CN217834546U - Electronic product connector stamping die with buffering effect - Google Patents
Electronic product connector stamping die with buffering effect Download PDFInfo
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- CN217834546U CN217834546U CN202221760945.XU CN202221760945U CN217834546U CN 217834546 U CN217834546 U CN 217834546U CN 202221760945 U CN202221760945 U CN 202221760945U CN 217834546 U CN217834546 U CN 217834546U
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- buffering
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- damping
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Abstract
The utility model discloses an electronic product connector stamping die with buffering effect, the on-line screen storage device comprises a fixed pedestal, cover half and movable mould, the cover half left and right sides sets up the damping lever of locating flexible guide bar lower part, the end of damping lever rotates through the pivot that has the torsional spring and sets up the buffering deflector, the slip ball on buffering deflector surface and the removal of movable mould outer wall laminating cooperation movable mould, the buffering deflector supports forward to damping cylinder seat position damping lever, the damping lever supports the resistance that produces with the damping cylinder seat and plays certain buffering effect to the lower removal of movable mould, reduce the impact force when movable mould and cover half coincide, reduce when moulding plastics to the electronic product connector because the movable mould with the cover half impact force too big produce the displacement increase defective rate the probability, further improve the security to product injection moulding production; the movable mould is provided with an injection molding pipe communicated with the cover plate upper bolt joint seat, and the injection molding raw material communicated with the cover plate is directly guided out of a molding cavity of the fixed mould through the injection molding pipe, so that the leakage probability of the injection molding raw material is reduced.
Description
Technical Field
The utility model belongs to the technical field of the production facility that moulds plastics, concretely relates to electronic product connector stamping die with buffering effect.
Background
The injection mold consists of a movable mold and a fixed mold, wherein the movable mold is arranged on a movable template of the injection molding machine, and the fixed mold is arranged on a fixed template of the injection molding machine. The movable mould and the fixed mould are closed to form a pouring system and a cavity during injection molding, the movable mould and the fixed mould are separated during mould opening so as to take out a plastic product, and the movable mould is directly driven by a stamping driving device to coincide with the fixed mould, so that the aim of injection molding production of a workpiece is fulfilled;
therefore, the utility model provides an electronic product connector stamping die with buffering effect.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide an electronic product connector stamping die with buffering effect to solve the problem that proposes among the above-mentioned background art.
In order to achieve the above purpose, the utility model provides a following technical scheme:
the stamping die for the electronic product connector with the buffering effect comprises a fixed base, a fixed die and a movable die, wherein the fixed die is fixedly arranged on the fixed base, the top ends of telescopic guide rods fixed at four corners on the fixed base are provided with injection molding upper dies, and the movable die is fixedly arranged on the bottom surface of the injection molding upper dies and is arranged above the fixed die;
damping cylinder seats are respectively arranged on the inner sides of the lower parts of the telescopic guide rods, damping rods are arranged in the damping cylinder seats, the tail ends of the damping rods are provided with buffering guide plates in a matched mode through rotating shafts with torsional springs, and sliding balls are arranged on the buffering guide plates;
the movable mould with mould on moulding plastics on the equipartition have a plurality of through-hole, the spiro union has the end to locate the pipe of moulding plastics on the top in the mould of moulding plastics in the port of moulding plastics of movable mould bottom surface, mould plastics the fixed bottom that is equipped with apron and apron of last top surface of mould and be equipped with the stand pipe that inlays the dress in the inside wall of the pipe of moulding plastics, be equipped with the spiro union seat of putting through mutually with the stand pipe on the apron.
Furthermore, the lower part of the fixed die is embedded in a mounting groove on the fixed base and fixed through a locking bolt, and the locking bolt is arranged at the bottom of the fixed base.
When the fixed die needs to be replaced according to the model of the injection-molded electronic product connector, the fixed die is convenient to replace by detaching the locking bolt to separate the fixed die from the installation groove.
