CN217848619U

CN217848619U - Direct output type semiconductor laser module

Info

Publication number: CN217848619U
Application number: CN202221387149.6U
Authority: CN
Inventors: 吴茂冬; 卢国杰; 韩金龙
Original assignee: United Winners Laser Co Ltd
Current assignee: United Winners Laser Co Ltd
Priority date: 2022-06-02
Filing date: 2022-06-02
Publication date: 2022-11-18
Anticipated expiration: 2032-06-02

Abstract

The utility model discloses a direct output type semiconductor laser module belongs to laser technical field, for solving the bulky problem design of current device. The utility model discloses a: the device comprises a placing cavity, wherein a cooling bottom plate is arranged on the side wall of the placing cavity, and a water-cooling diaphragm, a focusing unit, a protecting unit and an emergent unit are sequentially arranged at one end outside the placing cavity; an LD pump source and a reflector are arranged inside the placing cavity, the laser is spatially integrated and reflected by the reflector to form a laser beam, the laser beam is focused by a focusing mirror, and the laser is output by the emergent unit. The utility model discloses but direct output laser directly is used for processing, small in size.

Description

Direct output type semiconductor laser module

Technical Field

The utility model relates to a laser instrument technical field, especially a direct output type semiconductor laser module.

Background

The laser welding machine generates laser by a laser pump source, transmits the laser through an optical fiber after the operations of shaping, beam combining, focusing and the like of the laser are carried out through a series of optical devices, and then applies the laser to a workpiece through a laser welding head. Laser transmission needs to couple laser into an optical fiber from a laser device, and after the laser is transmitted through the optical fiber, the laser is struck on a workpiece by a laser welding head, and the process of coupling the laser to output the laser can cause laser energy loss.

SUMMERY OF THE UTILITY MODEL

A primary object of the present invention is to provide a direct output type semiconductor laser module, which is designed to solve the technical problems of high laser energy loss, large size, etc. of the existing devices.

The device comprises a placing cavity, wherein a cooling bottom plate is arranged on the side wall of the placing cavity, and a water-cooling diaphragm, a focusing unit, a protecting unit and an emergent unit are sequentially arranged at one end outside the placing cavity; an LD pump source and a reflector are arranged inside the placing cavity, the laser is spatially integrated and reflected by the reflector to form a laser beam, the laser beam is focused by a focusing mirror, and the laser is output by the emergent unit.

Optionally, there are one or more LD pump sources, and the LD pump sources are fixed on the cooling base plate.

Optionally, a bonding surface between the LD pump source and the cooling base plate is coated with a heat conductive silicone grease for increasing heat conductivity.

Optionally, the cooling bottom plate is provided with a water receiving port for connecting external circulating cooling water.

Optionally, a water-cooling diaphragm is arranged in the laser beam transmission direction, and the water-cooling diaphragm is composed of a diaphragm inner ring, a diaphragm outer seat and a diaphragm water pipe interface; the inner ring of the diaphragm absorbs stray light of laser beams generated by divergence angles, the size of the laser beams is limited, and the water pipe interface of the diaphragm is externally connected with circulating cooling water to take away heat of the laser absorbed by the inner ring of the diaphragm.

Optionally, the front end of water-cooling diaphragm is equipped with the focus unit, focus unit inside is equipped with the focusing mirror, be equipped with on the focus unit and be used for connecting outside recirculated cooling water, in order to reach and give focusing water pipe connector is focused in the radiating purpose of focusing mirror.

Optionally, a protection unit is arranged on the focusing unit, and a protection glass is arranged on the protection unit.

Optionally, an emergent unit is arranged in front of the focusing unit, one or more air nozzles are arranged on the emergent unit, and the emergent unit is externally connected with shielding gas and used for blowing out the shielding gas during welding processing so as to protect the surface of a processed workpiece and blow away dust and smoke generated during welding.

Optionally, a PD monitor is arranged on the laser beam edge for real-time monitoring of laser output energy.

