CN217947541U - Sealing lifting mechanism and semiconductor equipment - Google Patents
Sealing lifting mechanism and semiconductor equipment Download PDFInfo
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- CN217947541U CN217947541U CN202222331014.4U CN202222331014U CN217947541U CN 217947541 U CN217947541 U CN 217947541U CN 202222331014 U CN202222331014 U CN 202222331014U CN 217947541 U CN217947541 U CN 217947541U
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- 238000007789 sealing Methods 0.000 title claims abstract description 117
- 230000007246 mechanism Effects 0.000 title claims abstract description 36
- 239000004065 semiconductor Substances 0.000 title claims abstract description 16
- 230000000694 effects Effects 0.000 abstract description 10
- 238000005516 engineering process Methods 0.000 abstract description 2
- 235000012431 wafers Nutrition 0.000 description 9
- 238000009434 installation Methods 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000002349 favourable effect Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
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Abstract
The utility model provides a sealed hoist mechanism and semiconductor equipment relates to semiconductor technology field. The seal lifting mechanism includes a cavity, a lifting bracket, a first seal, and a second seal. The cavity is provided with an inner cavity and a first channel communicated with the inner cavity; the lifting bracket is movably arranged in the first channel, one end of the lifting bracket is arranged in the inner cavity, and the other end of the lifting bracket is arranged outside the first channel. The first sealing element is arranged at one end, close to the inner chamber, in the first channel and is abutted against the lifting bracket so as to play a role in sealing under the condition that the pressure of the inner chamber is greater than the external pressure; the second sealing piece is arranged at one end, far away from the inner cavity, of the first channel and is abutted against the lifting bracket, so that a sealing effect is achieved under the condition that the pressure of the inner cavity is smaller than the external pressure, the adaptability of the sealing and lifting mechanism is improved, the pressure condition of the cavity and the external part can be adapted, and the first sealing piece and the second sealing piece are convenient to install or disassemble.
Description
Technical Field
The utility model relates to the field of semiconductor technology, particularly, relate to a sealed hoist mechanism and semiconductor equipment.
Background
In the domestic semiconductor trade, the sealed more complicated design of most motion at present stage, and present motion seals the promotion bracket mostly through the bellows, and the bellows both ends are all sealed through flange and sealing washer, and it receives the space restriction great, leads to motion's installation and dismantlement operation more difficult.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a sealed hoist mechanism and semiconductor device, its installation is dismantled simply, and sealing performance is good, also can adapt to different pressure situations.
The embodiment of the utility model is realized like this:
in a first aspect, the present invention provides a seal lifting mechanism, including:
the cavity is provided with an inner cavity and a first channel communicated with the inner cavity;
a lifting bracket movably disposed in the first channel, with one end of the lifting bracket disposed in the internal cavity and the other end disposed outside the first channel;
a first seal disposed at an end of the first channel proximate the interior chamber and abutting the lifting bracket to seal when the pressure in the interior chamber is greater than the external pressure; and (c) a second step of,
and the second sealing element is arranged at one end, far away from the inner chamber, in the first channel and is abutted against the lifting bracket so as to play a sealing role under the condition that the pressure of the inner chamber is less than the external pressure.
In an alternative embodiment, the first and second seals are both annular and both Y-shaped in cross-section.
In an alternative embodiment, the Y-shaped opening of the first seal faces the interior chamber and the Y-shaped opening of the second seal faces away from the interior chamber.
In an optional embodiment, a first receiving groove and a second receiving groove are formed in an inner wall of the first channel, the first receiving groove is disposed close to the inner chamber, a portion of the first sealing member is received in the first receiving groove, the second receiving groove is disposed away from the inner chamber, and a portion of the second sealing member is received in the second receiving groove.
In an optional embodiment, the number of the first sealing elements and the number of the first receiving grooves each include at least one, and at least one of the first sealing elements is received in at least one of the first receiving grooves in a one-to-one correspondence manner.
In an optional embodiment, the number of the second sealing elements and the number of the second receiving grooves each include at least one, and at least one of the second sealing elements is received in at least one of the second receiving grooves in a one-to-one correspondence manner.
In an alternative embodiment, the lifting bracket includes lifting columns disposed in the first passage and a tray disposed at an end of the lifting columns extending into the internal chamber, the tray being configured to carry wafers.
In an alternative embodiment, the lifting column is provided with a second passage, which communicates with the internal chamber.
In an alternative embodiment, the lifting column is cylindrical and both the first and second seals are provided around the lifting column.
In a second aspect, the present invention provides a semiconductor device comprising a seal lifting mechanism as described in any one of the previous embodiments.
