CN217858342U

CN217858342U - Welding flux card upgrades mould

Info

Publication number: CN217858342U
Application number: CN202220941004.XU
Authority: CN
Inventors: 林艳红; 胡闻问
Original assignee: WUHAN FEITE ELECTRIC CO Ltd
Current assignee: WUHAN FEITE ELECTRIC CO Ltd
Priority date: 2022-04-22
Filing date: 2022-04-22
Publication date: 2022-11-22
Anticipated expiration: 2032-04-22

Abstract

The utility model discloses a solder card upgrades mould, including last mould assembly, including the lower pressure drift that sets up, with upper die base, the setting that the lower pressure drift is connected are in the upper padding plate on upper die base surface, fix the convex mould piece on upper die base surface with connect on the upper die base surface to distribute at the guide post of convex mould piece side, lower mould assembly is in including setting up die holder, the setting in the upper die base below the lower bolster, the setting on die holder surface are in the die cavity of die holder top surface is with seting up the uide bushing of die holder top surface, pay-off subassembly is including setting up the material supporting plate of die holder side, install the pressure flitch on material supporting plate surface and be located the material card flitch between material supporting plate and the pressure flitch. The utility model discloses a mutually supporting of last mode structure, lower mode structure and the pay-off structure that sets up reaches the effect of carrying out the mould ization production to the solder card, improves the machining efficiency of solder card greatly.

Description

Welding flux card upgrades mould

Technical Field

The utility model relates to a solder mould technical field specifically is a solder card upgrades mould.

Background

The solder card is a very large number of parts used in the whole vacuum tube welding process, if manual semi-mechanical processing is adopted, the efficiency is low, the workload is large, time and labor are wasted, and therefore the solder card progressive die is provided.

SUMMERY OF THE UTILITY MODEL

Therefore, the utility model aims at providing a welding material card upgrades mould, through mutually supporting of last mode structure, lower mode structure and pay-off structure that sets up, reach the effect of carrying out the mould ization production to the welding material card, improve the machining efficiency of welding material card greatly.

In order to solve the technical problem, according to the utility model discloses an aspect, the utility model provides a following technical scheme:

a solder card progressive die, comprising:

the upper die assembly comprises a lower pressing punch, an upper die holder connected with the lower pressing punch, an upper base plate arranged on the surface of the upper die holder, a convex die block fixed on the surface of the upper die holder and guide columns which are connected with the surface of the upper die holder and distributed on the side face of the convex die block;

the lower die assembly comprises a lower die base arranged below the upper die base, a lower padding plate arranged on the surface of the lower die base, a female die cavity arranged on the top surface of the lower die base and a guide sleeve arranged on the top surface of the lower die base;

the feeding assembly comprises a material bearing plate arranged on the side surface of the lower die base, a material pressing plate arranged on the surface of the material bearing plate and a material clamping plate positioned between the material bearing plate and the material pressing plate.

As a preferred scheme of solder card mould that upgrades, wherein, still including the subassembly of unloading, the subassembly of unloading is including setting up the spring of unloading of convex mould side and the stripper of connection at the spring top surface of unloading.

As a preferred scheme of a solder card upgrades mould, wherein, the stripper is the annular form to protruding module runs through the stripper.

As a preferred scheme of the solder card mould that upgrades of the utility model, wherein, the guide post with the uide bushing registrates each other.

As a preferred scheme of solder card mould that upgrades, wherein, the surface of holding the flitch is provided with cutting blade to cutting blade is located the juncture of material card flitch and convex mould piece.

As a preferred scheme of solder card mould that upgrades, wherein, the convex mould piece is corresponding with the die cavity forward.

