CN217890698U - Clamping device for processing semiconductor precision die - Google Patents

Clamping device for processing semiconductor precision die Download PDF

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Publication number
CN217890698U
CN217890698U CN202221019681.2U CN202221019681U CN217890698U CN 217890698 U CN217890698 U CN 217890698U CN 202221019681 U CN202221019681 U CN 202221019681U CN 217890698 U CN217890698 U CN 217890698U
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CN
China
Prior art keywords
bottom plate
clamping device
plate
sliding
inboard
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Expired - Fee Related
Application number
CN202221019681.2U
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Chinese (zh)
Inventor
周杰
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Besi Leshan Co ltd
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Besi Leshan Co ltd
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Priority to CN202221019681.2U priority Critical patent/CN217890698U/en
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Abstract

The utility model belongs to the technical field of the semiconductor, especially, be a clamping device is used in accurate mould processing of semiconductor, comprising a base plate, the top of bottom plate is provided with the machined part, the both sides of machined part are provided with the grip block, the inboard sliding connection of bottom plate has the sliding block, the top of sliding block and the top fixed mounting that is located the bottom plate have the regulating plate, grip block sliding connection is in the inboard of regulating plate. This clamping device is used in processing of accurate mould of semiconductor can drive the bull stick through rotating the knob and rotate, and the rotation of bull stick can drive the screw rod and rotate, under spacing left and right sides of spacing ring, can make the sliding block horizontal slip in the bottom plate, through adjusting the position of sliding block in the bottom plate, the position of adjustable regulating plate, and then the initial distance of the grip block of adjusting the machined part both sides for the centre gripping of the machined part of device suitability not unidimensional, the practicality of improvement device.

