CN217956701U - Electric energy quality optimizing device - Google Patents
Electric energy quality optimizing device Download PDFInfo
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- CN217956701U CN217956701U CN202220771488.8U CN202220771488U CN217956701U CN 217956701 U CN217956701 U CN 217956701U CN 202220771488 U CN202220771488 U CN 202220771488U CN 217956701 U CN217956701 U CN 217956701U
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Abstract
The utility model relates to a distribution network electric energy compensation technical field, in particular to an electric energy quality optimization device; including the apron, the cavity, optimize the device body, dampproofing subassembly and radiating unit, radiating unit includes circulation water cooling assembly and absorber plate, the absorber plate is established to the outside cover of optimizing the device body, utilize the absorber plate to absorb the radiating heat of optimizing device body during operation, and carry cold water to the heat dissipation pipeline in through circulation water cooling assembly, because on the mounting groove of heat dissipation pipeline gomphosis on the absorber plate, and the mounting groove is the helical structure setting, make cold water and the abundant heat transfer of absorber plate in the heat dissipation pipeline, make the absorber plate remain good heat absorptivity throughout, thereby absorb the radiating heat of optimization device body during operation, and then improve reliability and the life of optimizing the device body.
Description
Technical Field
The utility model relates to a distribution network electric energy compensation technical field especially relates to an electric energy quality optimization device.
Background
In the middle of the life, the distribution lines circuit is long, the mounting point is many, the circuit is new and old various condition such as differ, receive seasonal variation, change day and night, factors such as circuit load change, can arouse the great change of line voltage, thereby influence the quality and the power supply reliability of circuit power supply, therefore the chemical industry, the environmental protection trade, electric power system, metallurgical system, nuclear power industry, fire safety monitoring, trades such as traffic industry just need electric energy quality optimizing device to guarantee self safety and guarantee self production, but current electric energy quality optimizing device does not set up dampproofing measure mostly, the water condensation phenomenon appears in the device inner wall easily in rainy season, thereby cause the device to wet the electric leakage, cause the incident.
In order to solve the problems, a part of the electric energy quality optimization device is provided with the anti-cover plate on the cavity, the anti-damp partition plate and the anti-damp drying strips are arranged in the cavity, the anti-cover plate is utilized to prevent rainwater from directly spraying on the cavity and flowing into the electric energy quality optimization device, water drops on the surfaces of the cavity and the electric energy quality optimization device due to a water condensation phenomenon are absorbed through the anti-damp drying strips, the device is prevented from being subjected to damp and leakage, and the safety of the device is improved.
However, most of the existing power quality optimization devices still adopt a mode of arranging a heat dissipation groove on the cavity to dissipate heat of the device, the heat dissipation effect is poor, and when the heat in the cavity cannot be reduced in time, the service life of the device can be influenced.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide an electric energy quality optimization device, the most mode that still adopts to set up the radiating groove on the cavity of current electric energy quality optimization device among the solution prior art dispels the heat to the device, and the radiating effect is relatively poor, and the heat in the cavity can't in time reduce, can influence device life's problem.
In order to achieve the purpose, the utility model provides an electric energy quality optimization device, which comprises a cover plate, a cavity, an optimization device body, a moisture-proof component and a heat dissipation unit, wherein the cover plate is detachably connected with the cavity and is positioned above the cavity;
the heat dissipation unit includes circulation water cooling assembly and absorber plate, circulation water cooling assembly is located the inside in installing zone, be provided with the heat dissipation pipeline on the circulation water cooling assembly, the absorber plate with the cavity is dismantled and is connected, and is located the inside in equipment district, and cover and establish the outside of optimizing the device body, the absorber plate is the tubular structure setting, the outside of absorber plate is provided with the mounting groove, the mounting groove is the helical structure setting, the heat dissipation pipeline inlays to be established on the mounting groove.