Furthermore, the damping cylinder seats are at least provided with two groups of damping cylinder seats which are respectively arranged at the lower parts of the two opposite telescopic guide rods.
The damping rods on the two groups of damping cylinder seats are matched with the buffering guide plates to generate resistance for abutting and guiding the left side and the right side of the moving die when moving downwards, so that the balance of resistance generated for buffering the moving die is kept.
Furthermore, the buffering guide plate is obliquely arranged on the outer side below the fixed die.
The bottom end of the movable die is connected with the bottom end of the buffer guide plate, and the bottom end of the buffer guide plate is connected with the bottom end of the movable die.
Furthermore, the connecting plate at the top end of the damping rod is rotatably connected with the connecting block at the back of the buffering guide plate in a matching manner through the rotating shaft.
When the buffering guide plate is subjected to downward pressure when the movable die moves downwards, the rotating shaft connected with the connecting block through the connecting plate rotates, and the damping rod and the damping cylinder seat are matched to stretch and contract to generate resistance to downward movement of the movable die.
Furthermore, the buffering deflector adopts the rubber slab to make slip ball on the buffering deflector is equipped with three groups, three groups both ends and the middle part on buffering deflector surface are located respectively to the slip ball.
The sliding ball is used for being attached to the outer wall of the movable die when the buffer guide plate generates resistance to the matching of the movable die, and is attached to the surface of the outer wall of the movable die in a limiting mode along with the continuous downward movement of the movable die.
Compared with the prior art, the utility model have following technological effect and advantage:
the stamping die for the electronic product connector with the buffering effect is characterized in that damping rods arranged at the lower parts of telescopic guide rods are arranged on the left side and the right side of a fixed die, and a buffering guide plate is arranged at the tail end of each damping rod in a rotating mode through a rotating shaft with a torsion spring, so that when a movable die receives driving equipment moving downwards and is overlapped with the fixed die to stamp the electronic product connector, the tilting of the buffering guide plate is supported on the left side and the right side of the bottom end of the movable die and rotates in a matching mode with the rotating shaft at the tail end of the damping rods along with the moving of the movable die, the torsion spring generates torsion on the rotation of the buffering guide plate, the buffering effect is further achieved on the moving downwards of the movable die, sliding balls on the surface of the buffering guide plate are attached to the outer wall of the movable die to match with the movement of the movable die along with the continuous moving downwards of the movable die, the buffering guide plate supports the damping rods towards the position of a damping cylinder seat, the damping cylinder seat generates resistance to the movable die in a certain buffering effect, the downward movement of the movable die, the movable die and the fixed die is further reduced, the impact force generated by the excessive movement of the movable die and the fixed die during injection of the electronic product connector, and further improved safety during the production of products;
the movable mould is provided with an injection molding pipe communicated with the cover plate upper screw joint seat, and the injection molding pipe is tightly attached to the inner wall of the top end of the injection molding pipe through the guide pipe, so that injection molding raw materials output by the injection molding raw material output pipe screwed in the screw joint seat are directly led out to the forming cavity of the fixed mould through the injection molding pipe, and the leakage probability of the injection molding raw materials is reduced.
Drawings
Fig. 1 is a schematic structural view of the present invention;
FIG. 2 is a schematic view of the connection structure of the damping rod and the buffering guide plate of the present invention;
fig. 3 is a schematic cross-sectional view of a portion a in fig. 1 according to the present invention.