Description

Clamping device for processing semiconductor precision die
Technical Field
The utility model relates to the field of semiconductor technology, specifically be a clamping device is used in processing of accurate mould of semiconductor.
Background
The semiconductor is a material with the conductivity between a conductor and an insulator at normal temperature, the conductivity of the semiconductor is controllable, the conductivity of the semiconductor ranges from the insulator to the conductor, the semiconductor influences the daily work and life of people from the aspects of science, technology and economic development, and when the semiconductor precision mold is machined at present, a clamping device cannot stably clamp molds with different sizes, so that a plurality of groups of clamps with different specifications are required, the use is inconvenient, and the machining cost and steps are increased.
SUMMERY OF THE UTILITY MODEL
Not enough to prior art, the utility model provides a clamping device is used in processing of accurate mould of semiconductor has solved the problem that exists today.
In order to achieve the above purpose, the utility model provides a following technical scheme: the utility model provides a clamping device is used in processing of accurate mould of semiconductor, includes the bottom plate, the top of bottom plate is provided with the machined part, the both sides of machined part are provided with the grip block, the inboard sliding connection of bottom plate has the sliding block, the top of sliding block and the top fixed mounting who is located the bottom plate have the regulating plate, grip block sliding connection is in the inboard of regulating plate.
As the utility model discloses a preferred technical scheme, the sliding tray has been seted up to the inboard of bottom plate, sliding block sliding connection is in the inboard of sliding tray, the inboard threaded connection of sliding block has the screw rod, the one end fixed mounting that the sliding block was kept away from to the screw rod has the bull stick, the bull stick rotates the outside of connecting the inner wall at the bottom plate and extending to the bottom plate, the spacing ring has been cup jointed in the outside of bull stick
As a preferred technical scheme of the utility model, the spacing groove has been seted up to the inner wall of bottom plate, spacing ring sliding connection is at the spacing inslot.
As a preferred technical scheme of the utility model, the inside groove has been seted up at the top of regulating plate, the inboard fixed mounting of inside groove has the cross axle, the outside of cross axle is rotated and is connected with the regulation pole, the one end of adjusting the pole extends to the top of regulating plate, the outside of adjusting the pole and the outside fixed mounting that is located the cross axle have a rotating gear, the inboard of regulating plate and the bottom sliding connection that is located rotating gear have the pinion rack, the outside fixed mounting of pinion rack has the ejector pad.
As a preferred technical scheme of the utility model, the other end fixedly connected with of regulation pole supports the pole, the outside sliding connection who supports the pole has the stop collar, stop collar sliding connection is in the bottom of inside groove, the bottom of inside groove is the arc design, fixed mounting has spacing spring between stop collar and the regulation pole.
As an optimal technical scheme of the utility model, the ejector pad just is connected for the wedge with the grip block laminating each other.
As an optimized technical scheme of the utility model, the rotating gear and pinion rack intermeshing.
As an optimized technical scheme of the utility model, the outside of bull stick and the outside fixed mounting that is located the bottom plate have the knob.
Compared with the prior art, the utility model provides a clamping device is used in accurate mould processing of semiconductor possesses following beneficial effect:
1. this clamping device is used in processing of accurate mould of semiconductor can drive the bull stick through rotating the knob and rotate, and the rotation of bull stick can drive the screw rod and rotate, under spacing left and right sides of spacing ring, can make the sliding block horizontal slip in the bottom plate, through adjusting the position of sliding block in the bottom plate, the position of adjustable regulating plate, and then the initial distance of the grip block of adjusting the machined part both sides for the centre gripping of the machined part of device suitability not unidimensional, the practicality of improvement device.
2. This clamping device is used in processing of accurate mould of semiconductor, adjust the pole through stirring and move to opposite direction, just can drive the slewing gear through adjusting the pole and rotate, when changing the angle, drive the pinion rack rather than meshing motion towards the reverse motion to realize the pinion rack and move ejector pad reverse motion, the steady state between ejector pad and the grip block is broken, thereby the grip block can stop exerting the effect of clamping force to the machined part, has reached the effect that conveniently takes off the machined part this moment.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a side view of the internal structure of the internal groove of the present invention;
fig. 3 is a top view of the structure near the toothed plate of the present invention;
fig. 4 is a top view of the internal structure of the bottom plate of the present invention.
In the figure: 1. a base plate; 2. processing a workpiece; 3. an adjusting plate; 4. a clamping plate; 5. an inner tank; 6. adjusting a rod; 7. a horizontal axis; 8. a support rod; 9. a position limiting sleeve; 10. a limiting spring; 11. a rotating gear; 12. a knob; 13. a toothed plate; 14. a push block; 15. a sliding groove; 16. a slider; 17. a screw; 18. a limiting ring; 19. a rotating rod; 20. a limiting groove.
Detailed Description
In the following, only certain exemplary embodiments are briefly described. As those skilled in the art will recognize, the described embodiments may be modified in various different ways, all without departing from the spirit or scope of the present invention. Accordingly, the drawings and description are to be regarded as illustrative in nature, and not as restrictive.
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", and the like, indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or to implicitly indicate the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically limited otherwise.
In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," and "fixed" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally formed; the connection can be mechanical connection, electrical connection or communication; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present invention can be understood according to specific situations by those of ordinary skill in the art.
In the present disclosure, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise direct contact between the first and second features, or may comprise contact between the first and second features not directly. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly above and obliquely above the second feature, or simply meaning that the first feature is at a lesser level than the second feature.
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts all belong to the protection scope of the present invention.
