CN217883795U

CN217883795U - Wireless earphone

Info

Publication number: CN217883795U
Application number: CN202222101902.7U
Authority: CN
Inventors: 王梦阳
Original assignee: Beijing Xiaomi Mobile Software Co Ltd
Current assignee: Beijing Xiaomi Mobile Software Co Ltd
Priority date: 2022-08-10
Filing date: 2022-08-10
Publication date: 2022-11-22
Anticipated expiration: 2032-08-10

Abstract

The utility model discloses a wireless earphone, including casing assembly, circuit board, microphone and sealing member. The housing assembly includes an accommodating chamber and a first acoustic opening in communication with the accommodating chamber. The circuit board is at least partially arranged in the accommodating cavity and is provided with a second acoustic hole. The microphone is arranged on the circuit board and provided with a sound receiving cavity communicated with the second sound receiving hole. The sealing element comprises a first sealing layer, a second sealing layer and a supporting layer arranged between the first sealing layer and the second sealing layer, and the sealing element is provided with a sound channel penetrating through the first sealing layer, the supporting layer and the first sealing layer. The first sealing layer is in sealing bonding with the shell assembly, and the second sealing layer is in sealing bonding with the circuit board, so that the first sound receiving hole is communicated with the second sound receiving hole through the sound channel. The radio receiving sealing performance of the wireless earphone is good, and the speaking quality of the wireless earphone is improved.

Description

Wireless earphone

Technical Field

The present disclosure relates to the field of sound production technology, and in particular, to a wireless headset.

Background

Earphones, as a sound emitting device, are becoming more and more important in people's life and work. At present, with the improvement of the sound quality of the wireless earphone and the improvement of the manufacturing level, the wireless earphone is favored by more and more consumers. A Microphone (MIC), a circuit board, a battery, and other components are stacked in the wireless headset.

In the related art, the microphone is integrated on the circuit board, and the sound receiving cavity of the microphone is communicated with the sound receiving hole on the shell assembly. However, in the conventional wireless earphone, the sealing structure connected between the sound receiving cavity and the sound receiving hole is easily affected by assembly errors, so that the sealing effect is poor, the sound receiving effect of the microphone is affected, and the improvement of the speech quality of the earphone is not facilitated.

SUMMERY OF THE UTILITY MODEL

The present disclosure provides a wireless headset. The radio receiving sealing performance of the wireless earphone is good, and the speaking quality of the wireless earphone is improved.

The technical scheme is as follows:

according to a first aspect of embodiments of the present disclosure, there is provided a wireless headset comprising a housing assembly, a circuit board, a microphone, and a seal. The housing assembly comprises an accommodating cavity and a first acoustic hole communicated with the accommodating cavity. The circuit board is at least partially arranged in the accommodating cavity and is provided with a second acoustic hole. The microphone is arranged on the circuit board and provided with a sound receiving cavity communicated with the second sound receiving hole. The sealing element comprises a first sealing layer, a second sealing layer and a supporting layer arranged between the first sealing layer and the second sealing layer, and the sealing element is provided with a sound channel penetrating through the first sealing layer, the supporting layer and the first sealing layer. The first sealing layer is in sealing bonding with the shell assembly, and the second sealing layer is in sealing bonding with the circuit board, so that the first acoustic opening is communicated with the second acoustic opening through the sound channel.

The technical scheme provided by the embodiment of the disclosure can have the following beneficial effects:

when the wireless earphone is used, at least part of the circuit board is arranged in the accommodating cavity of the shell assembly, and the microphone is arranged on the circuit board. The first sealing layer is in sealing bonding with the shell assembly, and the second sealing layer is in sealing bonding with the circuit board, so that the first acoustic opening is communicated with the second acoustic opening through the sound channel, and the sound receiving cavity of the microphone is communicated with the first acoustic opening. Because the first sealing layer is in sealing bonding with the shell assembly, and the second sealing layer is in sealing bonding with the circuit board, the sound cannot leak in the process of being transmitted from the first sound receiving hole to the second sound receiving hole. Therefore, the radio receiving sealing performance of the wireless earphone is good, and the speaking quality of the wireless earphone is improved.

The technical solution of the present disclosure is further explained below:

in one embodiment, the total deformation of the first sealing layer and the second sealing layer is greater than or equal to 0.15mm; and/or at least one of the first sealing layer and the second sealing layer is foam cotton glue, and the supporting layer is mesh cloth.

