CN217944585U - Outer envelope structure and vacuum insulation panel - Google Patents

Outer envelope structure and vacuum insulation panel Download PDF

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CN217944585U
CN217944585U CN202220130960.XU CN202220130960U CN217944585U CN 217944585 U CN217944585 U CN 217944585U CN 202220130960 U CN202220130960 U CN 202220130960U CN 217944585 U CN217944585 U CN 217944585U
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layer structure
puncture
barrier
film
barrier layer
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高文锦
戴竟成
赵阳
徐祺
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Shanghai Relief Printing Co ltd
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Shanghai Relief Printing Co ltd
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    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02A—TECHNOLOGIES FOR ADAPTATION TO CLIMATE CHANGE
    • Y02A30/00—Adapting or protecting infrastructure or their operation
    • Y02A30/24—Structural elements or technologies for improving thermal insulation
    • Y02A30/242—Slab shaped vacuum insulation
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
    • Y02B80/00—Architectural or constructional elements improving the thermal performance of buildings
    • Y02B80/10—Insulation, e.g. vacuum or aerogel insulation

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Abstract

The application discloses outer envelope structure and vacuum insulation panel, outer envelope structure includes: the first barrier layer structure, the second barrier layer structure, the puncture-proof layer structure and the sealing layer structure; the second barrier layer structure is arranged between the first barrier layer structure and the anti-puncture layer structure, and the sealing layer structure is arranged between the anti-puncture layer structure and a to-be-packaged object; the second barrier layer structure is an aluminum plating silicon oxide dimethyl terephthalate film layer structure, or an aluminum plating aluminum oxide dimethyl terephthalate film layer structure. The vacuum insulation panel comprises the outer wrapping film structure. The outer envelope structure of this application can effectively prevent the condition such as fracture, tear, crackle that inside puncture, external impact or folding and take place. This second keeps off layer structure with prevent the cooperation of puncture layer structure under, compare prior art and promoted the puncture-resistant intensity of outer envelope structure, effectively replaced by the VMEVOH layer structure of foreign monopoly.

