CN217901025U - Intensive bus temperature measurement system - Google Patents
Intensive bus temperature measurement system Download PDFInfo
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- CN217901025U CN217901025U CN202122864901.3U CN202122864901U CN217901025U CN 217901025 U CN217901025 U CN 217901025U CN 202122864901 U CN202122864901 U CN 202122864901U CN 217901025 U CN217901025 U CN 217901025U
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Abstract
The utility model provides a dense bus temperature measurement system, which comprises a non-contact temperature monitoring component, a branch node MCU data processing module, a power carrier module or a zigbee module, a root node MCU data processing module, a 4G module and a temperature monitoring server; the non-contact temperature monitoring assembly comprises a temperature measuring bracket and a temperature sensor arranged on the temperature measuring bracket, and non-contact temperature measurement is realized; the branch node MCU data processing module is connected with the temperature sensor through a communication cable, the root node MCU data processing module is in communication connection with the branch node MCU data processing module through the power carrier module or the zigbee module, short-distance communication is realized by utilizing the power carrier module or the zigbee module, and the temperature monitoring server is in long-distance communication with the root node MCU data processing module through the 4G module, so that the use amount of the 4G module is greatly reduced, and the operation cost is reduced.
Description
Technical Field
The utility model relates to a circuit temperature detects technical field, in particular to intensive generating line temperature measurement system.
Background
In recent years, dense buses, power carriers, and the like have been widely used in life of people. The dense bus has small volume and low energy consumption; the transmission current is large, and tapping feed is convenient; the bus duct insulating material has the advantages of good performance, good stability and the like. Power line carrier communication (PLC) is a basic communication system unique to a power system, and is a technology for transmitting an analog or digital signal at high speed by a carrier system using an existing power line. The power line is used as a network access scheme, the existing power distribution network can be used for communication without rewiring, the power line network is widely distributed and convenient to access, and multiple users can share the broadband, so that the power line network is one of the most competitive technologies for solving the problem of the last 1 kilometer of the broadband network. Zigbee is a new technology for deploying wireless sensor networks. The wireless network technology is a short-distance and low-speed wireless network technology, the data transmission speed is low, the protocol is simple, and the cost can be greatly reduced.
However, in the long-term operation process of the power equipment, the contact points in the dense bus switch cabinet are aged, the resistance is increased, the temperature is greatly increased, a large amount of electric energy is lost, and most importantly, a fire disaster is possibly caused, so that a great problem is caused to the safety of users. In the field application of the current temperature measuring system, most of the temperature sensing head assemblies are fixed on a bus through an entrainment device to monitor the temperature of the bus at a joint, and the temperature data is transmitted through wiring or a large number of wireless communication modules. However, because the equipment bus is electrified for a long time, certain problems are brought to the safety of the contact type temperature measuring system, and the cost of wiring and infinite transmission is higher and the practicability is poorer.
SUMMERY OF THE UTILITY MODEL
The utility model provides an intensive generating line temperature measurement system for solve the above-mentioned technical problem who provides.
The utility model provides an intensive generating line temperature measurement system, it includes:
the non-contact temperature monitoring assembly comprises a temperature measuring bracket and a temperature sensor which is arranged on the temperature measuring bracket and provided with a sensing end facing the dense bus;
the branch node MCU data processing module is connected with the temperature sensor through a communication cable and is used for receiving temperature detection data acquired by the temperature sensor;
the system comprises a root node MCU data processing module, a branch node MCU data processing module and a power carrier module, wherein the root node MCU data processing module is in communication connection with the branch node MCU data processing module through the power carrier module or the zigbee module;
the temperature monitoring server is in communication connection with the root node MCU data processing module through the 4G module, and the 4G module is connected with the root node MCU data processing module through a communication cable.
Preferably, the temperature measurement support is erected above the dense bus, and the sensing end of the temperature sensor is arranged downwards towards the dense bus.
Preferably, the number of the temperature sensors is consistent with the number of the wire harnesses of the dense bus.
Preferably, the temperature sensors are arranged in one-to-one correspondence with the dense buses.
Preferably, the power carrier module is connected at a dense bus above the air switch.
Preferably, the temperature sensor, the branch node MCU data processing module and the power carrier module are arranged in a branch node accessory box, and each floor is provided with a branch node accessory box.
Preferably, the temperature sensor, the branch node MCU data processing module and the zigbee module are arranged in a branch node accessory box, and each floor is provided with a branch node accessory box.
Preferably, the temperature sensor, the root node MCU data processing module and the 4G module are arranged in a root node fitting box, and each building is provided with one root node fitting box.
Preferably, the dense bus temperature measurement system further comprises a voltage conversion module, wherein in the branch node accessory box, the input end of the voltage conversion module is electrically connected with the dense bus, and the output end of the voltage conversion module is electrically connected with the branch node MCU data processing module, the temperature sensor and the power carrier module respectively.