In one embodiment, at least two microphones are arranged on the circuit board at intervals, and the first acoustic opening, the second acoustic opening and the sealing element are respectively in one-to-one correspondence with the microphones.

In one embodiment, the housing assembly includes an antenna support and a first housing forming a receiving cavity with the antenna support. At least one microphone is a feedforward microphone, the antenna bracket is provided with a first sound receiving hole, and the corresponding sealing element is arranged between the antenna bracket and the circuit board so as to enable the sound receiving cavity of the feedforward microphone to be communicated with the first sound receiving hole of the antenna bracket.

And/or at least one microphone is a communication microphone, the first shell is provided with a first sound receiving hole, and the corresponding sealing element is arranged between the first shell and the circuit board so as to enable the sound receiving cavity of the communication microphone to be communicated with the first sound receiving hole of the first shell.

In one embodiment, the antenna bracket is provided with a convex part, the convex part and the circuit board are clamped with a sealing piece, and the first acoustic opening is arranged on the convex part.

And/or, the antenna bracket comprises a supporting rib, the first shell is provided with a pressure-bearing surface which is arranged opposite to the supporting rib, and the supporting rib abuts against the circuit board so that the sealing element is clamped between the circuit board and the pressure-bearing surface.

And/or the antenna bracket is fixed with the first shell in a buckling mode, and the circuit board is clamped and fixed in the shell assembly.

In one embodiment, the wireless headset further includes an elastic support disposed opposite to the protrusion and between the microphone and the first housing.

In one embodiment, the housing assembly further includes a second housing, the second housing is matched with the first housing to fix the antenna support, and the second housing is provided with a third acoustic opening, and the third acoustic opening is communicated with the first acoustic opening of the antenna support.

In one embodiment, the first housing is cylindrical, the first acoustic opening disposed in the first housing includes a first hole communicating with the acoustic channel and a second hole communicating with the first hole, and an inlet of the second hole is disposed at an end of the first housing.

In one embodiment, the wireless earphone further comprises a magnetic attraction piece, wherein the magnetic attraction piece is fixedly arranged on the shell component and supports the circuit board.

In one embodiment, the magnetic member is at least partially embedded in the housing assembly, and the magnetic member is adhesively fixed to the circuit board.

And/or the magnetic suction pieces are at least two and are arranged on the shell component at intervals and support the middle part of the circuit board.

In one embodiment, the wireless headset further includes a charging element embedded in the housing assembly, the charging element is disposed between two adjacent magnetic attraction elements and insulated from the magnetic attraction elements, one end of the charging element is electrically connected to the circuit board, and the other end of the charging element is exposed outside the housing assembly.

It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the disclosure.

Drawings

Brief description of the drawingsthe accompanying drawings, which are included to provide a further understanding of the disclosure, illustrate embodiments of the disclosure and together with the description serve to explain the disclosure and are not intended to limit the disclosure.

In order to more clearly illustrate the technical solutions in the embodiments of the present disclosure, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present disclosure, and it is obvious for those skilled in the art to obtain other drawings based on the drawings without creative efforts.

Fig. 1 is a schematic structural diagram (the internal components are indicated by dotted lines) of a wireless headset shown in an embodiment.

Fig. 2 is a schematic diagram of a partial structure of the wireless headset shown in fig. 1.

Fig. 3 is a schematic cross-sectional view of the wireless headset shown in fig. 2 (with the addition of a third housing).

Description of the reference numerals:

10. a wireless headset; 100. a housing assembly; 110. an accommodating chamber; 111. a first acoustic hole; 101. a first hole; 102. a second hole; 120. a first housing; 121. a pressure bearing face; 130. an antenna mount; 131. a convex portion; 132. supporting ribs; 140. a second housing; 141. a third acoustic hole; 200. a control main board; 210. a second acoustic hole; 300. a seal member; 310. a first sealing layer; 320. a first sealing layer; 330. a support layer; 340. a sound channel; 400. a microphone; 410. a sound receiving cavity; 500. a battery; 600. an elastic support member; 700. a magnetic member; 800. a charging member.

Detailed Description

For the purpose of making the purpose, technical solutions and advantages of the present disclosure more apparent, the present disclosure will be described in further detail below with reference to the accompanying drawings and detailed description. It should be understood that the detailed description and specific examples, while indicating the scope of the disclosure, are intended for purposes of illustration only and are not intended to limit the scope of the disclosure.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs. The terminology used herein in the description of the disclosure is for the purpose of describing particular embodiments only and is not intended to be limiting of the disclosure.

