CN217955804U - Wafer expands membrane device - Google Patents
Wafer expands membrane device Download PDFInfo
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- CN217955804U CN217955804U CN202221365715.3U CN202221365715U CN217955804U CN 217955804 U CN217955804 U CN 217955804U CN 202221365715 U CN202221365715 U CN 202221365715U CN 217955804 U CN217955804 U CN 217955804U
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Abstract
The utility model relates to the technical field of wafer production, in particular to a wafer film expanding device, which comprises a base, a wafer supporting plate, a film expanding plate, a jacking driving mechanism, a pressing plate and a pressing driving mechanism; the wafer supporting plate is fixed on the base, the jacking driving mechanism is fixed on the bottom surface of the wafer supporting plate, and the film expanding plate is connected with the jacking driving mechanism; the wafer supporting plate is provided with a film expanding hole matched with the film expanding plate; the pressing plate is arranged above the wafer supporting plate and connected with the pressing driving mechanism, and a avoiding hole used for avoiding the film expanding plate is formed in the pressing plate. After the wafer product is placed on the designated position on the wafer supporting plate, the pressing plate is driven by the pressing driving mechanism to press the wafer product on the wafer supporting plate downwards, and then the film expanding plate is driven by the jacking driving mechanism to pass through the film expanding hole and jack the wafer product upwards, so that the wafer gap with the scribed wafer is expanded; the device simple structure, and can realize the automatic fixed of wafer product through pushing down actuating mechanism and clamp plate cooperation.
Description
Technical Field
The utility model relates to a wafer production technical field, concretely relates to wafer expands membrane device.
Background
In the wafer production process, the scribed wafer is usually required to be expanded by a film expanding device to form a gap, so that the wafer can be conveniently taken. The conventional film expanding device is generally complex in structure, and a clamp is adopted to fix a wafer product, so that the automatic fixation of the wafer product cannot be realized; and the cylinder jacking is usually adopted, so that the precise control of the film expanding process cannot be realized.
Disclosure of Invention
In order to overcome the deficiencies in the prior art, the utility model aims at providing a simple structure's wafer expands membrane device not only can realize the automatic fixed of wafer product, can also realize accurate control to expanding the membrane.
In order to achieve the above object, the technical solution of the present invention is a wafer film expanding device, which comprises a base, a wafer supporting plate, a film expanding plate, a jacking driving mechanism, a pressing plate and a pressing driving mechanism; the wafer supporting plate is fixed on the base, the jacking driving mechanism is fixed on the bottom surface of the wafer supporting plate, and the film expanding plate is connected with the jacking driving mechanism; the wafer supporting plate is provided with a film expanding hole matched with the film expanding plate; the pressing plate is arranged above the wafer supporting plate and connected with the pressing driving mechanism, and avoidance holes for avoiding the film expanding plate are formed in the pressing plate.
Further, push down actuating mechanism and include that it drives actuating cylinder, backup pad, connecting plate and connecting rod to push down, the connecting plate with the backup pad from supreme set gradually in the top of clamp plate down, it is fixed in to push down to drive actuating cylinder in the backup pad, just it drives actuating cylinder's piston rod and the connecting plate is connected to push down, the connecting plate pass through the connecting rod with the clamp plate is connected.
Furthermore, four corners of the connecting plate are respectively connected with four corners of the pressing plate through four connecting rods.
Furthermore, the supporting plate is connected with the wafer supporting plate through at least two guide rods, through holes are formed in the positions, corresponding to the guide rods, of the connecting plate, linear bearings are installed in the through holes, and the guide rods penetrate through the corresponding linear bearings and are connected with the linear bearings.
Furthermore, four corners of the supporting plate are connected to the wafer supporting plate through four guiding rods, respectively.
Furthermore, both sides of the connecting plate are provided with buffers.
Furthermore, a plurality of positioning columns are arranged on the top surface of the wafer supporting plate, and the positioning columns are arranged at intervals along the circumferential direction of the wafer product placing area.
Furthermore, the jacking driving mechanism comprises a fixing frame, a film expanding plate fixing seat, a lifting slide rail, a lifting slide block, a screw rod and a servo motor, wherein the fixing frame is fixed on the bottom surface of the wafer supporting plate, the lifting slide rail is vertically arranged and fixed on the fixing frame, the lifting slide block is slidably mounted on the lifting slide rail, and the servo motor is connected with the lifting slide block through the screw rod; the membrane expansion plate fixing seat is fixed on the lifting slide block, and the membrane expansion plate is fixed at the top of the membrane expansion plate fixing seat.
Furthermore, the base comprises a bottom plate and support columns, and four corners of the wafer supporting plate are fixed on the bottom plate through the four support columns respectively.
Furthermore, a mounting window is arranged on the bottom plate, the four support columns are arranged around the mounting window, and the lower end of the jacking driving mechanism penetrates through the mounting window downwards.
Compared with the prior art, the beneficial effects of the utility model are that:
(1) The utility model discloses after putting the wafer product to the assigned position on the wafer layer board, through pushing down actuating mechanism drive clamp plate and compressing tightly the wafer product downwards on the wafer layer board, then drive the expand membrane board through jacking actuating mechanism and pass the expand membrane hole and upwards jack up the wafer product, through expanding the membrane make the wafer clearance that has already scribed the piece expand; the device has a simple structure, and can realize automatic fixation of the wafer product through the cooperation of the pressing driving mechanism and the pressing plate;
(2) The utility model discloses a servo motor drive lead screw drives the lift slider and reciprocates to drive expand the lamina membranacea fixing base and expand the lamina membranacea on it and reciprocate along vertical direction, distance and speed that can the accurate control expand the lamina membranacea and rise, thereby realize expanding the accurate control of membrane process.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a wafer film expanding apparatus according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of a wafer film expanding device according to an embodiment of the present invention;
fig. 3 is a schematic structural diagram of a wafer supporting plate and a jacking driving mechanism according to an embodiment of the present invention;
in the figure: 1. a base; 11. a base plate; 12. a support pillar; 13. installing a window; 2. a wafer support plate; 21. expanding a membrane hole; 22. a positioning column; 3. a membrane expansion plate; 4. a jacking driving mechanism; 41. a fixed mount; 42. lifting the slide rail; 43. a lifting slide block; 44. a servo motor; 45. a fixed base of the film expanding plate; 5. pressing a plate; 51. avoiding holes; 6. a push-down drive mechanism; 61. a driving cylinder is pressed downwards; 62. a support plate; 63. a connecting plate; 64. a connecting rod; 65. a guide bar; 66. a linear bearing; 67. a buffer; 7. and (5) wafer production.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
In the description of the present invention, it is to be understood that the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on those shown in the drawings, and are merely for convenience of description and simplicity of description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, are not to be construed as limiting the present invention.
The terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or to implicitly indicate the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature; in the description of the present invention, "a plurality" means two or more unless otherwise specified.
As shown in fig. 1-3, an embodiment of the present invention provides a wafer film expanding device, which includes a base 1, a wafer supporting plate 2, a film expanding plate 3, a jacking driving mechanism 4, a pressing plate 5, and a pressing driving mechanism 6; the wafer supporting plate 2 is fixed on the base 1, the jacking driving mechanism 4 is fixed on the bottom surface of the wafer supporting plate 2, and the film expanding plate 3 is connected with the jacking driving mechanism 4; the wafer supporting plate 2 is provided with a film expanding hole 21 matched with the film expanding plate 3; the pressing plate 5 is arranged above the wafer supporting plate 2, the pressing plate 5 is connected with the pressing driving mechanism 6, and the pressing plate 5 is provided with an avoiding hole 51 for avoiding the film expanding plate 3. In this embodiment, after the wafer product 7 is placed at a designated position on the wafer supporting plate 2, the pressing plate 5 is driven by the pressing driving mechanism 6 to press the wafer product 7 on the wafer supporting plate 2 downwards, then the film expanding plate 3 is driven by the jacking driving mechanism 4 to penetrate through the film expanding holes 21 to jack the wafer product 7 upwards, and the scribed wafer gap is expanded by film expansion; the device is simple in structure, and automatic fixing of the wafer product can be achieved through cooperation of the pressing driving mechanism 6 and the pressing plate 5.
Specifically, the film expanding plate 3 in this embodiment is cylindrical, and is matched with the size of a wafer in a wafer product; the film expanding holes 21 and the avoiding holes 51 are both circular, and the sizes of the film expanding holes 21 and the avoiding holes 51 are slightly larger than that of the film expanding plate 3.
Refine above-mentioned embodiment, push down actuating mechanism 6 and drive actuating cylinder 61, backup pad 62, connecting plate 63 and connecting rod 64 including pushing down, the connecting plate 63 with backup pad 62 from supreme setting gradually in the top of clamp plate 5, it drives actuating cylinder 61 and is fixed in to push down on the backup pad 62, just push down drive actuating cylinder 61 the piston rod with connecting plate 63 is connected, connecting plate 63 through connecting rod 64 with clamp plate 5 is connected. In order to realize that the pressing plate 5 uniformly presses the wafer product 7, the pressing driving cylinder 61 is fixed in the middle of the supporting plate 62 and directly faces the middle of the pressing plate, and the avoidance hole 51 needs to be formed in the middle of the pressing plate 5, so that the connecting plate 63 is arranged above the pressing plate 5 and fixed with the pressing plate 5, and then the pressing driving cylinder 61 drives the connecting plate 63 to drive the pressing plate 5 to downwardly and uniformly press the wafer product 7 on the wafer supporting plate 2. Optimally, four corners of the connecting plate 63 are connected with four corners of the pressing plate 5 through four connecting rods 64, so that the uniformity of pressing the wafer product 7 by the pressing plate 5 is further improved.
In an optimized embodiment, the supporting plate 62 is connected with the wafer supporting plate 2 through at least two guide rods 65, through holes are formed in the connecting plate 63 at positions corresponding to the guide rods 65, linear bearings 66 are installed in the through holes, and the guide rods 65 penetrate through the corresponding linear bearings 66 and are connected with the linear bearings 66. In the embodiment, the supporting plate 62 is fixed above the wafer supporting plate 2 through the guide rod 65, and the linear bearing 66 arranged on the connecting plate 63 is matched with the guide rod 65, so that the downward pressing driving air cylinder 61 drives the connecting plate 63 to move upwards in the vertical direction. Preferably, four corners of the support plate 62 are connected to the wafer pallet 2 through four guide rods 65, respectively.
Preferably, the connecting plate 63 is mounted with bumpers 67 on both sides. As shown in fig. 2, two buffers 67 are disposed on opposite sides of the connection plate 63 to buffer the wafer pallet 2 when the pressing plate 5 is pressed down.
Specifically, a plurality of positioning columns 22 are disposed on the top surface of the wafer supporting plate 2, and the positioning columns 22 are disposed at intervals along the circumferential direction of the wafer product placement area. As shown in fig. 3, four positioning posts 22 are respectively located outside four corners of the wafer product 7, so that the wafer product 7 can be accurately positioned on the wafer pallet 2.
The embodiment is refined, the jacking driving mechanism 4 includes a fixing frame 41, a film expanding plate fixing seat 45, a lifting slide rail 42, a lifting slide block 43, a screw rod and a servo motor 44, the fixing frame 41 is fixed on the bottom surface of the wafer supporting plate 2, the lifting slide rail 42 is vertically arranged and fixed on the fixing frame 41, the lifting slide block 43 is slidably mounted on the lifting slide rail 42, and the servo motor 44 is connected with the lifting slide block 43 through the screw rod; the membrane expansion plate fixing seat 45 is fixed on the lifting slide block 43, and the membrane expansion plate 3 is fixed at the top of the membrane expansion plate fixing seat 45. As shown in fig. 2 and fig. 3, in the embodiment, the servo motor 44 drives the screw rod to drive the lifting slide block 43 and the film expansion plate fixing seat 45 thereon, and the film expansion plate 3 moves along the vertical direction, so that the ascending distance and speed of the film expansion plate 3 can be accurately controlled, and the film expansion process can be accurately controlled.
Further, the base 1 includes a bottom plate 11 and support pillars 12, and four corners of the wafer pallet 2 are fixed on the bottom plate 11 through four support pillars 12, respectively. Furthermore, a mounting window 13 is arranged on the bottom plate 11, four support columns 12 are arranged around the mounting window 13, and the lower end of the jacking driving mechanism 4 penetrates through the mounting window 13 downwards.