Compared with the prior art, the utility model discloses the beneficial effect who has is: through the last die structure that sets up, mutually support of lower die structure and pay-off structure, reach the effect that carries out the mould ization production to the solder card, improve the machining efficiency of solder card greatly, when specifically using, the user drops into the material card flitch between upper die base and die holder, use the pressure flitch with the material card flitch pressfitting locking, the user controls the drift that pushes down this moment, the drift that pushes down drives the upper die base and pushes down fast, make the mutual block in convex module and die cavity, the block in-process, uide bushing and guide post block, the convex module directly suppresses the material card flitch shaping in the die cavity, the back is accomplished in the shaping, the cutting blade that is located the holding plate surface directly cuts the material card flitch, accomplish the preparation promptly, the user separates upper die base and die holder this moment, and take out the fashioned solder card, promote the material card flitch forward this moment, continue the punching press preparation can, the preparation efficiency is higher.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the present invention will be described in detail below with reference to the accompanying drawings and detailed embodiments, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to these drawings without inventive laboriousness. Wherein:

FIG. 1 is a structural view of a progressive solder card mold of the present invention;

fig. 2 is the structure diagram of the material-bearing plate in fig. 1 of the solder card progressive die of the present invention.

In the figure: 100. an upper die assembly; 110. pressing down the punch; 120. an upper die holder; 130. an upper base plate; 140. a guide post; 150. a male mold block; 200. a lower die assembly; 210. a lower die holder; 220. a lower base plate; 230. a cavity; 240. a guide sleeve; 300. a feeding assembly; 310. a material bearing plate; 320. a material pressing plate; 330. a material clamping plate; 3101. a cutting blade; 400. a discharge assembly; 410. a discharge spring; 420. and (4) a stripper plate.

Detailed Description

In order to make the aforementioned objects, features and advantages of the present invention more comprehensible, embodiments accompanied with figures are described in detail below.

In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention, however, other embodiments may be utilized and other implementations may be devised without departing from the spirit and scope of the present invention.

Next, the present invention will be described in detail with reference to the drawings, and in order to describe the embodiments of the present invention in detail, the sectional view showing the device structure will not be enlarged partially according to the general scale for convenience of description, and the drawings are only examples, which should not limit the scope of the present invention. In addition, the three-dimensional dimensions of length, width and depth should be included in the actual fabrication.

In order to make the objects, technical solutions and advantages of the present invention clearer, embodiments of the present invention will be described in further detail below with reference to the accompanying drawings.

The utility model provides a welding flux card upgrades mould, through mutually supporting of last mode structure, lower mode structure and pay-off structure that sets up, reach the effect that carries out the mould ization production to the welding flux card, improve the machining efficiency of welding flux card greatly.

Fig. 1-2 are schematic diagrams showing an overall structure of an embodiment of a progressive solder card mold of the present invention, and referring to fig. 1-2, a main body of the progressive solder card mold of the present embodiment includes: upper die assembly 100, lower die assembly 200, and feed assembly 300.

The upper die assembly 100 is used in cooperation with the lower die assembly 200, specifically, the upper die assembly 100 includes a lower press punch 110, an upper die base 120 connected with the lower press punch 110, an upper backing plate 130 arranged on the surface of the upper die base 120, a convex die block 150 fixed on the surface of the upper die base 120, and guide posts 140 connected on the surface of the upper die base 120 and distributed on the side of the convex die block 150, and when the upper die assembly is used specifically, the lower press punch 110 drives the upper die base 120 to press downwards, so that the convex die block 150 is driven to move downwards, and the upper die base 120 is in contact with the lower die base 210.

The lower die assembly 200 is used for press forming of the material clamping plate 330, specifically, the lower die assembly 200 includes a lower die holder 210 arranged below the upper die holder 120, a lower backing plate 220 arranged on the surface of the lower die holder 210, a die cavity 230 arranged on the top surface of the lower die holder 210, and a guide sleeve 240 arranged on the top surface of the lower die holder 210, when the lower die assembly is used specifically, the guide sleeve 240 is clamped with the guide column 140, and the material clamping plate 330 is directly pressed in the die cavity 230 by the male die block 150 for forming.

The feeding assembly 300 is used for providing raw materials for manufacturing solder cards, and specifically, the feeding assembly 300 includes a material supporting plate 310 disposed on a side surface of the lower die holder 210, a material pressing plate 320 mounted on a surface of the material supporting plate 310, and a material clamping plate 330 located between the material supporting plate 310 and the material pressing plate 320, when the feeding assembly is used specifically, a user puts the material clamping plate 330 between the upper die holder 120 and the lower die holder 210, presses and locks the material clamping plate 330 by using the material pressing plate 320, and after the molding is completed, the cutting blade 3101 located on the surface of the material supporting plate 310 directly cuts the material clamping plate 330, thereby completing the manufacturing.

