CN217869084U - Film coating device - Google Patents
Film coating device Download PDFInfo
- Publication number
- CN217869084U CN217869084U CN202222052348.8U CN202222052348U CN217869084U CN 217869084 U CN217869084 U CN 217869084U CN 202222052348 U CN202222052348 U CN 202222052348U CN 217869084 U CN217869084 U CN 217869084U
- Authority
- CN
- China
- Prior art keywords
- electrode
- electrode plates
- plate
- coating
- support plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Chemical Vapour Deposition (AREA)
Abstract
The utility model discloses a film coating device. The method comprises the following steps: the device comprises a fixed support plate and a coated electrode arranged on the fixed support plate, wherein the coated electrode comprises a plurality of electrode plates arranged in parallel with the fixed support plate, and the electrode plates are insulated from each other; the power supply and matcher feed-in systems are arranged on the fixed supporting plate and are connected with the electrode plates in a one-to-one corresponding mode. Compared with the prior art, the embodiment of the utility model provides a coating device has the advantage of guaranteeing coating film homogeneity, integrality and security when promoting coating film speed.
Description
Technical Field
The utility model relates to a general semiconductor technology field especially relates to solar cell PECVD coating film device.
Background
As the demand of the solar cell industry for high productivity and high efficiency continues to increase, the size of the solar cell becomes larger and larger, and the sizes of the coating chamber and the coating electrode of the coating device need to be increased correspondingly in order to perform the coating treatment on the large-sized solar cell. With the increase of the sizes of the film-coated electrode and the solar cell, the film-coating rate is reduced, and the film-coating rate is generally increased by adopting a method of increasing the power of a power supply in the prior art.
However, the inventor of the present invention found that the technical solution of increasing the power of the power supply in the prior art can result in the reduction of the uniformity and integrity of the coating while increasing the coating rate. In addition, the promotion of power supply power still leads to the components and parts problem of generating heat on the circuit serious, influences the security of coating process.
SUMMERY OF THE UTILITY MODEL
The utility model provides a coating device, which can ensure the uniformity, integrity and safety of coating while improving the coating speed.
According to an aspect of the utility model, a coating device is provided, include: the device comprises a fixed support plate and a coated electrode arranged on the fixed support plate, wherein the coated electrode comprises a plurality of electrode plates arranged in parallel with the fixed support plate, and the electrode plates are insulated from each other; the power supply and matcher feed-in systems are arranged on the fixed supporting plate and are connected with the electrode plates in a one-to-one corresponding mode.
In the technical scheme of the embodiment of the utility model, the coating film electrode comprises a plurality of plate electrodes of mutual insulation, and set up a plurality of power and adapter feed-in system and each plate electrode one-to-one is connected, when carrying out the coating film to the work piece that for example solar cell etc. need carry out the coating film, every power and adapter feed-in system can carry out independent power supply for the panel rather than corresponding being connected, thereby realize carrying out the coating film respectively on the region that work piece and each panel correspond, because the coating film electrode is constituteed jointly to a plurality of plate electrodes, for the coating film electrode of the monoblock plate electrode among the prior art, the size of each electrode plate of this application is less, coating film rate is higher under equal power, coating film homogeneity and integrality are also higher; in addition, because a single power supply and matcher feed-in system only needs to supply power for a single electrode plate with a small area, the power required to be supplied by the single power supply and matcher feed-in system is small under the condition of maintaining the same coating rate, the heating problem of components on a circuit is not easy to generate, and the safety of the whole coating process is improved.
In addition, the projection pattern of the plurality of electrode plates in the direction perpendicular to the fixed support plate is an axisymmetric pattern. The plurality of electrode plates are arranged in an axisymmetric manner, so that electric fields generated by the plurality of electrode plates are mutually symmetrical, and the uniformity and the integrity of a coating result are ensured.