Referring to fig. 1-4, in the present embodiment: the utility model provides a clamping device is used in processing of accurate mould of semiconductor, comprising a base plate 1, the top of bottom plate 1 is provided with machined part 2, the both sides of machined part 2 are provided with grip block 4, the inboard sliding connection of bottom plate 1 has sliding block 16, sliding block 16's top and the top fixed mounting who is located bottom plate 1 have regulating plate 3, 4 sliding connection of grip block are in the inboard of regulating plate 3, machined part 2 specifically is for waiting to process the accurate mould of semiconductor, through the position of adjusting sliding block 16 in bottom plate 1, the position of adjustable regulating plate 3, and then adjust the initial distance of grip block 4 of 2 both sides of machined part, make the device be applicable to the centre gripping of the machined part 2 of not unidimensional, and the practicability of the device is improved.
In this embodiment, sliding tray 15 has been seted up to bottom plate 1's inboard, sliding block 16 sliding connection is in sliding tray 15's inboard, sliding block 16's inboard threaded connection has screw rod 17, sliding block 16's one end fixed mounting is kept away from to screw rod 17 has bull stick 19, bull stick 19 rotates to be connected at bottom plate 1's inner wall and extends to bottom plate 1's the outside, spacing ring 18 has been cup jointed in bull stick 19's the outside, spacing groove 20 has been seted up to bottom plate 1's inner wall, spacing ring 18 sliding connection is in spacing groove 20, can drive screw rod 17 through bull stick 19's rotation and rotate, under spacing left and right sides of spacing ring 18, can make sliding block 16 horizontal slip in bottom plate 1, the outside of bull stick 19 and the outside fixed mounting that is located bottom plate 1 have knob 12, knob 12 symmetric distribution is in bottom plate 1's both sides, can drive bull stick 19 through rotating knob 12 and rotate.
As shown in fig. 2, the other end of the adjusting rod 6 is fixedly connected with a resisting rod 8, the outer side of the resisting rod 8 is slidably connected with a limiting sleeve 9, the limiting sleeve 9 is slidably connected to the bottom of the inner groove 5, the bottom of the inner groove 5 is designed in an arc shape, and a limiting spring 10 is fixedly installed between the limiting sleeve 9 and the adjusting rod 6, in this embodiment, when the adjusting rod 6 is pulled, the limiting sleeve 9 slides in the inner groove 5, when the pulling angle of the adjusting rod 6 reaches the maximum, that is, when the adjusting rod 6 is in a non-vertical state in the inner groove 5, the limiting spring 10 is in an initial state, and does not have an elastic force effect, the limiting sleeve 9 is no longer in contact with the groove wall of the inner groove 5, at this time, if the adjusting rod 6 rotates back, the limiting sleeve 9 connected therewith needs to be subjected to a friction force again, so that the angle of the adjusting rod 6 is fixed without an external force, the angle of the rotating gear 11 rotating synchronously therewith also remains stationary at this time, and the toothed plate 13 also remains stationary, and the external force of the toothed plate 13 disappears, the pushing block 14 is misaligned with the clamping plate 4, and the workpiece 14 remains stable, thereby achieving the clamping effect of the clamping plate 2. When the adjusting rod 6 is perpendicular to the top of the adjusting plate 3, the limiting spring 10 is compressed, and the friction force between the inner walls of the inner grooves 5 of the limiting sleeves 9 is maximum.
As shown in fig. 3, the contact surfaces between the push block 14 and the clamping plates 4 are mutually attached, the top of the adjusting plate 3 is provided with an inner groove 5, the inner side of the inner groove 5 is fixedly provided with a transverse shaft 7, the outer side of the transverse shaft 7 is rotatably connected with an adjusting rod 6, one end of the adjusting rod 6 extends to the upper side of the adjusting plate 3, the outer side of the adjusting rod 6 and the outer side of the transverse shaft 7 are fixedly provided with a rotating gear 11, the inner side of the adjusting plate 3 and the bottom of the rotating gear 11 are slidably connected with a toothed plate 13, the outer side of the toothed plate 13 is fixedly provided with a push block 14, the rotating gear 11 and the toothed plate 13 are mutually engaged, the push block 14 and the clamping plates 4 are mutually attached and in a wedge-shaped connection, in this embodiment, the push block 4 can be pushed to mutually approach each other by shifting the adjusting rod 6 to drive the rotating gear 11 to rotate in the inner groove 5 and drive the toothed plate 13 to slide in the adjusting plate 3, the push block 14 to move, when the surface of the push block 14 is misaligned between the clamping plates 4, the clamping block 14 becomes a stable clamping force generated by the clamping block 4, and the clamping force of the clamping plate 4 is received by the clamping block 2, and the clamping block is stably received by the adjusting plate 2, and the clamping block 2.
The utility model discloses a theory of operation and use flow: an operator can drive the rotating rod 19 to rotate through rotating the knob 12, the rotating rod 19 can drive the screw rod 17 to rotate, under the limiting left and right of the limiting ring 18, the sliding block 16 can slide left and right in the bottom plate 1, the position of the adjusting plate 3 can be adjusted by adjusting the position of the sliding block 16 in the bottom plate 1, the initial distance of the clamping plates 4 on the two sides of the workpiece 2 is further adjusted, on the premise of the initial position, the toggle adjusting rod 6 is controlled to drive the rotating gear 11 to rotate in the inner groove 5 and drive the toothed plate 13 to slide in the adjusting plate 3, the toothed plate 13 can push the push block 14 to move, the push block 14 pushes the clamping plates 4 to slide in the adjusting plate 3, the clamping plates 4 are close to and clamp the workpiece 2, at the moment, the clamping force of the clamping plates 4 on the workpiece 2 is not very large, the rotating rod 19 needs to be driven to move again through the rotation of the knob 12, so that the screw rod 17 is controlled under the action of the limiting ring 18, the two sliding blocks 16 are driven to be close to, the workpiece 2 can be completely fixed, and the workpiece 2 can be completely fixed in actual operation, and the workpiece 2 can be adjusted and finished for 2-3 times.
After processing is finished, the workpiece 2 needs to be taken down, when another workpiece 2 with the same specification is reinstalled, at the moment, only the adjusting rod 6 needs to be shifted to move in the opposite direction, the rotating gear 11 can be driven to rotate through the adjusting rod 6, the angle is changed, meanwhile, the toothed plate 13 which is in meshing motion with the adjusting rod is driven to move in the opposite direction, the toothed plate 13 can move the pushing block 14 in the opposite direction, the stable state between the pushing block 14 and the clamping plate 4 is broken, the clamping plate 4 can stop exerting the clamping force on the workpiece 2, and the effect of conveniently taking down the workpiece 2 is achieved at the moment.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described in the foregoing embodiments, or equivalents may be substituted for elements thereof. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims (8)

