CN217884240U - Heat sink device - Google Patents
Heat sink device Download PDFInfo
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- CN217884240U CN217884240U CN202220553164.7U CN202220553164U CN217884240U CN 217884240 U CN217884240 U CN 217884240U CN 202220553164 U CN202220553164 U CN 202220553164U CN 217884240 U CN217884240 U CN 217884240U
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Abstract
The utility model discloses a heat dissipation device. The heat dissipating double-fuselage includes: the heat dissipation module comprises a shell assembly, a heat dissipation assembly, a heat conduction assembly and a circuit board; the heat dissipation assembly is arranged on the shell assembly; the heat conducting component is stacked on the heat radiating component and is used for being attached to the equipment to be radiated so as to conduct heat generated by the equipment to be radiated to the heat radiating component; the circuit board is arranged on the shell component; the circuit board is provided with a first side and a second side which are arranged oppositely, the first side faces the heat conduction assembly, the second side deviates from the heat conduction assembly, at least part of components integrated on the circuit board are arranged on the second side of the circuit board, and a sealing element is arranged between the edge of the circuit board and the shell assembly and used for limiting liquid formed by condensation from flowing to the second side from the first side. In this way, the utility model discloses heat abstractor's leakproofness can be improved to reduce the liquid that the condensation formed to heat abstractor's influence.
Description
Technical Field
The utility model relates to a heat dissipation technical field especially relates to a heat abstractor.
Background
With the diversification of functions of electronic devices such as mobile phones, users often use mobile phones for a long time, which causes high body temperature after the mobile phones are used for a period of time, and easily damages the mobile phone batteries and other components. Therefore, the mobile phone can be cooled by the heat sink, but in the process of using the heat sink, the temperature of the surface of the heat sink may be lower than the critical temperature for liquefying the intake airflow, so that condensed liquid such as condensed water is formed on the surface of the heat sink, and the condensed water easily flows into the heat sink from gaps on the surface of the heat sink, so as to corrode various devices in the heat sink, thereby affecting the normal operation of the heat sink.
SUMMERY OF THE UTILITY MODEL
In view of this, the present invention provides a heat dissipation device, which can improve the sealing performance of the heat dissipation device to reduce the influence of the liquid formed by condensation on the heat dissipation device.
In order to solve the technical problem, the utility model discloses a technical scheme be: a heat dissipation device is provided, which comprises a shell component, a heat dissipation component, a heat conduction component and a circuit board; the heat dissipation assembly is arranged on the shell assembly; the heat conducting component is stacked on the heat radiating component and is used for being attached to the equipment to be radiated so as to conduct heat generated by the equipment to be radiated to the heat radiating component; the circuit board is arranged on the shell component; the circuit board is provided with a first side and a second side which are oppositely arranged, the first side faces the heat conducting assembly, the second side deviates from the heat conducting assembly, at least part of components integrated on the circuit board are arranged on the second side of the circuit board, and a sealing element is arranged between the edge of the circuit board and the shell assembly and used for limiting liquid formed by condensation to flow from the first side to the second side.
In an embodiment of the present invention, the housing assembly includes an outer housing and a bearing member; the outer shell is arranged around the periphery of the bearing piece, and a circuit board mounting area is formed by matching the outer shell and the bearing piece; the circuit board is arranged in the circuit board mounting area, and the sealing element is arranged between the circuit board and the shell body of the circuit board mounting area and between the circuit board and the bearing piece of the circuit board mounting area.
In an embodiment of the present invention, the supporting member is provided with a surrounding bone; the surrounding bone and the outer shell are matched to form a circuit board mounting area; wherein, the sealing member is arranged between the circuit board and the surrounding bone.
In an embodiment of the present invention, the thickness of the circuit board is smaller than the height of the surrounding bone.
In an embodiment of the present invention, the width of the gap between the circuit board and the surrounding bone is 0.2mm.
In an embodiment of the present invention, the heat dissipation assembly includes a semiconductor refrigeration member; the surrounding bone is arranged around the periphery of the semiconductor refrigerating piece.
In an embodiment of the present invention, the heat dissipation assembly includes a semiconductor refrigeration piece; the circuit board is arranged around the periphery of the semiconductor refrigerating piece in an enclosing mode.
In an embodiment of the present invention, the heat dissipation assembly includes a semiconductor refrigeration component and a heat dissipation fan; the semiconductor refrigerating piece and the cooling fan are sequentially arranged along the direction away from the heat conducting assembly, and the cooling fan is located on the second side.