The embodiment of the utility model provides a sealed hoist mechanism and semiconductor device's beneficial effect includes: first sealing member and second sealing member all set up in first passageway, and first sealing member is close to and towards inside cavity, and the inside cavity is kept away from and is dorsad to the second sealing member, reaches the sealed effect of multilayer through first sealing member and second sealing member, when improving sealed hoist mechanism's sealing performance, also is favorable to installing or dismantles first sealing member and second sealing member. In addition, play main sealed effect through first sealing member under the circumstances that interior cavity pressure is great, play main sealed effect through the second sealing member under the circumstances that external pressure is great to this adaptability that improves sealed hoist mechanism, play good sealed effect through first sealing member and second sealing member promptly.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention, and therefore should not be considered as limiting the scope, and that those skilled in the art can also obtain other related drawings based on these drawings without inventive efforts.
Fig. 1 is a schematic structural view of a seal lifting mechanism according to an embodiment of the present invention;
fig. 2 is a schematic diagram of a cross-sectional structure of a cavity provided by an embodiment of the present invention;
fig. 3 is a sectional view of the sealing and lifting mechanism provided by the embodiment of the present invention.
An icon: 10-a seal lifting mechanism; 100-a cavity; 110-an internal chamber; 120-a first channel; 121-a first receiving groove; 122-a second receiving groove; 200-lifting the carriage; 210-a lifting column; 211-a second channel; 220-a tray; 300-a first seal; 400-second seal.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. The components of the embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the invention, as presented in the figures, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate the position or positional relationship based on the position or positional relationship shown in the drawings, or the position or positional relationship which is usually placed when the product of the present invention is used, and are only for convenience of description and simplification of the description, but do not indicate or imply that the device or element referred to must have a specific position, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," "third," and the like are used solely to distinguish one from another and are not to be construed as indicating or implying relative importance.
Furthermore, the terms "horizontal", "vertical" and the like do not imply that the components are required to be absolutely horizontal or pendant, but rather may be slightly inclined. For example, "horizontal" merely means that the direction is more horizontal than "vertical" and does not mean that the structure must be perfectly horizontal, but may be slightly inclined.
In the description of the present invention, it should also be noted that, unless otherwise explicitly specified or limited, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood as a specific case by those skilled in the art.
The utility model provides a semiconductor equipment is applied to the semiconductor field. The semiconductor equipment comprises a sealing lifting mechanism, and the wafer can be coated in a vacuum environment through other mechanisms such as the sealing lifting mechanism and the like, and effective sealing is realized, so that the normal operation of a coating process is ensured.
It should be noted that the semiconductor device may be, but is not limited to, a photoresist stripping device, an etching device, a CVD device, a coating device, and the like, and is not limited herein.
Referring to fig. 1 to 3, the seal lifting mechanism 10 includes a chamber 100, a lifting bracket 200, a first sealing member 300, and a second sealing member 400.
Further, the chamber 100 is provided with an inner chamber 110 and a first passage 120 communicating with the inner chamber 110; the lifting bracket 200 is movably disposed in the first passage 120, and one end of the lifting bracket 200 is disposed in the inner chamber 110, and the other end is disposed outside the first passage 120.
In this embodiment, one end of the lifting bracket 200 passes through the first passage 120 into the inner chamber 110, and the other end passes through the first passage 120 and is disposed outside the end of the inner chamber 110. One end of the lifting bracket 200 extending into the inner chamber 110 is used for carrying the wafer, and one end of the lifting bracket 200 extending out of the first channel 120 and far away from the inner chamber 110 can make a reciprocating linear motion along the first channel 120 under the action of an external force, so as to lift the wafer or lower the wafer, thereby completing the related process of the wafer.
Specifically, the first channel 120 is vertically disposed at the very center of the bottom wall of the cavity 100.
Further, a first sealing member 300 is disposed in the first passage 120 near one end of the inner chamber 110 and abuts against the lifting bracket 200 to perform a sealing function in a case where the pressure of the inner chamber 110 is greater than the external pressure; the second seal 400 is disposed at an end of the first passage 120 remote from the inner chamber 110 and abuts against the lifting bracket 200 to seal when the pressure in the inner chamber 110 is lower than the external pressure.
In this embodiment, the first sealing element 300 and the second sealing element 400 are both disposed in the first passage 120, the first sealing element 300 is close to and faces the inner chamber 110, and the second sealing element 400 is far from and faces away from the inner chamber 110, so that the first sealing element 300 and the second sealing element 400 can achieve a multi-layer sealing effect, improve the sealing performance of the seal lifting mechanism 10, and facilitate the installation or the removal of the first sealing element 300 and the second sealing element 400.