Optionally, be equipped with the upper cover on the cooling plate, the zigzag is covered in the upper end design to the upper cover, and increase and external area of contact can effectual supplementary heat dissipation, be equipped with outside socket behind the upper cover, outside power supply system is connected to outside socket, for the power supply of inside LD pump source to and feed back external control system with internal power or temperature monitoring.

The beneficial effects of the utility model are that: the laser module is connected with a circulating cooling water cooling pump source and an optical lens, laser can be directly output without an optical fiber and a laser welding head, the laser module is directly used for processing, the size is small and exquisite and light, the manufacturing cost of the optical module is low, the maintenance is convenient, the laser output energy is stable, and the laser module can be connected with a control system through external power supply to realize parameter setting.

Drawings

FIG. 1 is a cross-sectional view of the present invention;

FIG. 2 is a perspective view of the present invention;

FIG. 3 is a partial view of the water-cooled diaphragm of the present invention;

fig. 4 is a partial view of the focusing unit and the protection unit of the present invention.

Detailed Description

Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary and intended to be used for explaining the present invention, and should not be construed as limiting the present invention. In the description of the present invention, it is to be understood that the terms "inside", "upper", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. In the description of the present invention, unless expressly stated or limited otherwise, the term "connected" is to be understood in a broad sense, e.g. fixedly connected, detachably connected, or integral; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

The present invention will be further explained with reference to the accompanying drawings:

referring to fig. 1-4, in an embodiment of the present invention, including cooling bottom plate 1, upper cover 2, water-cooling diaphragm 3, focusing unit 4, protection unit 5, and exit unit 6, referring to fig. 1, through external power supply, LD pump source 12 generates laser, and laser is spatially integrated and reflected by one or more mirrors 13 to form laser beam 14, and laser beam 14 is focused by focusing mirror 42, and laser is output by exit unit 6.

Referring to fig. 1 and 2, one or more LD pump sources 12 are arranged on the cooling base plate 1, the LD pump sources 12 are locked on the cooling base plate 1 by screws, and the bonding surfaces of the LD pump sources 12 and the cooling base plate 1 are coated with heat-conducting silicone grease which is mainly used for increasing heat conductivity; meanwhile, a water receiving port 11 is formed in the cooling bottom plate 1 and is mainly used for connecting external circulating cooling water so as to achieve the purpose of radiating the LD pump source 12 and enable the optical module to stably output laser.

Referring to fig. 1 and 2, a water-cooled diaphragm 3 is arranged along the forward direction after laser reflection, and mainly comprises a diaphragm inner ring 32, a diaphragm outer seat 33 and a diaphragm water pipe interface 31. Stray light generated by the beam-collected laser due to the divergence angle is absorbed by the diaphragm inner ring 32, and the size of the beam-collected laser is limited, so that the purpose of protecting the subsequent optical lens is achieved. Meanwhile, the diaphragm water pipe interface 31 is externally connected with circulating cooling water, so that the heat of the diaphragm inner ring 32 absorbing laser is taken away, the laser module is prevented from being overheated, and the stability of the optical lens is ensured.

Referring to fig. 1, 2 and 3, a focusing unit 4 is arranged at the front end of the water-cooling diaphragm 3, a focusing mirror 42 is arranged inside the focusing unit 4, and a focusing water pipe connector 41 is arranged on the focusing unit 4 and is mainly used for connecting external circulating cooling water to achieve the purpose of radiating the focusing mirror 42.

Referring to fig. 1, 2 and 4, the focusing unit 4 is provided with a protection unit 5, and the protection unit 5 is provided with a protection glass 51, which is mainly used for preventing welding smoke and dust from entering the module to pollute the optical lens and the pump source, so that the laser module has a longer service life.

Referring to fig. 1 and 2, an exit unit 6 is arranged in front of the focusing unit 4, one or more air nozzles 61 are arranged on the exit unit 6, and are externally connected with shielding gas, and the shielding gas is blown out during welding processing to protect the surface of a processed workpiece and blow away dust and smoke generated during welding.

Referring to fig. 1, a PD monitor 15 is provided alongside the laser beam 14 for real-time monitoring of the laser output energy.