The circulating water cooling assembly further comprises a water tank, a pump body, a water delivery pipe and a water return pipe, the water tank and the pump body are located inside the installation area, a semiconductor refrigerator is arranged on the water tank and used for refrigerating water in the water tank, a water outlet and a water inlet are further formed in the water tank, the input end of the pump body is connected with a water outlet pipeline, the output end of the pump body is connected with the water delivery pipe in a flange mode, one end of the pump body, far away from the water delivery pipe, is connected with a heat dissipation pipeline in a flange mode, one end of the water delivery pipe, far away from the heat dissipation pipeline, is connected with the water return pipe in a flange mode, and one end of the heat dissipation pipeline, far away from the water return pipe, is connected with the water inlet in a flange mode.
The heat absorption plate comprises a mounting ring and a plate body, the plate body is arranged in a cylindrical structure, the mounting ring is arranged at one end of the plate body, and the mounting ring is detachably connected with the cavity.
Wherein, dampproofing subassembly includes two dampproofing boards and a plurality of dampproofing dry strip, the both sides in equipment district all are provided with the spout, every dampproofing board respectively with one spout sliding connection, every all be provided with a plurality ofly on the dampproofing board dampproofing dry strip.
The side wall of the water tank is also provided with a heat insulation frame, the heat insulation frame covers the outside of the hot end of the semiconductor refrigerator, and one end, far away from the water tank, of the heat insulation frame penetrates through the cavity.
The utility model discloses an electric energy quality optimization device, including apron, cavity, optimization device body, dampproofing subassembly and radiating unit, radiating unit includes circulation water-cooling subassembly and absorber plate the outside cover of optimizing the device body is established the absorber plate utilizes the absorber plate absorbs optimize the radiating heat of device body during operation, and pass through circulation water-cooling subassembly carries cold water extremely in the heat dissipation pipeline, because the heat dissipation pipeline gomphosis is in on the absorber plate on the mounting groove, and the mounting groove is the helical structure setting, makes cold water in the heat dissipation pipeline with the absorber plate fully exchanges heat, makes the absorber plate keeps good heat absorption performance all the time, thereby absorbs optimize the radiating heat of device body during operation, and then improve optimize the life of device body.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the description below are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
Fig. 1 is a schematic structural diagram of the electric energy quality optimization device provided by the present invention.
Fig. 2 is a partial enlarged view of a structure of fig. 1.
Fig. 3 is a schematic structural diagram of the heat dissipation unit provided by the present invention.
The device comprises a cover plate 1, a cavity 2, an optimization device body 3, a damp-proof component 4, a heat dissipation unit 5, a partition plate 6, an equipment area 7, an installation area 8, a water circulation cooling component 9, a heat absorption plate 10, a heat dissipation pipeline 11, a mounting groove 12, a water tank 13, a pump body 14, a water delivery pipe 15, a water return pipe 16, a semiconductor refrigerator 17, a water outlet 18, a water inlet 19, a mounting ring 20, a plate body 21, a damp-proof plate 22, a damp-proof drying strip 23, a chute 24 and a heat insulation frame 25.
Detailed Description
Reference will now be made in detail to the embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the drawings are exemplary and intended to be used for explaining the present invention, and should not be construed as limiting the present invention.
In the description of the present invention, it is to be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are merely for convenience of description and simplicity of description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, are not to be construed as limiting the present invention. In addition, in the description of the present invention, "a plurality" means two or more unless specifically limited otherwise.