In addition, the first sealing member 300 plays a main sealing role when the pressure in the inner chamber 110 is high, and the second sealing member 400 plays a main sealing role when the external pressure is high, so that the adaptability of the seal lifting mechanism 10 is improved, and the pressure conditions of the cavity 100 different from the external pressure can be adapted, in other words, no matter how the pressure inside and outside the cavity 100 is, a good sealing effect can be achieved through the first sealing member 300 and the second sealing member 400.
Further, the first and second seals 300 and 400 are both ring-shaped, and the first and second seals 300 and 400 are both Y-shaped in cross section.
In this embodiment, the first sealing element 300 and the second sealing element 400 can be Y-shaped sealing rings, and the Y-shaped sealing rings are selected as the first sealing element 300 and the second sealing element 400, so that the sealing performance of the first sealing element 300 and the second sealing element 400 is reliable, the applicable pressure range is wide, the structure is simple, the installation or the disassembly is convenient, and the stable movement of the bracket 200 is also facilitated.
Of course, it is understood that the cross-section of the first and second seals 300 and 400 may have other shapes, i.e. the first and second seals 300 and 400 may be other types of sealing rings, and are not limited thereto.
Further, the Y-shaped opening of the first seal 300 faces the direction of the inner chamber 110 in the extending direction of the first passage 120, and the Y-shaped opening of the second seal 400 faces away from the direction of the inner chamber 110 in the extending direction of the first passage 120.
In the present embodiment, the first sealing element 300 faces the inner chamber 110, so that the first sealing element 300 mainly seals the inner chamber 110, and the second sealing element 400 faces the direction opposite to the first sealing element 300, i.e. away from the inner chamber 110, so that the second sealing element 400 mainly seals the outside of the cavity 100, so that a good sealing effect can be achieved no matter the external pressure is greater than or less than the inner chamber 110, and the sealing performance and adaptability of the seal lifting mechanism 10 are improved significantly.
Further, a first receiving groove 121 and a second receiving groove 122 are disposed on an inner wall of the first channel 120, the first receiving groove 121 is disposed near the inner chamber 110, at least a portion of the first sealing element 300 is received in the first receiving groove 121, the second receiving groove 122 is disposed far from the inner chamber 110, and at least a portion of the second sealing element 400 is received in the second receiving groove 122.
In the present embodiment, the first receiving groove 121 and the second receiving groove 122 are both formed on the inner wall of the first channel 120 and are annular. By respectively disposing the first sealing element 300 and the second sealing element 400 in the first receiving groove 121 and the second receiving groove 122, the first sealing element 300 and the second sealing element 400 can be vertically limited, so as to prevent the lifting bracket 200 from dropping the first sealing element 300 and the second sealing element 400 to affect the sealing performance under the condition of reciprocating linear motion along the first channel 120.
In addition, the first sealing member 300 and the second sealing member 400 are respectively disposed in the first receiving groove 121 and the second receiving groove 122, which is beneficial to mounting or dismounting the first sealing member 300 and the second sealing member 400, so that the mounting or dismounting operation is simpler and more convenient.
Further, the number of the first sealing members 300 and the number of the first receiving grooves 121 both include at least one, and at least one of the first sealing members 300 is received in at least one of the first receiving grooves 121 in a one-to-one correspondence manner; the number of the second sealing members 400 and the number of the second receiving grooves 122 each include at least one, and at least one of the second sealing members 400 is received in at least one of the second receiving grooves 122 in a one-to-one correspondence manner.
In the present embodiment, by providing a plurality of first seals 300 and a plurality of second seals 400, the sealing performance and the adaptability of the seal lifting mechanism 10 can be significantly increased.
Optionally, the number of the first sealing members 300 and the number of the second sealing members 400 are both one, and the number of the first receiving grooves 121 and the number of the second receiving grooves 122 are both one.
It should be noted that the number of the first seals 300 and the number of the second seals 400 may be adjusted according to actual requirements, and the number of the first seals 300 and the number of the second seals 400 are not specifically limited herein.
Further, the lifting bracket 200 includes lifting columns 210 and a tray 220, the lifting columns 210 are disposed in the first passage 120, the tray 220 is disposed at an end of the lifting columns 210 extending into the inner chamber 110, and the tray 220 is used for carrying the wafer.
In the embodiment, the end of the lifting column 210 extending out of the first channel 120 can drive the tray 220 to ascend or descend under the driving force, so that the tray 220 drives the wafer carried on the tray 220 to ascend or descend, thereby completing the related processes of the wafer.
In particular, the lifting column 210 is provided with a second channel 211, the second channel 211 being in communication with the inner chamber 110.
