CN217916172U

CN217916172U - High-precision cutting equipment for semiconductor materials

Info

Publication number: CN217916172U
Application number: CN202221445611.3U
Authority: CN
Inventors: 陈叶清; 徐春平
Original assignee: Jiangyin Unitop Technology Co ltd
Current assignee: Jiangyin Unitop Technology Co ltd
Priority date: 2022-06-10
Filing date: 2022-06-10
Publication date: 2022-11-29
Anticipated expiration: 2032-06-10

Abstract

The utility model discloses a semiconductor material's high accuracy cutting equipment, the on-line screen storage device comprises a base, the upper end fixedly connected with box of base, the bottom fixedly connected with operation panel of box, one side of operation panel is provided with the second motor, the output end fixedly connected with second threaded rod of second motor, one side that the operation panel was passed to the one end of second threaded rod extends to inside, the inside symmetry of operation panel is provided with the slide bar, the slider has been cup jointed to the outside of slide bar, the third thread piece has been cup jointed to the outside of second threaded rod, the upper end fixedly connected with cutting bed of slider and third thread piece, the utility model relates to a cutting device technical field mainly utilizes the hold-in range to fix semiconductor material, and semiconductor material hold-in range also rotates simultaneously when removing, makes semiconductor material remain stable throughout, and guarantee cutting device can cut steadily, accurately.

Description

High-precision cutting equipment for semiconductor materials

Technical Field

The utility model relates to a cutting device technical field specifically is semiconductor material's high accuracy cutting equipment.

Background

Semiconductor materials are a class of electronic materials having semiconductor properties that can be used to fabricate semiconductor devices and integrated circuits, and natural substances and materials can be classified into three categories, namely conductors, semiconductors and insulators according to the magnitude of their conductive capabilities.

The existing semiconductor material cutting device has certain defects when being used, adopts the fixing block to fix the semiconductor material when fixing the semiconductor material, easily damages the semiconductor material when fixing, and is inconvenient to move and troublesome after use.

The applicant is applying the utility model discloses a, through the retrieval, discover chinese patent and disclose a "semiconductor precision cutting equipment", its application number is "202021314694.3", this patent is mainly through the sliding connection between second U type mounting panel and the first mounting groove, the elasticity of first spring, sliding connection between suppression pole and the third U type mounting panel, the elasticity of second spring, first touch switch respectively with the electric connection of the first servo motor that corresponds, the second touch switch respectively with the electric connection of the second servo motor that corresponds, make clamping force reach the standard after, second U type mounting panel and suppression pole can touch first touch switch and second touch switch respectively, thereby control first servo motor and second servo motor stop to continue to exert clamping force, avoid clamping force too big to cause the damage to the material, the utility model discloses a set up the hold-in range and fix semiconductor material, hold-in range and semiconductor material are mutually supported, semiconductor material rotates along with semiconductor material when being promoted by the cutting bed, thereby hold-in range is fixed to the cutting before the semiconductor material accomplishes cutting, utilize the pliability of hold-in range to protect effectively to take place the extrusion.

Therefore, the utility model provides a semiconductor material's high accuracy cutting equipment to solve above-mentioned problem.

SUMMERY OF THE UTILITY MODEL

Not enough to prior art, the utility model provides a semiconductor material's high accuracy cutting equipment has solved above-mentioned problem.

In order to achieve the above purpose, the utility model discloses a following technical scheme realizes: the high-precision cutting equipment for the semiconductor materials comprises a base, wherein a box body is fixedly connected to the upper end of the base, an operation table is fixedly connected to the bottom of the box body, a second motor is arranged on one side of the operation table, a second threaded rod is fixedly connected to the output end of the second motor, one end of the second threaded rod penetrates through one side of the operation table and extends to the inside of the operation table, slide rods are symmetrically arranged inside the operation table, a slide block is sleeved outside the slide rods, a third threaded block is sleeved outside the second threaded rod, and a cutting table is fixedly connected to the upper ends of the slide block and the third threaded block;

the bottom of operation panel is provided with two-way motor, two-way motor be output fixedly connected with pivot, the one end fixedly connected with second bevel gear of pivot, the inside symmetry of operation panel is provided with a plurality of third threaded rod, the second screw thread piece has been cup jointed to the outside of third threaded rod, the first bevel gear of outside fixedly connected with of third threaded rod, one side fixedly connected with bracing piece of second screw thread piece, the upper end fixedly connected with montant of bracing piece, one side fixedly connected with diaphragm of montant, the lower extreme symmetry fixedly connected with second riser of diaphragm, the lateral wall of second riser is provided with the band pulley, the lateral wall of band pulley rotates with the lateral wall of second riser to be connected, the hold-in range has been cup jointed to the outside of band pulley.

