator, 231-a second bubble outlet, 300-an ultrasonic generating device, a-a first direction, b-a first included angle and c-a second included angle.

Detailed Description

The technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application, and it is obvious that the embodiments described are only some embodiments of the present invention, and not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by those skilled in the art without making creative efforts belong to the protection scope of the present invention.

In the description of the present invention, it should be understood that the terms "upper", "lower", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of the description, but do not indicate or imply that the device or element referred to must have a unique orientation, be constructed and operated in a particular orientation, and thus should not be construed as limiting the present invention. In the description of the present invention, the meaning of "a plurality" includes two or more unless otherwise specifically limited.

In this application, the word "exemplary" is used to mean "serving as an example, instance, or illustration. Any embodiment described herein as "exemplary" is not necessarily to be construed as preferred or advantageous over other embodiments. The following description is presented to enable any person skilled in the art to make and use the invention. In the following description, details are set forth for the purpose of explanation. It will be apparent to one of ordinary skill in the art that the present invention may be practiced without these specific details. In other instances, well-known structures and processes are not shown in detail to avoid obscuring the description of the invention with unnecessary detail. Thus, the present invention is not intended to be limited to the embodiments shown, but is to be accorded the widest scope consistent with the principles disclosed herein.

In the conventional graphene plating solution, since graphene is likely to agglomerate in the plating solution, it is necessary to sufficiently and uniformly diffuse graphene into the plating solution by some means. In a related technology, a method of adding a dispersing agent in an electroplating solution is used for reducing agglomeration of graphene in the electroplating solution, but the dispersing agent can only allow the electroplating solution to be sufficiently diffused in a static state; when electroplating, the graphene in the electroplating solution is locally agglomerated along with the ion migration and graphene migration, and particularly, the agglomeration is easy to occur near a cathode.

In another related art, mechanical stirring is adopted, so that the plating solution must be stirred in real time to fully diffuse the graphene in the plating solution, but the real-time stirring is difficult to control a stirring area, and the plating layer quality is easily affected by the flowing of the plating solution near the cathode area. Therefore, this solution is only suitable for stirring the plating solution before electroplating to sufficiently mix the plating solution, and is not suitable for using the graphene during the electroplating process.

In still another correlation technique, adopt ultrasonic oscillation's mode to carry out real-time oscillation to the plating solution, it is less singly to adopt ultrasonic oscillation to influence the plating solution, and adopts the ultrasonic wave to vibrate the whole of plating solution, and graphite alkene disperses in the supersound meeting plating solution, but also can aggravate the graphite alkene diffusion, leads to graphite alkene to gather.

Therefore, the application improves the structure of the traditional electroplating tank based on the structure.

Referring to fig. 1, the main body of the present embodiment is an electroplating tank, which includes a tank body 100 and a dispersing device. The tank 100 is used for containing the plating solution 130, and the dispersing device is used for uniformly dispersing the plating solution 130.

Wherein the dispersing means comprises a bubble generating means 200 and an ultrasonic wave generating means 300. The bubble generating device 200 and the ultrasonic wave generating device 300 are disposed in the tank body 100, and at least a portion of the bubble generating device 200 and the ultrasonic wave generating device 300 is submerged in the plating solution 130.

It should be noted that at least a part of the bubble generating device 200 and the ultrasonic wave generating device 300 is used to be immersed in the plating liquid 130, and it is understood that the bubble outlet of the bubble generating device 200 and the sound wave emitting end of the ultrasonic wave generating device 300 are immersed in the plating liquid.

More specifically, the bubble generating device 200 is disposed adjacent to the ultrasonic wave generating device 300, and the output direction of the bubble 210 of the bubble generating device 200 intersects with the ultrasonic wave emitting direction of the ultrasonic wave generating device 300.

It should be noted that, on the one hand, the bubbles 210 generated by the bubble generating device 200 can push the plating solution 130 to flow; on the other hand, the ultrasonic generator 300 breaks the bubbles 210 to locally stir the plating liquid 130 by micro-oscillation; not only can the electroplating solution 130 be stirred, but also the overall stability of the electroplating solution 130 can be ensured; and the output direction of the bubbles 210 of the bubble generating device 200 is intersected with the ultrasonic wave emission direction of the ultrasonic wave generating device 300, so that the ultrasonic wave generating device 300 can vibrate the bubbles 210 in time, and the bubbles 210 are prevented from being stirred to other areas.

