CN217843206U - Computer height-adjusting support integrated with heat dissipation mechanism - Google Patents

Computer height-adjusting support integrated with heat dissipation mechanism Download PDF

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Publication number
CN217843206U
CN217843206U CN202220584987.6U CN202220584987U CN217843206U CN 217843206 U CN217843206 U CN 217843206U CN 202220584987 U CN202220584987 U CN 202220584987U CN 217843206 U CN217843206 U CN 217843206U
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China
Prior art keywords
computer
heat dissipation
fan
screw thread
dissipation mechanism
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CN202220584987.6U
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Chinese (zh)
Inventor
魏巍
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Beijing Sikepai Electronic Products Co ltd
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Beijing Sikepai Electronic Products Co ltd
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Priority to CN202220584987.6U priority Critical patent/CN217843206U/en
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    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02DCLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
    • Y02D10/00Energy efficient computing, e.g. low power processors, power management or thermal management

Abstract

The utility model discloses a support is increaseed to computer of integrated heat dissipation mechanism, the on-line screen storage device comprises a base, base top middle part both sides are fixed respectively and are provided with first riser and second riser, the middle part screw thread of first riser is provided with the screw thread post, the fixed knob that is provided with of one end of screw thread post, the utility model relates to a support is increaseed to computer of integrated heat dissipation mechanism, through rotating the knob, drive the screw thread post and rotate, drive two sleeves or move dorsad, it reciprocates to drive to place the seat, realize highly adjusting the computer, application scope is more extensive, monitor the temperature of computer bottom through temperature detect switch, the cold air that comes the refrigeration piece production of refrigeration piece to blow off through first fan, come to cool down the heat dissipation to the bottom of computer, avoid the computer high temperature to advance and cause the damage to internal components and parts to the hot-air of semiconductor piece cooling surface comes to discharge fast through the second fan, improves the radiating efficiency.