In an embodiment of the present invention, the heat conducting assembly includes a first heat conducting member and a second heat conducting member stacked in sequence along a direction away from the heat dissipating assembly, and elasticity of the second heat conducting member is superior to elasticity of the first heat conducting member.
In an embodiment of the present invention, the heat dissipation assembly includes a semiconductor refrigeration member; the shell assembly comprises a connecting shell, the connecting shell is arranged on one side, facing the heat conducting assembly, of the circuit board, the connecting shell is arranged around the semiconductor refrigerating piece, and a connecting groove is formed in the connecting shell; the heat dissipation device further comprises a magnetic part, and the magnetic part is arranged in the connecting groove and used for attracting the equipment to be dissipated.
The utility model has the advantages that: be different from prior art, the utility model discloses integrated in at least part components and parts of circuit board among the heat abstractor establishes and is located the one side second side that heat-conducting component was kept away from to the circuit board, and at least part components and parts do not set up the one side at the liquid that the easy contact condensation of circuit board formed promptly, even inside the liquid inflow heat abstractor that the condensation formed, also can reduce the risk of this part components and parts on the liquid corrosion circuit board that the condensation formed at least. And, be equipped with the sealing member between the edge of circuit board and the casing subassembly for the liquid that the restriction condensation formed flows through from the clearance between circuit board and the casing subassembly, thereby the liquid that the restriction condensation formed flows to the second side from the first side, in order to improve heat abstractor's leakproofness, the liquid that reduces the condensation formation leads to establishing the components and parts short circuit that are located the circuit board second side or the risk of being corroded, and reduce the risk that the liquid that the condensation formed corrodes other parts of heat abstractor of locating the circuit board second side, in other words, the utility model discloses can improve heat abstractor's leakproofness, in order to reduce the influence of the liquid that the condensation formed to heat abstractor.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the invention and together with the description, serve to explain the principles of the invention. Moreover, the drawings and the description are not intended to limit the scope of the inventive concept in any way, but rather to illustrate it by those skilled in the art with reference to specific embodiments.
Fig. 1 is a schematic structural view of an embodiment of the heat dissipation device of the present invention;
fig. 2 is a schematic structural diagram of an embodiment of the circuit board, the heat dissipation assembly and a part of the housing assembly of the present invention;
FIG. 3 isbase:Sub>A schematic cross-sectional view of the circuit board, the heat sink assembly andbase:Sub>A portion of the housing assembly shown in FIG. 2 along the A-A direction;
FIG. 4 is a schematic view of a portion of the circuit board, heat sink assembly and a portion of the housing assembly shown in FIG. 3 in the area α;
fig. 5 is a schematic structural diagram of an embodiment of the carrier of the present invention;
fig. 6 is a schematic structural view of an embodiment of the connecting housing and the magnetic member of the present invention;
fig. 7 is a schematic structural view of another embodiment of the connecting housing and the magnetic member of the present invention;
fig. 8 is a schematic structural diagram of an embodiment of the heat conducting assembly of the present invention;
fig. 9 is a schematic sectional view of the heat transfer assembly of fig. 7 taken along the direction B-B.
Detailed Description
To make the objects, technical solutions and advantages of the present invention clearer, embodiments of the present invention are combined to clearly and completely describe the technical solutions in the embodiments of the present invention, and obviously, the described embodiments are some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention. The embodiments described below and the features of the embodiments can be combined with each other without conflict.
In order to solve the technical problem that the function of the heat dissipation device is affected by the condensed water flowing into the heat dissipation device in the prior art, the utility model provides a heat dissipation device. The heat dissipation device comprises a shell assembly, a heat dissipation assembly, a heat conduction assembly and a circuit board; the heat dissipation assembly is arranged on the shell assembly; the heat conducting component is stacked on the heat radiating component and is used for being attached to the equipment to be radiated so as to conduct heat generated by the equipment to be radiated to the heat radiating component; the circuit board is arranged on the shell component; the circuit board is provided with a first side and a second side which are oppositely arranged, the first side faces the heat conducting assembly, the second side deviates from the heat conducting assembly, at least part of components integrated on the circuit board are arranged on the second side of the circuit board, and a sealing element is arranged between the edge of the circuit board and the shell assembly and used for limiting liquid formed by condensation to flow from the first side to the second side. The following is to explain the utility model discloses heat abstractor in detail.
