CN217884013U - Reflow oven for SMT (surface mount technology) patch processing - Google Patents

Abstract

The embodiment of the utility model relates to the technical field of SMT paster processing, in particular to a reflow oven for SMT paster processing, which comprises a reflow oven main body, a circulating pipeline arranged on the reflow oven main body and used for circulating hot air, and a hot air mechanism arranged on the circulating pipeline and used for heating air, wherein a material carrying frame is connected inside the reflow oven main body in a sliding way through a sliding mechanism, and a driving mechanism used for driving the material carrying frame to move is arranged on the reflow oven main body; the inside of carrying the material frame is provided with first year material district and second year material district, the inside in first year material district and second year material district all is provided with the waffle slab, be provided with the fixed establishment who is used for fixed material on the waffle slab, be provided with the fan in the reflow oven main part. The utility model has the advantages that: when in actual use, through the cooperation in first year material district and second year material district, do not need longer heat time, and need not wait for the material cooling alone, promote work efficiency.

Description

Reflow oven is used in processing of SMT paster

Technical Field

The utility model relates to a SMT paster processing technology field, concretely relates to reflow oven is used in SMT paster processing.

Background

The reflow oven is also called reflow oven (reflow soldering, reflow oven), is a kind of equipment needed by SMT process in the electronic technology industry, the reflow oven process is to melt the paste soft solder pre-distributed on the printed board pad, to realize the soft soldering of mechanical and electrical connection between the soldering terminal or pin of the surface assembled component and the printed board pad, the reflow oven is the last key process of SMT (surface mount technology), which is a real-time process control;

when the existing reflow furnace is in actual use, materials are usually placed into the reflow furnace, the reflow furnace is heated circularly through a hot air mechanism, and after the materials are processed, the materials are taken out and are loaded with new materials;

however, in actual use, after the materials are processed, the materials need to be cooled, after the temperature inside the reflow oven is reduced, the oven door is opened to take out the processed materials, then new materials are loaded into the oven door, the reflow oven needs to be heated again, the required heating time is long, the working efficiency is low, the materials can be taken out from the reflow oven only after the materials are cooled separately, one end of time is needed for cooling, and the working efficiency is low.

Therefore, a reflow oven for SMT sheet processing is required to overcome the above problems.

SUMMERY OF THE UTILITY MODEL

In order to solve the problem, the embodiment of the utility model provides a reflow oven is used in processing of SMT paster has realized solving the purpose of the problem that proposes among the background art.

The embodiment of the utility model provides a in order to realize above-mentioned purpose, specifically adopt following technical scheme: a reflow oven for SMT (surface mount technology) patch processing comprises a reflow oven main body, a circulating pipeline arranged on the reflow oven main body and used for circulating hot air, and a hot air mechanism arranged on the circulating pipeline and used for heating air, wherein a material carrying frame is connected inside the reflow oven main body in a sliding mode through a sliding mechanism, and a driving mechanism used for driving the material carrying frame to move is arranged on the reflow oven main body; the inside of carrying the material frame is provided with first year material district and second year material district, the inside in first year material district and second year material district all is provided with the waffle slab, be provided with the fixed establishment who is used for fixed material on the waffle slab, be provided with the fan in the reflow oven main part.

As a further improvement of the above technical solution:

the sliding mechanism comprises sliding rails arranged on two sides of the material loading frame and pulleys fixedly connected inside the reflow furnace main body and capable of sliding inside the sliding rails.

The driving mechanism comprises a gear groove arranged on the material carrying frame, a gear which is rotatably arranged in the reflow furnace main body and meshed with the gear groove, and a motor for driving the gear to rotate.

The fixing mechanism comprises a fixing block fixedly connected to the bottom of the grid plate, a sliding block arranged inside the fixing block through elastic sliding of a spring, and a clamping block fixedly connected to the sliding block.

The slider rotates to be connected in the inside of fixed block, the clamp splice is "T" font.

