CN217952382U - Temperature sensing device mounting structure of quick temperature sensing panel and cooking utensil - Google Patents

Abstract

The utility model discloses a temperature sensing device mounting structure of a rapid temperature sensing panel and a cooking utensil, which comprises a panel body, a temperature sensor, a bottom cover and an insulating cover, wherein the panel body is provided with a plurality of non-through holes from top to bottom; the temperature sensors are arranged in the cavities in a one-to-one correspondence manner, and the temperature sensors are tightly attached to the tops of the cavities; the insulation covers are fixedly arranged in the non-through holes in a one-to-one correspondence manner; heat-conducting media are respectively filled in the non-through holes and the cavities; the bottom cover is arranged on the bottom surface of the panel body and covers the bottom of the non-through hole. The utility model has the advantage of sensitive temperature sensing.

Description

Temperature sensing device mounting structure of quick temperature sensing panel and cooking utensil

Technical Field

The utility model relates to an electromagnetism cooking utensil technical field especially relates to a temperature sensing device mounting structure and cooking utensil of quick temperature sensing panel.

Background

Since the electromagnetic heating technology is applied to the cooking industry, temperature control is always a big problem, and the main electromagnetic oven has the following two structures:

the first structure is as follows: the cooker, the microcrystal panel (about 4 mm) and the sensor component (comprising a shell, an insulating layer and a sensor are sequentially arranged from top to bottom, and the sensor is positioned at the center of the coil panel). Because the micrite panel is the tabulate structure, and sensor subassembly hugs closely in the bottom surface of micrite panel, and the characteristics of this kind of structure are that temperature sensor is too far away from between the pan, and the temperature of pan needs to be conducted the micrite panel of 4mm thickness earlier, makes the micrite panel generate heat, then by micrite panel with heat conduction to sensor, consequently has the problem that heat conduction is too slow. In normal household cooking, the heating temperature generally required does not exceed 280 ℃, but because the temperature cannot be quickly sensed, a thin pot can be burnt red, but the temperature cannot be sensed by a sensor. The results from this phenomenon are as follows: 1. potential safety hazards, temperature sensing with severe hysteresis, may cause oil to reach the ignition point when the amount of oil is small, causing a fire; 2. too high oil temperature produces large amounts of aromatic hydrocarbons, which are severely carcinogenic. 3. The Chinese dish is cooked and has poor taste.

The second structure is as follows: the center position department of microcrystalline glass relative to coil panel trompil, let the direct contact of temperature sensor subassembly to the pan, the sensor subassembly contains shell, insulating layer, sensor. The shell of the sensor is generally made of metal, when a pot is placed on the top of the sensor, the metal shell can generate heat in an alternating magnetic field (all metal can generate heat under the pot of the induction cooker, and the closer the metal is to the pot, the faster the metal is generated), so that the temperature sensing of the sensor is inaccurate; in addition, according to the requirements of safety regulations, an insulating layer is required below the shell of the sensor, and engineering plastics which can resist the temperature of about 350 ℃ are generally adopted, so that the thermal conductivity is poor. The biggest defect of the structure is that the shell can generate heat to continuously accumulate heat, and in addition, the temperature of the cookware cannot be really judged due to the heating of the shell, so that the breakthrough of the temperature sensing technology cannot be realized. Meanwhile, the water resistance and the aging resistance also need to pay extra cost.

The above two structures also have the following common disadvantages: in order to ensure that the sensor does not leak electricity, the outer shell is required to be arranged outside the sensor, so that the size of the sensor assembly is large, a special assembly position needs to be designed on the coil panel, and the heat generation efficiency of the coil panel is considered, so that the sensor assembly is usually required to be designed in the center of the coil panel. The heat generated by electromagnetism is mainly concentrated on a circular ring with the diameter of about 90mm, so that the sensor is too far away from the high-temperature area, and the temperature cannot be accurately fed back. Almost all induction cooker manufacturers need to use their own induction cookers to perform different pot heating experiments, record temperature change curves, compare the temperature change curves with the recorded curves when users use the induction cookers, and evaluate the heating conditions of pots. However, in the actual use process, the quality change of the pan, the type change of the pan and the change of food materials are unpredictable, so that the induction cooker cannot become a mainstream cooking tool and is mainly used for boiling water, making hot pots, cooking porridge and the like. In the aspect of panel use, because accurate temperature sensing cannot be achieved, microcrystalline glass with higher temperature resistance is needed to reduce the risk of excessive heat generation, and therefore the panel cost of the induction cooker is high.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a temperature sensing device mounting structure and cooking utensil of quick temperature sensing panel to solve above-mentioned problem.