In some embodiments, the plating solution 130 is a graphene plating solution or other graphene-like material doped plating solution 130.

It should be noted that the graphene plating solution may be understood as a plating solution 130 formed by mixing graphene, metal salts or other trace elements, rare earth elements, and the like into the same plating solution.

Since graphene has the advantages of high electric conductivity, high heat conductivity, high strength, high flexibility, strong chemical inertness, excellent gas barrier property and the like, a mixed coating of graphene and electroplating metal can be formed on the surface of an electric contact conductor by applying the graphene electroplating solution to an electroplating process, so that the mixed coating has the excellent properties of two materials, namely graphene and electroplating metal.

It should be explained that, during the electroplating process, graphene may migrate from the position of the anode 110 along the direction close to the cathode 120; by disposing the bubble generating device 200 between the anode 110 and the cathode 120, it is beneficial to promote sufficient migration and diffusion of graphene between the anode 110 and the cathode 120 to the plating solution. Since the cathode 120 is consuming graphene, it is advantageous to supply graphene to the cathode 120 sufficiently uniformly by activating the plating solution between the anode 110 and the cathode 120.

In some embodiments of the present application, the dispersing device further includes a control device, which is in communication connection with the bubble generating device 200 and the ultrasonic wave generating device 300, and is used for controlling the on/off of the bubble generating device 200 and the ultrasonic wave generating device 300.

In some embodiments, the control device may be disposed outside of the body of the cell 100 of the plating cell.

In some embodiments of the present application, the bubble generating device 200 and the ultrasonic wave generating device 300 are both disposed near the tank bottom 140 of the tank body 100.

In some embodiments of the present application, the bubble generating device 200 includes a first bubble generator 220 and a second bubble generator 230, the first bubble generator 220 and the second bubble generator 230 are respectively located at different heights from the tank bottom 140 of the tank body 100, and the ultrasonic wave emitting direction of the ultrasonic wave generating device 300 intersects with the respective output directions of the bubbles 210 of the first bubble generator 220 and the second bubble generator 230.

In some embodiments, the control device can cyclically and intermittently control the first bubble generator 220, the second bubble generator 230, and the ultrasonic wave generation device to be turned on.

In some embodiments of the present application, the distance between the ultrasonic generator and the bottom of the tank is between the distance between the first bubble generator 220 and the bottom of the tank and the distance between the second bubble generator 230 and the bottom of the tank, the bubble output direction of the first bubble generator 220 is opposite to the bubble output direction of the second bubble generator 230, and both of them face the ultrasonic generator.

The use of one ultrasonic wave generator 300 can simultaneously combine the first bubble generator 220 and the second bubble generator 230 to oscillate the bubbles 210 generated by both.

In some embodiments of the present application, the output direction of the bubbles 210 of the first bubble generator 220 is toward the bottom 140 of the tank 100, and the output direction of the bubbles 210 of the second bubble generator 230 is toward the opening of the tank 100.

It should be noted that the plating bath has an oppositely disposed bath bottom 140 and an open mouth. The plating solution 130 is injected into the plating bath through the opening.

In some embodiments, the plating bath has a rectangular longitudinal cross-section, and the opening is disposed at the top of the plating bath.

In some embodiments, the ultrasonic wave generating device 300 is disposed on a central axis between the first bubble generator 220 and the second bubble generator 230. The central axis may be understood as a perpendicular bisector of a line connecting the center of gravity of the first bubble generator 220 and the center of gravity of the second bubble generator 230.

In some embodiments of the present application, the first bubble generator 220 and the second bubble generator 230 overlap each other in an orthographic projection of the ultrasonic generator 300 on the bottom 140 of the tank 100, and are spaced apart from each other in an orthographic projection of the ultrasonic generator 300 on the bottom 140 of the tank 100.

In some embodiments of the present application, the tank 100 is further configured to place an anode 110 and a cathode 120 for electroplating, and the bubble generating device 200 and the ultrasonic wave generating device 300 are configured to be disposed between the anode 110 and the cathode 120, and the ultrasonic wave generating device 300 is located between the bubble generating device 200 and the cathode 120.

In some embodiments of the present application, the tank 100 is further configured to place an anode 110 and a cathode 120 for electroplating, and the bubble generating device 200 and the ultrasonic wave generating device 300 are configured to be disposed between the anode 110 and the inner side wall of the tank 100 close to the anode 110, and the ultrasonic wave generating device 300 is located between the bubble generating device 200 and the anode 110.

More specifically, the bubble-generating device 200 is disposed between the anode 110 and the cathode 120, and the distance between the bubble-generating device 200 and the anode 110 is smaller than the distance between the bubble-generating device 200 and the cathode 120.

Through set up bubble generating device 200 between positive pole 110 and negative pole 120, not only realized the circulation of graphite alkene in the plating bath, also carried out the pertinence to the plating bath between negative pole and positive pole and stir a little simultaneously, increased the diffusion migration of graphite alkene between positive pole and negative pole, increased graphite alkene and migrated to the cathode surface, ensured that cathode surface graphite alkene concentration maintains certain concentration.

It is to be explained that the distance between the bubble-generating means 200 and the anode 110 is smaller than the distance between the bubble-generating means 200 and the cathode 120; it is understood that the bubble generating device 200 is disposed closer to the anode 110, and since the bubble generating device 200 generates the bubbles 210 capable of stirring the plating solution, the arrangement can reduce the stirring force of the bubbles 210 to the plating solution near the cathode 120, so as to ensure the stability of the plating solution at the cathode 120, thereby improving the quality of the plating layer.

It should be explained that the bubble generating device can generate more fine bubbles 210, and the fine bubbles 210 can slightly stir the plating solution due to the floating motion of the plating solution during the floating motion, which is beneficial to the graphene to uniformly diffuse to the cathode 120.

More specifically, the ultrasonic wave generating means 300 is disposed between the bubble generating means 200 and the cathode 120.

It should be noted that the vibration wave generated by the ultrasonic wave generator 300 gradually weakens with increasing distance, and in order to prevent the air bubble 210 from moving from the position of the air bubble generator 200 to the cathode 120, the ultrasonic wave generator 300 is directly disposed between the air bubble generator 200 and the cathode 120, and the ultrasonic wave generator 300 can block the air bubble 210.

If the ultrasonic wave generator 300 is disposed in another area, the bubble 210 may move from the position of the bubble generator 200 to the cathode 120 and may also move away from the ultrasonic wave generator 300, and a part of the bubble 210 may not move to the cathode 120 and may be broken, thereby degrading the quality of the plating layer of the cathode 120.

In some embodiments, the first bubble generator 220 and the second bubble generator 230 may be an integrated structure, i.e. two bubble outlets are provided on the same bubble generating device 200. More specifically, more bubble outlets can be arranged according to actual conditions.

In some embodiments, the first bubble generator 220 and the second bubble generator 230 can be separate independent structures, and the first bubble generator 220 and the second bubble generator 230 can operate independently. More specifically, more bubble generators may be arranged according to actual conditions.

It should be noted that the bubble generating means 200 can be selectively arranged according to actual parameters such as the depth, concentration, and homogenization degree of the plating liquid.

Referring to fig. 2 and 3, in some embodiments of the present application, the first bubble generator 220 has a first bubble outlet, the second bubble generator 230 has a second bubble outlet, and the first bubble outlet and the second bubble outlet are both disposed toward the first side portion; wherein the first side portion is a side of the bubble generation device 200 close to the ultrasonic wave generation device 300.

It should be noted that the first bubble outlet and the second bubble outlet are both disposed toward the first side portion, and bubbles can move toward the first side portion when they are generated, that is, toward the ultrasonic wave generating device 300, thereby facilitating the movement of the plating liquid toward the ultrasonic wave generating device 300. On the other hand, the bubbles 210 are broken by vibration on the way to the ultrasonic generator 300, and promote the local plating solution to be uniformly dispersed; on the other hand, when the ultrasonic wave generator 300 is disposed between the bubble generator 200 and the cathode 120, the bubbles 210 can promote the movement of the plating liquid toward the cathode 120, and further supply graphene to the cathode 120.

Referring to fig. 2, in some embodiments of the present application, the first bubble outlet is disposed toward the bottom of the groove, and a bubble outlet direction of the first bubble outlet forms an inclined angle with a first direction a; the first direction a is a direction in which the bubbles 210 are subjected to buoyancy in the solution in the tank 100. The plating liquid in the lower part can be dispersed.