Referring to fig. 1 and fig. 2, fig. 1 is a schematic structural diagram of an embodiment of the heat dissipation device of the present invention, and fig. 2 is a schematic structural diagram of an embodiment of the circuit board, the heat dissipation assembly, and a portion of the housing assembly of the present invention.
In one embodiment, the heat dissipation device includes a housing assembly 10, a heat dissipation assembly 20, a heat conducting assembly 30, and a circuit board 40.
The shell assembly 10 can bear all parts of the heat dissipation device, protect all parts and bear equipment to be cooled, so that the heat dissipation device can dissipate heat of the borne equipment to be cooled; for example, the device to be cooled may be a mobile phone, a tablet computer, a notebook computer, etc., and will not be described herein again.
The heat dissipation assembly 20 is arranged on the housing assembly 10, and as the name suggests, the heat dissipation assembly 20 can dissipate heat of the equipment to be dissipated, which is borne by the heat dissipation device, and reduce the temperature of the machine body of the equipment to be dissipated, so as to reduce the risk of damage of the equipment to be dissipated due to overhigh temperature, and effectively reduce the potential safety hazard of the equipment to be dissipated due to overhigh temperature.
The heat dissipation assembly 20 can dissipate heat of the device to be dissipated by heat conduction, in other words, the temperature of the heat dissipation assembly 20 is lower than that of the device to be dissipated, so that when the device to be dissipated and the heat dissipation assembly 20 are close to each other, the heat of the body of the device to be dissipated can be conducted to the heat dissipation assembly 20 to dissipate heat, thereby reducing the temperature of the device to be dissipated and achieving the heat dissipation effect.
The heat conducting assembly 30 is stacked on the heat dissipating assembly 20, the heat conducting assembly 30 is attached to the device to be dissipated, and when a temperature difference exists between the device to be dissipated and the heat dissipating assembly 20, that is, the temperature of the device to be dissipated is higher than the temperature of the heat dissipating assembly 20, the heat conducting assembly 30 conducts heat generated by the device to be dissipated to the heat dissipating assembly 20, so as to reduce the temperature of the device to be dissipated.
The circuit board 40 is disposed on the housing assembly 10, and is equivalent to a main board of the heat dissipation device for coordinating the components of the heat dissipation device to work together. The circuit board 40 has a first side and a second side which are arranged oppositely, the first side faces the heat conducting assembly 30, the second side deviates from the heat conducting assembly 30, at least part of components integrated on the circuit board 40 are arranged on the second side of the circuit board 40, namely, at least part of components are arranged on one side far away from the heat conducting assembly 30, part of components can be arranged on the second side of the circuit board 40, and all components can be arranged on the second side of the circuit board 40. Also, a seal 50 is provided between the edge of the circuit board 40 and the housing assembly 10 to restrict the flow of liquid formed by condensation from the first side to the second side.
It is easy to understand that when the heat dissipation device dissipates heat to the device to be dissipated, a liquid formed by condensation, such as condensed water, may flow from one side of the heat conducting assembly 30 to the circuit board 40 and the heat dissipating assembly 20, in other words, a condensed liquid (i.e., a liquid formed by condensation, which is described below as a condensed liquid instead of a liquid formed by condensation) is more likely to appear on a surface of one side of the circuit board 40 facing the heat conducting assembly 30, i.e., the first side of the circuit board 40 is more likely to be affected by the condensed liquid than the second side, which results in a short circuit of the circuit board 40 or corrosion of the circuit board 40, and thus normal implementation of the function of the circuit board 40 is affected. Therefore, at least part of the components integrated on the circuit board 40 is arranged on the second side, which is beneficial to reducing the possibility that the condensed liquid flows to the at least part of the components, so as to at least reduce the risk that the part of the circuit is short-circuited or corroded to fail to normally realize the function; and, be equipped with sealing member 50 between the edge of circuit board 40 and casing subassembly 10 to improve heat abstractor's leakproofness, thereby further restrict the condensate liquid flow to be located the components and parts on the second side, can also restrict the condensate liquid flow to locate other parts that circuit board 40 kept away from heat-conducting component 30 one side, with the risk that reduces the short circuit of circuit and components and parts/other parts are corroded, and then reduce the condensate liquid to heat abstractor's influence.