Referring to fig. 1 to 3, the utility model provides an electric energy quality optimization device, including a cover plate 1, a cavity 2, an optimization device body 3, a moisture-proof component 4 and a heat dissipation unit 5, the cover plate 1 is detachably connected with the cavity 2 and is located above the cavity 2, a partition plate 6 is arranged inside the cavity 2, the partition plate 6 divides the inside of the cavity 2 into a device area 7 and an installation area 8, the optimization device body 3 and the moisture-proof component 4 are installed inside the device area 7;
radiating element 5 includes water cooling circulation subassembly 9 and absorber plate 10, water cooling circulation subassembly 9 is located the inside of installing zone 8, be provided with heat dissipation pipeline 11 on the water cooling circulation subassembly 9, the absorber plate 10 with cavity 2 is dismantled and is connected, and is located the inside of equipment district 7, and the cover is established optimize the outside of device body 3, the absorber plate 10 is the setting of cylindric structure, the outside of absorber plate 10 is provided with mounting groove 12, mounting groove 12 is the helical structure setting, heat dissipation pipeline 11 inlays to be established on the mounting groove 12.
In this embodiment, the heat absorbing plate 10 is covered outside the optimization device body 3, the heat absorbing plate 10 is used to absorb heat dissipated when the optimization device body 3 works, and cold water is conveyed into the heat dissipating pipeline 11 through the circulating water cooling assembly 9, because the heat dissipating pipeline 11 is embedded on the installation groove 12 on the heat absorbing plate 10, and the installation groove 12 is arranged in a spiral structure, the cold water in the heat dissipating pipeline 11 and the heat absorbing plate 10 fully exchange heat, so that the heat absorbing plate 10 always maintains good heat absorbing performance, thereby absorbing heat dissipated when the optimization device body 3 works, and further improving the service life of the optimization device body 3.
Further, the circulating water cooling assembly 9 further includes a water tank 13, a pump body 14, a water pipe 15 and a water return pipe 16, the water tank 13 and the pump body 14 are located inside the installation area 8, a semiconductor refrigerator 17 is arranged on the water tank 13, the semiconductor refrigerator 17 is used for refrigerating water in the water tank 13, a water outlet 18 and a water inlet 19 are further arranged on the water tank 13, an input end of the pump body 14 is connected with the water outlet 18 through a pipeline, an output end of the pump body 14 is connected with the water pipe 15 through a flange, one end, far away from the pump body 14, of the water pipe 15 is connected with the heat dissipation pipeline 11 through a flange, one end, far away from the water pipe 15, of the heat dissipation pipeline 11 is connected with the water return pipe 16 through a flange, and one end, far away from the heat dissipation pipeline 11, of the water return pipe 16 is connected with the water inlet 19 through a flange.
In this embodiment, after the water in the water tank 13 is cooled by the semiconductor cooler 17, the pump body 14 is started to convey cold water into the heat dissipation pipeline 11 through the water pipe 15, so that the cold water in the heat dissipation pipeline 11 and the heat absorbing plate 10 exchange heat sufficiently, the heat of the heat absorbing plate 10 is reduced, the heat absorbing plate 10 maintains good heat absorbing performance all the time, the heat dissipated when the optimization device body 3 works is absorbed, the service life of the optimization device body 3 is further prolonged, and the heat exchanged water is conveyed into the water tank 13 through the water return pipe 16 for cyclic cooling.
Further, the heat absorbing plate 10 includes a mounting ring 20 and a plate body 21, the plate body 21 is disposed in a cylindrical structure, the mounting ring 20 is disposed at one end of the plate body 21, and the mounting ring 20 is detachably connected to the cavity 2.
In this embodiment, after the plate body 21 is sleeved outside the optimization device body 3, the installation ring 20 is installed inside the equipment area 7 by using screws, so as to complete installation of the heat absorbing plate 10, and the plate body 21 and the installation ring 20 are fixedly connected, and are manufactured by using an integral molding technology during manufacturing, so that the structure is firmer.
Further, dampproofing subassembly 4 includes two dampproofing boards 22 and a plurality of dampproofing dry strip 23, the both sides of equipment district 7 all are provided with spout 24, every dampproofing board 22 respectively with one spout 24 sliding connection, every all be provided with a plurality ofly on the dampproofing board 22 dampproofing dry strip 23.