1. The utility model provides a clamping device is used in processing of semiconductor precision mould, includes bottom plate (1), the top of bottom plate (1) is provided with machined part (2), the both sides of machined part (2) are provided with grip block (4), its characterized in that: the inboard sliding connection of bottom plate (1) has sliding block (16), the top of sliding block (16) and the top fixed mounting who is located bottom plate (1) have regulating plate (3), grip block (4) sliding connection is in the inboard of regulating plate (3).
2. The clamping device for precision mold processing of semiconductors as claimed in claim 1, wherein: sliding tray (15) have been seted up to the inboard of bottom plate (1), sliding block (16) sliding connection is in the inboard of sliding tray (15), the inboard threaded connection of sliding block (16) has screw rod (17), the one end fixed mounting that sliding block (16) were kept away from in screw rod (17) has bull stick (19), bull stick (19) rotate to be connected in the inner wall of bottom plate (1) and extend to the outside of bottom plate (1), spacing ring (18) have been cup jointed in the outside of bull stick (19).
3. The clamping device for semiconductor precision mold processing according to claim 2, characterized in that: the inner wall of the bottom plate (1) is provided with a limiting groove (20), and the limiting ring (18) is connected in the limiting groove (20) in a sliding mode.
4. The clamping device for processing the semiconductor precision mold according to claim 1, wherein: inside groove (5) have been seted up at the top of regulating plate (3), the inboard fixed mounting of inside groove (5) has cross axle (7), the outside of cross axle (7) is rotated and is connected with regulation pole (6), the one end of adjusting pole (6) extends to the top of regulating plate (3), the outside fixed mounting who just is located cross axle (7) in the outside of adjusting pole (6) has rotating gear (11), the inboard bottom sliding connection who just is located rotating gear (11) of regulating plate (3) has pinion rack (13), the outside fixed mounting of pinion rack (13) has ejector pad (14).
5. The clamping device for semiconductor precision mold processing according to claim 4, wherein: the other end of the adjusting rod (6) is fixedly connected with a supporting rod (8), the outer side of the supporting rod (8) is connected with a limiting sleeve (9) in a sliding mode, the limiting sleeve (9) is connected to the bottom of the inner groove (5) in a sliding mode, the bottom of the inner groove (5) is designed in an arc mode, and a limiting spring (10) is fixedly installed between the limiting sleeve (9) and the adjusting rod (6).
6. The clamping device for semiconductor precision mold processing according to claim 4, wherein: the push block (14) and the clamping plate (4) are mutually attached and are in wedge-shaped connection.
7. The clamping device for semiconductor precision mold processing according to claim 4, wherein: the rotating gear (11) is meshed with the toothed plate (13).
8. The clamping device for semiconductor precision mold processing according to claim 2, characterized in that: and a knob (12) is fixedly arranged on the outer side of the rotating rod (19) and the outer side of the bottom plate (1).
CN202221019681.2U 2022-04-29 2022-04-29 Clamping device for processing semiconductor precision die Expired - Fee Related CN217890698U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202221019681.2U CN217890698U (en) 2022-04-29 2022-04-29 Clamping device for processing semiconductor precision die

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202221019681.2U CN217890698U (en) 2022-04-29 2022-04-29 Clamping device for processing semiconductor precision die

Publications (1)

Publication Number Publication Date
CN217890698U true CN217890698U (en) 2022-11-25

Family

ID=84111194

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202221019681.2U Expired - Fee Related CN217890698U (en) 2022-04-29 2022-04-29 Clamping device for processing semiconductor precision die

Country Status (1)

Country Link
CN (1) CN217890698U (en)

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CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20221125

CF01 Termination of patent right due to non-payment of annual fee