The earphone as a sound producing device has become an indispensable scientific and technological product in the life, study and entertainment process of people. Along with the development of wireless earphones with wireless communication functions, the wireless earphones are various in types and brands, so that consumers can select a plurality of wireless earphones, and how to obtain the favor of the consumers becomes a problem that wireless earphone manufacturers attach more and more importance.

At present, a Microphone (MIC), a circuit board, a battery, and other components are stacked in a wireless headset. In the related art, the microphone is integrated on the circuit board, and the sound receiving cavity of the microphone is communicated with the sound receiving hole on the shell assembly. However, in the conventional wireless earphone, the sealing structure connected between the sound receiving cavity and the sound receiving hole is easily affected by assembly errors, so that the sealing effect is poor, the sound receiving effect of the microphone is affected, and the improvement of the speech quality of the earphone is not facilitated.

Based on this, the present disclosure provides a wireless headset. The radio receiving sealing performance of the wireless earphone is good, and the speaking quality of the wireless earphone is improved.

The wireless headset of the present disclosure is explained below with reference to the drawings.

As shown in fig. 1-3, in an embodiment of the present disclosure, a wireless headset 10 includes a housing assembly 100, a circuit board, a microphone 400, and a seal 300. The housing assembly 100 includes a receiving chamber 110 and a first acoustic opening 111 communicating with the receiving chamber 110. The circuit board is at least partially disposed in the accommodating cavity 110, and the circuit board is provided with a second acoustic opening 210. The microphone 400 is disposed on the circuit board, and the microphone 400 is provided with a sound receiving cavity 410 communicated with the second sound receiving hole 210. The seal 300 includes a first seal layer 320310, a second seal layer, and a support layer 330 disposed between the first seal layer 320310 and the second seal layer, the seal being provided with an acoustic channel 340 extending through the first seal layer 320310, the support layer 330, and the first seal layer 320310. The first sealing layer 320310 is hermetically adhered to the housing assembly 100, and the second sealing layer is hermetically adhered to the circuit board, so that the first acoustic opening 111 is communicated with the second acoustic opening 210 through the acoustic passage 340.

When the wireless headset 10 is used, the circuit board is at least partially disposed in the accommodating cavity 110 of the housing assembly 100, and the microphone 400 is disposed on the circuit board. The first sealing layer 320310 is hermetically bonded to the housing assembly 100, and the second sealing layer is hermetically bonded to the circuit board, so that the first acoustic opening 111 is communicated with the second acoustic opening 210 through the acoustic channel 340, and the acoustic cavity 410 of the microphone 400 is communicated with the first acoustic opening 111. Since the first sealing layer 320310 is hermetically bonded to the housing assembly 100 and the second sealing layer is hermetically bonded to the circuit board, no leakage occurs during the transmission of sound from the first acoustic opening 111 to the second acoustic opening 210. Therefore, the wireless earphone 10 has good radio reception sealing performance, which is beneficial to improving the speech quality of the wireless earphone 10.

It should be noted that the specific implementation manner of the "housing assembly 100" can be various, for example, at least two housings are assembled to form.

As shown in fig. 1, in some embodiments, the headset further includes a battery 500, the battery 500 is used to provide power for the microphone 400 and a circuit board, and the circuit board is connected to the microphone 400 and can control the microphone 400 to receive sound.

It should be noted that the specific implementation of the "battery 500" may be various, including but not limited to a button battery 500, a cylindrical battery 500, a special-shaped battery 500, etc., and may be capable of supplying power to the earphone.

It should be noted that the specific implementation manner of the "circuit board" may be various, and it is only necessary to implement some functions of the earphone electronic control. In some embodiments, the circuit board is an electronic control board.

Optionally, in some embodiments, the headset of the present disclosure is a TWS headset, and is capable of implementing True Wireless Stereo (TWS). Because the protruding outside thickness of sound-out part is little, avoid or reduce sound-out part extrusion ear, reduce the foreign matter sense when wearing the earphone, and then can improve the travelling comfort of wearing of TWS earphone.

In one embodiment, the total deformation of the first sealant layer 320310 and the second sealant layer is greater than or equal to 0.15mm. Thus, the sealing member 300 has good deformation and tolerance capability, and is convenient for being fixed to a circuit board by pressing with the housing assembly 100 without interfering with the installation of the circuit board.

