CN217903113U - Double-base-island deep-dented lead frame - Google Patents

Abstract

The utility model discloses a two base island lead frame of caving deeply, pin, outer pin and seat post in pin, below in first base island, second base island, top, first base island with second base island all is used for settling the chip and sets up to form one and is located side by side the clearance groove between the second base island first base island with, the pin is located in the top first base island with the top and the bending type in second base island are formed with the inclined plane kink, the pin passes through in the top inclined plane kink with first base island with second base island is connected, the pin is located in the below first base island with the below and the unsettled setting in interval of second base island, the one end of seat post is connected respectively first base island with second base island, the other end and external frame are connected. The utility model has the advantages that: the heat dissipation speed of the wafer is accelerated; the risk of offset short circuit of the high-temperature plastic package base island after die bonding is prevented; the thickness of the plastic package body can be reduced. The lead frame has simple structure, good heat dissipation and strong electrical conductivity.

Description

Double-base-island deep-dented lead frame

[ technical field ] A method for producing a semiconductor device

The utility model relates to a semiconductor package technical field especially relates to a two base island lead frame of denting deeply.

[ background of the invention ]

In recent years, with the rapid development in the electronic industry, the requirements for semiconductor packaging technology are increasing, and the requirements for packages are becoming finer and finer. However, the conventional lead frame product usually can only place one wafer, and if two or more wafers are placed, more than two base islands need to be arranged, but after the more than two base islands are arranged, it is difficult to isolate the current mutually transmitted between the two base islands, and after packaging, the lead frame product has large volume, heavy weight and poor heat dissipation.

[ Utility model ] A method for manufacturing a semiconductor device

The utility model discloses a two base island lead frame of caving deeply, it places two wafers, and can completely cut off the electric current of mutual transmission between two base islands to and accelerate wafer high temperature back radiating rate. The plastic package has the characteristics of small volume, light weight, portability, good electrical conductivity and good heat dissipation, thereby solving the technical problems involved in the background technology.

In order to achieve the above purpose, the technical scheme of the utility model is that:

the utility model provides a two base island lead frame of deeply digging, includes first base island, second base island, pin in the top, pin in the below, outer pin and seat post, first base island with the second base island all is used for settling the chip and sets up to form one side by side the interval and is located first base island with keep away the dead slot between the second base island, the pin is located in the top first base island with the top of second base island is buckled and is formed with the inclined plane kink, the pin passes through in the top the inclined plane kink with first base island with the second base island is connected, the pin is located in the below first base island with the below of second base island is unsettled to be set up at the interval, the one end of seat post is connected respectively first base island with second base island, the other end and external frame are connected.

As an optimized improvement of the utility model, the spacing of the clearance groove is 0.260-0.340 mm, the bottom of the clearance groove is gradually enlarged to form a trapezoidal notch.

As a preferred improvement of the utility model, the seat post is including the fixed position of bending type one-tenth, the seat post passes through fixed position respectively with the left side of first base island with the right side of second base island is connected.

As a preferred improvement of the present invention, the Z-direction height difference between the first base island and the second base island and the pin in the upper portion is not less than three times the thickness of the outer frame.

As a preferable improvement of the present invention, the thickness of the fixing portion is smaller than the thickness of the outer frame, and the cross section of the fixing portion and the angle range of the first base island and the second base island are 55 to 65 °.

As a preferred improvement of the utility model, the width of the seat post is 0.200-0.300 mm.

As a preferred improvement of the invention, the thickness of the outer frame is 0.203+/-0.008mm.

As an optimized improvement of the utility model, the height of the trapezoidal notch is 0.500mm, and the trapezoidal angle range is 55-65 degrees.

As a preferred improvement of the utility model, first base island with the second base island respectively with the left and right sides the fixed position of seatpost forms first crossing node, the left and right sides distance between the first crossing node is 3.720 ~ 3.920mm.

As a preferable improvement of the present invention, the height difference of the first base island and the second base island and the lower inner pin in the Z direction is 0.620 to 0.675mm.