In addition, the fixed supporting plate can be a cavity door cover plate, and the cavity door cover plate and the electrode plate are positioned above the film coating area; the fixed supporting plate can also be a cavity body bottom plate, and the cavity body bottom plate and the electrode plate are positioned below the film coating area. In addition, the number of the electrode plates is four, and the four electrode plates are arranged in a matrix of two rows and two columns. The flatness and the uniformity of the coating can be furthest ensured.
In addition, the electrode plate and the power supply and matcher feed-in system are respectively arranged on two opposite surfaces of the fixed supporting plate. Set up panel and power and matcher feed-in system respectively on two relative surfaces of fixed bolster, can not disturb another person when maintaining and changing panel or power and matcher feed-in system, can be more convenient for maintain and change panel and battery.
In addition, the coated electrode further comprises: and the insulating connecting piece is used for connecting the electrode plates and is filled in the interval regions among the electrode plates. The insulating connecting piece is arranged to be filled in the interval area between the plurality of electrode plates, and when the film-coated electrode is prepared, the electrode plates and the insulating connecting piece can be integrally formed for preparation, so that the preparation process of the film-coated electrode is simplified.
In addition, the width of the interval area between the adjacent electrode plates is more than 1 mm and less than 50 mm. The undersize width of the spacing region between the adjacent electrode plates is easy to influence the insulation effect between the adjacent electrode plates, and the overlarge width of the spacing region between the adjacent electrode plates is easy to cause the poor film coating effect of the region corresponding to the spacing region, such as a solar cell needing film coating, and the like, and influence the integrity and uniformity of the whole film coating. The width of the interval region between the adjacent electrode plates is larger than 1 mm and smaller than 50 mm, so that the integrity and uniformity of the coating film can be ensured while the insulation effect between the adjacent electrode plates is ensured.
In addition, the areas of the plurality of electrode plates are equal. The areas of the plurality of electrode plates are equal, the power supply power required by the electrode plates with the equal areas is the same during film coating, and the film coating rate of the electrode plates with the same power supply power and the same areas is also the same, so that the uniformity and the evenness of the film coating are better ensured. In addition, the electrode plate is provided with a plurality of through holes; the plurality of electrode plates include a first electrode surface parallel to the fixed support plate and a second electrode surface opposite to the first electrode surface, and the through-holes penetrate the first electrode surface and the second electrode surface. Through holes penetrating through the surfaces of the first electrode and the second electrode are formed in each electrode plate, and the through holes can form channels when a coating process such as chemical vapor deposition is carried out and plasma or gas participates in the coating process, so that the uniformity of the coating is better.
In addition, the extending direction of the through hole is perpendicular to the surface of the first electrode. The extending direction of the through holes is vertical to the surface of the first electrode, so that a channel of gas or plasma and other fluids can be formed better, and the uniformity of the coating film is further improved.
In addition, the sum of the areas of the plurality of electrode plates is greater than 1 square meter.
In addition, the phase difference of the radio frequency power supplies connected with two adjacent electrode plates is 45-315 degrees.
It should be understood that the statements in this section are not intended to identify key or critical features of the embodiments of the present invention, nor are they intended to limit the scope of the invention. Other features of the present invention will become apparent from the following description.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.
Fig. 1 is a front view of a film coating electrode in a film coating apparatus according to a first embodiment of the present invention;
fig. 2 is a schematic back view of a film coating electrode in a film coating apparatus according to an embodiment of the present invention;
fig. 3 is a front view of a film coating electrode in a film coating apparatus according to another embodiment of the present invention;
FIG. 4 is a front view of a film-coating electrode in a film-coating apparatus according to still another embodiment of the present invention;
fig. 5 is a front view of a film-coated electrode in a film-coating device according to an embodiment of the present invention.
Detailed Description
In order to make the technical solution of the present invention better understood, the technical solution of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts shall belong to the protection scope of the present invention.