It should be noted that, the specific implementation form of the first sealing layer 320310 and/or the second sealing layer may be various, including but not limited to a sealing layer with adhesive properties such as silica gel. The supporting layer 330 may have various implementations, and can support the sealing layer, so that the sealing member 300 can be shaped without blocking the sound receiving hole.

Optionally, in some embodiments, at least one between the first sealant layer 320310 and the second sealant layer is foam. Therefore, the sealing element 300 has good bonding performance, good deformation and good tolerance capability by using the foam rubber. The sealing element 300 can ensure that the sealing yield of the microphone 400 is over 99.5 percent and the sealing consistency is good.

Optionally, in some embodiments, the support layer 330 is a mesh. Thus, the support layer 330 is thin and reliable in connection with the first seal layer 320310 and the second seal layer.

In addition to any of the above embodiments, as shown in fig. 3, in some embodiments, at least two microphones 400 are disposed on the circuit board at intervals, and the first acoustic port 111, the second acoustic port 210 and the sealing member 300 are respectively corresponding to the microphones 400 one by one. Thus, the utilization of at least two microphones 400 is beneficial to improve the sound receiving effect of the wireless earphone 10 and improve the speech quality.

Further, as shown in fig. 2 and 3, in some embodiments, the housing assembly 100 includes an antenna support 130 and a first housing 120 forming an accommodating cavity 110 with the antenna support 130. At least one microphone 400 is a feedforward microphone 400, the antenna bracket 130 is provided with a first acoustic hole 111, and the corresponding sealing member 300 is disposed between the antenna bracket 130 and the circuit board, so that the acoustic cavity 410 of the feedforward microphone 400 is communicated with the first acoustic hole 111 of the antenna bracket 130. And/or, at least one microphone 400 is a communication microphone 400, the first casing 120 is provided with a first acoustic hole 111, and the corresponding sealing member 300 is disposed between the first casing 120 and the circuit board, so that the acoustic cavity 410 of the communication microphone 400 is communicated with the first acoustic hole 111 of the first casing 120. Thus, the feedforward microphone 400 can be used to cooperate with the call microphone 400 to improve the sound quality of the wireless headset 10. Meanwhile, the sealing element 300 in any of the above embodiments can be used for fixing, so that the sound receiving sealing performance of the feedforward microphone 400 and the conversation microphone 400 is good.

In addition to any of the above-mentioned embodiments of the antenna holder 130, as shown in fig. 3, in some embodiments, the antenna holder 130 is provided with a convex portion 131, the convex portion 131 and the circuit board are sandwiched by a sealing member 300, and the first acoustic hole 111 is provided in the convex portion 131. Thus, the sealing member 300 can be better pressed by matching the convex portion 131 with the circuit board, and the sealing performance of the sealing member 300 is fully activated, so that the first sound receiving hole 111 and the second sound receiving hole 210 have good sealing performance, and sound leakage is avoided. In combination with the feedforward microphone 400, the sound receiving effect of the feedforward microphone 400 can be improved.

On the basis of any embodiment of the antenna bracket 130, as shown in fig. 3, in some embodiments, the antenna bracket 130 includes a supporting rib 132, the first housing 120 is provided with a pressure-bearing surface 121 disposed opposite to the supporting rib 132, and the supporting rib 132 abuts against the circuit board, so that the sealing member 300 is sandwiched between the circuit board and the pressure-bearing surface 121. Thus, the circuit board is pressed by the support rib 132, so that the sealing member 300 is clamped between the circuit board and the pressure bearing surface 121, the sealing member 300 can be better extruded, the sealing performance of the sealing member 300 is fully activated, good sealing performance is achieved between the first sound receiving hole 111 and the second sound receiving hole 210, and sound leakage is avoided. In combination with the call microphone 400, the sound receiving effect of the call microphone 400 can be improved.

Based on any of the above embodiments of the antenna holder 130, as shown in fig. 3, in some embodiments, the antenna holder 130 is fixed to the first housing 120 by a snap-fit, so as to clamp the circuit board in the housing assembly 100. So, realize antenna boom 130 and first casing 120 fixed through the buckle mode, easily fast assembly improves assembly efficiency.

In addition, the antenna bracket 130 and the first housing 120 are used to fix the circuit board, so that the number of fasteners can be reduced, the space inside the wireless headset 10 can be better released, the miniaturization of the wireless headset 10 can be facilitated, or a larger battery 500 can be integrated. At this time, although the circuit board cannot be strongly fixed in the thickness direction thereof, the circuit board may be fixed in the housing assembly 100 by the sealing member 300. The sealing member 300 has good adhesion and deformation ability, and does not interfere with the circuit board to be clamped.

