CN217881874U - Dielectric resonator antenna and communication equipment - Google Patents
Dielectric resonator antenna and communication equipment Download PDFInfo
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- CN217881874U CN217881874U CN202220815447.4U CN202220815447U CN217881874U CN 217881874 U CN217881874 U CN 217881874U CN 202220815447 U CN202220815447 U CN 202220815447U CN 217881874 U CN217881874 U CN 217881874U
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Abstract
The utility model discloses a dielectric resonator antenna and communication equipment, which comprises a dielectric resonance block, a balun, a dielectric layer and a chip; the balun includes a fixed portion; the dielectric resonance block and the fixing part are arranged on one side of the dielectric layer; the chip is arranged on one side of the dielectric layer, which is far away from the dielectric resonance block; the signal input end of the balun is connected with the chip; the fixed part with the dielectric resonance piece is connected, just the fixed part with the adaptation of dielectric resonance piece, through setting up balun to the balun structure that has the fixed part for balun's fixed part can be used for being connected with the dielectric resonance piece, realizes that dielectric resonance piece is connected with PCB, thereby has avoided adopting glue bonding or SMT welded mode to be connected dielectric resonance piece and PCB, has solved because adopt the problem of antenna performance decay or feed impedance change that bad connected modes such as glue bonding, SMT welding lead to, has improved the joint effect of dielectric resonance piece and PCB.
Description
Technical Field
The invention relates to the technical field of antennas, in particular to a dielectric resonator antenna and communication equipment.
Background
With the development of 5G technology, the performance requirements for antennas are also higher and higher. Since the dielectric resonator antenna has many advantages in terms of process and performance, the improvement of the performance of the dielectric resonator antenna can promote the development of the 5G technology.
However, at present, there are two general ways of bonding the dielectric resonator antenna and the PCB: one is by gluing and the other is by SMT soldering. However, when the glue is used for bonding, if the thickness of the glue changes by a few tenths of millimeters, the performance of the antenna can be rapidly attenuated, so that the thickness of the glue needs to be accurately controlled. When the SMT (Surface Mounted Technology) soldering is used, metal needs to be plated on the Surface of the dielectric, and then the metal on the Surface is connected to the pads on the PCB. However, the solder is uncontrollable during the soldering process, which can cause the feed impedance to change dramatically. The integration of dielectric resonator antennas is a problem to be solved.
SUMMERY OF THE UTILITY MODEL
The utility model discloses the technical problem that will solve is: provided are a dielectric resonator antenna and a communication device, which improve the joint effect of a dielectric resonator block and a PCB.
In order to solve the technical problem, the utility model discloses a technical scheme be:
a dielectric resonator antenna comprises a dielectric resonant block, a balun, a dielectric layer and a chip;
the balun includes a fixed portion;
the dielectric resonance block and the fixing part are arranged on one side of the dielectric layer;
the chip is arranged on one side of the dielectric layer, which is far away from the dielectric resonance block;
the signal input end of the balun is connected with the chip;
the fixed part is connected with the dielectric resonance block, and the fixed part is matched with the dielectric resonance block.
Further, the balun further comprises a horizontal part and a broken line part;
the horizontal part is arranged on one side of the medium layer far away from the fixed part;
one end of the folding line part is connected with the fixing part, and the other end of the folding line part is connected with the horizontal part.
Furthermore, the device also comprises a folded metal sheet;
the shape of the fold metal sheet corresponds to that of the fold part and is arranged on two sides of the fold part;
the folded metal sheet is grounded.
Further, the fixing portion includes a first metal sheet and a second metal sheet;
the first metal sheet and the second metal sheet are oppositely arranged;
the distance between the first metal sheet and the second metal sheet is matched with the thickness of the dielectric resonance block;
the first group connects the first metal sheet with a first branch port of the horizontal part, and the second group connects the second metal sheet with a second branch port of the horizontal part;
the horizontal portion has a signal input end with a different distance from the first branch port and the second branch port.
Further, the total lengths of the two sets of the fold line parts are different.
Further, the dielectric layer comprises a microstrip line ground layer, a first strip line layer, a second strip line layer and a third strip line layer which are sequentially stacked;
the microstrip line ground layer, the first strip line layer and the third strip line layer are connected in a penetrating way;
one end of the second strip line layer is connected with the chip, and the other end of the second strip line layer is connected with a signal input end of the balun;
the microstrip line stratum is close to the dielectric resonant block.
Further, the dielectric resonator block includes a plurality of groups;
and the multiple groups of dielectric resonance blocks are arranged at equal intervals in a straight line along the direction parallel to the dielectric layer.
Further, the device also comprises BGA solder balls;
the BGA solder balls are arranged on one side of the dielectric layer, which is far away from the dielectric resonant block;
the chip is connected with the dielectric layer through the BGA solder balls.
In order to solve the technical problem, the utility model discloses an another technical scheme be:
a communication device comprising a dielectric resonator antenna as described above.
The beneficial effects of the utility model reside in that: through setting balun to be the balun structure that has the fixed part, make balun's fixed part can be used for being connected with the dielectric resonance piece, realize that dielectric resonance piece is connected with PCB, thereby avoided adopting glue bonding or SMT welded mode to be connected dielectric resonance piece and PCB, solved because adopt the problem of poor connected modes such as glue bonding, SMT welding and the antenna performance decay or feed impedance change that lead to, improved the joint effect of dielectric resonance piece and PCB, thereby promote the performance of dielectric resonator antenna.
Drawings
Fig. 1 is a schematic structural diagram of a dielectric resonator antenna in an implementation of the present invention;
fig. 2 is a schematic side view of a dielectric resonator antenna in accordance with an embodiment of the present invention;
fig. 3 is a schematic diagram of a balun structure of a dielectric resonator antenna in an implementation of the present invention;
fig. 4 is a diagram illustrating simulation results of S parameters of a dielectric resonator antenna according to an embodiment of the present invention;
description of reference numerals:
1. a dielectric resonator block; 2. a balun; 21. a fixed part; 211. a first metal sheet; 212. a second metal sheet; 22. a horizontal portion; 221. a first branch port; 222. a second branch port; 23. a fold line portion; 3. a dielectric layer; 31. a microstrip line ground layer; 32. a first strip line layer; 33. a second stripline layer; 34. a third stripline layer; 4. a chip; 5. a folded metal sheet; 6. BGA solder balls.
Detailed Description
In order to explain the technical content, the objects and the effects of the present invention in detail, the following description is made with reference to the accompanying drawings in combination with the embodiments.
Referring to fig. 1, a dielectric resonator antenna includes a dielectric resonator block, a balun, a dielectric layer, and a chip;
the balun includes a fixed portion;
the dielectric resonant block and the fixing part are arranged on one side of the dielectric layer;
the chip is arranged on one side of the dielectric layer, which is far away from the dielectric resonance block;
the signal input end of the balun is connected with the chip;
the fixed part is connected with the dielectric resonance block, and the fixed part is matched with the dielectric resonance block.
As can be seen from the above description, the utility model has the advantages that: the balun structure with the fixing portion is arranged, so that the fixing portion of the balun can be used for being connected with the dielectric resonance block, the dielectric resonance block is connected with the PCB, the dielectric resonance block is prevented from being connected with the PCB in a glue bonding or SMT welding mode, the problem that antenna performance is attenuated or feed impedance changes due to the fact that poor connection modes such as glue bonding and SMT welding are adopted is solved, the joint effect of the dielectric resonance block and the PCB is improved, and the performance of the dielectric resonator antenna is improved.
Further, the balun further comprises a horizontal part and a broken line part;
the horizontal part is arranged on one side of the medium layer far away from the fixed part;
one end of the folding line part is connected with the fixing part, and the other end of the folding line part is connected with the horizontal part.
As can be seen from the above description, the balun is provided with the horizontal portion and the broken line portion, and one end of the broken line portion is connected to the fixing portion and the other end is connected to the horizontal portion, so that the original planar balun structure is converted into a 3D balun structure, and the balun can be used for both feeding and fixing the dielectric resonant block.
Furthermore, the device also comprises a folded metal sheet;
the shape of the fold-shaped metal sheet corresponds to that of the fold line part, and the fold-shaped metal sheet is arranged on two sides of the fold line part;
the folded metal sheet is grounded.
As can be seen from the above description, the folded metal sheets connected to the ground are disposed on both sides of the fold line portion, and the shape of the folded metal sheets is set to correspond to the shape of the fold line portion, so that the folded metal sheets serve as a shield for the fold line portion to shield an interference signal, thereby improving the anti-interference capability of the balun, and improving the antenna performance.
Further, the fixing portion includes a first metal sheet and a second metal sheet;
the first metal sheet and the second metal sheet are oppositely arranged;
the distance between the first metal sheet and the second metal sheet is matched with the thickness of the dielectric resonance block;
the first group connects the first metal sheet with a first branch port of the horizontal part, and the second group connects the second metal sheet with a second branch port of the horizontal part;
the horizontal portion has a signal input end with a different distance from the first branch port and the second branch port.
As can be seen from the above description, by providing the first metal sheet and the second metal sheet, and adapting the distance between the first metal sheet and the second metal sheet to the thickness of the dielectric resonator block, the first metal sheet and the second metal sheet form a fixture for fixing the dielectric resonator block, which has an effect of effectively fixing the dielectric resonator block; meanwhile, the lengths of the two branch output ends of the horizontal part are different, so that the effect of outputting differential signals is achieved.
Further, the total length of the two sets of the fold line parts is different.
As can be seen from the above description, by setting the total lengths of the two sets of broken line portions to be different, the differential signal output of the balun can be adjusted by adjusting the lengths of the broken line portions and the horizontal portion, so as to reduce the difficulty in designing the balun and provide a stable differential output signal.
Further, the dielectric layer comprises a microstrip line ground layer, a first strip line layer, a second strip line layer and a third strip line layer which are sequentially stacked;
the microstrip line ground layer, the first strip line layer and the third strip line layer are in three-layer through connection;
one end of the second strip line layer is connected with the chip, and the other end of the second strip line layer is connected with a signal input end of the balun;
the microstrip line stratum is close to the dielectric resonance block.
As can be seen from the above description, the microstrip ground layer, the first stripline layer, the second stripline layer, and the third stripline layer are provided, and the first stripline layer, the second stripline layer, and the third stripline layer form a stripline which plays a role in feeding matching and connecting the chip and the balun.
Further, the dielectric resonator block includes a plurality of groups;
and the multiple groups of dielectric resonance blocks are arranged at equal intervals in a straight line along the direction parallel to the dielectric layer.
From the above description, it can be known that, by providing a plurality of sets of cylindrical dielectric resonator blocks to form an antenna module, the gain of the antenna can be increased as much as possible while the small size is satisfied, and the radiation intensity of the antenna is improved.
Further, the device also comprises BGA solder balls;
the BGA solder balls are arranged on one side of the dielectric layer, which is far away from the dielectric resonant block;
the chip is connected with the dielectric layer through the BGA solder balls.
From the above description, the BGA solder balls are disposed on the other side of the dielectric layer, so that the chip and the dielectric layer can be connected more easily, and the process difficulty can be reduced.
Another embodiment of the present invention provides a communication device, including the above-mentioned dielectric resonator antenna.
In this embodiment, the dielectric resonator antenna may be applied to a device of a 5G millimeter wave communication system, such as a handheld mobile device or a base station antenna, and is described below by using specific embodiments:
referring to fig. 1 and 2, a dielectric resonator antenna includes a dielectric resonator block 1, a balun 2, a dielectric layer 3, a chip 4, and a BGA solder ball 6;
the dielectric resonance block 1 and the fixing part 21 are arranged on one side of the dielectric layer 3; the chip 4 is arranged on one side of the dielectric layer 3 far away from the dielectric resonance block 1; the signal input end of the balun 2 is connected with the chip 4; the fixing part 21 is connected with the dielectric resonance block 1, and the fixing part 21 is matched with the dielectric resonance block 1; the BGA solder balls 6 are arranged on one side of the dielectric layer 3, which is far away from the dielectric resonant block 1; the chip 4 is connected with the dielectric layer 3 through the BGA solder balls 6; the dielectric layer 3 comprises a microstrip line ground layer 31, a first strip line layer 32, a second strip line layer 33 and a third strip line layer 34 which are sequentially stacked; the microstrip ground layer 31, the first strip line layer 32 and the third strip line layer 34 are connected in a penetrating manner through metal columns, and the second strip line layer 33 is provided with an avoiding hole at a position corresponding to the metal columns so as not to be connected with the microstrip ground layer 31, the first strip line layer 32 and the third strip line layer 34; one end of the second stripline layer 33 is connected with the chip 4, and the other end is connected with a signal input end of the balun 2; the microstrip line ground layer 31 is close to the dielectric resonant block 1; the first stripline layer 32, the second stripline layer 33 and the third stripline layer 34 constitute a stripline for feed matching of the antenna;
referring to fig. 3, the balun 2 includes a fixing portion 21, a horizontal portion 22 and a folding line portion 23; the fixing portion 21 includes a first metal sheet 211 and a second metal sheet 212; the first metal sheet 211 and the second metal sheet 212 are oppositely arranged; the distance between the first metal sheet 211 and the second metal sheet 212 is matched with the thickness of the dielectric resonant block 1, and the dielectric resonant block 1 can be fixed in an auxiliary mode; one end of the fold line part 23 is connected to the fixing part 21, and the other end is connected to the horizontal part 22; specifically, the folding line part 23 is in an "L" shape, the folding line part 23 includes two groups, the folding height of the two groups is adapted to the thickness of the dielectric layer 3, the first group of folding line part 23 connects the first metal sheet 211 with the first branch opening 221 of the horizontal part 22, the second group of folding line part 23 connects the second metal sheet 212 with the second branch opening 222 of the horizontal part 22, and the total lengths of the two groups of folding line parts 23 are different; the horizontal part 22 is arranged on one side of the medium layer 3 far away from the fixed part 21; the distances from the signal input end of the horizontal portion 22 to the first branch port 221 and the second branch port 222 are different; a fold metal sheet 5 is further provided, the shape of the fold metal sheet 5 corresponds to the shape of the fold portion 23, and the fold metal sheet is arranged on two sides of the fold portion 23; the top layer of the folded metal sheet 5 is connected with the microstrip line ground layer 31, the bottom layer is connected with the third strip line layer 34, and the top layer is in penetrating connection with the bottom layer; the anti-interference performance of the fold part 23 is improved by arranging the fold metal sheet 5 to ensure that the reference ground also exists on the side surface of the dielectric layer 3;
when the dielectric resonator antenna structure is designed into an antenna module, a plurality of groups of dielectric resonator blocks 1 can be arranged at equal intervals in a straight line along the direction parallel to the dielectric layer 3; in an alternative embodiment, the dielectric resonance blocks 1 comprise four groups, and the four groups of the dielectric resonance blocks 1 are arranged at equal intervals in a straight line along a direction parallel to the dielectric layer 3; referring to fig. 4, it can be seen that the whole coverage N257 (26.5-29.5 GHz) frequency band can be used as a 5G millimeter wave terminal or base station antenna, which is a simulation diagram of the corresponding S parameter.
