CN217902175U

CN217902175U - MEMS micro-mirror array

Info

Publication number: CN217902175U
Application number: CN202221461383.9U
Authority: CN
Inventors: 李伟; 江火秀; 赵旭东; 李芳萌; 徐静
Original assignee: Anhui Zhongkemi Microelectronics Technology Co ltd
Current assignee: Anhui Zhongkemi Microelectronics Technology Co ltd
Priority date: 2022-06-10
Filing date: 2022-06-10
Publication date: 2022-11-25
Anticipated expiration: 2032-06-10

Abstract

The utility model provides a MEMS micro mirror array, through with a plurality of MEMS micro mirrors respectively on wiring substrate fixed arrangement and carry out the electricity with wiring substrate and be connected, can show the yield that improves MEMS micro mirror array, reduce the manufacturing degree of difficulty of MEMS micro mirror array, can make manufacturing process simple to MEMS micro mirror array's the mode of arranging, the position of arranging, micro mirror quantity etc. can be nimble more convenient, help further expanding MEMS micro mirror array's application.

Description

MEMS micro-mirror array

Technical Field

The utility model relates to a micro-electromechanical systems technical field especially relates to a MEMS micro mirror array.

Background

In optical communication systems, MEMS micromirrors have become the core component for conditioning or modifying optical signals. Currently, MEMS micromirrors are widely used in various optical communication devices such as Variable Optical Attenuators (VOAs), optical switches (switches), tunable Filters (TFs), wavelength selectors (WSS), optical cross-connects (OXCs), etc. With the rapid development of optical communication technology and MEMS technology, the MEMS micro-mirror has more and more extensive applications.

A MEMS micro-mirror array is an array of multiple MEMS micro-mirrors. Currently, MEMS micro-mirror arrays are mainly used in OXCs. With the growing maturity of MEMS micro-mirror array technology, the application field thereof will be wider and wider. The MEMS micro-mirror array is usually manufactured by MEMS technology to simultaneously manufacture M × N closely connected MEMS micro-mirrors, the position arrangement of each MEMS micro-mirror is very consistent, and the MEMS micro-mirrors can be manufactured in batch, but if one or more of the MEMS micro-mirrors are bad, the performance of the whole micro-mirror array will be seriously affected, even if the MEMS micro-mirrors cannot be applied at all, and the yield of the micro-mirror array is low. Therefore, the MEMS micro-mirror array requires a very high manufacturing process, which also results in a relatively high price of the MEMS micro-mirror array.

Therefore, it is desirable to further reduce the difficulty of manufacturing the MEMS micro-mirror array, increase the manufacturing yield, and reduce the price to improve the above-mentioned defects.

SUMMERY OF THE UTILITY MODEL

In view of the above-mentioned shortcomings of the prior art, an object of the present invention is to provide a MEMS micro-mirror array for solving the problems of the prior art, such as large difficulty in manufacturing MEMS micro-mirror array, low yield, etc.

To achieve the above and other related objects, the present invention provides a MEMS micro-mirror array, comprising:

a wiring substrate;

the MEMS micro-mirrors are fixed above the wiring substrate and electrically connected with the wiring substrate, wherein the total value of M multiplied by N is more than or equal to 2.

Optionally, the values of M and N include that M is not less than 2,N is not less than 2, and the formed MEMS micro-mirror array includes one or a combination of a parallel array and a staggered array.

Optionally, the electrode pad of the MEMS micro-mirror is located on the front side or the back side of the MEMS micro-mirror, when the electrode pad of the MEMS micro-mirror is located on the front side of the MEMS micro-mirror, the electrode pad of the MEMS micro-mirror is electrically connected to the pad of the wiring substrate in a lead bonding manner, and when the electrode pad of the MEMS micro-mirror is located on the back side of the MEMS micro-mirror, the electrode pad of the MEMS micro-mirror is electrically connected to the pad of the wiring substrate in a conductive manner.

Optionally, the wiring substrate comprises one of a silicon substrate, a PCB substrate and a ceramic substrate.