Referring to fig. 2, the upper cover 2 is arranged on the cooling bottom plate 1, and the upper end of the upper cover 2 is designed to be zigzag, so that the contact area between the upper cover and the external part is increased, and the auxiliary heat dissipation can be effectively realized.

Referring to fig. 1 and 2, an external socket 80 is provided behind the upper cover 2, and is mainly used for connecting an external power supply system and a control system, supplying power to the internal LD pump source 12, setting parameters and the like, and feeding back internal power/temperature monitoring to the external control system.

The technical principle of the present invention is described above with reference to the specific embodiments. The description is made for the purpose of illustrating the principles of the invention and is not to be construed in any way as limiting the scope of the invention. Based on the explanations herein, those skilled in the art will be able to conceive of other embodiments of the present invention without any inventive step, and these embodiments are all intended to fall within the scope of the present invention.

Claims

1. A direct output type semiconductor laser module is characterized by comprising a placing cavity, wherein a cooling bottom plate (1) is arranged on the side wall of the placing cavity, and a water-cooling diaphragm (3), a focusing unit (4), a protection unit (5) and an emergent unit (6) are sequentially arranged at one end of the outside of the placing cavity; an LD pump source (12) and a reflector (13) are arranged inside the placing cavity, the laser is spatially integrated and reflected by the reflector (13) to form a laser beam (14), the laser beam (14) is focused by a focusing mirror (42), and the laser is output by the emitting unit (6).

2. The direct output type semiconductor laser module according to claim 1, wherein the LD pump sources (12) are one or more, and the LD pump sources (12) are fixed on the cooling substrate (1).

3. The direct output type semiconductor laser module according to claim 1, wherein a bonding surface between the LD pump source (12) and the cooling substrate (1) is coated with a heat conductive silicone grease for increasing heat conductivity.

4. A direct output type semiconductor laser module as claimed in claim 1, wherein the cooling substrate (1) is provided with a water receiving port (11) for connecting externally circulated cooling water.

5. The direct output type semiconductor laser module according to claim 1, wherein a water-cooled diaphragm (3) is provided in a transmission direction of the laser beam (14), the water-cooled diaphragm (3) being composed of a diaphragm inner ring (32), a diaphragm outer seat (33) and a diaphragm water pipe interface (31); stray light of the laser beam (14) generated by a divergence angle is absorbed by the diaphragm inner ring (32), the size of the laser beam (14) is limited, and the diaphragm water pipe interface (31) is externally connected with circulating cooling water to take away heat of the laser absorbed by the diaphragm inner ring (32).

6. The direct output type semiconductor laser module according to claim 5, wherein a focusing unit (4) is provided at a front end of the water-cooled diaphragm (3), the focusing mirror (42) is provided inside the focusing unit (4), and a focusing water pipe connector (41) for connecting external circulating cooling water is provided on the focusing unit (4) to achieve a purpose of dissipating heat of the focusing mirror (42).

7. The direct output type semiconductor laser module according to claim 6, wherein a protection unit (5) is provided on the focusing unit (4), and a protection glass (51) is provided on the protection unit (5).

8. The direct output type semiconductor laser module according to claim 6, wherein an emitting unit (6) is provided in front of the focusing unit (4), and one or more gas nozzles (61) are provided on the emitting unit (6) and externally connected with a shielding gas for blowing out the shielding gas during the welding process for protecting the surface of the workpiece and blowing off dust and smoke generated during the welding process.

9. A direct output type semiconductor laser module as set forth in claim 1, wherein a PD monitor (15) is provided on the laser beam (14) side for monitoring the laser output energy in real time.

10. A direct output type semiconductor laser module as claimed in claim 1, wherein the cooling substrate (1) is provided with an upper cover (2), the upper end of the upper cover (2) is designed in a zigzag shape, an external socket (80) is provided behind the upper cover (2), the external socket (80) is connected with an external power supply system, supplies power to the internal LD pump source (12), and feeds back internal power or temperature monitoring to an external control system.