The above mentioned is only the embodiment of the present invention, and not the limitation of the patent scope of the present invention, all the equivalent transformations made by the contents of the specification and the drawings, or the direct or indirect application in the related technical field, are included in the patent protection scope of the present invention.
Claims (9)
1. A dielectric resonator antenna is characterized by comprising a dielectric resonant block, a balun, a dielectric layer and a chip;
the balun includes a fixed portion;
the dielectric resonant block and the fixing part are arranged on one side of the dielectric layer;
the chip is arranged on one side of the dielectric layer, which is far away from the dielectric resonance block;
the signal input end of the balun is connected with the chip;
the fixed part is connected with the dielectric resonance block, and the fixed part is matched with the dielectric resonance block.
2. A dielectric resonator antenna according to claim 1, wherein the balun further comprises a horizontal portion and a folded portion;
the horizontal part is arranged on one side of the medium layer far away from the fixed part;
one end of the folding line part is connected with the fixing part, and the other end of the folding line part is connected with the horizontal part.
3. A dielectric resonator antenna according to claim 2, further comprising an accordion-shaped metal sheet;
the shape of the fold metal sheet corresponds to that of the fold part and is arranged on two sides of the fold part;
the folded metal sheet is grounded.
4. A dielectric resonator antenna according to claim 2, wherein the fixing portion comprises a first metal sheet and a second metal sheet;
the first metal sheet and the second metal sheet are oppositely arranged;
the distance between the first metal sheet and the second metal sheet is matched with the thickness of the dielectric resonant block;
the first group connects the first metal sheet with a first branch port of the horizontal part, and the second group connects the second metal sheet with a second branch port of the horizontal part;
the horizontal portion has a signal input end with a different distance from the first branch port and the second branch port.
5. A dielectric resonator antenna according to claim 4, wherein the total lengths of the fold portions in the two sets are different.
6. The dielectric resonator antenna of claim 1, wherein the dielectric layer comprises a microstrip line ground layer, a first strip line layer, a second strip line layer, and a third strip line layer, which are stacked in this order;
the microstrip line ground layer, the first strip line layer and the third strip line layer are connected in a penetrating way;
one end of the second strip line layer is connected with the chip, and the other end of the second strip line layer is connected with a signal input end of the balun;
the microstrip line stratum is close to the dielectric resonance block.
7. A dielectric resonator antenna according to claim 1, wherein the dielectric resonator mass comprises a plurality of groups;
and the multiple groups of dielectric resonance blocks are arranged at equal intervals in a straight line along the direction parallel to the dielectric layer.
8. A dielectric resonator antenna according to claim 1, further comprising a BGA solder ball;
the BGA solder balls are arranged on one side, far away from the dielectric resonant block, of the dielectric layer;
and the chip is connected with the dielectric layer through the BGA solder balls.
9. A communication device comprising a dielectric resonator antenna according to any one of claims 1 to 8.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220815447.4U CN217881874U (en) | 2022-04-08 | 2022-04-08 | Dielectric resonator antenna and communication equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220815447.4U CN217881874U (en) | 2022-04-08 | 2022-04-08 | Dielectric resonator antenna and communication equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217881874U true CN217881874U (en) | 2022-11-22 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202220815447.4U Active CN217881874U (en) | 2022-04-08 | 2022-04-08 | Dielectric resonator antenna and communication equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217881874U (en) |
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2022
- 2022-04-08 CN CN202220815447.4U patent/CN217881874U/en active Active
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