Optionally, the wiring substrate is provided with electrodes located on one or a combination of the front, back and side surfaces of the wiring substrate.

Optionally, the MEMS micro-mirror comprises any one or a combination of a one-dimensional moving MEMS micro-mirror and a two-dimensional moving MEMS micro-mirror.

Optionally, the MEMS micro-mirror includes any one or a combination of an electrostatic driven MEMS micro-mirror, an electromagnetic driven MEMS micro-mirror, a piezoelectric driven MEMS micro-mirror, and an electro-thermal driven MEMS micro-mirror.

As described above, the utility model discloses a MEMS micro mirror array, through with a plurality of MEMS micro mirrors respectively on wiring substrate fixed arrangement and with wiring substrate carry out the electricity and be connected, can show the yield that improves MEMS micro mirror array, reduce MEMS micro mirror array's the manufacturing degree of difficulty, can make manufacturing process simple to MEMS micro mirror array's the mode of arranging, the position of arranging, micro mirror quantity etc. can be more nimble convenient, help further expanding MEMS micro mirror array's application.

Drawings

Fig. 1 is a flow chart illustrating a process for fabricating a MEMS micro-mirror array according to an embodiment of the present invention.

Fig. 2 is a schematic structural diagram of a MEMS micro-mirror array according to an embodiment of the invention.

Fig. 3 is a schematic diagram showing a partially enlarged structure of the MEMS micro-mirror array of fig. 2.

Fig. 4 is a schematic diagram illustrating a structure of electrodes around the back surface of a wiring substrate according to a first embodiment of the present invention.

Fig. 5 is a schematic view illustrating a structure of a bottom electrode on a back surface of a wiring substrate according to a first embodiment of the present invention.

Fig. 6 is a flow chart of a process for fabricating a MEMS micro-mirror array according to a second embodiment of the present invention.

Fig. 7 is a schematic structural diagram of a MEMS micro-mirror array according to a second embodiment of the present invention.

Fig. 8 is a partially enlarged schematic structural diagram of the MEMS micro-mirror array of fig. 7.

Description of the element reference

110. 120 wiring substrate

111. 121 pad

112. Electrode for electrochemical cell

210. 220 MEMS micro-mirror

211. 221 electrode pad

310. Lead wire

S1-1 to S1-3, S2-1 to S2-2

Detailed Description

The following description of the embodiments of the present invention is provided for illustrative purposes, and other advantages and effects of the present invention will be readily apparent to those skilled in the art from the disclosure herein. The present invention can also be implemented or applied through other different specific embodiments, and various details in the present specification can be modified or changed based on different viewpoints and applications without departing from the spirit of the present invention.

As in the detailed description of the embodiments of the present invention, the cross-sectional views illustrating the device structure are not partially enlarged in general scale for convenience of illustration, and the schematic views are only examples, which should not limit the scope of the present invention. In addition, the three-dimensional dimensions of length, width and depth should be included in the actual fabrication.

For convenience in description, spatial relational terms such as "below," "beneath," "below," "under," "over," "upper," and the like may be used herein to describe one element or feature's relationship to another element or feature as illustrated in the figures. It will be understood that these terms of spatial relationship are intended to encompass other orientations of the device in use or operation in addition to the orientation depicted in the figures. In addition, when a layer is referred to as being "between" two layers, it can be the only layer between the two layers, or one or more intervening layers may also be present. Where an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or be indirectly connected to the other element.

Expressions such as "between … …" may be used herein to include both endpoints, and expressions such as "plurality" may be used herein to represent two or more unless specifically limited otherwise. Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature.

It should be noted that the drawings provided in the present embodiment are only for illustrating the basic idea of the present invention, and only the components related to the present invention are shown in the drawings rather than being drawn according to the number, shape and size of the components in actual implementation, and the form, amount and ratio of the components in actual implementation may be changed at will, and the layout of the components may be more complicated.

