CN217881437U

CN217881437U - Semiconductor equipment conveyer

Info

Publication number: CN217881437U
Application number: CN202221679086.1U
Authority: CN
Inventors: 黄中山; 唐俊
Original assignee: Shengjisheng Semiconductor Technology Shanghai Co ltd; SGS Ningbo Semiconductor Technology Co Ltd
Current assignee: Shengjisheng Semiconductor Technology Shanghai Co ltd; SGS Ningbo Semiconductor Technology Co Ltd
Priority date: 2022-07-01
Filing date: 2022-07-01
Publication date: 2022-11-22
Anticipated expiration: 2032-07-01

Abstract

The utility model discloses a semiconductor device conveyer, including wafer conveying load-bearing platform, the activity is inserted and is equipped with the ceramic member that a plurality of bottom edges all are the setting of annular slope form on the wafer conveying load-bearing platform, this semiconductor device conveyer, be different from prior art, utilize adjustment mechanism, can adjust the extension length of ceramic member bump, in order to satisfy the user demand of different production conditions, application scope is wide, secondly, utilize chucking mechanism, can be according to the production conditions of difference, to a plurality of ceramic members and the ceramic member bump on it carry out the dismouting on wafer conveying load-bearing platform, thereby can be under partial production conditions, the wafer conveying load-bearing platform that need not more renew satisfies the production demand of product, then guarantee can not cause the unusual problem that leads to the processing procedure defect of granule quantity, it is comparatively convenient to use.

Description

Semiconductor equipment conveyer

Technical Field

The utility model relates to a technical field is improved to the granule, specifically is a semiconductor equipment conveyer.

Background

The existing equipment is related to a wafer conveying bearing platform, the equipment platform is contacted with the back of the wafer, under part of production conditions, along with errors of a mechanical transmission arm, the edge of the wafer is contacted with salient points of a ceramic piece of the platform, so that abnormal particle quantity is generated, and the process defect is caused.

At present, a plurality of ceramic parts on current wafer conveying bearing platform, generally, fixed setting is on wafer conveying bearing platform, can't switch the dismouting and use according to the in service behavior of difference, under partial production condition, wafer conveying bearing platform that needs to be renewed guarantees can not cause the unusual problem that leads to the processing procedure defect of granule quantity, it is comparatively inconvenient to use, secondly, the length of stretching out of ceramic part bump is not convenient for adjust, so that can't adjust the use according to actual production condition, application scope is restricted, for this reason, we propose a semiconductor equipment conveyer.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a semiconductor device conveyer to solve the problem that proposes among the above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme: a semiconductor device conveying device comprises a wafer conveying and bearing platform, wherein a plurality of ceramic pieces with bottom end edges arranged in an annular inclined shape are movably inserted into the wafer conveying and bearing platform, inserting cavities matched with the ceramic pieces are formed in the wafer conveying and bearing platform, ceramic piece salient points are connected to the inner portions of the ceramic pieces in a sliding mode, telescopic cavities matched with the ceramic piece salient points are formed in the inner portions of the ceramic pieces, adjusting mechanisms are installed between the ceramic piece salient points and the corresponding ceramic pieces, and clamping mechanisms are installed between the ceramic pieces and the wafer conveying and bearing platform;

a first sliding block is fixed on one side wall of each ceramic part salient point, a first sliding groove matched with the corresponding first sliding block is formed in one side wall of each telescopic cavity, and a first spring is connected between the bottom end of each ceramic part salient point and the corresponding inner bottom wall of each telescopic cavity.

Preferably, the adjusting mechanism comprises a moving rod which is connected in the corresponding telescopic cavity in a sliding mode, and two sliding blocks II are fixed at two ends of the moving rod.

Preferably, the inner walls of the two sides of the telescopic cavity are respectively provided with a second sliding groove matched with the sliding block, and a second spring is connected between one end of the second sliding block and the inner wall of one side of the corresponding second sliding groove.

Preferably, a plurality of triangular blocks which are arranged at equal intervals are fixed on one side wall of the moving rod, which faces the convex point of the ceramic piece, trapezoidal blocks matched with the triangular blocks are fixed on one side wall of the convex point of the ceramic piece, a hand screw is spirally connected to the ceramic piece, and one end of the hand screw abuts against one side wall of the moving rod.

Preferably, the clamping mechanism comprises a clamping block which is slidably connected in the wafer conveying and bearing platform, one end of the clamping block is arranged in an inclined manner, a movable cavity matched with the clamping block is formed in the wafer conveying and bearing platform, a third spring is connected between the other end of the clamping block and the inner wall of one side of the movable cavity, and a clamping groove matched with the clamping block is formed in one side wall of the ceramic part.

