CN217942962U

CN217942962U - Chuck structure for wafer polishing

Info

Publication number: CN217942962U
Application number: CN202222132923.5U
Authority: CN
Inventors: 李文明; 龙科
Original assignee: Shenzhen Zhiyuan Precision Equipment Co ltd
Current assignee: Shenzhen Zhiyuan Precision Equipment Co ltd
Priority date: 2022-08-12
Filing date: 2022-08-12
Publication date: 2022-12-02
Anticipated expiration: 2032-08-12

Abstract

The utility model discloses a chuck structure for wafer polishing relates to wafer processing equipment technical field. The novel portable air conditioner comprises a tray body, wherein a silicon rubber film is arranged on the surface of the tray body, metal ferrules are arranged around the silicon rubber film, clamping grooves are formed in the edge of the tray body, a positioning bolt is arranged on the lower surface of the tray body, an annular cavity is formed in the tray body, a strip-shaped cavity is formed at the lower end of the annular cavity, a plug is clamped at the opening of the strip-shaped cavity, an air suction opening is formed in the middle of the tray body, a groove is formed in the upper surface of the tray body, four annular cavities are formed in the annular cavity, and the four annular cavities and the tray body are arranged in the same circle center; through setting up the disk body that has the pellosil, utilize pellosil deformation to produce adsorption when adsorbing fixed operation, avoid polishing solution and its polishing piece inevitable to remain on wafer adsorption chuck, the crystallization pollutes the chuck to avoid the seal of a government organization in old china defect, improve the wafer quality.

Description

Chuck structure for wafer polishing

Technical Field

The utility model relates to a wafer processing equipment technical field specifically is a chuck structure for wafer polishing.

Background

The wafer refers to a silicon wafer used for manufacturing a silicon semiconductor integrated circuit, and is called a wafer because the shape is circular; various circuit device structures can be fabricated on a silicon wafer to form an IC product with specific electrical functions. The starting material for the wafer is silicon, while the crust surface has an inexhaustible amount of silicon dioxide.

In the prior art, in the polishing process of a wafer, a special polishing solution is required to be used for assisting in processing to achieve the effect of grinding and polishing, but in the polishing process, for example, a wafer polishing pad and a wafer polishing device with the publication number of CN201922292239.1, a fixed plate and a clamping component are used for clamping a polishing component, a movable component rotates under the action of an external driving motor and enables the fixed polishing component to rotate together, and the top end of a groove of the polishing component rotating at a high speed is used for polishing the wafer. The polishing solution and polishing debris thereof inevitably remain on the wafer adsorption chuck, the wafer adsorption chuck is polluted by crystals, and imprinting defects can occur on the adsorption surface in the wafer adsorption process.

SUMMERY OF THE UTILITY MODEL

The utility model provides a chuck structure for wafer polishing possesses the advantage that prevents the crystallization pollution to solve the problem that the chuck pollutes.

In order to achieve the above object, the utility model provides a following technical scheme: a chuck structure for polishing a wafer comprises a chuck body, wherein a silicon membrane is arranged on the surface of the chuck body, and a metal ferrule is arranged around the silicon membrane;

the edge of the tray body is provided with a clamping groove, the lower surface of the tray body is provided with a positioning bolt, an annular cavity is arranged inside the tray body, the lower end of the annular cavity is provided with a bar-shaped cavity, the opening of the bar-shaped cavity is connected with a plug in a clamping manner, an air suction opening is formed in the middle of the tray body, and a groove is formed in the upper surface of the tray body.

Furthermore, the annular cavities are four in number, the four annular cavities and the disc body are arranged concentrically, and the upper ends of the annular cavities are communicated with the grooves.

Furthermore, the strip-shaped cavities are arranged around the air suction opening in a radial mode, and one ends, far away from the air suction opening, of the strip-shaped cavities are opened on the side face of the plate body.

Further, the pellosil is attached on the disk body upper surface, the edge of pellosil extends to the disk body side and fixes inside the draw-in groove through the ferrule joint.

Furthermore, the positioning bolts are uniformly arranged at the bottom of the tray body at equal intervals.

Compared with the prior art, the utility model provides a wafer is chuck structure for polishing possesses following beneficial effect:

this chuck structure for wafer polishing through setting up the disk body that has the pellosil, utilizes pellosil deformation to produce the adsorption effect when adsorbing fixed operation, avoids polishing solution and its polishing piece inevitable to remain on wafer adsorption chuck, and the crystallization pollutes the chuck to avoid the seal of a government organization in old china defect, improve the wafer quality.

Drawings

FIG. 1 is a schematic view of the non-wafer state structure of the present invention;

fig. 2 is a schematic structural view of the release state of the present invention;

FIG. 3 is a schematic view of the structure of the adsorption state of the present invention;

fig. 4 is a cross-sectional view of the present invention;

fig. 5 is a partially enlarged view of a portion a in fig. 1.