Example one

Referring to fig. 2 and 3, the present embodiment provides a MEMS micro-mirror array, which includes a wiring substrate 110 and M × N independently disposed MEMS micro-mirrors 210, wherein the MEMS micro-mirrors 210 are fixed above the wiring substrate 110, and the MEMS micro-mirrors 210 are electrically connected to the wiring substrate 110, wherein the total value of M × N is greater than or equal to 2.

In this embodiment, a plurality of MEMS micromirrors 210 are respectively fixed on the wiring substrate 110 and arranged and electrically connected to the wiring substrate 110, which can significantly improve the yield of the MEMS micromirror array, reduce the difficulty in manufacturing the MEMS micromirror array, and simplify the manufacturing process, and the arrangement, arrangement position, number of micromirrors, and the like of the MEMS micromirror array can be more flexible and convenient, and thus, the application field of the MEMS micromirror array can be further expanded.

For example, the values of M and N include that M is not less than 2,N is not less than 2, and the MEMS micro-mirror 210 in the MEMS micro-mirror array includes one or a combination of vertical arrangement and staggered arrangement.

Specifically, as shown in fig. 2 and fig. 3, in the present embodiment, M of the formed MEMS micro-mirror array is 8,N is 8, so as to form an 8 × 8 MEMS micro-mirror array, and the MEMS micro-mirror array is a parallel array, but not limited thereto, the formed MEMS micro-mirror array may also be a staggered array, that is, one of two adjacent columns may be translated upwards or downwards for a certain distance, so that the MEMS micro-mirrors 210 are staggered and arranged for the subsequent electrical connection application, the value of M may also include, for example, 2, 4, 5, 10, 15, and the like, and the values of M and N may be equal or unequal, and the values of M and N and the arrangement manner of the MEMS array may be set according to specific needs, which is not limited herein.

As an example, the electrode pad 211 of the MEMS micro-mirror 210 is located on the front surface of the MEMS micro-mirror 210, and the electrode pad 211 of the MEMS micro-mirror 210 and the pad 111 of the wiring substrate 110 are electrically connected by wire bonding.

Specifically, referring to fig. 2 and 3, the electrode pad 211 of the MEMS micro-mirror 210 of the present embodiment is located on the front surface of the MEMS micro-mirror 210, the pad 111 of the wiring substrate 110 is disposed on the front surface of the wiring substrate 110 and close to the corresponding MEMS micro-mirror 210, and the MEMS micro-mirror 210 and the wiring substrate 110 can be electrically connected through the lead 310. The type of the lead 310 may include, for example, an aluminum wire, a gold wire, etc., and the specific type is not limited herein.

As an example, the fixing manner of the MEMS micro-mirror 210 and the wiring substrate 110 may include one or a combination of soldering and adhering to fix the MEMS micro-mirror 210 and the wiring substrate 110 firmly.

As an example, the wiring substrate 110 may include one of a silicon substrate, a PCB substrate, and a ceramic substrate; the wiring substrate 110 is provided with an electrode 112, and the electrode 112 is located on one or a combination of the front surface, the back surface, and the side surface of the wiring substrate 110.

Specifically, the type of the wiring substrate 110 may be selected according to the requirement, and may include one of a silicon substrate, a PCB substrate and a ceramic substrate, but is not limited thereto, and may be specifically selected according to the requirement.

Referring to fig. 2 and 3, in the present embodiment, the wiring substrate 110 is provided with the electrode 112, the electrode 112 is located around the front surface of the wiring substrate 110, and a connection line is provided inside the wiring substrate 110 to electrically connect the electrode 112 of the wiring substrate 110 and the pad 111 of the wiring substrate 110 through the connection line, so as to facilitate subsequent electrical connection through the electrode 112 of the wiring substrate 110, but the position of the electrode 112 is not limited thereto, and as required, referring to fig. 4 and 5, the electrode 112 may also be provided in any one or a combination of the center of the back surface of the wiring substrate 110, the periphery of the back surface of the wiring substrate 110, or the side surface of the wiring substrate 110, which is not limited herein.