The utility model discloses beneficial effect does:

when the reflow furnace is in actual use, materials are fixed in a first material carrying area through a fixing mechanism, then the first material carrying area is sent into the reflow furnace main body through a driving mechanism, the interior of the reflow furnace main body is heated through a hot air mechanism and a circulating pipeline, so that the processing of the materials is completed, after the processing is completed, the processed materials do not need to be cooled, the first material carrying area is directly sent out of the reflow furnace main body through the driving mechanism, meanwhile, a second material carrying area (materials on the first material carrying area can be loaded on the second material carrying area when the reflow furnace main body heats the materials on the first material carrying area) is sent into the reflow furnace main body, the temperature of the interior of the reflow furnace main body does not change greatly because the interior of the reflow furnace main body is not cooled, the interior of the reflow furnace main body does not need to be heated for a long time, the materials on the first material carrying area are cooled through a fan after the first material carrying area is sent out of the reflow furnace main body, and when the temperature is reduced, the materials on the second material carrying area are heated and do not need to be independently waited for cooling; when in actual use, carry the cooperation in material district through first year material district and second, do not need longer heat time, and do not need to wait for the material cooling alone, promote work efficiency.

Drawings

Fig. 1 is a schematic structural view of a first viewing angle of the present invention;

fig. 2 is a schematic structural view of a second viewing angle of the present invention;

fig. 3 is a schematic cross-sectional view of the present invention;

FIG. 4 is a schematic view of the structure of the material loading frame of the present invention;

fig. 5 is a schematic sectional view of the fixing mechanism of the present invention;

fig. 6 is an enlarged view of the structure at a in fig. 5.

In the figure: 1. a reflow oven main body; 2. a circulation pipe; 3. a hot air mechanism; 4. a sliding mechanism; 41. a slide rail; 42. a pulley; 5. a material loading frame; 6. a drive mechanism; 61. a gear groove; 62. a gear; 63. a motor; 7. a first loading area; 8. a second loading area; 9. a fixing mechanism; 91. a fixed block; 92. a slider; 93. a clamping block; 94. a spring; 10. a grid plate; 11. a fan.

Detailed Description

Preferred embodiments of the present invention will be described below with reference to the accompanying drawings. It should be understood by those skilled in the art that these embodiments are only for explaining the technical principle of the present invention, and are not intended to limit the scope of the present invention.

Referring to fig. 1 to 6, an embodiment of the present invention discloses a reflow oven for SMT patch processing, including a reflow oven main body 1, a circulation pipeline 2 arranged on the reflow oven main body 1 for circulating hot air, and a hot air mechanism 3 arranged on the circulation pipeline 2 for heating air, wherein the inside of the reflow oven main body 1 is slidably connected with a material carrying frame 5 through a sliding mechanism 4, the reflow oven main body 1 is provided with a driving mechanism 6 for driving the material carrying frame 5 to move, and the reflow oven main body 1 is provided with a fan 11;

a first material loading area 7 and a second material loading area 8 are arranged inside the material loading frame 5, grid plates 10 are arranged inside the first material loading area 7 and the second material loading area 8, and a fixing mechanism 9 for fixing materials is arranged on the grid plates 10;

when the reflow furnace is in actual use, materials are fixed in the first material carrying area 7 through the fixing mechanism 9, then the first material carrying area 7 is sent into the reflow furnace main body 1 through the driving mechanism 6, the interior of the reflow furnace main body 1 is heated through the hot air mechanism 3 and the circulating pipeline 2, and the processing of the materials is finished, after the processing is finished, the processed materials do not need to be cooled, the first material carrying area 7 is directly sent out from the reflow furnace main body 1 through the driving mechanism 6, meanwhile, the second material carrying area 8 (when the reflow furnace main body 1 carries out heating processing on the materials on the first material carrying area 7, the materials which are processed instead can be loaded on the second material carrying area 8) is sent into the reflow furnace main body 1, as the interior of the reflow furnace main body 1 is not cooled, the temperature of the interior of the reflow furnace main body does not change greatly, the temperature of the interior of the reflow furnace does not need to be heated for a long time, after the first material carrying area 7 is sent out from the interior of the reflow furnace main body 1, the materials on the first material carrying area 7 are cooled through the fan 11, and when the temperature is reduced, the reflow furnace main body 1 carries out independent heating processing on the materials on the second material carrying area 8, and the material which is not needed to be cooled;

when in actual use, through the cooperation in first year material district 7 and second year material district 8, do not need longer heat time, and need not wait for the material cooling alone, promote work efficiency.