Description

Computer height-adjusting support integrated with heat dissipation mechanism
Technical Field
The utility model relates to a computer support field specifically is a computer height-regulating support of integrated heat dissipation mechanism.
Background
The computer support is a so-called lazy support, is used in a comfortable mode, obtains comfortable computer use experience according to human engineering and participation of a man-machine design idea, and is formed by combining a display support and a notebook support. The height of a computer is not convenient to adjust in the using process of the existing computer support, so that the computer support is not convenient and fast to use.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a support is increaseed to computer of integrated heat dissipation mechanism to the height of being not convenient for with the computer that proposes in solving above-mentioned background art is adjusted, leads to using convenient problem inadequately.
In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a support is increaseed to computer of integrated heat dissipation mechanism, includes the base, base top middle part both sides are fixed respectively and are provided with first riser and second riser, the middle part screw thread of first riser is provided with the screw thread post, the fixed knob that is provided with of one end of screw thread post, the surface screw thread of screw thread post is provided with two sleeves, two the telescopic top is all fixed and is provided with first articulated ear, and two the middle part of first articulated ear all articulates there is branch, two the one end that branch kept away from first articulated ear all articulates there is the articulated ear of second, two it is fixed with the pillar to be provided with between the articulated ear of second, the fixed seat of placing in top of pillar is provided with, through rotating the knob, drives the screw thread post and rotates, drives two sleeves and moves in opposite directions or dorsad, drives the seat of placing and reciprocates, realizes adjusting the height of computer, and application scope is more extensive, the middle part fixed mounting who places seat top has the temperature detect switch, the both sides of seat top all fixed heat radiation structure that is provided with.
Preferably, two heat radiation structure all includes mount pad, protection network, first fan and semiconductor refrigeration piece, the fixed protection network that is provided with in inboard top of mount pad, the bottom fixed mounting of protection network has first fan, the inboard middle part fixed mounting of mount pad has the semiconductor refrigeration piece, the cooling surface fixed mounting of semiconductor refrigeration piece has a plurality of evenly distributed's fin, a plurality of bottom fixed mounting between the fin has the second fan, two first fan, two semiconductor refrigeration pieces and two second fans all through temperature detect switch and external power supply electric connection, monitor the temperature of computer bottom through temperature detect switch, can trigger temperature detect switch when the temperature reaches a definite value, come to control two first fans, two semiconductor refrigeration pieces and two second fans circular telegram and begin work, come to blow out the cold air that the refrigeration piece of semiconductor refrigeration piece produced through first fan, come to cool down the bottom of computer, avoid computer high temperature to advance and cause the damage to internal components and parts to come to discharge the hot-air of semiconductor piece cooling surface through the second fan, come to improve radiating efficiency.
Preferably, the first fan is arranged corresponding to the cooling surface of the semiconductor cooling plate, the second fan is arranged corresponding to the heat dissipation surface of the semiconductor cooling plate, and hot air on the heat dissipation surface of the semiconductor cooling plate is rapidly discharged through the second fan, so that the heat dissipation efficiency is improved.
Preferably, the base and four corners of placing between the seat all fixedly are provided with the telescopic link, and the setting of four telescopic links can play the effect of stabilizing the support to placing the seat.
Preferably, four corners of the bottom end of the base are fixedly provided with anti-skidding seats, and the anti-skidding performance of the device can be improved through the arrangement of the anti-skidding seats.
Preferably, one end, far away from the knob, of the threaded column is rotatably connected with the middle of the second vertical plate, and threads in opposite directions are arranged at two ends of the surface of the threaded column, so that the moving directions of the two sleeves are opposite.
Compared with the prior art, the beneficial effects of the utility model are that: through rotating the knob, it rotates to drive the screw thread post, drive two sleeves and remove in opposite directions or dorsad, it reciprocates to drive the seat of placing, realize highly adjusting the computer, application scope is more extensive, come to monitor the temperature of computer bottom through temperature detect switch, blow off the cold air that the refrigeration piece of semiconductor refrigeration piece produced through first fan, come to cool down the heat dissipation to the bottom of computer, avoid the computer high temperature and then lead to the fact the damage to internal components and parts, and come to discharge the hot-air of semiconductor refrigeration piece cooling surface fast through the second fan, improve the radiating efficiency.
Drawings
Fig. 1 is a perspective view of the present invention;
fig. 2 is a front sectional view of the present invention;
fig. 3 is a structural diagram of the heat dissipation structure of the present invention.
In the figure: 1. a base; 2. a telescopic rod; 3. a placing seat; 4. a heat dissipation structure; 41. a mounting seat; 42. a protective net; 43. a first fan; 44. a semiconductor refrigerating sheet; 45. a heat sink; 46. a second fan; 5. a temperature control switch; 6. a first vertical plate; 7. a second vertical plate; 8. a threaded post; 9. a sleeve; 10. a first hinge ear; 11. a strut; 12. a second hinge ear; 13. a pillar; 14. an anti-slip seat; 15. a knob.
Detailed Description
The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention.
Please refer to fig. 1-3, the utility model provides a computer heightening support of integrated heat dissipation mechanism, including base 1, 1 top middle part both sides of base are fixed respectively and are provided with first riser 6 and second riser 7, the middle part screw thread of first riser 6 is provided with screw thread post 8, the fixed knob 15 that is provided with of one end of screw thread post 8, the surface screw thread of screw thread post 8 is provided with two sleeves 9, the top of two sleeves 9 is all fixed and is provided with first articulated ear 10, the middle part of two first articulated ears 10 all articulates there is branch 11, the one end that two branch 11 kept away from first articulated ear 10 all articulates there is second articulated ear 12, the fixed pillar 13 that is provided with between two second articulated ear 12, the fixed seat 3 that is placed in top of pillar 13, through rotating knob 15, drive screw thread post 8 and rotate, drive two sleeves 9 and move in opposite directions or dorsad, it reciprocates to drive seat 3 of placing, realize highly adjusting the computer, application scope is more extensive, the middle part fixed mounting who places seat 3 top has temperature control switch 5, the both sides of seat 3 top are all fixed and are provided with heat radiation structure 4.
The two heat dissipation structures 4 respectively comprise a mounting seat 41, a protective net 42, a first fan 43 and a semiconductor chilling plate 44, the protective net 42 is fixedly arranged at the top of the inner side of the mounting seat 41, a first fan 43 is fixedly arranged at the bottom end of the protective net 42, the semiconductor chilling plate 44 is fixedly arranged at the middle of the inner side of the mounting seat 41, a plurality of radiating fins 45 which are uniformly distributed are fixedly arranged on the heat dissipation surface of the semiconductor chilling plate 44, a second fan 46 is fixedly arranged at the bottom of the radiating fins 45, the two first fans 43, the two semiconductor chilling plates 44 and the two second fans 46 are electrically connected with an external power supply through a temperature control switch 5, the temperature of the bottom of the computer is monitored through the temperature control switch 5, the temperature control switch 5 is triggered when the temperature reaches a certain value, the two first fans 43 are controlled, the two semiconductor chilling plates 44 and the two second fans 46 are electrified to start working, cold air generated by the chilling plates of the semiconductor chilling plates 44 is blown out through the first fans 43, the bottom of the computer is cooled, the computer is prevented from being excessively high temperature and damages to the internal components are prevented, and the heat dissipation efficiency of the semiconductor chilling surface is improved.
The first fan 43 is arranged corresponding to the cooling surface of the semiconductor cooling plate 44, the second fan 46 is arranged corresponding to the heat dissipation surface of the semiconductor cooling plate 44, and hot air on the heat dissipation surface of the semiconductor cooling plate 44 is rapidly discharged through the second fan 46, so that the heat dissipation efficiency is improved.
Base 1 and four corners of placing between the seat 3 are all fixed and are provided with telescopic link 2, and the setting of four telescopic links 2 can play the effect of stabilizing the support to placing seat 3.
Four corners of base 1 bottom are all fixed and are provided with anti-skidding seat 14, can improve the device's non-slip property through the setting of anti-skidding seat 14.
One end of the threaded column 8, which is far away from the knob 15, is rotatably connected with the middle part of the second vertical plate 7, and two ends of the surface of the threaded column 8 are provided with threads in opposite directions, so that the moving directions of the two sleeves 9 are opposite.
When the embodiment of the application is used: an operator places a computer on the placing seat 3 firstly, then rotates the knob 15, drive the threaded column 8 to rotate, drive two sleeves 9 to move in opposite directions or in the opposite directions, drive the placing seat 3 to move up and down, realize the height adjustment of the computer, the application range is wider, in the use process, the temperature of the bottom of the computer is monitored through the temperature control switch 5, the temperature control switch 5 is triggered when the temperature reaches a certain value, control two first fans 43, control two semiconductor refrigerating sheets 44 and two second fans 46 to start working after being electrified, the cold air generated by the refrigerating sheets of the semiconductor refrigerating sheets 44 is blown out through the first fans 43, the bottom of the computer is cooled and radiated, the computer is prevented from being too high in temperature and damaging internal components, and the hot air of the radiating surfaces of the semiconductor refrigerating sheets 44 is rapidly discharged through the second fans 46, so that the radiating efficiency is improved.
Although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments or portions thereof without departing from the spirit and scope of the invention.

Claims (6)

1. The utility model provides a support is increaseed to computer of integrated heat dissipation mechanism, includes base (1), its characterized in that: base (1) top middle part both sides are fixed respectively and are provided with first riser (6) and second riser (7), the middle part screw thread of first riser (6) is provided with screw thread post (8), the fixed knob (15) that is provided with in one end of screw thread post (8), the surface screw thread of screw thread post (8) is provided with two sleeves (9), two the top of sleeve (9) is all fixed and is provided with first articulated ear (10), two the middle part of first articulated ear (10) all articulates there is branch (11), two the one end that first articulated ear (10) was kept away from in branch (11) all articulates there is articulated ear (12) of second, two fixed pillar (13) that is provided with between the articulated ear of second (12), the top of pillar (13) is fixed to be provided with places seat (3), the middle part fixed mounting who places seat (3) top has temperature detect switch (5), the both sides of placing seat (3) top are all fixed and are provided with heat radiation structure (4).
2. The computer height-adjusting bracket integrated with a heat dissipation mechanism of claim 1, wherein: two heat radiation structure (4) all include mount pad (41), protection network (42), first fan (43) and semiconductor refrigeration piece (44), the fixed protection network (42) that is provided with in top of mount pad (41) inboard, the bottom fixed mounting of protection network (42) has first fan (43), the middle part fixed mounting of mount pad (41) inboard has semiconductor refrigeration piece (44), the cooling surface fixed mounting of semiconductor refrigeration piece (44) has a plurality of evenly distributed's fin (45), a plurality of bottom fixed mounting between fin (45) has second fan (46), two first fan (43), two semiconductor refrigeration pieces (44) and two second fan (46) all are through temperature detect switch (5) and external power supply electric connection.
3. The computer height-adjusting bracket integrated with a heat dissipation mechanism of claim 2, wherein: the first fan (43) is arranged corresponding to the refrigerating surface of the semiconductor refrigerating sheet (44), and the second fan (46) is arranged corresponding to the heat radiating surface of the semiconductor refrigerating sheet (44).
4. The computer height-adjusting bracket integrated with a heat dissipation mechanism of claim 1, wherein: the four corners between the base (1) and the placing seat (3) are fixedly provided with telescopic rods (2).
5. The computer height-adjusting bracket integrated with a heat dissipation mechanism of claim 1, wherein: and anti-skidding seats (14) are fixedly arranged at four corners at the bottom end of the base (1).
6. The computer height-adjusting bracket integrated with a heat dissipation mechanism of claim 1, wherein: one end, far away from the knob (15), of the threaded column (8) is rotatably connected with the middle of the second vertical plate (7), and threads in opposite directions are arranged at two ends of the surface of the threaded column (8).
CN202220584987.6U 2022-03-17 2022-03-17 Computer height-adjusting support integrated with heat dissipation mechanism Active CN217843206U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202220584987.6U CN217843206U (en) 2022-03-17 2022-03-17 Computer height-adjusting support integrated with heat dissipation mechanism

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202220584987.6U CN217843206U (en) 2022-03-17 2022-03-17 Computer height-adjusting support integrated with heat dissipation mechanism

Publications (1)

Publication Number Publication Date
CN217843206U true CN217843206U (en) 2022-11-18

Family

ID=84010704

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202220584987.6U Active CN217843206U (en) 2022-03-17 2022-03-17 Computer height-adjusting support integrated with heat dissipation mechanism

Country Status (1)

Country Link
CN (1) CN217843206U (en)

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