Preferably, a third sliding block is fixed at the bottom end of the clamping block, a third sliding groove matched with the three phases of the sliding block is formed in the inner bottom wall of the movable cavity, a pushing column is fixed at the top end of the clamping block, a pushing groove matched with the pushing column is formed in the wafer conveying and bearing platform, and the pushing groove is communicated with the movable cavity.

Compared with the prior art, the beneficial effects of the utility model are that:

the utility model is different from the prior art, utilize adjustment mechanism, can adjust the extension length of ceramic member bump, in order to satisfy the user demand of different production conditions, application scope is wide, secondly, utilize chucking mechanism, can be according to the production conditions of difference, to a plurality of ceramic members and the ceramic member bump on it carry out dismouting on wafer conveying load-bearing platform, thereby can be under partial production conditions, the wafer conveying load-bearing platform that need not to be renewed satisfies the production demand of product, then guarantee can not cause the unusual problem that leads to the processing procedure defect of granule quantity, it is comparatively convenient to use.

Drawings

Fig. 1 is a schematic overall structure diagram of the present invention;

FIG. 2 is a schematic side view of the present invention;

FIG. 3 is an enlarged schematic view of the structure at the position A of the present invention;

fig. 4 is a schematic plan view of each component of the adjusting mechanism and its clamping mechanism of the present invention.

In the figure: 1. a wafer conveying and bearing platform; 2. a ceramic piece; 21. salient points of the ceramic piece; 22. a first sliding block; 23. a first spring; 3. an adjustment mechanism; 301. a travel bar; 302. a second sliding block; 303. a triangular block; 304. a second spring; 305. screwing the screw by hand; 306. a trapezoidal block; 4. inserting a cavity; 5. a chucking mechanism; 501. a clamping block; 502. a third sliding block; 503. a third spring; 504. pushing the column; 505. pushing the slot.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-4, the present invention provides a technical solution: a semiconductor device conveying device comprises a wafer conveying and bearing platform 1, wherein a plurality of ceramic pieces 2 with bottom end edges arranged in an annular inclined shape are movably inserted into the wafer conveying and bearing platform 1, inserting cavities 4 matched with the ceramic pieces 2 are formed in the wafer conveying and bearing platform 1, ceramic piece salient points 21 are connected inside the ceramic pieces 2 in a sliding mode, and telescopic cavities matched with the ceramic piece salient points 21 are formed in the ceramic pieces 2;

all be fixed with slider 22 on the lateral wall of ceramic member bump 21, offer on the lateral wall in flexible chamber with the slider 22 matched with spout one that corresponds, the bottom of ceramic member bump 21 all with be connected with spring 23 between the flexible intracavity diapire that corresponds, the setting of spring 23 can make carriage release lever 301 drive a plurality of triangle-shaped blocks 303 remove and leave its trapezoidal piece 306 when, then can make ceramic member bump 21 automatic re-setting, the cross section of slider 22 is the T shape.

Further, ceramic member bump 21 all with the ceramic member 2 that corresponds between install adjustment mechanism 3, adjustment mechanism 3 includes sliding connection at the flexible intracavity that corresponds travel bar 301, the both ends of travel bar 301 all are fixed with slider two 302, all set up on the both sides inner wall in flexible chamber with slider two 302 matched with spout two, be connected with spring two 304 between the one end of slider two 302 and the two one side inner walls that correspond spout, be fixed with the triangle-shaped piece 303 that a plurality of equidistance set up on the lateral wall towards ceramic member bump 21 on the travel bar 301, be fixed with on the lateral wall of ceramic member bump 21 with the trapezoidal piece 306 of a plurality of triangle-shaped piece 303 matched with, threaded connection has hand screw 305 on ceramic member 2, the one end of hand screw 305 contradicts on a lateral wall of travel bar 301, the setting of hand screw 305, can fix the position of travel bar 301, prevent to become flexible, the vertical cross-section of slider two 302 is T shape and the shape of falling T.

Further, a clamping mechanism 5 is installed between each ceramic part 2 and the wafer conveying and bearing platform 1, each clamping mechanism 5 includes a fixture block 501 slidably connected in the wafer conveying and bearing platform 1, one end of each fixture block 501 is obliquely arranged, a movable cavity matched with the fixture block 501 is formed in the wafer conveying and bearing platform 1, a third spring 503 is connected between the other end of each fixture block 501 and the inner wall of one side of the movable cavity, a clamping groove matched with the fixture block 501 is formed in one side wall of each ceramic part 2, a third slider 502 is fixed at the bottom end of each fixture block 501, a third sliding groove matched with the third slider 502 is formed in the inner bottom wall of the movable cavity, a pushing column 504 is fixed at the top end of each fixture block 501, a pushing groove 505 matched with the pushing column 504 is formed in the wafer conveying and bearing platform 1, the pushing groove 505 is communicated with the movable cavity, and the vertical section of the third slider 502 is in an inverted T shape.