To achieve the purpose, the utility model adopts the following technical proposal:

a temperature sensing device mounting structure of a rapid temperature sensing panel comprises a panel body, a temperature sensor, a bottom cover and an insulating cover, wherein the panel body is provided with a plurality of non-through holes from top to bottom; the temperature sensors are arranged in the cavities in a one-to-one correspondence manner, and the temperature sensors are tightly attached to the tops of the cavities; the insulation covers are fixedly arranged in the non-through holes in a one-to-one correspondence manner; heat-conducting media are respectively filled in the non-through holes and the cavities; the bottom cover is arranged on the bottom surface of the panel body and covers the bottom of the non-through hole.

Preferably, the top of the insulating cover is higher than the top surface of the panel body, an arc-shaped surface is arranged on the outer edge of the top of the insulating cover, and the arc-shaped surface is tangent to the top surface of the panel body.

Preferably, the top of insulating cover is higher than the top surface of panel body, the outer wall of insulating cover is equipped with the conical surface, the bottom of conical surface with the top surface of panel body meets, the conical surface with the contained angle of the top surface of panel body is the obtuse angle.

Preferably, the bottom of the non-through hole is provided with first threading holes which are in one-to-one correspondence with the leads of the temperature sensor; the bottom cover is provided with second threading holes which are in one-to-one correspondence with the first threading holes.

Preferably, the temperature sensor further comprises a plurality of conductive cylinders, the conductive cylinders are fixed in the second threading holes in a one-to-one correspondence mode, and the conductive cylinders are electrically connected with the leads of the temperature sensor.

Preferably, the heat conducting medium is one or more of heat conducting silicone grease or temperature resistant glue.

An electromagnetic cooking utensil uses the temperature sensing device mounting structure of the rapid temperature sensing panel.

The utility model discloses a beneficial effect of one of them embodiment is:

1. the temperature sensor is arranged in the non-through hole of the panel body, so that the temperature sensor is more sensitive and accurate to detect the temperature of the cookware;

2. the bottom cover is arranged on the bottom surface of the panel body, so that the panel body can be reinforced, and the safety is improved;

3. the temperature sensor can be protected by the insulating cover, so that the temperature sensor is prevented from being damaged due to impact;

3. the temperature sensor can also play an insulating role without additionally installing a shell and can meet the requirement of safety regulations, so that the volume of the temperature sensor is much smaller than that of a temperature sensing device of the traditional electromagnetic cooking appliance, the temperature sensor is almost completely embedded into a non-through hole of a panel body, only two connecting wires penetrate out, a space is not required to be reserved for installing the temperature sensor in the electromagnetic cooking appliance, the structure is more compact, and the temperature sensor is more flexibly and freely assembled;

4. because can quick temperature sensing, reduced the temperature resistant demand of panel body, can replace with borosilicate glass, fire-retardant engineering plastics, it also becomes possible even in the future with soda-lime glass as the panel body of electromagnetism stove, can reduce manufacturing cost by a wide margin.

Drawings

The accompanying drawings are used for further explaining the present invention, but the content in the accompanying drawings does not constitute any limitation to the present invention.

Fig. 1 is a schematic view of an installation structure of a temperature sensor according to an embodiment of the present invention;

FIG. 2 isbase:Sub>A schematic cross-sectional view A-A of FIG. 1;

fig. 3 is a schematic top view of one embodiment of the present invention;

fig. 4 is a schematic top view of one embodiment of the present invention;

fig. 5 is a schematic view of an installation structure of a temperature sensor according to another embodiment of the present invention;

fig. 6 is a schematic view of the installation structure of the temperature sensor according to another embodiment of the present invention;

fig. 7 is a schematic view of an installation structure of a temperature sensor according to another embodiment of the present invention;

fig. 8 is a schematic view of an installation structure of a temperature sensor according to another embodiment of the present invention;

in the drawings: 1-panel body, 11-non-through hole, 12-first threading hole, 2-temperature sensor, 3-bottom cover, 31-second threading hole, 4-insulating cover, 41-cavity, 42-arc surface, 43-conical surface, 5-heat-conducting medium, 6-conductive cylinder and alpha-included angle.

Detailed Description

Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the accompanying drawings are exemplary only for the purpose of explaining the present invention, and should not be construed as limiting the present invention. In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and to simplify the description, but do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the present invention. Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first", "second", may explicitly or implicitly include one or more of the described features. In the description of the present invention, "a plurality" means two or more, and "a plurality" means one or more unless specifically limited otherwise.

In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; may be mechanically connected, may be electrically connected or may be in communication with each other; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present invention can be understood according to specific situations by those of ordinary skill in the art.

In the present application, unless expressly stated or limited otherwise, the recitation of a first feature "on" or "under" a second feature may include the recitation of the first and second features being in direct contact, and may also include the recitation of the first and second features not being in direct contact, but being in contact with another feature between them. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.

The following disclosure provides many different embodiments or examples for implementing different features of the invention. In order to simplify the disclosure of the present invention, the components and arrangements of specific examples are described below. Of course, they are merely examples and are not intended to limit the present invention. Furthermore, the present invention may repeat reference numerals and/or reference letters in the various examples, which have been repeated for purposes of simplicity and clarity and do not in themselves dictate a relationship between the various embodiments and/or arrangements discussed. In addition, the present disclosure provides examples of various specific processes and materials, but one of ordinary skill in the art may recognize applications of other processes and/or use of other materials.

The technical solution of the present invention is further explained by the following embodiments with reference to the drawings.

The temperature sensing device mounting structure of a rapid temperature sensing panel of the present embodiment, as shown in fig. 1-6, includes a panel body 1, a temperature sensor 2, a bottom cover 3 and an insulating cover 4, wherein the panel body 1 has a plurality of non-through holes 11 formed from top to bottom; the number of the insulation covers 4 and the number of the temperature sensors 2 are a plurality, cavities 41 are arranged in the insulation covers 4, the bottoms of the cavities 41 are open, the temperature sensors 2 are correspondingly arranged in the cavities 41 one by one, and the temperature sensors 2 are tightly attached to the tops of the cavities 41; the insulation covers 4 are fixedly arranged in the non-through holes 11 in a one-to-one correspondence manner; the non-through hole 11 and the cavity 41 are respectively filled with a heat-conducting medium 5; the bottom cover 3 is disposed on the bottom surface of the panel body 1 and covers the bottom of the non-through hole 11.

The utility model discloses an open cavity 41 in insulating lid 4 to install temperature sensor 2 in cavity 41, and hug closely in the top of cavity 41, consequently can make and greatly reduce the distance between temperature sensor 2 and the pan, thereby make temperature sensor 2 be close to the pan more, understandably, the distance between temperature sensor 2 and the pan is less, then temperature sensor 2 then can perceive the temperature of pan more fast.

The temperature sensor 2 is mounted in the insulating cover 4, and the temperature sensor 2 can be protected by the insulating cover 4. If the temperature sensor 2 is only installed in the insulating cover 4, when the temperature of the inner wall of the insulating cover 4 is high, but the insulating cover 4 is filled with air which is a poor heat conductor, the heat of the insulating cover 4 is difficult to transfer to the temperature sensor 2, and the problem that the temperature sensed by the temperature sensor 2 is greatly different from the actual temperature of the pot still exists; the utility model discloses a pack heat-conducting medium 5 in the cavity 41 of insulating lid 4, heat-conducting medium 5 is all filled up with the gap between temperature sensor 2 and the cavity 41, thereby make temperature sensor 2 and insulating lid 4 between there is not the air almost, when the temperature transfer of pan to insulating lid 4, insulating lid 4 passes through the inner wall of cavity 41 with heat transfer to heat-conducting medium 5, heat-conducting medium 5 can be rapidly with heat transfer to temperature sensor 2, thereby make temperature sensor 2 wholly heat up, thereby realize the effect of quick temperature sensing. In addition, the heat-conducting medium 5 is also filled between the insulating cover 4 and the non-through hole 11, so that the heat of the panel body 1 can be quickly transferred to the insulating cover 4 through the heat-conducting medium 5, the temperature of the insulating cover 4 is enabled to be more quickly close to the temperature of a pot, and the temperature sensing efficiency is further improved; in addition, the heat conducting medium 5 in the non-through hole 11 not only plays a role in conducting heat, but also can fill the gap between the insulating cover 4 and the non-through hole 11 completely, so that the insulating cover 4 and the temperature sensor 2 are sealed in the non-through hole 11, the gap between the insulating cover 4 and the non-through hole 11 is sealed, and the short circuit caused by the soup and the porridge water permeating into the non-through hole 11 is prevented.