In this embodiment, utilize dampproofing board 22 with dampproofing dry strip 23 absorbs cavity 2 with optimize the drop of water that the device body 3 surface appears because of the water congealing phenomenon, avoid the device because of the electric leakage that wets, improved the security of device, dampproofing board 22 with spout 24 sliding connection is convenient for the installation and the change of dampproofing board 22.
Further, a heat insulation frame 25 is further arranged on the side wall of the water tank 13, the heat insulation frame 25 covers the outside of the hot end of the semiconductor refrigerator 17, and one end, far away from the water tank 13, of the heat insulation frame 25 penetrates through the cavity 2.
In this embodiment, the heat insulation frame 25 is covered on the outside of the hot end of the semiconductor refrigerator 17, so that the heat dissipated by the hot end of the semiconductor refrigerator 17 is transmitted to the outside of the cavity 2 through the heat insulation frame 25, thereby avoiding heat overflow and reducing the refrigeration efficiency of the water in the water tank 13.
While the invention has been described with reference to a preferred embodiment, it will be understood by those skilled in the art that various changes in form and detail may be made without departing from the spirit and scope of the invention.
Claims (5)
1. An electric energy quality optimizing device is characterized in that,
the heat dissipation device comprises a cover plate, a cavity, an optimization device body, a moisture-proof component and a heat dissipation unit, wherein the cover plate is detachably connected with the cavity and is positioned above the cavity;
the heat dissipation unit includes circulation water cooling assembly and absorber plate, circulation water cooling assembly is located the inside in installing zone, be provided with the heat dissipation pipeline on the circulation water cooling assembly, the absorber plate with the cavity is dismantled and is connected, and is located the inside in equipment district, and cover and establish the outside of optimizing the device body, the absorber plate is the tubular structure setting, the outside of absorber plate is provided with the mounting groove, the mounting groove is the helical structure setting, the heat dissipation pipeline inlays to be established on the mounting groove.
2. The power quality optimization device of claim 1,
the circulating water cooling assembly further comprises a water tank, a pump body, a water delivery pipe and a water return pipe, wherein the water tank and the pump body are located inside the installation area, a semiconductor refrigerator is arranged on the water tank and used for refrigerating water in the water tank, a water outlet and a water inlet are further formed in the water tank, the input end of the pump body is connected with a water outlet pipeline, the output end of the pump body is connected with a water delivery pipe flange, the water delivery pipe is far away from one end of the pump body and a heat dissipation pipeline flange, the heat dissipation pipeline is far away from one end of the water delivery pipe and the water return pipe flange, and the water return pipe is far away from one end of the heat dissipation pipeline and the water inlet flange.
3. The power quality optimization device of claim 1,
the heat absorption plate comprises a mounting ring and a plate body, the plate body is arranged in a cylindrical structure, the mounting ring is arranged at one end of the plate body, and the mounting ring is detachably connected with the cavity.
4. The power quality optimization device of claim 1,
dampproofing subassembly includes two dampproofing boards and a plurality of dampproofing dry strip, the both sides in equipment district all are provided with the spout, every dampproofing board respectively with one spout sliding connection, every all be provided with a plurality ofly on the dampproofing board dampproofing dry strip.
5. The power quality optimization device of claim 2,
the side wall of the water tank is also provided with a heat insulation frame, the heat insulation frame covers the outer part of the hot end of the semiconductor refrigerator, and one end, far away from the water tank, of the heat insulation frame penetrates through the cavity.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220771488.8U CN217956701U (en) | 2022-04-01 | 2022-04-01 | Electric energy quality optimizing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220771488.8U CN217956701U (en) | 2022-04-01 | 2022-04-01 | Electric energy quality optimizing device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217956701U true CN217956701U (en) | 2022-12-02 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202220771488.8U Active CN217956701U (en) | 2022-04-01 | 2022-04-01 | Electric energy quality optimizing device |
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| Country | Link |
|---|---|
| CN (1) | CN217956701U (en) |
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2022
- 2022-04-01 CN CN202220771488.8U patent/CN217956701U/en active Active
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