The above description is only a preferred embodiment of the present invention, and should not be taken as limiting the invention, and any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (10)
1. A wafer film expanding device is characterized in that: the device comprises a base, a wafer supporting plate, a film expanding plate, a jacking driving mechanism, a pressing plate and a pressing driving mechanism; the wafer supporting plate is fixed on the base, the jacking driving mechanism is fixed on the bottom surface of the wafer supporting plate, and the film expanding plate is connected with the jacking driving mechanism; the wafer supporting plate is provided with a film expanding hole matched with the film expanding plate; the pressing plate is arranged above the wafer supporting plate and connected with the pressing driving mechanism, and avoidance holes for avoiding the film expanding plate are formed in the pressing plate.
2. The wafer film expanding device according to claim 1, wherein: push down actuating mechanism and drive actuating cylinder, backup pad, connecting plate and connecting rod including pushing down, the connecting plate with the backup pad from supreme set gradually in the top of clamp plate down, it is fixed in to push down to drive actuating cylinder in the backup pad, just push down to drive actuating cylinder's piston rod with the connecting plate is connected, the connecting plate pass through the connecting rod with the clamp plate is connected.
3. The wafer film expanding device as claimed in claim 2, wherein: and four corners of the connecting plate are connected with the four corners of the pressing plate through four connecting rods respectively.
4. The wafer film expanding device according to claim 2, wherein: the supporting plate is connected with the wafer supporting plate through at least two guide rods, through holes are formed in the positions, corresponding to the guide rods, of the connecting plate, linear bearings are installed in the through holes, and the guide rods penetrate through the corresponding linear bearings and are connected with the linear bearings.
5. The wafer film expanding device as claimed in claim 4, wherein: and four corners of the supporting plate are respectively connected with the wafer supporting plate through four guide rods.
6. The wafer film expanding device according to claim 2, wherein: and buffers are arranged on two sides of the connecting plate.
7. The wafer film expanding device as claimed in claim 1, wherein: the top surface of the wafer supporting plate is provided with a plurality of positioning columns, and the positioning columns are arranged at intervals along the circumferential direction of the wafer product placing area.
8. The wafer film expanding device according to claim 1, wherein: the jacking driving mechanism comprises a fixing frame, a film expanding plate fixing seat, a lifting slide rail, a lifting slide block, a screw rod and a servo motor, wherein the fixing frame is fixed on the bottom surface of the wafer supporting plate, the lifting slide rail is vertically arranged and fixed on the fixing frame, the lifting slide block is slidably mounted on the lifting slide rail, and the servo motor is connected with the lifting slide block through the screw rod; the membrane expansion plate fixing seat is fixed on the lifting slide block, and the membrane expansion plate is fixed at the top of the membrane expansion plate fixing seat.
9. The wafer film expanding device according to claim 1, wherein: the base comprises a bottom plate and supporting columns, and four corners of the wafer supporting plate are fixed on the bottom plate through the four supporting columns respectively.
10. The wafer film expanding device according to claim 9, wherein: the bottom plate is provided with a mounting window, the four supporting columns are arranged around the mounting window, and the lower end of the jacking driving mechanism penetrates through the mounting window downwards.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221365715.3U CN217955804U (en) | 2022-06-02 | 2022-06-02 | Wafer expands membrane device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221365715.3U CN217955804U (en) | 2022-06-02 | 2022-06-02 | Wafer expands membrane device |
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| Publication Number | Publication Date |
|---|---|
| CN217955804U true CN217955804U (en) | 2022-12-02 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202221365715.3U Active CN217955804U (en) | 2022-06-02 | 2022-06-02 | Wafer expands membrane device |
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| CN (1) | CN217955804U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116174336A (en) * | 2023-02-08 | 2023-05-30 | 珠海市科迪电子科技有限公司 | Wafer outward appearance detects machine |
-
2022
- 2022-06-02 CN CN202221365715.3U patent/CN217955804U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116174336A (en) * | 2023-02-08 | 2023-05-30 | 珠海市科迪电子科技有限公司 | Wafer outward appearance detects machine |
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