As further illustration of the present application: the sliding mechanism 4 comprises sliding rails 41 arranged at two sides of the material loading frame 5 and pulleys 42 fixedly connected inside the reflow oven main body 1 and capable of sliding inside the sliding rails 41;

in actual use, when the drive mechanism 6 drives the carriage frame 5 to move, the slide rails 41 on the carriage frame 5 slide outside the pulleys 42, thereby reducing the friction between the carriage frame 5 and the reflow furnace main body 1.

As further illustration of the present application: the driving mechanism 6 comprises a gear groove 61 arranged on the material loading frame 5, a gear 62 which is rotatably arranged in the reflow oven main body 1 and is meshed with the gear groove 61, and a motor 63 for driving the gear 62 to rotate;

the motor 63 drives the gear 62 to rotate, so that the loading frame 5 is driven to move under the meshing of the gear 62 and the gear groove 61.

As further illustration of the present application: the fixing mechanism 9 comprises a fixing block 91 fixedly connected to the bottom of the grid plate 10, a slide block 92 arranged in the fixing block 91 through a spring 94 in an elastic sliding manner, and a clamping block 93 fixedly connected to the slide block 92;

when the material is clamped and fixed by the fixing mechanism 9, the clamping block 93 is lifted up, then the material is placed below the clamping block 93, and the clamping block 93 is loosened, so that the material is clamped and fixed by the clamping block 93 under the elastic action of the spring 94.

As further illustration of the present application: slider 92 rotates to be connected in the inside of fixed block 91, and clamp splice 93 is "T" font, and slider 92 can rotate in the inside of fixed block 91 to make clamp splice 93 rotate, can rotate clamp splice 93 according to the actual conditions of material, the clamp splice 93 of being convenient for fixes the material, and the clamp splice 93 of "T" font can increase the area of contact between clamp splice 93 and the material, is convenient for carry out the centre gripping.

It should be noted that in the description of the present invention, the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. indicating the directions or positional relationships are based on the directions or positional relationships shown in the drawings, which are only for convenience of description, and do not indicate or imply that the device or element must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

Furthermore, it should be noted that, in the description of the present invention, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood by those skilled in the art according to specific situations.

The terms "comprises," "comprising," or any other similar term are intended to cover a non-exclusive inclusion, such that a process, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, article, or apparatus.

So far, the technical solution of the present invention has been described with reference to the preferred embodiments shown in the drawings, but it is easily understood by those skilled in the art that the scope of the present invention is obviously not limited to these specific embodiments. Equivalent changes or substitutions can be made on the related technical features by those skilled in the art without departing from the principle of the invention, and the technical scheme after the changes or substitutions will fall into the protection scope of the invention.

Claims (5)

1. A reflow oven for SMT patch processing comprises a reflow oven main body (1), a circulating pipeline (2) arranged on the reflow oven main body (1) and used for circulating hot air, and a hot air mechanism (3) arranged on the circulating pipeline (2) and used for heating air, and is characterized in that a material carrying frame (5) is connected to the inside of the reflow oven main body (1) in a sliding mode through a sliding mechanism (4), a driving mechanism (6) used for driving the material carrying frame (5) to move is arranged on the reflow oven main body (1), and a fan (11) is arranged on the reflow oven main body (1);

the material loading device is characterized in that a first material loading area (7) and a second material loading area (8) are arranged inside the material loading frame (5), grid plates (10) are arranged inside the first material loading area (7) and the second material loading area (8), and fixing mechanisms (9) used for fixing materials are arranged on the grid plates (10).

2. A reflow oven for SMT patch processing according to claim 1, wherein the sliding mechanism (4) comprises sliding rails (41) disposed at both sides of the loading frame (5), and pulleys (42) fixedly connected inside the reflow oven body (1) and slidable inside the sliding rails (41).

3. A reflow oven for SMT chip processing according to claim 1, wherein the driving mechanism (6) comprises a gear groove (61) disposed on the material loading frame (5), a gear (62) rotatably disposed inside the reflow oven body (1) and engaged with the gear groove (61), and a motor (63) for driving the gear (62) to rotate.

4. A reflow oven for SMT patch processing according to claim 1, wherein the fixing mechanism (9) comprises a fixing block (91) fixedly connected to the bottom of the grid plate (10), a slider (92) elastically slidably disposed inside the fixing block (91) through a spring (94), and a clamping block (93) fixedly connected to the slider (92).

5. An SMT chip processing reflow oven according to claim 4, wherein the slide block (92) is rotatably connected to an inside of the fixing block (91), and the clamping block (93) is T-shaped.

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