Preferably, the first riser of upper end symmetry fixedly connected with of box, the first motor of one side fixedly connected with of first riser, the first threaded rod of output fixedly connected with of first motor, the outside symmetry of first threaded rod is provided with first screw piece.

Preferably, the lateral wall fixedly connected with first gag lever post of first riser, first stopper has been cup jointed to the outside symmetry of first gag lever post, one side of first stopper and the upper end fixed connection of first thread piece.

Preferably, the lower end of the first thread block is fixedly connected with a support frame, the lower end of the support frame is symmetrically and fixedly connected with a hydraulic rod, the output end of the hydraulic rod is fixedly connected with a support plate, and the upper end of the support plate is provided with a cutting device.

Preferably, a plurality of second limiting rods are symmetrically arranged inside the operating platform, second limiting blocks are sleeved outside the second limiting rods, and one sides of the second limiting blocks are fixedly connected with one sides of the second thread blocks.

Preferably, a box door is arranged on one side of the box body, a window is arranged on one side of the box door, and a handle is fixedly connected to one side of the box door.

Preferably, the four corners of the lower end of the base are fixedly connected with supporting legs, and the first bevel gear is meshed with the second bevel gear.

Preferably, one side of the third thread block is fixedly connected with a connecting rod, and one end of the connecting rod is fixedly connected with one side of the sliding block.

Advantageous effects

The utility model provides a semiconductor material's high accuracy cutting equipment. Compared with the prior art, the method has the following beneficial effects:

(1) The utility model discloses a set up hold-in range, band pulley and second riser, utilize the lower extreme of hold-in range to suppress semiconductor material, semiconductor material removes with the hold-in range together, is convenient for fix semiconductor material, and the cutting device of being convenient for cuts, causes semiconductor material's damage when avoiding adopting the fixed block to fix.

(2) The utility model discloses a set up third screw thread piece, second threaded rod and slide bar, utilize third screw thread piece to drive the cutting bed under the drive of second threaded rod and remove, utilize the cutting bed to utilize cutting device to cut semiconductor material when removing, can ensure under the cooperation of hold-in range moreover that semiconductor material can not take place the skew in the cutting.

Drawings

Fig. 1 is a perspective view of the present invention;

fig. 2 is a cross-sectional view of the present invention;

fig. 3 is a half sectional view of the present invention;

fig. 4 is an enlarged view of a portion a in fig. 2 according to the present invention.

FIG. 1, base; 2. a box body; 3. a slider; 4. a vertical rod; 5. supporting legs; 6. a support plate; 7. a support frame; 8. a first vertical plate; 9. a first limit rod; 10. a first stopper; 11. a first thread block; 12. a first threaded rod; 13. a first motor; 14. a hydraulic rod; 15. a cutting device; 16. a transverse plate; 17. a second vertical plate; 18. a synchronous belt; 19. a slide bar; 20. cutting table; 21. a second threaded rod; 22. a connecting rod; 23. a box door; 24. a window; 25. a handle; 26. a pulley; 27. a third threaded rod; 28. a second screw block; 29. a first bevel gear; 30. a second bevel gear; 31. a rotating shaft; 32. a bi-directional motor; 33. a second motor; 34. a support bar; 35. a second limiting block; 36. a second limiting rod; 37. an operation table; 38. and a third thread block.