The utility model provides a pair of two basic island lead frame of caving deeply's beneficial effect: the two base islands are separated independently by arranging the clearance groove between the two base islands, so that the current transmitted between the two base islands is isolated, and the heat dissipation speed of the wafer is accelerated; the lower part of the clearance groove is provided with a trapezoidal notch, so that the risk of offset short circuit of the high-temperature plastic package base island after die bonding can be prevented; in addition, the thickness of the plastic package body can be reduced by the design of the sinking seat. The lead frame has simple structure, good heat dissipation and strong electrical conductivity.

[ description of the drawings ]

In order to more clearly illustrate the technical solution of the embodiments of the present invention, the drawings used in the description of the embodiments are briefly introduced below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and other drawings can be obtained by those skilled in the art without inventive efforts, wherein:

fig. 1 is a schematic structural diagram of a double-base-island deep-recessing lead frame provided by the present invention;

FIG. 2 is a transverse cross-sectional schematic view of the seat post shown in FIG. 1;

fig. 3 is a schematic longitudinal sectional view of the upper and lower inner leads shown in fig. 1.

[ detailed description ] embodiments

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.

It should be noted that all the directional indicators (such as up, down, left, right, front, back \8230;) in the embodiments of the present invention are only used to explain the relative position relationship between the components, the motion situation, etc. in a specific posture (as shown in the attached drawings), and if the specific posture is changed, the directional indicator is changed accordingly.

Furthermore, descriptions in the present application as to "first," "second," etc. are for descriptive purposes only and are not to be construed as indicating or implying relative importance or to implicitly indicate the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "plurality" means at least two, e.g., two, three, etc., unless explicitly defined otherwise.

In the present application, unless expressly stated or limited otherwise, the terms "connected" and "fixed" are to be construed broadly, e.g., "fixed" may be fixedly connected or detachably connected, or integrally formed; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be interconnected within two elements or in a relationship where two elements interact with each other unless otherwise specifically limited. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.

In addition, the technical solutions between the embodiments of the present invention can be combined with each other, but it is necessary to be able to be realized by a person having ordinary skill in the art as a basis, and when the technical solutions are contradictory or cannot be realized, the combination of such technical solutions should be considered to be absent, and is not within the protection scope of the present invention.

Please refer to fig. 1-3, the utility model provides a two base island lead frame 100 of sinking deeply, including first base island 101, second base island 102, pin 103 in the top, pin 104 in the below, outer pin 105 and seatpost 106, first base island 101 is located the left side of second base island 102, first base island 101 with second base island 102 all is used for settling the chip, plays and accepts and the solid brilliant effect.

The first base island 101 and the second base island 102 are arranged in parallel at intervals to form a clearance groove 11 between the first base island 101 and the second base island 102, and the distance between the clearance grooves 11 is 0.260-0.340 mm.

Further, the bottom of the clearance groove 11 is gradually enlarged to form a trapezoidal notch 12, specifically, the height of the trapezoidal notch is 0.500mm, and the trapezoidal angle range is 55-65 °.

The upper inner pin 103 is located above the first base island 101 and the second base island 102 and is bent to form an inclined plane bending part (not shown), the upper inner pin 103 is connected with the first base island 101 and the second base island 102 through the inclined plane bending part, the upper inner pin 103 not only can play a role in fixing, but also can reduce the heights of the first base island 101 and the second base island 102, reduce a plastic package body, and improve the electric conduction and heat conduction effects, so that the package body is refined and is convenient to carry.

Further, the inclined plane bending part and the first and second base islands 101 and 102 respectively form a second intersection node 109, and the distance from the second intersection node 109 to the bottom edges of the first and second base islands 101 and 102 is 2.540 to 2.620mm.

Further, the difference in height in the Z direction between the first base island 101 and the second base island 102 and the upper inner lead 103 is not less than three times the thickness of the outer frame.

The lower inner pins 104 are positioned below the first base island 101 and the second base island 102 and are spaced apart from each other, so that the lower inner pins 104 form four pins which are independently arranged. Specifically, a height difference is formed between the first base island 101 and the second base island 102 and between the lower inner lead 104 and the lower inner lead in the Z direction, and the height difference is 0.620 to 0.675mm.

The number of the seat posts 106 is plural, one end of each seat post is connected to the first base island 101 and the second base island 102, and the other end of each seat post is connected to an external frame. The outer frame is made of copper material C194, and has a Vickers hardness in the range of 130-150 and a thickness of 0.203+/-0.008mm.