With reference to fig. 1-2, in a specific use of the progressive die for solder cards of the present embodiment, a user puts a material clamping plate 330 between an upper die holder 120 and a lower die holder 210, and presses and locks the material clamping plate 330 by using a material pressing plate 320, at this time, the user controls a press punch 110 to press down, the press punch 110 drives the upper die holder 120 to press down rapidly, so that a male die block 150 and a female die cavity 230 are engaged with each other, in the engaging process, a guide sleeve 240 is engaged with a guide post 140, the male die block 150 directly presses the material clamping plate 330 in the female die cavity 230 for molding, after the molding is completed, a cutting blade 3101 on the surface of a material bearing plate 310 directly cuts the material clamping plate 330, so as to complete the manufacturing, at this time, the user separates the upper die holder 120 from the lower die holder 210, takes out the molded solder card, at this time, the material clamping plate 330 is pushed forward, and the punching manufacturing is continued, and the manufacturing efficiency is high.

Further, if the solder card is adhered to the surface of the male die block 150 after being pressed and formed, manual unloading is needed, and therefore the problem is solved by arranging the unloading assembly 400, specifically, the solder card further comprises the unloading assembly 400, the unloading assembly 400 comprises an unloading spring 410 arranged on the side surface of the male die block 150 and an unloading plate 420 connected to the top surface of the unloading spring 410, when the upper die base 120 is moved downwards in specific use, the male die block 150 penetrates through the unloading plate 420 and is clamped into the female die cavity 230 for pressing and forming, at the moment, the unloading spring 410 is compressed by the upper die base 120, the unloading plate 420 is in contact with the material card plate 330, when the upper die base 120 moves upwards, the unloading spring 410 loses pressure and directly drives the unloading plate 420 to push forwards, and the unloading plate 420 directly pushes out the material card plate 330, so that unloading is completed, and adhesion is prevented.

While the invention has been described above with reference to an embodiment, various modifications may be made and equivalents may be substituted for elements thereof without departing from the scope of the invention. In particular, as long as there is no structural conflict, the various features of the disclosed embodiments of the present invention can be used in any combination with each other, and the non-exhaustive description of these combinations in this specification is merely for the sake of brevity and resource conservation. Therefore, it is intended that the invention not be limited to the particular embodiments disclosed, but that the invention will include all embodiments falling within the scope of the appended claims.

Claims

1. A solder card progressive die, comprising:

the upper die assembly (100) comprises a lower pressing punch (110), an upper die base (120) connected with the lower pressing punch (110), an upper backing plate (130) arranged on the surface of the upper die base (120), a convex die block (150) fixed on the surface of the upper die base (120) and guide columns (140) connected to the surface of the upper die base (120) and distributed on the side face of the convex die block (150);

the lower die assembly (200) comprises a lower die holder (210) arranged below the upper die holder (120), a lower cushion plate (220) arranged on the surface of the lower die holder (210), a female die cavity (230) arranged on the top surface of the lower die holder (210) and a guide sleeve (240) arranged on the top surface of the lower die holder (210);

the feeding assembly (300) comprises a material bearing plate (310) arranged on the side surface of the lower die holder (210), a pressure plate (320) arranged on the surface of the material bearing plate (310), and a material clamping plate (330) positioned between the material bearing plate (310) and the pressure plate (320).

2. A solder card progressive die as claimed in claim 1 further comprising a discharge assembly (400), said discharge assembly (400) comprising a discharge spring (410) disposed on a side of said male die block (150) and a discharge plate (420) attached to a top surface of said discharge spring (410).

3. A solder card progressive die as claimed in claim 2 wherein said stripper plate (420) is ring shaped and male modules (150) extend through said stripper plate (420).

4. A solder card progressive die as claimed in claim 3 wherein said guide posts (140) and said guide sleeves (240) are nested with each other.

5. The progressive solder card die of claim 4, wherein the surface of the retainer plate (310) is provided with cutting blades (3101), and the cutting blades (3101) are located at the interface of the retainer plate (330) and the male die block (150).

6. A solder card progressive die according to claim 5, wherein the male die block (150) is positively corresponding to the female die cavity (230).