In addition, because the panel body 1 is provided with the plurality of non-through holes 11, the strength of the panel body 1 is reduced, and when the panel body 1 is impacted, the position provided with the non-through holes 11 is easy to crack; the utility model discloses paste bottom 3 in the bottom surface of panel body 1, and bottom 3 covers whole non-through holes 11, therefore bottom 3 can play the effect of strengthening panel body 1, when the top surface of panel body 1 received the impact, the impact force that panel body 1 received can transmit a part to bottom 3 to reduce the cracked risk of panel body 1; therefore, the panel body 1 of the present invention can have sufficient strength to withstand the impact of the pot even if it is provided with the plurality of non-through holes 11.

The temperature sensor 2 is arranged in the insulating cover 4, the insulating cover 4 and the temperature sensor 2 are both arranged in the non-through hole 11, and the insulating cover 4 and the panel body 1 are both insulated, so that the temperature sensor 2 of the utility model can also play an insulating effect without additionally arranging a shell, and can meet the requirement of safety regulations; because need not to set up extra shell in order to carry out insulation treatment to temperature sensor 2 in the bottom of panel body 1 or electromagnetism cooking utensil, temperature sensor 2 imbeds completely in panel body 1's non-through hole 11, only two connecting wire wear out, need not in the electromagnetism cooking utensil for temperature sensor 2's installation reserved space, and the structure is compacter, and temperature sensor 2's assembly is nimble more free, can set up a plurality of temperature sensor 2 conveniently in order to detect out the temperature in each region of pan accurately.

The utility model discloses a quick temperature sensing, free assembly: the temperature sensing speed reaches more than ten times of the traditional temperature sensing speed, a special installation space is not required to be provided by the coil panel, and a plurality of sensors can be assembled at extremely low cost. Simultaneously, owing to can quick temperature sensing, let the electromagnetism stove possess the basis that realizes intelligent culinary art, reduced glass panels body 1's temperature resistant demand, can replace with borosilicate glass, fire-retardant engineering plastics, it is also possible as the panel body 1 of electromagnetism stove even with soda-lime glass in the future. These advantages will let the efficient characteristics of electromagnetism stove energy conversion come out fully to can reduce manufacturing cost by a wide margin, improve assembly efficiency, expand the range of application of electromagnetism stove. After the borosilicate glass and the soda-lime glass are tempered, the physical impact resistance strength of the borosilicate glass and the soda-lime glass is far higher than that of microcrystalline glass, and the safety of the induction cooker is greatly improved under the condition that the temperature resistance requirement is reduced.

Further, as an embodiment, the top of the insulating cover 4 is higher than the top surface of the panel body 1, an arc-shaped surface 42 is arranged on the outer edge of the top of the insulating cover 4, and the arc-shaped surface 42 is tangent to the top surface of the panel body 1.

The arrangement can enable the joint of the insulating cover 4 and the panel body 1 to be smoothly transited, and when soup or porridge is sprinkled on the panel body 1 in the cooking process, the soup and the porridge at the joint of the insulating cover 4 and the panel body 1 can be easily and completely cleaned, so that the problem that the cleaning is difficult due to the sanitary dead angle formed at the joint of the insulating cover 4 and the panel body 1 is avoided.

Further, as an embodiment, the top of the insulating cover 4 is higher than the top surface of the panel body 1, the outer wall of the insulating cover 4 is provided with a tapered surface 43, the bottom of the tapered surface 43 is connected with the top surface of the panel body 1, and an included angle α between the tapered surface 43 and the top surface of the panel body 1 is an obtuse angle.

An obtuse angle is formed at the joint of the insulating cover 4 and the panel body 1, so that the dirt hidden at the joint of the insulating cover 4 and the top surface of the panel body 1 can be reduced, and the difficulty in cleaning the panel body 1 is reduced.

Further, as an embodiment, the bottom of the non-through hole 11 is provided with first threading holes 12 corresponding to the wires of the temperature sensor 2 one by one; the bottom cover 3 is provided with second threading holes 31 which are in one-to-one correspondence with the first threading holes 12.

The second wire passing hole 31 is provided in the bottom cover 3, so that the lead wires of the temperature sensor 2 in the non-through hole 11 can be led out of the bottom cover 3, and the temperature sensor 2 can be electrically connected to other electrical components.

Further, as an embodiment, the temperature sensor further comprises a plurality of conductive cylinders 6, the conductive cylinders 6 are fixed in the second threading holes 31 in a one-to-one correspondence manner, and the conductive cylinders 6 are electrically connected with the wires of the temperature sensor 2.