Further, the seatpost 106 is disposed in a long strip shape on the left side of the first base island 101 and the right side of the second base island 102, and the width of the seatpost 106 is 0.200 to 0.300mm.

Further, the seat post 106 includes a fixing position 107 formed by bending, and the seat post 106 is connected to the left side of the first base island 101 and the right side of the second base island 102 through the fixing position 107, respectively. The thickness of the fixing locations 107 is less than the thickness of the outer frame, and the cross-section of the fixing locations 107 has an angle in the range of 55 to 65 ° with the first base island 101 and the second base island 102.

Further, an L-shaped groove is formed above the seat post 106 and on a side of the first base island 101, and the L-shaped groove penetrates through the outside of the external frame.

Further, the first base island 101 and the second base island 102 respectively form a first intersecting node 108 with the fixing sites 107 of the seatpost 106 on the left and right sides, and the distance between the first intersecting nodes 108 on the left and right sides is 3.720-3.920 mm.

The utility model provides a pair of two basic island lead frame of caving deeply's beneficial effect: the two base islands are separated independently by arranging the clearance groove between the two base islands, so that the current transmitted between the two base islands is isolated, and the heat dissipation speed of the wafer is accelerated; the lower part of the clearance groove is provided with a trapezoidal notch, so that the risk of offset short circuit of the high-temperature plastic package base island after die bonding can be prevented; in addition, the design of the sinking seat can reduce the thickness of the plastic package body. The lead frame has simple structure, good heat dissipation and strong electrical conductivity.

While the embodiments of the invention have been disclosed above, it is not limited to the applications set forth in the description and embodiments, but is capable of being applied in all kinds of fields adapted to the invention, and further modifications may readily be made by those skilled in the art, and the invention is therefore not limited to the details shown and described herein, without departing from the general concept defined by the claims and their equivalents.

Claims (10)

1. The utility model provides a two base island lead frame of sinking deeply which characterized in that, includes first base island, second base island, pin in the top, pin in the below, outer pin and pedestal column, first base island with second base island all is used for settling the chip and sets up to form one side by side the interval and is located first base island with keep away the dead slot between the second base island, the pin is located in the top first base island with the top of second base island is buckled and is formed with the inclined plane kink, the pin passes through in the top the inclined plane kink with first base island with the second base island is connected, the pin is located in the below of first base island with the below of second base island is unsettled the setting at interval, the one end of pedestal column is connected respectively first base island with the second base island, the other end is connected with external frame.

2. The double-base-island deep-dented lead frame according to claim 1, wherein the spacing between the clearance grooves is 0.260 to 0.340mm, and the bottoms of the clearance grooves are gradually enlarged to form trapezoidal notches.

3. The dual-base-island deep-recessing lead frame of claim 1, wherein said pedestal posts comprise fixing sites formed by bending, and said pedestal posts are respectively connected with the left side of said first base island and the right side of said second base island through said fixing sites.

4. The dual-island deep-recessed lead frame of claim 1, wherein the difference in Z-direction heights between said first and second base islands and said upper inner lead is no less than three times the thickness of the outer frame.

5. The dual base island deep recessed lead frame of claim 3, wherein the thickness of said anchor is less than the thickness of said outer frame, and the cross section of said anchor is at an angle in the range of 55-65 ° to said first and second base islands.

6. The dual-island deep-recessed lead frame of claim 1, wherein the width of the pedestal is 0.200-0.300 mm.

7. The dual island deep recessed leadframe according to claim 1 or 4, wherein the thickness of the outer frame is 0.203+/-0.008mm.

8. The dual-island deep-recessed lead frame of claim 2, wherein the height of the trapezoidal notch is 0.500mm, and the trapezoidal angle ranges from 55 ° to 65 °.

9. The dual-island deep-recessing lead frame according to claim 3, wherein said first and second islands respectively form first intersecting nodes with the fixed positions of said seatpost on the left and right sides, and the distance between said first intersecting nodes on the left and right sides is 3.720-3.920 mm.

10. The dual-base-island deep-recessing lead frame of claim 1, wherein the height difference between said first base island and said second base island and said lower inner lead in the Z direction is 0.620-0.675 mm.

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