Referring to fig. 2 to 4, fig. 3 isbase:Sub>A schematic cross-sectional view of the circuit board, the heat dissipation assembly andbase:Sub>A portion of the housing assembly shown in fig. 2 alongbase:Sub>A directionbase:Sub>A-base:Sub>A, and fig. 4 isbase:Sub>A schematic partial structure view of the circuit board, the heat dissipation assembly andbase:Sub>A portion of the housing assembly shown in fig. 3 in an area α.
In an embodiment, the housing assembly 10 includes an outer housing 11 and a carrier 12. The outer housing 11 is disposed around the outer periphery of the carrier 12, and a circuit board mounting area 41 (as shown in fig. 4) is formed between the outer housing 11 and the carrier 12, which corresponds to the circuit board mounting area 41 formed by the outer housing 11 and the carrier 12, the circuit board 40 can be disposed in the circuit board mounting area 41, and the carrier 12 can carry the circuit board 40. Also, a sealing member 50 may be provided between the circuit board 40 and the outer case 11 of the circuit board mounting area 41 to seal a gap between the circuit board 40 and the outer case 11, and reduce condensed liquid flowing into the second side of the circuit board 40 from the gap between the circuit board 40 and the outer case 11; further, a sealing member 50 is further disposed between the circuit board 40 and the carrier 12 of the circuit board mounting region 41 to seal a gap between the circuit board 40 and the carrier 12, so as to reduce condensed liquid flowing into the second side of the circuit board 40 from the gap between the circuit board 40 and the carrier 12.
Alternatively, the sealing member 50 may be a sealing silicone or the like. Taking the sealing element 50 as a sealing silica gel as an example, a semi-dense sealing silica gel may be applied to the edge of the circuit board 40 by an automatic dispenser or the like in the gap between the circuit board 40 and the outer casing 11 and the gap between the circuit board 40 and the carrier 12, and the sealing silica gel is waited to be solidified to seal the gap between the circuit board 40 and the outer casing 11/the carrier 12, so as to limit the condensed liquid from flowing from the first side to the second side of the circuit board 40, thereby achieving the waterproof effect.
Further, please refer to fig. 1, fig. 2, fig. 4 and fig. 5 in combination, wherein fig. 5 is a schematic structural diagram of an embodiment of the supporting member of the present invention.
The carrier 12 is provided with a collar 121 (as shown in fig. 5), and the collar 121 and the outer housing 11 cooperate to form a circuit board mounting area 41. The sealing member 50 is disposed between the circuit board 40 and the surrounding frame 121 to seal a gap between the circuit board 40 and the carrier 12, and further surround and fix the circuit board 40 through the surrounding frame 121, so that the circuit board 40 can be fixed inside the heat sink. Accordingly, to accommodate the appearance of the surround 121 and the outer case 11, the circuit board 40 may be made with a special-shaped appearance to increase the surface area of the first/second sides of the circuit board 40 and to enlarge the area of the circuit board 40 for the integration of components and wiring.
Still further, the thickness of the circuit board 40 may be less than the height of the perimeter bone 121 to reduce the risk that the height of the perimeter bone 121 is too low and the sealing effect is affected due to insufficient sealing member 50 between the circuit board 40 and the perimeter bone 121. In an alternative embodiment, the thickness of the circuit board 40 may be equal to the height of the surrounding bone 121, or the thickness of the circuit board 40 may be greater than the height of the surrounding bone 121. Wherein the height of the circumferential bone 121 refers to the length of the circumferential bone 121 in the direction opposite to the heat conducting assembly 30 (shown in fig. 1) and the heat dissipating assembly 20.
Optionally, the width of the gap between the circuit board 40 and the surrounding bone 121 is 0.2mm, so that it can be avoided that the gap between the circuit board 40 and the surrounding bone 121 is too large, which causes the sealing element 50 to fall off from the gap between the circuit board 40 and the surrounding bone 121; the gap between the circuit board 40 and the surrounding bone 121 can be prevented from being too small, so that the sealing element 50 is not enough to seal the gap between the circuit board 40 and the surrounding bone 121, and the sealing effect of the heat dissipation device is further influenced. In alternative embodiments, the width of the gap between the circuit board 40 and the surrounding bone 121 may also be 0.13mm, 0.15mm, 0.18mm, 0.25mm, etc., which is not limited herein.