By way of example, the MEMS micro-mirror 210 may comprise any one or a combination of a one-dimensional motion MEMS micro-mirror and a two-dimensional motion MEMS micro-mirror.

Specifically, the MEMS micromirrors 210 on the wiring substrate 110 may be selected according to the needs, wherein the MEMS micromirrors 210 may be of the same type or different types, and are not limited herein, for example, the MEMS micromirrors 210 may include any one or a combination of one-dimensional motion MEMS micromirrors and two-dimensional motion MEMS micromirrors.

By way of example, the MEMS micro-mirror 210 can include any one or combination of an electrostatically driven MEMS micro-mirror, an electromagnetically driven MEMS micro-mirror, a piezoelectrically driven MEMS micro-mirror, and an electrically and thermally driven MEMS micro-mirror.

Referring to fig. 1, the present embodiment further provides a method for manufacturing a MEMS micro-mirror array, including the following steps:

s1-1: providing a wiring substrate and M multiplied by N independently arranged MEMS micro-mirrors, wherein the front surfaces of the MEMS micro-mirrors are provided with electrode pads, and the total value of M multiplied by N is more than or equal to 2;

s1-2: fixing the MEMS micro-mirror above the wiring substrate;

s1-3: and carrying out wire bonding on the electrode bonding pad of the MEMS micro-mirror and the bonding pad of the wiring substrate so as to realize the electrical connection of the MEMS micro-mirror and the wiring substrate.

The MEMS micromirror array can be prepared by the preparation method, but not limited thereto, and the structure of the MEMS micromirror array prepared by the preparation method can refer to the MEMS micromirror array, which is not described herein.

Specifically, the preparation steps may include:

1) The wiring substrate can be designed according to the quantity, the position, the arrangement mode, the electrode lead mode and the like of the MxN MEMS micro-mirror array;

2) Processing and manufacturing the wiring substrate, wherein the wiring substrate can be any one of a silicon substrate, a PCB (printed Circuit Board) substrate or a ceramic substrate;

3) Fixing M multiplied by N independently arranged MEMS micro-mirrors with electrode pads on the front surfaces above the wiring substrate in a sticking or welding mode;

4) And carrying out wire bonding welding on the electrode pads of the M multiplied by N MEMS micromirrors and the pad positioned on the front surface of the wiring substrate so as to realize the electrical connection of the electrode pads of the M multiplied by N MEMS micromirrors and the pad of the wiring substrate.

Example two

Referring to fig. 7 and 8, the present embodiment provides a MEMS micro-mirror array, which is different from the first embodiment mainly in that: the electrode pad 221 of the MEMS micro-mirror 220 is located on the back side of the MEMS micro-mirror 220.

The MEMS micro-mirror array includes a wiring substrate 120 and M × N MEMS micro-mirrors 220 independently disposed, the MEMS micro-mirrors 220 are fixed above the wiring substrate 120, and the MEMS micro-mirrors 220 are electrically connected to the wiring substrate 120, wherein a total value of M × N is greater than or equal to 2.

Specifically, the type and layout of the wiring substrate 120 and the MEMS micro-mirror 220 can be referred to in the first embodiment, which is not described herein.

As an example, the electrode pad 221 of the MEMS micro-mirror 220 is located on the back surface of the MEMS micro-mirror 220, and the electrode pad 221 of the MEMS micro-mirror 220 is electrically connected to the pad 121 of the wiring substrate 120.

Specifically, referring to fig. 7 and 8, in the present embodiment, the electrode pad 221 of the MEMS micro-mirror 220 is located on the back side of the MEMS micro-mirror 220, and the pad 121 of the wiring substrate 120 is disposed on the front side of the wiring substrate 120 and is in one-to-one correspondence with the position of the electrode pad 221 of the MEMS micro-mirror 220, so that the MEMS micro-mirror 220 and the wiring substrate 120 can be electrically connected directly by welding the electrode pad 221 and the pad 121. The conductive connection between the electrode pad 221 of the MEMS micro-mirror 220 and the pad 121 of the wiring substrate 120 may include conductive adhesion or metal welding, so that the MEMS micro-mirror 220 and the wiring substrate 120 may be fixed and electrically connected at the same time, thereby reducing the number of process steps and the cost.