After the temperature sensor 2 is installed on the panel body 1, a wire of the temperature sensor 2 penetrates out of a first threading hole 12 of the bottom cover 3 and then needs to be electrically connected with a wiring terminal, the temperature sensor 2 is connected to a circuit board of an electromagnetic cooking appliance through the wiring terminal, the wire of the temperature sensor 2 can penetrate into a corresponding conductive cylinder 6 and is electrically connected with the conductive cylinder 6, and the wire of the wiring terminal can also be inserted into the conductive cylinder 6 and is electrically connected with the wire of the temperature sensor 2; because the side wall of the conductive cylinder 6 is conductive, the contact area between the wire of the temperature sensor 2 and the conductive cylinder 6 can be larger, and the problem of poor contact is not easy to occur.

Further, as an embodiment, the heat conducting medium 5 is one or more of heat conducting silicone grease or temperature resistant glue.

The heat conducting medium 5 includes, but is not limited to, one or more of a temperature resistant glue or a heat conducting silicone grease, wherein the temperature resistant glue refers to a glue adapted to the temperature of the product application, and includes, but is not limited to, silicone glue and ceramic glue. For example, an induction cooker, when the upper limit of the temperature is 350 ℃ in the using process, the glue which can resist the temperature of more than 350 ℃ is selected; in another use scenario, for example, a chopping board is heated, the upper limit of the temperature in the use process is 60 ℃, and then glue capable of resisting the temperature of more than 60 ℃ is selected. As an embodiment, the heat-conducting medium 5 filled in the cavity 41 is the same as the heat-conducting medium 5 filled in the non-through hole 11, and is silicone adhesive or ceramic adhesive; as another embodiment, the heat-conducting medium 5 filled in the cavity 41 is different from the heat-conducting medium 5 filled in the non-through hole 11, the cavity 41 is filled with heat-conducting silicone grease, and the non-through hole 11 is filled with silicone adhesive or ceramic adhesive.

An electromagnetic cooking utensil uses the temperature sensing device mounting structure of the rapid temperature sensing panel. Electromagnetic cooking appliances include, but are not limited to, induction cookers, IH rice cookers, and kitchen warming plates.

In the description of the present specification, reference to the terms "example," "one embodiment," "certain embodiments," "illustrative embodiments," "example," "specific example," or "some examples" or the like means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

The technical principle of the present invention has been described above with reference to specific embodiments. The description is made for the purpose of illustrating the principles of the invention and should not be construed in any way as limiting the scope of the invention. Based on the explanations herein, those skilled in the art will be able to conceive of other embodiments of the present invention without inventive efforts, and such equivalent modifications or substitutions are intended to be included within the scope of the present invention as defined in the appended claims.

Claims (7)

1. A temperature sensing device mounting structure of a rapid temperature sensing panel is characterized by comprising a panel body, a temperature sensor, a bottom cover and an insulating cover, wherein the panel body is provided with a plurality of non-through holes from top to bottom; the temperature sensors are arranged in the cavities in a one-to-one correspondence manner, and the temperature sensors are tightly attached to the tops of the cavities; the insulation covers are fixedly arranged in the non-through holes in a one-to-one correspondence manner; heat-conducting media are respectively filled in the non-through holes and the cavities; the bottom cover is arranged on the bottom surface of the panel body and covers the bottom of the non-through hole.

2. The temperature sensing device mounting structure of a rapid temperature sensing panel according to claim 1, wherein the top of the insulating cover is higher than the top surface of the panel body, and an arc-shaped surface is provided at an outer edge of the top of the insulating cover and is tangent to the top surface of the panel body.

3. The temperature sensing device mounting structure of a rapid temperature sensing panel according to claim 1, wherein the top of the insulation cover is higher than the top surface of the panel body, the outer wall of the insulation cover is provided with a tapered surface, the bottom of the tapered surface is connected to the top surface of the panel body, and an included angle between the tapered surface and the top surface of the panel body is an obtuse angle.

4. The temperature sensing device mounting structure of a rapid temperature sensing panel according to claim 1, wherein the bottom of the non-through hole is provided with first threading holes corresponding to the wires of the temperature sensor one to one; the bottom cover is provided with second threading holes corresponding to the first threading holes one by one.

5. The structure of claim 4, further comprising a plurality of conductive tubes, wherein the conductive tubes are fixed in the second through holes in a one-to-one correspondence, and the conductive tubes are electrically connected to the wires of the temperature sensor.

6. The temperature sensing device installation structure of a rapid temperature sensing panel according to claim 1, wherein the heat transfer medium is one or more of heat transfer silicone grease or temperature resistant glue.

7. An electromagnetic cooking appliance, characterized in that a temperature sensing means mounting structure of a rapid temperature sensing panel according to any one of claims 1 to 6 is used.

Images