Optionally, the heat dissipating assembly 20 includes a semiconductor cooling member 21, and the surrounding rib 121 may be disposed around the semiconductor cooling member 21 to improve the compactness of the heat dissipating device and reduce the volume of the heat dissipating device. The semiconductor cooling member 21 may be made of a semiconductor material using a peltier effect, such as TEC (Thermo Electric Cooler). The peltier effect is a phenomenon in which when a direct current passes through a couple composed of two semiconductor materials, one end absorbs heat and the other end releases heat. The semiconductor cooling element 21 comprises a number of pairs (groups) of P-type and N-type, connected together by electrodes and sandwiched between two ceramic electrodes; when current flows through the semiconductor cooling member 21, heat generated by the current is transferred from one side of the semiconductor cooling member 21 to the other side, creating a "hot" side and a "cold" side on the semiconductor cooling member 21. When the heat dissipation device dissipates heat for the equipment to be dissipated, the side of the semiconductor cooling element 21 facing the heat conduction assembly 30 is a "cold" side, so as to allow heat of the equipment to be dissipated to be conducted to the semiconductor cooling element 21.
Please continue to refer to fig. 2 and 3. In an embodiment, the circuit board 40 may be disposed around the periphery of the semiconductor cooling element 21 to improve the compactness of the heat dissipation device and reduce the volume of the heat dissipation device.
Please continue to refer to fig. 1-3. In an embodiment, the heat dissipation assembly 20 includes a semiconductor cooling element 21 and a heat dissipation fan 22, the semiconductor cooling element 21 and the heat dissipation fan 22 are sequentially disposed along a direction away from the heat conduction assembly 30, and the heat dissipation fan 22 is located at the second side. When the heat dissipation device dissipates heat to the device to be dissipated, the semiconductor refrigerating element 21 is arranged towards the heat conducting assembly 30 from the cold side and the heat dissipating fan 22 from the hot side, so that heat can be dissipated from the semiconductor refrigerating element 21 through the cold side and from the semiconductor refrigerating element 21 through the heat dissipating fan 22 when heat of external electronic equipment is conducted to the heat conducting assembly 30, and the heat dissipation effect is improved.
Referring to fig. 1, fig. 2 and fig. 6, fig. 6 is a schematic structural diagram of an embodiment of the connecting housing and the magnetic member according to the present invention. In an embodiment, the housing assembly 10 further includes a connecting housing 13, the connecting housing 13 is disposed on a side of the circuit board 40 facing the heat conducting assembly 30, the connecting housing 13 surrounds the semiconductor cooling element 21, and the connecting housing 13 is provided with a connecting slot 131. The heat dissipation device further comprises a magnetic part 60, wherein the magnetic part 60 is arranged in the connecting groove 131 and used for attracting the equipment to be cooled through magnetic force, so that the equipment to be cooled can be stably stopped on the heat dissipation device.
Alternatively, the magnetic member 60 may be a magnet or the like. One side of the connection housing 13 facing the heat conducting assembly 30 may be provided with an adhesive layer 132 (as shown in fig. 7), such as a double-sided adhesive tape, to adhere the heat conducting assembly 30 to the connection housing 13, so as to reduce the risk of separation between the heat conducting assembly 30 and the semiconductor cooling element 21, and to ensure that the heat of the heat conducting assembly 30 can be timely conducted to the heat dissipating assembly 20 for heat dissipation.
Referring to fig. 8 and 9, fig. 8 is a schematic structural view of a heat conducting assembly according to an embodiment of the present invention, and fig. 9 is a schematic sectional structural view of the heat conducting assembly shown in fig. 8 along a direction B-B.
In an embodiment, the heat conducting assembly 30 includes a first heat conducting member 31 and a second heat conducting member 32 stacked in sequence along a direction away from the heat dissipating assembly 20 (as shown in fig. 2), that is, the second heat conducting member 32 is used for contacting the device to be dissipated, the elasticity of the second heat conducting member 32 is better than that of the first heat conducting member 31, the second heat conducting member 32 is easily elastically deformed relative to the first heat conducting member 31, which is beneficial to improving the touch feeling of the heat dissipating apparatus, and when the device to be dissipated is loaded on the heat dissipating apparatus, the second heat conducting member 32 can elastically deform to adapt to the shape of the device to be dissipated, so that the contact area between the heat conducting assembly 30 and the device to be dissipated is increased, so as to improve the heat conduction efficiency, and thus, the heat dissipating effect is improved. Meanwhile, the friction force of the surface of the second heat conducting member 32 is greater than that of the surface of the first heat conducting member 31, so that the equipment to be cooled can be stably parked on the heat dissipation device, and the risk that the equipment to be cooled is separated from the heat dissipation device is reduced.