It should be noted that the terms "first," "second," and the like in the description and claims of the present invention and in the drawings described above are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used is interchangeable under appropriate circumstances such that the embodiments of the invention described herein are capable of operation in other sequences than those illustrated or described herein. Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed, but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.
Example one
Fig. 1 is a front view of a membrane-plated electrode in a membrane-plating apparatus according to a first embodiment of the present invention, and fig. 2 is a schematic back view of a membrane-plated electrode in a membrane-plating apparatus according to a first embodiment of the present invention. As shown in fig. 1 and 2, the plating device includes: the cavity door cover plate 10 and the coating electrode 20 arranged on the cavity door cover plate 10, wherein the coating electrode 20 comprises a plurality of electrode plates 21, the plurality of electrode plates 21 and the cavity door cover plate 10 are arranged in parallel, and the plurality of electrode plates 21 are arranged in an insulated mode. In addition, the power supply and matcher feed-in system further comprises a plurality of power supply and matcher feed-in systems 30 arranged on the cavity door cover plate 10, wherein the plurality of power supply and matcher feed-in systems 30 are connected with the plurality of electrode plates 21 in a one-to-one corresponding manner, that is, a single power supply and matcher feed-in system is connected with a single and unique corresponding electrode plate 21.
Compared with the prior art, the embodiment of the present invention provides a coating apparatus, the coating electrode 20 is composed of a plurality of mutually insulated electrode plates 21, and a plurality of power and matcher feed-in systems 30 are provided to be connected with each electrode plate 21 in a one-to-one correspondence, when coating is performed on a workpiece needing coating, such as a solar battery, etc., each power and matcher feed-in system 30 can independently supply power to the corresponding connected battery plate 21, thereby realizing coating in the region where the workpiece corresponds to each battery plate 21, because the plurality of electrode plates 21 jointly form the coating electrode 20, compared with the coating electrode 20 of the whole electrode plate in the prior art, the size of each electrode plate 21 in this embodiment is small, the coating rate under the same power supply is high, and the coating uniformity and integrity are also high; in addition, because the single power supply and matcher feed-in system 30 only needs to supply power for the single small-area electrode plate 21, the power required to be supplied by the single power supply 30 is small under the condition of maintaining the same coating rate, so that the problem of heating of components on a circuit is not easily caused, and the safety of the whole coating process is improved.
Specifically, in the present embodiment, the electrode plate 21 and the power supply and matching unit feeding system 30 are respectively disposed on two sides of the cavity door cover plate 10. Set up panel 21 and power and matcher feed-in system 30 respectively on two relative surfaces of cavity door apron 10, can not produce the interference to another person when maintaining and changing panel 21 or power and matcher feed-in system 30, can be more convenient for maintain and change panel 21 and battery 30.
As shown in fig. 1, each electrode plate 21 is provided with a plurality of through holes 23, each electrode plate 21 includes a first electrode surface 211 parallel to the chamber door cover 10 and a second electrode surface (not shown in fig. 1, hidden by the first electrode surface 211) opposite to the first electrode surface 211, and the through holes 23 penetrate through the first electrode surface 211 and the second electrode surface. The through holes 23 penetrating through the first electrode surface 211 and the second electrode surface are formed on each electrode plate 21, and when a coating process involving plasma or gas, such as chemical vapor deposition, is performed, the through holes 23 can form a passage, so that the coating uniformity is better.
In an embodiment of the present invention, the through hole 23 extends perpendicular to the first electrode surface 211. The extending direction of the through holes 23 is perpendicular to the first electrode surface 211, so that a channel of gas or plasma and other fluids can be formed better, and the uniformity of the coating film is further improved.