Referring to fig. 3, in some embodiments, the first bubble outlet and the first direction a form a first included angle b, and the first included angle b is within 20-70 °. More specifically, the first included angle b is within a range of 30 to 60.

Referring to fig. 2, in some embodiments of the present application, the second bubble outlet is disposed back to the bottom of the groove, and a bubble outlet direction of the second bubble outlet is disposed at an inclined angle with respect to the first direction a; the first direction a is a direction in which the bubbles 210 in the tank 100 are floated. The plating solution in the middle and lower parts can be stirred slightly.

Referring to fig. 3, in some embodiments, the first bubble outlet and the first direction a form a second included angle c, and the second included angle c is within 5-70 °. More specifically, the second included angle c is within the range of 10 to 60.

Referring to fig. 4, in some embodiments of the present application, the number of the bubble generating devices 200 is multiple, and at least a portion of the bubble generating devices 200 is disposed on a side of the anode 110 away from the cathode 120.

It should be explained that the side of the anode 110 facing away from the cathode 120 will generally gather high density graphene, and the bubble generation device 200 is arranged to facilitate the graphene flowing to the cathode 120.

In some embodiments, the ultrasonic wave generating device 300 is disposed beside the bubble generating device 200.

Referring to fig. 5, in some embodiments, the number of the anodes 110 may be multiple, and the bubble generating device 200 and the ultrasonic wave generating device 300 are disposed near the anodes 110.

Referring to fig. 2, in some embodiments of the present application, a distance between the ultrasonic wave generating device 300 and the bubble generating device 200 is smaller than a distance between the ultrasonic wave generating device 300 and the cathode 120.

It should be noted that the ultrasonic wave generating device 300 is disposed closer to the bubble generating device 200, and the influence of the bubbles 210 on the cathode 120 can be reduced.

In some embodiments, the ultrasonic wave generating device 300 is an ultrasonic wave generator, and the ultrasonic frequency of the ultrasonic wave generator is 40-50KHz.

More specifically, the plating liquid is agitated using the bubble generating device 200 and the ultrasonic wave generating device 300, and the power of the ultrasonic wave generating device 300 can be set to be sufficiently small as long as it is sufficient to collapse the bubbles 210 in the corresponding region. Further, the influence of the vibration of the ultrasonic wave generator 300 on other regions can be reduced.

In a second aspect, the present application further provides an electroplating apparatus, including the electroplating tank.

In some embodiments, the electroplating apparatus includes an anode 110 and a cathode 120. And the anode 110 and the cathode 120 are at least partially inserted into the plating solution 130.

In some embodiments, the ultrasonic generator is located away from the cathode 120 so as not to affect the quality of the plating layer on the cathode 120.

In some embodiments, the number of anodes 110 and cathodes 120 is not limited, and two anodes 110 and one cathode 120 may be provided, with the cathode 120 being disposed between the two anodes 110; further, the anode 110, the cathode 120, and the anode 110 are alternately arranged.

In some embodiments, the anode is made of silver material, and the electroplated layer is also changed from a common silver plated layer to a silver graphene plated layer, so that the conductivity and the wear resistance of the silver plated layer can be further improved.

In some embodiments, the anode is made of nickel material, and the electroplated layer has a nickel coating instead of a nickel graphene coating, so that the wear resistance and corrosion resistance of the nickel coating can be further improved.

In the foregoing embodiments, the descriptions of the respective embodiments have respective emphasis, and parts that are not described in detail in a certain embodiment may refer to the above detailed descriptions of other embodiments, which are not described herein again.

Having thus described the basic concept, it will be apparent to those skilled in the art that the foregoing detailed disclosure is to be considered merely illustrative and not restrictive of the broad application. Various modifications, improvements and adaptations to the present application may occur to those skilled in the art, though not expressly described herein. Such modifications, improvements and adaptations are proposed in the present application and thus fall within the spirit and scope of the exemplary embodiments of the present application.