Referring to fig. 6, the present embodiment further provides a method for manufacturing a MEMS micro-mirror array, including the following steps:

s2-1: providing a wiring substrate and M multiplied by N MEMS micro-mirrors which are independently arranged, wherein the total value of M multiplied by N is more than or equal to 2, and the back surfaces of the MEMS micro-mirrors are provided with electrode pads;

s2-2: and fixing the MEMS micro-mirror above the wiring substrate in a conductive connection mode, wherein an electrode pad of the MEMS micro-mirror is correspondingly connected with a pad of the wiring substrate so as to realize the electrical connection of the MEMS micro-mirror and the wiring substrate.

Specifically, the preparation steps may include:

3) The method comprises the steps that M multiplied by N MEMS micro-mirrors which are independently arranged and provided with electrode pads on the back sides are fixed above a wiring substrate in a conductive pasting or metal welding mode, the electrode pads of the M multiplied by N MEMS micro-mirrors correspond to the pads of the wiring substrate one by one, and therefore the electrode pads of the M multiplied by N MEMS micro-mirrors are electrically connected with the pads of the wiring substrate.

To sum up, the utility model discloses a MEMS micro mirror array, through with a plurality of MEMS micro mirrors respectively on wiring substrate fixed arrangement and with wiring substrate carry out the electricity and be connected, can show the yield that improves MEMS micro mirror array, reduce MEMS micro mirror array's the manufacturing degree of difficulty, can make manufacturing process simple to MEMS micro mirror array's the mode of arranging, the position of arranging, micro mirror quantity etc. can be more nimble convenient, help further expanding MEMS micro mirror array's application.

The above embodiments are merely illustrative of the principles and effects of the present invention, and are not to be construed as limiting the invention. Modifications and variations can be made to the above-described embodiments by those skilled in the art without departing from the spirit and scope of the present invention. Accordingly, it is intended that all equivalent modifications or changes which may be made by those skilled in the art without departing from the spirit and technical spirit of the present invention be covered by the claims of the present invention.

Claims

1. A MEMS micro-mirror array, comprising:

a wiring substrate;

2. The MEMS micro-mirror array of claim 1, wherein: the values of M and N comprise that M is more than or equal to 2,N is more than or equal to 2, and the formed MEMS micro-mirror array comprises one or a combination of a parallel array and a staggered array.

3. The MEMS micro-mirror array of claim 1, wherein: the electrode pad of MEMS micro-mirror is located the front or the back of MEMS micro-mirror, works as the electrode pad of MEMS micro-mirror is located when the front of MEMS micro-mirror, the electrode pad of MEMS micro-mirror with the electric connection mode of wiring substrate's pad is the lead bonding, works as the electrode pad of MEMS micro-mirror is located when the back of MEMS micro-mirror, the electrode pad of MEMS micro-mirror with the electric connection mode of wiring substrate's pad is electrically conductive connection.

4. The MEMS micro-mirror array of claim 1, wherein: the wiring substrate includes one of a silicon substrate, a PCB substrate, and a ceramic substrate.

5. The MEMS micro mirror array of claim 1, wherein: the wiring substrate is provided with electrodes which are located on one or a combination of the front surface, the back surface and the side surfaces of the wiring substrate.

6. The MEMS micro mirror array of claim 1, wherein: the MEMS micro-mirror comprises any one or combination of a one-dimensional motion MEMS micro-mirror and a two-dimensional motion MEMS micro-mirror.

7. The MEMS micro-mirror array of claim 1, wherein: the MEMS micro-mirror comprises any one or combination of an electrostatic driving MEMS micro-mirror, an electromagnetic driving MEMS micro-mirror, a piezoelectric driving MEMS micro-mirror and an electrothermal driving MEMS micro-mirror.