In the present embodiment, the projection pattern of the plurality of electrode plates 21 in the direction perpendicular to the chamber door cover 10 is an axisymmetric pattern. The plurality of electrode plates 21 are arranged in an axisymmetric manner, so that electric fields generated by the plurality of electrode plates 21 are symmetrical with each other, and the uniformity and the integrity of a coating result are ensured. It should be understood that fig. 1 is an illustration of an arrangement manner of the electrode plate 21 disclosed in the first embodiment, and is not limited thereto, and in other embodiments of the present invention, for example, as shown in fig. 3 and fig. 4, the plurality of electrode plates 21 may also be arranged in an axisymmetric manner with other structures, and particularly, the arrangement may be flexibly configured according to actual needs.
Preferably, in the present embodiment, the number of the electrode plates 21 is four, and the four electrode plates 21 are arranged in a matrix of two rows and two columns. The flatness and uniformity of the coating can be furthest ensured by the arrangement.
In the present embodiment, the areas of the plurality of electrode plates 21 are equal. The areas of the plurality of electrode plates 21 are equal, when in film coating, the power supply power required by the electrode plates 21 with the equal areas is also the same, and the film coating rate of the electrode plates 21 with the same power supply power and the same areas is also the same, so that the uniformity and the evenness of the film coating are better ensured.
In the present embodiment, the sum of the areas of the plurality of electrode plates 21 is greater than 1 square meter.
Example two
Fig. 5 is a front view of a plated electrode in a plating apparatus provided in the second embodiment of the present invention, which is the same as the first embodiment of the present invention, and the second embodiment of the present invention also includes a cavity door cover 10 and a plated electrode 20, and in the second embodiment of the present invention, the plated electrode 20 further includes an insulating connecting member 22 connected to a plurality of electrode plates 21, the insulating connecting member 22 is filled in a space region between the plurality of electrode plates 21, and the insulating connecting member 22 may be made of, for example, ceramic, PTFE (polytetrafluoroethylene), or aluminum block with an anodized surface.
Compared with the prior art, in the second embodiment, while the technical effect of the first embodiment is maintained, the insulating connecting piece 22 is arranged to fill the interval region between the plurality of electrode plates 21, and when the coated electrode 20 is prepared, the electrode plates 21 and the insulating connecting piece 22 can be integrally formed for preparation, so that the preparation process of the coated electrode 20 is simplified.
In the present embodiment, the width of the spacing region between the adjacent electrode plates 21 is greater than 1 mm and less than 30 mm. The too small width of the spacing region between the adjacent electrode plates 21 is likely to affect the insulation effect between the adjacent electrode plates 21, and the too large width of the spacing region between the adjacent electrode plates 21 is likely to cause the poor film coating effect of the region corresponding to the spacing region of the workpiece such as the solar cell needing film coating, and the like, and affect the integrity and uniformity of the whole film coating. The width of the spacing region between the adjacent electrode plates 21 is larger than 1 mm and smaller than 50 mm, so that the integrity and uniformity of the coating film can be ensured while the insulation effect between the adjacent electrode plates 21 is ensured.
In the present embodiment, the phase difference between the rf power sources connected to two adjacent electrode plates 21 is 45 ° to 315 °.
The above detailed description does not limit the scope of the present invention. It should be understood by those skilled in the art that various modifications, combinations, sub-combinations and substitutions may be made in accordance with design requirements and other factors. Any modification, equivalent replacement, and improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (10)
1. A plating device, characterized by comprising:
the device comprises a fixed support plate and a coated electrode arranged on the fixed support plate, wherein the coated electrode comprises a plurality of electrode plates arranged in parallel with the fixed support plate, and the electrode plates are insulated from each other;
the power supply and matcher feed-in systems are arranged on the fixed supporting plate and are connected with the electrode plates in a one-to-one corresponding mode;
the projection graphs of the plurality of electrode plates in the direction vertical to the fixed supporting plate are axisymmetric graphs;
the electrode plate is provided with a plurality of through holes, so that the coating area is uniformly distributed with air;
the plurality of electrode plates include a first electrode surface parallel to the fixed support plate and a second electrode surface opposite to the first electrode surface, and the through-holes penetrate the first electrode surface and the second electrode surface.