Also, the present application uses specific words to describe embodiments of the application. Reference to "one embodiment," "an embodiment," and/or "some embodiments" means a feature, structure, or characteristic described in connection with at least one embodiment of the application. Therefore, it is emphasized and should be appreciated that two or more references to "an embodiment" or "one embodiment" or "an alternative embodiment" in various places throughout this specification are not necessarily all referring to the same embodiment. Furthermore, some features, structures, or characteristics of one or more embodiments of the present application may be combined as appropriate.

Similarly, it should be noted that in the preceding description of embodiments of the present application, various features are sometimes grouped together in a single embodiment, figure, or description thereof for the purpose of streamlining the disclosure aiding in the understanding of one or more of the embodiments. This method of disclosure, however, is not intended to require more features than are expressly recited in the claims. Indeed, the embodiments may be characterized as having less than all of the features of a single disclosed embodiment.

Accordingly, in some embodiments, the numerical parameters used in the specification and claims are approximations that may vary depending upon the desired properties of the individual embodiments. In some embodiments, the numerical parameter should take into account the specified significant digits and employ a general digit preserving approach. Notwithstanding that the numerical ranges and parameters setting forth the broad scope of the range are approximations, in the specific examples, such numerical values are set forth as precisely as possible within the scope of the application.

For each patent, patent application publication, and other material cited in this application, such as articles, books, specifications, publications, documents, and the like, the entire contents of which are hereby incorporated by reference into this application, except for application history documents that are inconsistent with or conflict with the contents of this application, and except for documents that are currently or later become incorporated into this application as though fully set forth in the claims below. It is noted that the descriptions, definitions and/or use of terms in this application shall control if they are inconsistent or contrary to the present disclosure.

The technical solutions provided by the embodiments of the present invention are introduced in detail, and specific examples are applied herein to explain the principles and embodiments of the present invention, and the descriptions of the above embodiments are only used to help understand the methods and core ideas of the present invention; meanwhile, for those skilled in the art, according to the idea of the present invention, there may be some changes in the specific implementation and application scope, and to sum up, the content of the present specification should not be understood as a limitation to the present invention.

Claims

1. An electroplating cell, comprising:

the tank body is used for containing electroplating liquid;

2. The plating tank of claim 1, wherein a bubble output direction of the bubble generation device intersects with an ultrasonic wave emission direction of the ultrasonic wave generation device.

3. The plating tank as recited in claim 1, wherein the dispersing device further comprises a control device, the control device is in communication with the bubble generation device and the ultrasonic generation device and is configured to control the opening/closing of the bubble generation device and the ultrasonic generation device.

4. The plating tank as recited in any one of claims 1 to 3, wherein the bubble generation device and the ultrasonic generation device are both disposed proximate to a bottom of the tank body.

5. The plating tank of claim 4, wherein the bubble generation device comprises a first bubble generator and a second bubble generator, the first bubble generator and the second bubble generator are respectively located at different heights from the bottom of the tank body, and the ultrasonic wave emission direction of the ultrasonic wave generation device is respectively intersected with the bubble output directions of the first bubble generator and the second bubble generator.

6. The plating cell of claim 5, wherein the ultrasonic wave generation device is positioned at a distance from the bottom of the cell body between the first bubble generator and the bottom of the cell body and the second bubble generator and the bottom of the cell body, and wherein the bubble output direction of the first bubble generator is opposite to the bubble output direction of the second bubble generator and both face the ultrasonic wave generation device.

7. The plating cell of claim 6, wherein the bubble output direction of the first bubble generator is toward the bottom of the cell body and the bubble output direction of the second bubble generator is toward the opening of the cell body.

8. The plating cell of claim 6, wherein the first bubble generator and the second bubble generator each overlap in an orthographic projection of the ultrasonic wave generator on the bottom of the cell body and are spaced apart from each other in an orthographic projection of the ultrasonic wave generator on the bottom of the cell body.

9. The plating tank of claim 4, wherein the tank is further configured to house an anode and a cathode for plating, and the bubble generating device and the ultrasonic wave generating device are configured to be disposed between the anode and the cathode such that the ultrasonic wave generating device is positioned between the bubble generating device and the cathode.

10. The electroplating cell of claim 4, wherein an anode and a cathode for electroplating are disposed in the cell body, the bubble generation device and the ultrasonic generation device are disposed between the anode and an inner sidewall of the cell body adjacent to the anode, and the ultrasonic generation device is disposed between the bubble generation device and the anode.