Further, the lifting column 210 is cylindrical, and the first seal 300 and the second seal 400 are both disposed around the lifting column 210, so as to improve the contact tightness between the first seal 300 and the second seal 400, and thus improve the sealing performance of the first seal 300 and the second seal 400 when the lifting column 210 moves relative to the first seal 300 and the second seal 400.
To sum up, the utility model provides a sealed hoist mechanism 10 and semiconductor device, first sealing member 300 and second sealing member 400 all set up in first passageway 120, and first sealing member 300 is close to and towards inside cavity 110, and second sealing member 400 keeps away from and dorsad inside cavity 110, reaches the sealed effect of multilayer through first sealing member 300 and second sealing member 400, when improving sealed hoist mechanism 10's sealing performance, also is favorable to installing or dismantling first sealing member 300 and second sealing member 400. In addition, the first sealing member 300 plays a main sealing role when the pressure in the inner chamber 110 is high, and the second sealing member 400 plays a main sealing role when the external pressure is high, so that the adaptability of the seal lifting mechanism 10 is improved, and the pressure conditions of the cavity 100 different from the external pressure can be adapted, in other words, no matter how the pressure inside and outside the cavity 100 is, a good sealing effect can be achieved through the first sealing member 300 and the second sealing member 400.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (10)
1. A seal lifting mechanism, comprising:
the cavity is provided with an inner cavity and a first channel communicated with the inner cavity;
a lifting bracket movably disposed in the first channel, with one end of the lifting bracket disposed in the internal cavity and the other end disposed outside the first channel;
a first seal disposed at one end of the first channel proximate the interior chamber and abutting the lifting bracket to seal when the pressure in the interior chamber is greater than the external pressure; and (c) a second step of,
and the second sealing element is arranged at one end, far away from the internal chamber, in the first channel and is abutted against the lifting bracket so as to play a sealing role under the condition that the pressure of the internal chamber is smaller than the external pressure.
2. The seal lifting mechanism of claim 1, wherein the first seal and the second seal are each annular and the first seal and the second seal are each Y-shaped in cross-section.
3. The seal lifting mechanism of claim 2, wherein the Y-shaped opening of the first seal faces toward the interior chamber and the Y-shaped opening of the second seal faces away from the interior chamber.
4. The seal lifting mechanism of claim 1, wherein an inner wall of the first channel defines a first receiving slot and a second receiving slot, the first receiving slot being disposed proximate the interior chamber, the first seal portion being received within the first receiving slot, the second receiving slot being disposed distal the interior chamber, the second seal portion being received within the second receiving slot.
5. The seal lifting mechanism according to claim 4, wherein the number of the first sealing members and the number of the first receiving grooves each include at least one, and at least one of the first sealing members is received in at least one of the first receiving grooves in a one-to-one correspondence.
6. The seal lifting mechanism according to claim 4, wherein the number of the second sealing members and the number of the second receiving grooves each include at least one, and at least one of the second sealing members is received in at least one of the second receiving grooves in a one-to-one correspondence.
7. The seal lifting mechanism of claim 1, wherein the lifting bracket includes a lifting column disposed within the first channel and a tray disposed at an end of the lifting column extending into the internal chamber, the tray for carrying a wafer.
8. The seal lifting mechanism of claim 7, wherein the lifting ram is provided with a second passage, the second passage communicating with the interior chamber.
9. The seal lifting mechanism of claim 7, wherein the lifting ram is cylindrical and the first seal and the second seal are both disposed around the lifting ram.
10. A semiconductor device comprising the seal lifting mechanism according to any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222331014.4U CN217947541U (en) | 2022-08-31 | 2022-08-31 | Sealing lifting mechanism and semiconductor equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222331014.4U CN217947541U (en) | 2022-08-31 | 2022-08-31 | Sealing lifting mechanism and semiconductor equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217947541U true CN217947541U (en) | 2022-12-02 |
Family
ID=84212159
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222331014.4U Active CN217947541U (en) | 2022-08-31 | 2022-08-31 | Sealing lifting mechanism and semiconductor equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217947541U (en) |
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2022
- 2022-08-31 CN CN202222331014.4U patent/CN217947541U/en active Active
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| Date | Code | Title | Description |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 214028 No.1 Guanshan Road, Xinwu District, Wuxi City, Jiangsu Province Patentee after: Wuxi Yiwen Microelectronics Technology Co.,Ltd. Address before: 214028 No.1 Guanshan Road, Xinwu District, Wuxi City, Jiangsu Province Patentee before: WUXI YIWEN ELECTRONIC TECHNOLOGY Co.,Ltd. |
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| CP01 | Change in the name or title of a patent holder |