2. The plating device according to claim 1, wherein the fixed support plate is a chamber door cover plate, and the chamber door cover plate and the electrode plate are located above the plating region.
3. The plating device according to claim 1, wherein the fixed support plate is a chamber body base plate, and the chamber body base plate and the electrode plate are located below the plating region.
4. The plating device according to claim 1, wherein the number of the electrode plates is four, and four of the electrode plates are arranged in a matrix of two rows and two columns.
5. The plating device according to claim 1, wherein the electrode plate and the power supply and adapter feed-through system are disposed on two sides of the fixing support plate, respectively.
6. The plating device according to claim 1, wherein the plating electrode further comprises: and the insulating connecting piece is used for connecting the electrode plates and is filled in the interval region among the electrode plates.
7. The plating device according to claim 6, wherein a width of a spacing region between adjacent electrode plates is greater than 1 mm and less than 50 mm.
8. The plating device according to claim 1, wherein the plurality of electrode plates are equal in area.
9. The plating device according to claim 1, wherein the sum of the areas of the plurality of electrode plates is greater than 1 square meter.
10. The plating device according to claim 1, wherein the radio frequency power supply connected to two adjacent electrode plates has a phase difference of 45 ° to 315 °.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222052348.8U CN217869084U (en) | 2022-08-05 | 2022-08-05 | Film coating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222052348.8U CN217869084U (en) | 2022-08-05 | 2022-08-05 | Film coating device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217869084U true CN217869084U (en) | 2022-11-22 |
Family
ID=84074826
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222052348.8U Active CN217869084U (en) | 2022-08-05 | 2022-08-05 | Film coating device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217869084U (en) |
-
2022
- 2022-08-05 CN CN202222052348.8U patent/CN217869084U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP2053630A2 (en) | Capacitively coupled plasma reactor | |
| KR20010096568A (en) | Device for Fabricating Film for Plasma-Forming Thin Film | |
| SG177220A1 (en) | Showerhead electrode assembly with gas flow modification for extended electrode life | |
| WO2011088156A2 (en) | Phase-modulated rf power for plasma chamber electrode | |
| JP5377749B2 (en) | Plasma generator | |
| CN217869084U (en) | Film coating device | |
| US7708866B2 (en) | Sputtering apparatus | |
| JP2006120926A (en) | Plasma processing apparatus | |
| KR20060083793A (en) | Capacitively coupled plasma processing apparatus | |
| WO2009059640A1 (en) | Electrode arrangement with movable shield | |
| KR100954754B1 (en) | Tray for plasma processing apparatus | |
| JP2019049046A (en) | Distribution system for chemical and/or electrolytic surface treatment | |
| JP5329796B2 (en) | Plasma processing equipment | |
| EP2744925B1 (en) | Reaction chamber for deposition of a semiconductor layer on the plurality substrates in batches | |
| JP4875527B2 (en) | Plasma generator and thin film forming apparatus using the same | |
| CN206040608U (en) | A movable carries and coils device for production line | |
| KR101507390B1 (en) | capacitively coupled plasma reactor | |
| CN209798085U (en) | Plasma surface treatment device | |
| TW202215491A (en) | Workpiece holder, system and operating method for pecvd | |
| EP2081212A1 (en) | Double-Coating Device with one Process Chamber | |
| US20100006142A1 (en) | Deposition apparatus for improving the uniformity of material processed over a substrate and method of using the apparatus | |
| JP2018536768A (en) | System configured for sputter deposition on a substrate, shield apparatus for a sputter deposition chamber, and method of providing an electrical shield in a sputter deposition chamber | |
| KR20100120602A (en) | Compound plasma reactor | |
| CN220597632U (en) | Multi-point feed-in structure of radio frequency power supply | |
| KR20210074762A (en) | Wafer support boat |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |