CN217881040U - Anti-electromagnetic interference integrated inductor - Google Patents
Anti-electromagnetic interference integrated inductor Download PDFInfo
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- CN217881040U CN217881040U CN202221363997.3U CN202221363997U CN217881040U CN 217881040 U CN217881040 U CN 217881040U CN 202221363997 U CN202221363997 U CN 202221363997U CN 217881040 U CN217881040 U CN 217881040U
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Abstract
The utility model discloses an anti-electromagnetic interference's integrated into one piece inductance, include: the device comprises a magnet, a coil, a shielding metal film layer, an insulating layer and a plurality of electrodes; the electrode is arranged at the bottom of the magnet, the coil is embedded in the magnet, two ends of the coil penetrate out of the magnet and are respectively connected with one electrode, and the shielding metal film layer covers the upper surface and at least one third of the side surface of the magnet; the insulating layer covers the entire shielding metal film layer. The utility model discloses a thereby shielding metal film layer can effectually shield the magnetic leakage that produces under the high frequency and reduce the influence of magnetic leakage to output ripple current, and this shielding metal film layer is littleer than conventional product surface mounting metal-back shell volume moreover, avoids leading to sacrificing magnet volume or inductance volume big problem partially because of needs at inductance surface mounting metal-back.
Description
Technical Field
The utility model relates to an inductance technical field especially relates to an anti-electromagnetic interference's integrated into one piece inductance.
Background
With the development of PMIC integrated power management technology, the switching frequency of the power supply is becoming higher, and the inductance, which is one of the important components of the power supply, becomes more important to suppress or reduce EMI electromagnetic interference with the increase of the switching frequency. At present, the existing power inductor in the market has a structure that a magnet is not made into a shielding structure or a small product is installed through a metal shell, so that the size of the product exceeds the installation area of a circuit board, and the problem of serious interference of a circuit or heat accumulation caused by dense devices due to larger size can occur.
Thus, the prior art is deficient and needs improvement.
SUMMERY OF THE UTILITY MODEL
The to-be-solved technical problem of the utility model is: an integrated inductor with anti-electromagnetic interference is provided to solve the problems mentioned in the background art.
The technical scheme of the utility model as follows: provided is an integrated inductor resistant to electromagnetic interference, comprising: the device comprises a magnet, a coil, a shielding metal film layer, an insulating layer and a plurality of electrodes; the electrode is arranged at the bottom of the magnet, the coil is embedded in the magnet, two ends of the coil penetrate out of the magnet and are respectively connected with one electrode, and the shielding metal film layer covers the upper surface and at least one third of the side surface of the magnet; the insulating layer covers the entire shielding metal film layer. The coil is located at the middle position of the magnet. The insulating layer covers the entire side face of the magnet. The thickness of the shielding metal film layer is 1-20 μm. The thickness of the insulating layer is 1-20 μm. Preferably, the shielding metal film layer is made by physical vapor deposition. The shielding metal film layer is preferably made of any one of Fe, cu and Al. The insulating layer is preferably any one of parylene N, parylene C and parylene HT.
The insulating layer is used for protecting the shielding metal film layer, and the shielding metal film layer is prevented from being easily scratched. Thereby shielding metal film layer can effectually shield the influence of the magnetic leakage that produces under the high frequency to output ripple current, this shielding metal film layer is littleer than conventional product surface mounting metal casing volume moreover, avoids leading to sacrificing magnet volume or inductance volume problem big on the large side because of needs at inductance surface mounting metal casing, and this inductance simple structure simultaneously, the simple process of physics vapor deposition shielding metal film layer has solved the complicated problem with high costs of the technology of installation metal casing product.
Further, a boss is provided at a lower portion of the magnet, and the electrode is provided on the boss. The height of the boss is greater than 0.2mm. The boss can provide a space for the bottom of the magnet, which is beneficial to heat dissipation.
Further, the coils are 2 groups, and the number of the electrodes is 4.
Adopt above-mentioned scheme, the utility model provides an anti-electromagnetic interference's integrated into one piece inductance, thereby shielding metal film layer can effectually shield the magnetic leakage that produces under the high frequency and reduce the influence of magnetic leakage to output ripple current, this shielding metal film layer is littleer than conventional product surface mounting metal casing volume moreover, avoid leading to sacrificing magnet volume or inductance volume problem big on the large side at inductance surface mounting metal casing because of needs, this inductance simple structure simultaneously, the simple process of physics vapor deposition shielding metal film layer, the problem that the technology complexity of having solved installation metal casing product is with high costs.
Drawings
Fig. 1 is a schematic structural diagram of an embodiment of the present invention;
FIG. 2 is a schematic diagram of another perspective view of the embodiment of FIG. 1;
FIG. 3 is a schematic diagram of the embodiment of FIG. 1 from a further perspective.
Detailed Description
The present invention will be described in detail below with reference to the accompanying drawings and specific embodiments.
Referring to fig. 1-3, the present embodiment provides an integrated inductor with electromagnetic interference resistance, including: the magnetic body 10, the coil 20, the shielding metal film layer 30, the insulating layer 40 and the electrodes 50; the electrode 50 is arranged at the bottom of the magnet 10, the coil 20 is embedded in the magnet 10, two ends of the coil 20 penetrate out of the magnet 10 and are respectively connected with one electrode 50, and the shielding metal film layer 30 covers the upper surface and at least one third of the side surface of the magnet 10; the insulating layer 40 covers the entire shielding metal film layer 30. The coil 20 is located at the middle position of the magnet 10. The insulating layer 40 covers the entire side of the magnet 10. The thickness of the shielding metal film layer 30 is 1-20 μm. The thickness of the insulating layer 40 is 1 to 20 μm. The coils 20 are 2 groups, and the number of the electrodes 50 is 4.
In this embodiment, the shielding metal film 30 is formed by physical vapor deposition. The shielding metal film layer 30 is made of Cu. The insulating layer 40 adopts parylene N.
In the present embodiment, the lower portion of the magnet 10 is provided with a boss 60, and the electrode 50 is disposed on the boss 60. The height of the boss 60 is greater than 0.2mm. The bosses 60 provide space for the bottom of the magnet 10 to facilitate heat dissipation.
To sum up, the utility model provides an anti-electromagnetic interference's integrated into one piece inductance, thereby shielding metal film layer can effectually shield the magnetic leakage that produces under the high frequency and reduce the influence of magnetic leakage to output ripple current, this shielding metal film layer is littleer than conventional product surface mounting metal casing volume moreover, avoid leading to sacrificing magnet volume or inductance volume problem big on the large side because of needs at inductance surface mounting metal casing, this inductance simple structure simultaneously, the simple process of physics vapor deposition shielding metal film layer has solved the problem that the technology complexity of installation metal casing product is with high costs.
The present invention is not limited to the above preferred embodiments, and any modifications, equivalent replacements, and improvements made within the spirit and principle of the present invention should be included within the protection scope of the present invention.
Claims (8)
1. An anti-electromagnetic interference integrated inductor, comprising: the device comprises a magnet, a coil, a shielding metal film layer, an insulating layer and a plurality of electrodes; the electrode is arranged at the bottom of the magnet, the coil is embedded in the magnet, two ends of the coil penetrate out of the magnet and are respectively connected with one electrode, and the shielding metal film layer covers the upper surface and at least one third of the side surface of the magnet; the insulating layer covers the entire shielding metal film layer.
2. The inductor as claimed in claim 1, wherein the lower portion of the magnet is provided with a protrusion, and the electrode is disposed on the protrusion.
3. The inductor as claimed in claim 2, wherein the height of the bumps is greater than 0.2mm.
4. The inductor as claimed in claim 1, wherein the coil is located at a middle position of the magnet.
5. The inductor as claimed in claim 1, wherein the insulating layer covers the entire side surface of the magnet.
6. The inductor as claimed in claim 1, wherein the thickness of the shielding metal film is 1-20 μm.
7. The inductor as claimed in claim 1, wherein the insulating layer has a thickness of 1-20 μm.
8. The inductor as claimed in claim 1, wherein the number of the coils is 2, and the number of the electrodes is 4.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221363997.3U CN217881040U (en) | 2022-05-31 | 2022-05-31 | Anti-electromagnetic interference integrated inductor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221363997.3U CN217881040U (en) | 2022-05-31 | 2022-05-31 | Anti-electromagnetic interference integrated inductor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217881040U true CN217881040U (en) | 2022-11-22 |
Family
ID=84093169
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202221363997.3U Active CN217881040U (en) | 2022-05-31 | 2022-05-31 | Anti-electromagnetic interference integrated inductor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217881040U (en) |
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2022
- 2022-05-31 CN CN202221363997.3U patent/CN217881040U/en active Active
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