Alternatively, the first heat conducting member 31 may be made of copper-aluminum alloy, pure copper, aluminum alloy, or the like, which has good heat conducting property, and the second heat conducting member 32 may be a silica gel pad, heat conducting silicone grease, or the like.
Furthermore, in the present disclosure, unless otherwise explicitly stated or limited, the terms "connected," "stacked," and the like are to be construed broadly, e.g., as being fixedly connected, detachably connected, or integrated; they may be directly connected or indirectly connected through intervening media, or may be connected through the use of two elements or the interaction of two elements. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; although the present invention has been described in detail with reference to the foregoing embodiments, it should be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; such modifications and substitutions do not depart from the spirit and scope of the present invention.
Claims (10)
1. A heat dissipating device, comprising:
a housing assembly;
the heat dissipation assembly is arranged on the shell assembly;
the heat conduction assembly is laminated on the heat dissipation assembly and is used for being attached to equipment to be dissipated so as to conduct heat generated by the equipment to be dissipated to the heat dissipation assembly;
the circuit board is arranged on the shell assembly;
the circuit board is provided with a first side and a second side which are oppositely arranged, the first side faces the heat conduction assembly, the second side deviates from the heat conduction assembly, at least part of components integrated on the circuit board are arranged on the second side of the circuit board, a sealing element is arranged between the edge of the circuit board and the shell assembly and used for limiting liquid formed by condensation to flow from the first side to the second side.
2. The heat dissipating device of claim 1,
the housing assembly comprises an outer housing and a carrier;
the outer shell is arranged around the periphery of the bearing piece, and a circuit board mounting area is formed by matching the outer shell and the bearing piece;
the circuit board is arranged in the circuit board mounting area, and the sealing element is arranged between the circuit board and the shell body of the circuit board mounting area and between the circuit board and the bearing piece of the circuit board mounting area.
3. The heat dissipating device of claim 2,
the bearing piece is provided with a surrounding bone;
the surrounding bone and the outer shell are matched to form the circuit board mounting area;
wherein the sealing member is arranged between the circuit board and the surrounding bone.
4. The heat dissipating device of claim 3,
the thickness of the circuit board is smaller than the height of the surrounding bone.
5. The heat dissipating device of claim 3,
the width of the gap between the circuit board and the surrounding bone is 0.2mm.
6. The heat dissipating device of claim 3,
the heat dissipation assembly comprises a semiconductor refrigerating piece;
the surrounding bone is arranged around the periphery of the semiconductor refrigerating piece.
7. The heat dissipating device according to any one of claims 1 to 6,
the heat dissipation assembly comprises a semiconductor refrigerating piece;
the circuit board is arranged around the periphery of the semiconductor refrigerating piece in a surrounding mode.
8. The heat dissipating device according to any one of claims 1 to 6,
the heat dissipation assembly comprises a semiconductor refrigeration piece and a heat dissipation fan;
the semiconductor refrigerating piece and the cooling fan are sequentially arranged in the direction away from the heat conducting assembly, and the cooling fan is located on the second side.
9. The heat dissipating device of claim 1,
the heat conduction assembly comprises a first heat conduction piece and a second heat conduction piece which are sequentially stacked along the direction far away from the heat dissipation assembly, and the elasticity of the second heat conduction piece is superior to that of the first heat conduction piece.
10. The heat dissipating device of claim 1,
the heat dissipation assembly comprises a semiconductor refrigeration piece;
the shell assembly comprises a connecting shell, the connecting shell is arranged on one side, facing the heat conducting assembly, of the circuit board, the connecting shell surrounds the semiconductor refrigerating piece, and the connecting shell is provided with a connecting groove;
the heat dissipation device further comprises a magnetic part, and the magnetic part is arranged on the connecting groove and used for attracting the equipment to be dissipated.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220553164.7U CN217884240U (en) | 2022-03-14 | 2022-03-14 | Heat sink device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220553164.7U CN217884240U (en) | 2022-03-14 | 2022-03-14 | Heat sink device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217884240U true CN217884240U (en) | 2022-11-22 |
Family
ID=84085828
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202220553164.7U Active CN217884240U (en) | 2022-03-14 | 2022-03-14 | Heat sink device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217884240U (en) |
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2022
- 2022-03-14 CN CN202220553164.7U patent/CN217884240U/en active Active
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