In the figure: 1. a tray body; 11. a card slot; 12. positioning bolts; 13. an annular cavity; 14. a strip-shaped cavity; 15. a plug; 16. an air suction opening; 17. a groove; 2. a silicone membrane; 3. a metal ferrule.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts all belong to the protection scope of the present invention.

Referring to fig. 1-5, the utility model discloses a chuck structure for wafer polishing, which comprises a disk body 1, wherein a silicon membrane 2 is arranged on the surface of the disk body 1, and a metal ferrule 3 is arranged around the silicon membrane 2;

the edge of the tray body 1 is provided with a clamping groove 11, the lower surface of the tray body 1 is provided with a positioning bolt 12, an annular cavity 13 is arranged inside the tray body 1, the lower end of the annular cavity 13 is provided with a bar-shaped cavity 14, an opening of the bar-shaped cavity 14 is clamped with a plug 15, the middle of the tray body 1 is provided with an air suction opening 16, and the upper surface of the tray body 1 is provided with a groove 17.

Specifically, the annular cavities 13 are four in number, the four annular cavities 13 are arranged concentrically with the disc body 1, and the upper ends of the annular cavities 13 are communicated with the grooves 17.

In this embodiment, four annular cavities 13 and recess 17 intercommunication, when using, annular cavity 13 provides the negative pressure to in the recess 17, sets up the annular cavity 13 of four concentric circles structures, improves recess 17's adsorption effect.

Specifically, the strip-shaped cavity 14 is radially arranged around the air suction opening 16, and one end of the strip-shaped cavity 14, which is far away from the air suction opening 16, is opened on the side surface of the tray body 1.

In this embodiment, the strip-shaped cavity 14 arranged in a radial shape communicates the air suction opening 16 with the annular cavity 13, so that the vacuum-pumping efficiency is improved.

Specifically, pellosil 2 is attached on 1 upper surface of disk body, the edge of pellosil 2 extends to 1 side of disk body and fixes inside draw-in groove 11 through 3 joint of metal lasso.

In this embodiment, pellosil 2 uses as the replacement when disk body 1 uses, fixes on disk body 1 surface through ferrule 3, makes things convenient for the dismouting to replace.

Specifically, the positioning bolts 12 are uniformly arranged at the bottom of the tray body 1 at equal intervals.

In this embodiment, the positioning bolts 12 are used for connecting the tray body 1 with lower-level equipment, and the positioning bolts 12 uniformly arranged at equal intervals improve the stability of fixing the tray body 1.

When the polishing device is used, the plate body 1 is fixed on polishing equipment through the positioning bolt 12, the air suction opening 16 is connected with an air suction structure of lower-level equipment, the surface of the plate body 1 is covered with the silicon membrane 2, the edge of the silicon membrane 2 is fixed in the clamping groove 11 through the metal ferrule 3, the silicon membrane 2 is erected above the groove 17, the plug 15 is plugged into an opening of the strip-shaped cavity 14 to form sealing, a wafer is placed above the plate body 1, air is sucked to the outside of the device through the air suction opening 16, the silicon membrane 2 is deformed and attached to the inner wall of the groove 17, negative pressure is generated between the silicon membrane 2 and the wafer, adsorption is formed, and vice versa when the wafer is detached.

In summary, according to the chuck structure for wafer polishing, the body 1 with the silicone membrane 2 is arranged, so that the silicone membrane 2 is deformed to generate an adsorption effect during an adsorption fixing operation, and the inevitable residue of polishing solution and polishing debris on the wafer adsorption chuck and the pollution of crystallization on the chuck are avoided, thereby avoiding the imprinting defect and improving the wafer quality.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a chuck structure for wafer polishing, includes disk body (1), its characterized in that: a silicon membrane (2) is arranged on the surface of the tray body (1), and a metal ferrule (3) is arranged around the silicon membrane (2);

draw-in groove (11) have been seted up at the edge of disk body (1), the lower surface of disk body (1) is provided with pilot pin (12), the inside of disk body (1) is provided with annular cavity (13), the lower extreme of annular cavity (13) is provided with bar cavity (14), the opening part joint of bar cavity (14) has end cap (15), suction opening (16) have been seted up to the centre of disk body (1), the upper surface of disk body (1) is seted up flutedly (17).

2. The structure of claim 1, wherein: the annular cavities (13) are four, the four annular cavities (13) are arranged concentrically with the disc body (1), and the upper ends of the annular cavities (13) are communicated with the grooves (17).

3. The structure of claim 1, wherein: the strip-shaped cavity (14) is arranged around the air suction opening (16) in a radial shape, and one end, far away from the air suction opening (16), of the strip-shaped cavity (14) is opened on the side face of the tray body (1).

4. The wafer polishing chuck structure according to claim 1, wherein: the silicon rubber membrane (2) is attached to the upper surface of the tray body (1), and the edge of the silicon rubber membrane (2) extends to the side face of the tray body (1) and is clamped and fixed inside the clamping groove (11) through the metal ferrule (3).

5. The wafer polishing chuck structure according to claim 1, wherein: the positioning bolts (12) are uniformly arranged at the bottom of the tray body (1) at equal intervals.