Detailed Description

Referring to fig. 1-4, the high-precision cutting equipment for semiconductor materials includes a base 1, a box 2 is fixedly connected to the upper end of the base 1, an operation table 37 is fixedly connected to the bottom of the box 2, a second motor 33 is arranged on one side of the operation table 37 and used for driving a second threaded rod 21 to rotate, an output end of the second motor 33 is fixedly connected with the second threaded rod 21, and a third threaded block 38 is driven to move under the cooperation of a sliding rod 19 and a sliding block 3, so as to drive a cutting table 20 to move, one end of the second threaded rod 21 penetrates through one side of the operation table 37 and extends to the inside, sliding rods 19 are symmetrically arranged inside the operation table 37, the sliding block 3 is sleeved outside the sliding rod 19, the third threaded block 38 is sleeved outside the second threaded rod 21, the upper ends of the sliding block 3 and the third threaded block 38 are fixedly connected with the cutting table 20, and the cutting table 20 is used for placing semiconductor materials;

the bottom of the operating table 37 is provided with a bidirectional motor 32, the bottom of the operating table 37 is symmetrically provided with the bidirectional motors 32 in pairs, the bidirectional motor 32 is provided with a rotating shaft 31 fixedly connected with an output end, one end of the rotating shaft 31 is fixedly connected with a second bevel gear 30, the operating table 37 is symmetrically provided with a plurality of third threaded rods 27 inside, second threaded blocks 28 are sleeved outside the third threaded rods 27, first bevel gears 29 are fixedly connected outside the third threaded rods 27, the rotating shaft 31 is used for driving the second bevel gears 30 and the first bevel gears 29 to rotate and driving the second threaded blocks 28 to move, so that the height of the synchronous belt 18 can be adjusted, semiconductor materials with different thicknesses can be fixed, one side of each second threaded block 28 is fixedly connected with a supporting rod 34, the upper end of the supporting rod 34 is fixedly connected with a vertical rod 4, one side of the vertical rod 4 is fixedly connected with a transverse plate 16, the lower end of the transverse plate 16 is symmetrically and fixedly connected with a second vertical plate 17, the side wall of the second vertical plate 17 is provided with a belt wheel 26, the side wall of the belt 26 is rotatably connected with the side wall of the second vertical plate 17, the outer side wall of the belt 26 is sleeved with the synchronous belt 18, the synchronous belt 18 is used for rotating and for protecting the semiconductor materials when the semiconductor materials are moved, the semiconductor materials are fixed when the semiconductor materials are cut, the semiconductor materials are protected, and the semiconductor materials are stably, and the semiconductor material cutting device is convenient for cutting device for cutting, and the semiconductor materials, and the cutting device is convenient for cutting.

The upper end of the box body 2 is symmetrically and fixedly connected with a first vertical plate 8, one side of the first vertical plate 8 is fixedly connected with a first motor 13, is used for driving the first thread block 11 to drive the cutting device 15 to move under the coordination of the first limiting rod 9, the output end of the first motor 13 is fixedly connected with a first threaded rod 12, the first thread block 11 is symmetrically arranged outside the first threaded rod 12, the side wall of the first vertical plate 8 is fixedly connected with the first limiting rod 9, the first limiting block 10 is symmetrically sleeved outside the first limiting rod 9, the support device is used for limiting a first thread block 11, and ensures that the first thread block 11 can move outside a first threaded rod 12, one side of a first limiting block 10 is fixedly connected with the upper end of the first thread block 11, the lower end of the first thread block 11 is fixedly connected with a support frame 7, lower end symmetrical and fixedly connected with hydraulic rods 14 of the support frame 7, the two hydraulic rods 14 move simultaneously, the two hydraulic rods 14 enable a cutting device 15 to keep stable in the descending process, the inclination is avoided, an output end fixedly connected with support plate 6 of the hydraulic rods 14, the upper end of the support plate 6 is provided with the cutting device 15, a plurality of second limiting rods 36 are symmetrically arranged inside an operation table 37, a second limiting block 35 is sleeved outside the second limiting rod 36, one side of the second limiting block 35 is fixedly connected with one side of a second thread block 28, a box door 23 is arranged on one side of a box body 2, a window 24 is arranged on one side of the box door 23, one side of the box door 23 is fixedly connected with a handle 25, lower end four corners of a second bevel gear 5 of a base 1 are fixedly connected with one side of a slide block 22 of a connecting rod 22, and one side of the slide block 3.