Preferably, the dense bus temperature measurement system further comprises a voltage conversion module, wherein in the root node fitting box, the input end of the voltage conversion module is electrically connected with the dense bus, and the output end of the voltage conversion module is electrically connected with the temperature sensor, the root node MCU data processing module and the 4G module respectively.
An intensive generating line temperature measurement system, it establishes temperature sensor in intensive generating line top through the temperature measurement support, realize non-contact's temperature measurement, and simultaneously, utilize power line carrier module or zigbee module to realize the short distance communication between node MCU data processing module and the root node MCU data processing module, and realize the long distance communication between root node MCU data processing module and the temperature monitoring server through the 4G module, thereby very big reduction the use amount of 4G module, and then very big reduction the operation cost, and need not lay wire in addition, easy operation is convenient.
The technical solution of the present invention is further described in detail by the accompanying drawings and embodiments.
Drawings
The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention, and together with the description serve to explain the principles of the invention. In the drawings:
fig. 1 is a schematic diagram of a circuit branch principle of an intensive bus temperature measurement system according to an embodiment of the present invention;
fig. 2 is another schematic circuit diagram of a concentrated bus thermometry system according to an embodiment of the present invention;
fig. 3 is a schematic perspective view of a non-contact temperature monitoring assembly in an intensive bus bar temperature measuring system according to an embodiment of the present invention.
Detailed Description
The preferred embodiments of the present invention will be described hereinafter with reference to the accompanying drawings, and it should be understood that the preferred embodiments described herein are merely for purposes of illustration and explanation, and are not intended to limit the present invention.
The utility model provides an intensive generating line temperature measurement system, as shown in fig. 1 to fig. 3, it includes non-contact temperature monitoring subassembly, a node MCU data processing module 20, power carrier module 30 or zigbee module 90, root node MCU data processing module 40, 4G module 50 and temperature monitoring server 60.
As shown in fig. 3, the non-contact temperature monitoring assembly includes a temperature measurement support 80 and temperature sensors 10 disposed on the temperature measurement support 80, the temperature measurement support 80 is erected above the dense bus, the sensing ends of the temperature sensors 10 are disposed downward toward the dense bus, and the number of the temperature sensors 10 is the same as the number of the wire harnesses of the dense bus and is disposed in one-to-one correspondence with the dense bus.
The temperature sensor 10 is preferably an infrared temperature sensor 10; by arranging the infrared temperature sensor 10 on the bracket, the bus below the infrared temperature sensor is subjected to non-contact temperature measurement, so that the problem that the temperature of a contact point is different from that of other parts due to contact with the bus, the measured temperature is inaccurate, or the temperature is reduced due to long-time contact with electrified equipment is avoided.
As shown in fig. 1 and fig. 2, the branch node MCU data processing module 20 is connected to the temperature sensor 10 through a communication cable, and is configured to receive temperature detection data acquired by the temperature sensor 10; the root node MCU data processing module 40 is in communication connection with the branch node MCU data processing module 20 through the power carrier module 30 or the zigbee module 90, and the power carrier module 30 or the zigbee module 90 is connected with the branch node MCU data processing module 20 through a communication cable; the branch node MCU data processing module 20 transmits temperature detection data to the root node MCU data processing module 40 through the power carrier module 30 or the zigbee module 90 without additionally deploying a circuit; the temperature monitoring server 60 is in communication connection with the root node MCU data processing module 40 through the 4G module 50, the 4G module 50 is in communication cable connection with the root node MCU data processing module 40, and the root node MCU data processing module 40 transmits temperature detection data to the temperature monitoring server 60 through the 4G module 50.
Specifically, the power carrier module 30 is connected to the dense bus above the air switches, so as to prevent the air switches from blocking the power carrier signal, and the power carrier signal can be transmitted in a whole floor.
Preferably, the temperature sensor 10, the branch node MCU data processing module 20 and the power line carrier module 30 or the zigbee module 90 are arranged in a branch node accessory box, and only one branch node accessory box is arranged in each floor; the temperature sensor 10, the root node MCU data processing module 40 and the 4G module 50 are arranged in one root node fitting box, and each building is provided with one root node fitting box. By such arrangement, each building can upload temperature data in the whole building to the temperature monitoring server 60 by only configuring 1 4G module 50, and the temperature monitoring server 60 detects whether the temperature is abnormal or not.