In addition to any of the above embodiments of the protrusion 131, as shown in fig. 3, in some embodiments, the wireless headset 10 further includes an elastic support 600, and the elastic support 600 is disposed opposite to the protrusion 131 and between the microphone 400 and the first housing 120. In this way, the Li Yi elastic support 600 can fill the gap between the antenna bracket 130 and the housing assembly 100, so that the circuit board is reliably fixed.

Optionally, the elastic support 600 is a foam rubber sheet.

In addition to any of the above-mentioned embodiments of the antenna holder 130, as shown in fig. 3, in some embodiments, the housing assembly 100 further includes a second housing 140, the second housing 140 is matched with the first housing 120 to fix the antenna holder 130, the second housing 140 is provided with a third acoustic opening 141, and the third acoustic opening 141 is communicated with the first acoustic opening 111 of the antenna holder 130. Thus, the sound receiving hole can be flexibly disposed at different positions of the housing assembly 100.

Alternatively, the sealing member 300 is interposed between the antenna holder 130 and the second housing 140, and the third acoustic hole 141 communicates with the first acoustic hole 111 through the acoustic passage 340. The sealing member 300 can ensure good sealing performance between the first sound emission hole 111 and the third sound emission hole 141, and no sound leakage occurs.

In addition to any of the above-mentioned embodiments of the antenna holder 130, as shown in fig. 3, in some embodiments, the first housing 120 is cylindrical, the first acoustic opening 111 disposed in the first housing 120 includes a first hole 101 communicating with the acoustic channel 340 and a second hole 102 communicating with the first hole 101, and an inlet of the second hole 102 is disposed at an end of the first housing 120.

On the basis of any of the above embodiments, as shown in fig. 3, in some embodiments, the wireless headset 10 further includes a magnetic member 700, and the magnetic member 700 is fixed to the housing assembly 100 and supports the circuit board.

Further, in some embodiments, the magnetic member 700 is at least partially embedded in the housing assembly 100, and the magnetic member 700 is adhesively fixed to the circuit board. Thus, the magnetic attraction member 700 fully utilizes the thickness space of the housing assembly 100 for fixing, so that the structure of the wireless earphone 10 is more compact. Meanwhile, the magnetic attraction piece 700 is adhered and fixed with the circuit board, so that the circuit board is further reliably fixed in the casing assembly 100, the circuit board cannot easily shake in the casing assembly 100, and the reliability of the wireless earphone 10 is improved.

On the basis of any of the above embodiments of the magnetic member 700, in some embodiments, at least two magnetic members 700 are disposed on the housing assembly 100 at intervals and support the middle portion of the circuit board. Therefore, the strength of the wireless earphone 10 can be improved by using the at least two magnetic parts 700, and the supporting strength of the circuit board can be improved.

On the basis of any one of the above-mentioned embodiments of the magnetic attraction pieces 700, as shown in fig. 3, in some embodiments, the wireless headset 10 further includes a charging piece 800 embedded in the housing assembly 100, the charging piece 800 is disposed between two adjacent magnetic attraction pieces 700 and is insulated from the magnetic attraction pieces 700, one end of the charging piece 800 is electrically connected to the circuit board, and the other end of the charging piece 800 is exposed outside the housing assembly 100. Thus, the magnetic attraction piece 700 is matched with the magnetic attraction fitting piece on the charging device, so that the charging piece 800 is reliably electrically connected with the charging device, and the charging reliability of the wireless earphone 10 is improved.

In the description of the present disclosure, it is to be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the present disclosure and to simplify the description, but are not intended to indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and are not to be considered limiting of the present disclosure.

Furthermore, the terms "first", "second", etc. are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first," "second," etc. may explicitly or implicitly include at least one of the feature. In the description of the present disclosure, "a plurality" means at least two, e.g., two, three, etc., unless explicitly specifically limited otherwise.

In the present disclosure, unless otherwise expressly stated or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integral; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meaning of the above terms in the present disclosure can be understood by those of ordinary skill in the art as appropriate.

In the present disclosure, unless otherwise expressly stated or limited, the first feature "on" or "under" the second feature may be directly contacting the first and second features or indirectly contacting the first and second features through an intermediate. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature "under," "beneath," and "under" a second feature may be directly under or obliquely under the second feature, or may simply mean that the first feature is at a lesser elevation than the second feature.