When the ceramic part convex point adjusting device is used, when the extending length of the ceramic part convex point 21 needs to be adjusted, the hand-screw screws 305 can be loosened, the ceramic part convex point 21 is continuously pressed, the trapezoidal blocks 306 on one side wall of the ceramic part convex point 21 can extrude the triangular blocks 303 below, the movable rods 301 can be abutted and pressed to move through the two sliding blocks 302, the springs 304 are compressed, after the adjustment is completed, the hand-screw screws 305 are locked, the fixing effect after the adjustment of the ceramic part convex point 21 is realized, the ceramic part convex point adjusting device can be used according to different production conditions on the existing equipment, secondly, when the quantity of particles needs to be reduced, the ceramic parts 2 can be detached from the wafer conveying bearing platform one by one, external needle-shaped tools are inserted into the pushing grooves 505 and pushed to move, the clamping blocks 501 are driven to move, the clamping blocks 501 are separated from the clamping grooves on the side wall of the ceramic parts 2, the ceramic parts 2 can be detached one by one, the problem of reducing the quantity of the particles is solved, the clamping blocks can be switched and adjusted according to use according to different actual production conditions, and the application range is wide.

It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. A semiconductor device conveying device comprises a wafer conveying and bearing platform (1), and is characterized in that: a plurality of ceramic parts (2) with bottom end edges arranged in an annular inclined shape are movably inserted in the wafer conveying and bearing platform (1), inserting cavities (4) matched with the ceramic parts (2) are formed in the wafer conveying and bearing platform (1), ceramic part salient points (21) are connected in the ceramic parts (2) in a sliding mode, telescopic cavities matched with the ceramic part salient points (21) are formed in the ceramic parts (2), adjusting mechanisms (3) are installed between the ceramic part salient points (21) and the corresponding ceramic parts (2), and clamping mechanisms (5) are installed between the ceramic parts (2) and the wafer conveying and bearing platform (1);

a first sliding block (22) is fixed on one side wall of each ceramic part protruding point (21), a first sliding groove matched with the corresponding first sliding block (22) is formed in one side wall of the telescopic cavity, and a first spring (23) is connected between the bottom end of each ceramic part protruding point (21) and the corresponding inner bottom wall of the telescopic cavity.

2. The semiconductor device transfer apparatus according to claim 1, wherein: the adjusting mechanism (3) comprises a moving rod (301) which is connected in a corresponding telescopic cavity in a sliding mode, and two sliding blocks II (302) are fixed at two ends of the moving rod (301).

3. The semiconductor device transfer apparatus according to claim 1, wherein: and a second sliding groove matched with the second sliding block (302) is formed in the inner walls of the two sides of the telescopic cavity, and a second spring (304) is connected between one end of the second sliding block (302) and the inner wall of the corresponding second sliding groove.

4. The semiconductor device transfer apparatus according to claim 2, wherein: be fixed with triangle piece (303) that a plurality of equidistance set up on the lateral wall of ceramic member bump (21) towards on movable rod (301), be fixed with on the lateral wall of ceramic member bump (21) trapezoidal piece (306) with a plurality of triangle piece (303) matched with, there is hand screw (305) threaded connection on ceramic member (2), and the one end of hand screw (305) is contradicted on a lateral wall of movable rod (301).

5. The semiconductor device transfer apparatus according to claim 1, wherein: the clamping mechanism (5) comprises a clamping block (501) which is connected in the wafer conveying bearing platform (1) in a sliding mode, one end of the clamping block (501) is arranged in an inclined mode, a movable cavity matched with the clamping block (501) is formed in the wafer conveying bearing platform (1), a third spring (503) is connected between the other end of the clamping block (501) and the inner wall of one side of the movable cavity, and a clamping groove matched with the clamping block (501) is formed in one side wall of the ceramic part (2).

6. The semiconductor device transfer apparatus according to claim 5, wherein: a third sliding block (502) is fixed at the bottom end of the clamping block (501), a third sliding groove matched with the third sliding block (502) is formed in the inner bottom wall of the movable cavity, a pushing column (504) is fixed at the top end of the clamping block (501), a pushing groove (505) matched with the pushing column (504) is formed in the wafer conveying and bearing platform (1), and the pushing groove (505) is communicated with the movable cavity.