The during operation, at first cooperate semiconductor material's both sides and hold-in range 18's lower extreme, utilize two-way motor 32 to drive second thread piece 28 and remove, thereby adjust the height of hold-in range 18, utilize hold-in range 18 to fix semiconductor material, it is rotatory to recycle second motor 33 and drive second threaded rod 21, thereby drive third thread piece 38 and remove, third thread piece 38 drives cutting bed 20 at the in-process that removes and removes, thereby drive semiconductor material and remove, semiconductor material drives hold-in range 18 and rotates when removing, utilize hold-in range 18 to fix a position semiconductor material, avoid taking place the skew when making cutting device 15 cut, guarantee the precision of semiconductor material cutting.

Claims

1. Semiconductor material's high accuracy cutting equipment, including base (1), its characterized in that: the cutting table is characterized in that a box body (2) is fixedly connected to the upper end of the base (1), an operation table (37) is fixedly connected to the bottom of the box body (2), a second motor (33) is arranged on one side of the operation table (37), a second threaded rod (21) is fixedly connected to the output end of the second motor (33), one end of the second threaded rod (21) penetrates through one side of the operation table (37) and extends to the inside, slide rods (19) are symmetrically arranged inside the operation table (37), a slide block (3) is sleeved outside the slide rods (19), a third thread block (38) is sleeved outside the second threaded rod (21), and cutting tables (20) are fixedly connected to the upper ends of the slide block (3) and the third thread block (38);

the bottom of operation panel (37) is provided with two-way motor (32), two-way motor (32) be output end fixedly connected with pivot (31), the one end fixedly connected with second bevel gear (30) of pivot (31), the inside symmetry of operation panel (37) is provided with a plurality of third threaded rod (27), second threaded block (28) has been cup jointed to the outside of third threaded rod (27), the first bevel gear (29) of outside fixedly connected with of third threaded rod (27), one side fixedly connected with bracing piece (34) of second threaded block (28), the upper end fixedly connected with montant (4) of bracing piece (34), one side fixedly connected with diaphragm (16) of montant (4), the lower extreme symmetry fixedly connected with second riser (17) of diaphragm (16), the lateral wall of second riser (17) is provided with band pulley (26), the lateral wall of band pulley (26) rotates with the lateral wall of second riser (17) to be connected, the outside of band pulley (26) has hold-in range (18) to cup joint.

2. The apparatus for high-precision cutting of semiconductor material according to claim 1, wherein: the upper end symmetry fixedly connected with first riser (8) of box (2), one side fixedly connected with first motor (13) of first riser (8), the first threaded rod of output fixedly connected with (12) of first motor (13), the outside symmetry of first threaded rod (12) is provided with first thread piece (11).

3. The apparatus for high-precision cutting of semiconductor material according to claim 2, wherein: the utility model discloses a riser, including lateral wall fixedly connected with first gag lever post (9) of first riser (8), first stopper (10) have been cup jointed to the outside symmetry of first gag lever post (9), the upper end fixed connection of one side and first screw thread piece (11) of first stopper (10).

4. The apparatus for high-precision cutting of semiconductor material according to claim 2, characterized in that: the lower extreme fixedly connected with support frame (7) of first screw thread piece (11), the symmetry fixedly connected with hydraulic stem (14) of lower extreme of support frame (7), the output end fixedly connected with backup pad (6) of hydraulic stem (14), the upper end of backup pad (6) is provided with cutting device (15).

5. The apparatus for high-precision cutting of semiconductor material according to claim 1, characterized in that: the inside symmetry of operation panel (37) is provided with a plurality of second gag lever post (36), second gag lever post (35) has been cup jointed to the outside of second gag lever post (36), one side and one side fixed connection of second screw thread piece (28) of second gag lever post (35).

6. The apparatus for high-precision cutting of semiconductor material according to claim 1, characterized in that: a box door (23) is arranged on one side of the box body (2), a window (24) is arranged on one side of the box door (23), and a handle (25) is fixedly connected to one side of the box door (23).

7. The apparatus for high-precision cutting of semiconductor material according to claim 1, wherein: the lower end four corners of the base (1) are fixedly connected with supporting legs (5), and the first bevel gear (29) is meshed with the second bevel gear (30).

8. The apparatus for high-precision cutting of semiconductor material according to claim 1, characterized in that: one side of the third thread block (38) is fixedly connected with a connecting rod (22), and one end of the connecting rod (22) is fixedly connected with one side of the sliding block (3).