It will be understood that when an element is referred to as being "secured to," "disposed on," "secured to," or "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. Further, when one component is considered to be "fixedly connected" to another component, the two components may be fixed by way of detachable connection, or may be fixed by way of non-detachable connection, such as socket connection, snap connection, integrally formed fixation, welding, etc., which can be realized in the conventional art, and is not cumbersome.

The technical features of the above embodiments can be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the above embodiments are not described, but should be considered as the scope of the present specification as long as there is no contradiction between the combinations of the technical features.

The above examples only show several embodiments of the present disclosure, and the description thereof is more specific and detailed, but not construed as limiting the scope of the utility model. It should be noted that various changes and modifications can be made by one skilled in the art without departing from the spirit and scope of the disclosure.

Claims

1. A wireless headset, comprising:

the shell assembly comprises an accommodating cavity and a first sound receiving hole communicated with the accommodating cavity;

the circuit board is at least partially arranged in the accommodating cavity and provided with a second sound receiving hole;

the microphone is arranged on the circuit board and provided with a sound receiving cavity communicated with the second sound receiving hole; and

the sealing element comprises a first sealing layer, a second sealing layer and a supporting layer arranged between the first sealing layer and the second sealing layer, the sealing element is provided with a sound channel penetrating through the first sealing layer, the supporting layer and the first sealing layer, the first sealing layer is in sealing bonding with the shell assembly, and the second sealing layer is in sealing bonding with the circuit board, so that the first sound receiving hole is communicated with the second sound receiving hole through the sound channel.

2. The wireless headset of claim 1, wherein the first sealing layer and the second sealing layer have a total deformation of greater than or equal to 0.15mm; and/or at least one of the first sealing layer and the second sealing layer is made of foam cotton rubber, and the supporting layer is mesh cloth.

3. The wireless headset as claimed in claim 1, wherein the number of the microphones is at least two, and the microphones are spaced apart from each other on the circuit board, and the first acoustic opening, the second acoustic opening and the sealing member are in one-to-one correspondence with the microphones respectively.

4. The wireless headset of claim 3, wherein the housing assembly comprises an antenna mount and a first housing forming the receiving cavity with the antenna mount;

at least one of the microphones is a feedforward microphone, the antenna bracket is provided with the first acoustic hole, and the corresponding sealing element is arranged between the antenna bracket and the circuit board so as to communicate the acoustic cavity of the feedforward microphone with the first acoustic hole of the antenna bracket;

and/or at least one of the microphones is a communication microphone, the first shell is provided with the first sound receiving hole, and the corresponding sealing element is arranged between the first shell and the circuit board so as to enable the sound receiving cavity of the communication microphone to be communicated with the first sound receiving hole of the first shell.

5. The wireless earphone according to claim 4, wherein the antenna holder is provided with a convex portion, the convex portion and the circuit board sandwich the sealing member, and the first acoustic hole is provided in the convex portion;

and/or the antenna bracket comprises a support rib, the first shell is provided with a pressure-bearing surface which is arranged opposite to the support rib, and the support rib abuts against the circuit board so that the sealing element is clamped between the circuit board and the pressure-bearing surface;

6. The wireless headset of claim 5, further comprising a resilient support disposed opposite the boss and between the microphone and the first housing.

7. The wireless headset of claim 4, wherein the housing assembly further comprises a second housing, the second housing cooperating with the first housing to secure the antenna mount, the second housing defining a third acoustic port, the third acoustic port communicating with the first acoustic port of the antenna mount.

8. The wireless earphone according to claim 4, wherein the first housing has a cylindrical shape, the first acoustic hole provided in the first housing includes a first hole communicating with the acoustic channel and a second hole communicating with the first hole, and an inlet of the second hole is provided at an end portion of the first housing.

9. The wireless earphone according to any one of claims 1 to 8, further comprising a magnetic member fixed to the housing assembly and supporting the circuit board.

10. The wireless headset of claim 9, wherein the magnetic element is at least partially embedded in the housing assembly and is bonded to the circuit board;

11. The wireless earphone according to claim 10, further comprising a charging element embedded in the housing assembly, wherein the charging element is disposed between two adjacent magnetic attraction elements and insulated from the magnetic attraction elements, one end of the charging element is electrically connected to the circuit board, and the other end of the charging element is exposed outside the housing assembly.