Description

Outer envelope structure and vacuum insulation panels
Technical Field
The application belongs to the technical field of membrane structure, concretely relates to outer membrane structure and vacuum insulation panels.
Background
The vacuum insulation panel is made of glass fiber, and the like, and during the manufacturing process of the vacuum insulation panel, the glass fiber and the like are wrapped by an outer wrapping film, and then the vacuum is pumped to shrink the glass fiber and the glass fiber into a plate. Therefore, the outer film needs to be resistant to cracking, tearing, and cracking due to internal puncture, external impact, or folding. In addition, the processed vacuum insulation panel is generally applied to an insulation wall of a refrigerator, and therefore, the outer film is required to have characteristics of heat insulation, moisture resistance, and moisture resistance. The outer film structure in the prior art often has an aluminum-plated ethylene-vinyl alcohol copolymer (VMEVOH) layer structure and a polyvinylidene chloride film (PVDC) layer structure, and the VMEVOH layer structure has the situation of monopoly in foreign countries, inconvenient purchase, delayed delivery and higher cost; the PVDC layer structure is not environment-friendly and can bring damage to the environment.
Therefore, it is desirable to design an outer wrapping film structure to improve the condition of the "neck" of a foreign country.
SUMMERY OF THE UTILITY MODEL
In view of the above-mentioned shortcomings or drawbacks of the prior art, the present application provides an outer envelope structure and a vacuum insulation panel.
In order to solve the technical problem, the application is realized by the following technical scheme:
one aspect of the present application provides an overwrap film structure, comprising: the first barrier layer structure, the second barrier layer structure, the puncture-proof layer structure and the sealing layer structure; the second barrier layer structure is arranged between the first barrier layer structure and the anti-puncture layer structure, and the sealing layer structure is arranged between the anti-puncture layer structure and a to-be-packaged object; the second barrier layer structure is an aluminum plating silicon oxide dimethyl terephthalate film layer structure, or an aluminum plating aluminum oxide dimethyl terephthalate film layer structure.
Further, in the above outer wrapping film structure, the first barrier layer structure and the second barrier layer structure are connected by a first adhesive layer structure.
Further, in the above outer wrapping film structure, the second barrier layer structure and the puncture-proof layer structure are connected by a second adhesive layer structure.
Further, in the above outer wrapping film structure, the puncture-preventing layer structure and the sealing layer structure are connected by a third adhesive layer structure.
Further, the above outer film structure, wherein the first adhesive layer structure, the second adhesive layer structure and/or the third adhesive layer structure is made of polyurethane adhesive.
Further, the above outer clad film structure, wherein the first barrier layer structure comprises: and a silicon-plated polyethylene terephthalate film layer structure.
Further, the above outer wrapping film structure, wherein the penetration preventing layer structure comprises: co-extruded polyamide film layer structures.
Further, the overwrap structure described above, wherein said seal layer structure comprises: a linear low density polyethylene film layer structure.
The application also provides a vacuum insulation panel, which comprises the outer wrapping film structure.
Compared with the prior art, the method has the following technical effects:
in this application, the second keeps off layer structure and sets up between first keep off layer structure and the puncture-proof layer structure, and the involution layer structure sets up in puncture-proof layer structure and treats between the packing material. Through the arrangement, the outer wrapping film structure can effectively prevent the conditions of breakage, tearing, cracks and the like caused by internal puncture, external impact or folding. The second barrier layer structure is an aluminum plating silicon oxide dimethyl terephthalate film layer structure, or an aluminum plating aluminum oxide dimethyl terephthalate film layer structure. This second keeps off layer structure with the cooperation of preventing the puncture layer structure down, compares prior art and has promoted the puncture-resistant intensity of outer envelope structure, has effectively replaced the VMEVOH layer structure that is monopolized by the foreign country.
Drawings
Other features, objects and advantages of the present application will become more apparent upon reading of the detailed description of non-limiting embodiments made with reference to the following drawings:
FIG. 1: a schematic view of an overwrap film structure in an embodiment of the present application;
in the figure: the first barrier layer structure 1, the second barrier layer structure 2, the puncture-proof layer structure 3, the sealing layer structure 4, the first bonding layer structure 5, the second bonding layer structure 6 and the third bonding layer structure 7.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments obtained by a person of ordinary skill in the art based on the embodiments in the present application without making any creative effort belong to the protection scope of the present application.
As shown in FIG. 1, one embodiment of the present application, an overwrap film structure, comprises: the device comprises a first barrier layer structure 1, a second barrier layer structure 2, a puncture-proof layer structure 3 and a sealing layer structure 4; the second barrier layer structure 2 is arranged between the first barrier layer structure 1 and the anti-puncture layer structure 3, and the sealing layer structure 4 is arranged between the anti-puncture layer structure 3 and a to-be-packaged object; the second barrier layer structure 2 is an aluminized and silicon oxide-plated dimethyl terephthalate film layer structure, or an aluminized and aluminum oxide-plated dimethyl terephthalate film layer structure.
In this embodiment, the second barrier layer structure 2 is arranged between the first barrier layer structure 1 and the puncture-proof layer structure 3, and the sealing layer structure 4 is arranged between the puncture-proof layer structure 3 and the object to be packed. Through the arrangement, the outer wrapping film structure can effectively prevent the conditions of cracking, tearing, cracking and the like caused by internal puncture, external impact or folding. The second barrier layer structure 2 is an aluminum-plated silicon oxide and dimethyl terephthalate film layer structure, or an aluminum-plated aluminum oxide and dimethyl terephthalate film layer structure. This second keeps off layer structure 2 under with the cooperation of preventing puncture layer structure 3, compares prior art and has promoted the puncture-resistant intensity of outer envelope structure, has effectively replaced the VMEVOH layer structure that is monopolized by the foreign country.
Specifically, the first barrier layer structure 1 and the second barrier layer structure 2 are connected by a first adhesive layer structure 5 to enhance the firmness of the connection between the first barrier layer structure 1 and the second barrier layer structure 2.
Specifically, the second barrier layer structure 2 and the puncture-proof layer structure 3 are connected by the second adhesive layer structure 6, so as to enhance the firmness of the connection between the second barrier layer structure 2 and the puncture-proof layer structure 3.
In particular, the puncture-proof layer structure 3 is connected to the sealing layer structure 4 by a third adhesive layer structure 7, so as to enhance the firmness of the connection between the puncture-proof layer structure 3 and the sealing layer structure 4.
Optionally, the first adhesive layer structure 5, the second adhesive layer structure 6 and/or the third adhesive layer structure 7 employ a polyurethane based adhesive.
In particular, the first barrier layer structure 1 includes, but is not limited to, a silicon-plated polyethylene terephthalate (GX) layer structure to improve the barrier property of the outer wrapping film structure.
In particular, the puncture-resistant layer structure 3 includes, but is not limited to, a co-extruded polyamide film layer structure to further enhance the barrier property of the outer film structure.
In particular, the sealing layer structure 4 includes, but is not limited to, a linear low density polyethylene film (LLDPE) layer structure for contact with the package to be packaged.
The outer envelope structure specifically formed in this embodiment is a seven-layer structure, specifically: the multilayer film comprises a GX layer structure, a first bonding layer structure 5, an aluminized silicon oxide-plated polyethylene terephthalate film layer structure, a second bonding layer structure 6, a co-extruded polyamide film layer structure, a third bonding layer structure 7 and an LLDPE layer structure; or the following steps: the multilayer film comprises a GX layer structure, a first bonding layer structure 5, an aluminum-plated aluminum oxide-plated dimethyl terephthalate film layer structure, a second bonding layer structure 6, a co-extruded polyamide film layer structure, a third bonding layer structure 7 and an LLDPE layer structure. The performance index of the outer wrap film structure of this example is further explained by experimental data below.
Figure BDA0003475516450000041
Figure BDA0003475516450000051
Wherein, the structure of the existing product in the above table is a seven-layer structure, specifically: GX layer structure, adhesive layer structure, biaxially oriented polyamide film (NY) layer structure, adhesive layer structure, VMEVOH layer structure, adhesive layer structure, and LLDPE layer structure.
Comparing this embodiment with the existing product, it can be seen from the above table that in the test items, the puncture strength, tensile strength and sealing strength of the outer film structure of this embodiment are all improved, and other test items achieve substantially the same effect as the existing product, and do not adopt the VMEVOH layer structure monopolized in the market, so that the cost is reduced by 10%.
In addition, in the research and development process, the structure of the first comparative example is also developed, and the structure is a seven-layer structure, specifically: the multilayer film comprises a GX layer structure, an adhesive layer structure, an aluminized silicon oxide-plated dimethyl terephthalate film layer structure, an adhesive layer structure, an NY layer structure, an adhesive layer structure and an LLDPE layer structure; or the following steps: GX layer structure, bonding layer structure, aluminized aluminum oxide-plated dimethyl terephthalate film layer structure, bonding layer structure, NY layer structure, bonding layer structure and LLDPE layer structure.
The first comparative example, which employs an NY layer structure and the present example employs a co-extruded polyamide film layer structure, is inferior to the outer film structure of the present example in puncture strength and sealing strength, as can be seen from the test items in the table above.
The application also provides a vacuum insulation panel which comprises the outer wrapping film structure.
The structure of the outer coating film is described above, and is not described in detail here.
In this application, second barrier layer structure 2 sets up between first barrier layer structure 1 and puncture-proof layer structure 3, and involution layer structure 4 sets up between puncture-proof layer structure 3 and treating the packing material. Through the arrangement, the outer wrapping film structure can effectively prevent the conditions of breakage, tearing, cracks and the like caused by internal puncture, external impact or folding. The second barrier layer structure 2 is an aluminum plating silicon oxide dimethyl terephthalate film layer structure, or an aluminum plating aluminum oxide dimethyl terephthalate film layer structure. This second keeps off layer structure 2 under with the cooperation of preventing puncture layer structure 3, compares prior art and has promoted the puncture-resistant intensity of outer envelope structure, has effectively replaced the VMEVOH layer structure that is monopolized by the foreign country.
In the description of the present application, unless expressly stated or limited otherwise, the terms "connected," "connected," and "fixed" are to be construed broadly and include, for example, fixedly connected, detachably connected, or integral to one another; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or may be connected through the use of two elements or the interaction of two elements. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.
In this application, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise direct contact of the first and second features, or may comprise contact of the first and second features not directly but through another feature in between. Also, the first feature "on," "above" and "over" the second feature may include the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.
In the description of the present embodiment, the terms "upper", "lower", "left", "right", and the like are used based on the orientations and positional relationships shown in the drawings only for convenience of description and simplification of operation, and do not indicate or imply that the referred device or element must have a specific orientation, be configured and operated in a specific orientation, and thus, should not be construed as limiting the present application. Furthermore, the terms "first" and "second" are used only for descriptive purposes and are not intended to have a special meaning.
The above embodiments are merely to illustrate the technical solutions of the present application and are not limitative, and the present application is described in detail with reference to preferred embodiments. It should be understood by those skilled in the art that various changes may be made and equivalents may be substituted for elements thereof without departing from the true spirit and scope of the claims which follow.