As shown in fig. 1 and fig. 2, the dense bus temperature measuring system further includes a voltage conversion module 70, in the branch node fitting box, an input end of the voltage conversion module 70 is electrically connected to the dense bus, and an output end of the voltage conversion module is electrically connected to the branch node MCU data processing module 20, the temperature sensor 10, and the power carrier module 30 or the zigbee module 90, respectively, for converting the 220V voltage on the dense bus into the voltage usable by the branch node MCU data processing module 20, the temperature sensor 10, and the power carrier module 30 or the zigbee module 90, respectively, so that it is not necessary to additionally provide a power supply for the branch node fitting box. In the root node fitting box, the input end of the voltage conversion module 70 is electrically connected with the dense bus, and the output end of the voltage conversion module is electrically connected with the temperature sensor 10, the root node MCU data processing module 40 and the 4G module 50 respectively, so as to convert the 220V voltage on the dense bus into the voltage available for the temperature sensor 10, the root node MCU data processing module 40 and the 4G module 50 respectively, thereby avoiding the need of additionally providing a power supply for the root node fitting box.
An intensive generating line temperature measurement system, it erects temperature sensor 10 in intensive generating line top through temperature measurement support 80, realize non-contact's temperature measurement, and simultaneously, utilize power line carrier module 30 or zigbee module 90 to realize the short distance communication between a node MCU data processing module 20 and root node MCU data processing module 40, and realize the long distance communication between root node MCU data processing module 40 and temperature monitoring server 60 through 4G module 50, thereby very big reduction 4G module 50's use amount, and then very big reduction the running cost, and need not lay wire in addition, easy operation is convenient.
It will be apparent to those skilled in the art that various changes and modifications may be made without departing from the spirit and scope of the invention. Thus, if such modifications and variations of the present invention fall within the scope of the claims and their equivalents, the present invention is also intended to include such modifications and variations.
Claims (10)
1. A dense bus temperature measurement system is characterized by comprising:
the non-contact temperature monitoring assembly comprises a temperature measuring bracket and a temperature sensor which is arranged on the temperature measuring bracket and provided with a sensing end facing the dense bus;
the branch node MCU data processing module is connected with the temperature sensor through a communication cable and is used for receiving temperature detection data acquired by the temperature sensor;
the root node MCU data processing module is in communication connection with the branch node MCU data processing module through a power carrier module or a zigbee module, and the power carrier module or the zigbee module is connected with the branch node MCU data processing module through a communication cable;
the temperature monitoring server is in communication connection with the root node MCU data processing module through the 4G module, and the 4G module is connected with the root node MCU data processing module through a communication cable.
2. The dense bus temperature measurement system of claim 1, wherein the temperature measurement bracket is erected above the dense bus, and the sensing end of the temperature sensor is arranged downward toward the dense bus.
3. The dense bus thermometry system of claim 1, wherein the number of temperature sensors is the same as the number of bundles of the dense bus.
4. The dense bus bar temperature measurement system of claim 1, wherein the temperature sensors are arranged in one-to-one correspondence with the dense bus bars.
5. The dense bus thermometry system of claim 1, wherein the power carrier module is connected at the dense bus above the air switch.
6. The intensive bus temperature measurement system according to claim 1, wherein the temperature sensor, the branch node MCU data processing module and the power carrier module are arranged in a branch node fitting box, and one branch node fitting box is arranged in each floor.
7. The bus-bar-based temperature measurement system of claim 1, wherein the temperature sensor, the branch node MCU data processing module and the zigbee module are arranged in a branch node fitting box, and one branch node fitting box is arranged in each floor.
8. The intensive bus thermometry system of claim 1, wherein the temperature sensor, root node MCU data processing module and 4G module are arranged in one root node fitting box, one for each building.
9. The intensive bus bar temperature measurement system of claim 1, further comprising a voltage conversion module, wherein in the branch node fitting box, an input end of the voltage conversion module is electrically connected to the intensive bus bar, and an output end of the voltage conversion module is electrically connected to the branch node MCU data processing module, the temperature sensor and the power carrier module, respectively.
10. The intensive bus bar temperature measurement system of claim 1, further comprising a voltage conversion module, wherein in the root node fitting box, an input end of the voltage conversion module is electrically connected with the intensive bus bar, and an output end of the voltage conversion module is electrically connected with the temperature sensor, the root node MCU data processing module and the 4G module respectively.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122864901.3U CN217901025U (en) | 2021-11-22 | 2021-11-22 | Intensive bus temperature measurement system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122864901.3U CN217901025U (en) | 2021-11-22 | 2021-11-22 | Intensive bus temperature measurement system |
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| Publication Number | Publication Date |
|---|---|
| CN217901025U true CN217901025U (en) | 2022-11-25 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202122864901.3U Active CN217901025U (en) | 2021-11-22 | 2021-11-22 | Intensive bus temperature measurement system |
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| CN (1) | CN217901025U (en) |
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2021
- 2021-11-22 CN CN202122864901.3U patent/CN217901025U/en active Active
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