Claims (8)

1. An overwrap structure, comprising:
the first barrier layer structure, the second barrier layer structure, the puncture-proof layer structure and the sealing layer structure; the second barrier layer structure is arranged between the first barrier layer structure and the anti-puncture layer structure, and the sealing layer structure is arranged between the anti-puncture layer structure and a to-be-packaged object;
the second barrier layer structure is an aluminum plating silicon oxide dimethyl terephthalate film layer structure, or an aluminum plating aluminum oxide dimethyl terephthalate film layer structure; the puncture-proof layer structure is a co-extrusion polyamide film layer structure.
2. The overwrap structure according to claim 1, wherein said first barrier structure and said second barrier structure are connected by a first adhesive layer structure.
3. The overwrap film structure according to claim 2, wherein said second barrier structure and said penetration-resistant layer structure are connected by a second adhesive layer structure.
4. The overwrap structure according to claim 3, wherein said puncture resistant layer structure and said closure layer structure are joined by a third adhesive layer structure.
5. The overwrap structure according to claim 4, wherein said first adhesive layer structure, said second adhesive layer structure, and/or said third adhesive layer structure employs a polyurethane-based adhesive.
6. The overwrap film structure according to any one of claims 1 to 5, wherein said first barrier structure comprises: and a silicon-plated polyethylene terephthalate film layer structure.
7. The outer envelope structure of any one of claims 1 to 5, wherein the sealing layer structure comprises: a linear low density polyethylene film layer structure.
8. A vacuum insulation panel comprising an overwrap construction according to any of claims 1 to 7.
CN202220130960.XU 2022-01-18 2022-01-18 Outer envelope structure and vacuum insulation panel Active CN217944585U (en)

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