In the figure: 1. a fixed base; 2. fixing a mold; 3. moving the mold; 4. a telescopic guide rod; 5. injection molding an upper die; 6. a damping cylinder base; 7. a damping lever; 8. a buffer guide plate; 9. a sliding ball; 10. a through hole; 11. injection molding a port; 12. injecting a tube; 13. a cover plate; 14. a guide tube; 15. a screw joint seat; 16. mounting grooves; 17. and locking the bolt.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
The utility model provides an electronic product connector stamping die with buffering effect as shown in fig. 1-3, including unable adjustment base 1, cover half 2 and movable mould 3, cover half 2 is fixed to be located on unable adjustment base 1, and the lower part of cover half 2 is inlayed and is installed in mounting groove 16 on unable adjustment base 1 and fixed through locking bolt 17, and fixing base 1's bottom is located to locking bolt 17. When the fixed die 2 needs to be replaced according to the model of the injection-molded electronic product connector, the fixed die 2 is convenient to replace by detaching the locking bolt 17 to separate the fixed die 2 from the mounting groove 16. An injection upper die 5 is arranged at the top end of a telescopic guide rod 4 fixed at four corners on the fixed base 1, and the movable die 3 is fixedly arranged on the bottom surface of the injection upper die 5 and above the fixed die 2;
the inner sides of the lower parts of the telescopic guide rods 4 are respectively provided with a damping cylinder seat 6, damping rods 7 are arranged in the damping cylinder seats 6, and the damping cylinder seats 6 are at least provided with two groups of damping cylinder seats 6 which are respectively arranged at the lower parts of the two telescopic guide rods 4 which are opposite to each other. The damping rods 7 on the two groups of damping cylinder seats 6 are matched with the buffering guide plates 8 to generate resisting force for abutting and guiding the left side and the right side of the moving die 3 during moving downwards, so that the balance of the resisting force generated by buffering the moving die 3 is kept;
the terminal of damping rod 7 is equipped with buffering deflector 8 through the pivot cooperation that has the torsional spring, and the connecting plate on 7 tops of damping rod rotates with the connecting block cooperation pivot at the 8 backs of buffering deflector to be connected. When the buffering guide plate 8 is subjected to downward pressure when the movable mold 3 moves downwards, the rotating shaft connected with the connecting block through the connecting plate rotates, and the damping rod 7 and the damping cylinder seat 6 are matched to stretch and contract to generate resistance to downward movement of the movable mold 3. The buffer guide plate 8 is obliquely arranged on the outer side of the lower part of the fixed mold 2. The inclination of the buffer guide plate 8 is used for bearing the bottom end of the movable die 3 when the bottom end moves downwards, and the buffer guide plate 8 generates external pressure along with the downward movement of the movable die 3 towards the telescopic guide rod 4, so that the buffer guide plate 8 is prevented from being pressed between the movable die 3 and the fixed die 2 by the movable die 3;
be equipped with slip ball 9 on the buffering deflector 8, the slip ball 9 that buffering deflector 8 adopted the rubber slab to make on the buffering deflector 8 is equipped with three groups, and two ends and the middle part on buffering deflector 8 surface are located respectively to three groups of slip balls 9. The sliding ball 9 is used for being attached to the outer wall of the movable die 3 when the buffer guide plate 8 generates resistance to the matching of the movable die 3, and is attached to the surface of the outer wall of the movable die 3 for limiting along with the continuous downward movement of the movable die 3;
a plurality of through holes 10 are uniformly distributed on the movable mould 3 and the injection upper mould 5, an injection pipe 12 with the tail end arranged at the inner top end of the injection upper mould 5 is screwed in an injection port 11 at the bottom surface of the movable mould 3, a cover plate 13 is fixedly arranged on the upper top surface of the injection upper mould 5, a guide pipe 14 embedded in the inner wall of the injection pipe 12 is arranged at the bottom end of the cover plate 13, and a screw joint seat 15 communicated with the guide pipe 14 is arranged on the cover plate 13.
According to the electronic product connector stamping die with the buffering effect, the damping rods 7 arranged at the lower parts of the telescopic guide rods 4 are arranged on the left side and the right side of the fixed die 2, the buffering guide plates 8 are arranged at the tail ends of the damping rods 7 in a rotating mode through rotating shafts with torsional springs, so that when the movable die 3 receives the condition that a driving device moves downwards to be overlapped with the fixed die 2 to stamp the electronic product connector, the tilting of the buffering guide plates 8 is supported on the left side and the right side of the bottom end of the movable die 3, the buffering guide plates 8 are matched with the rotating shafts at the tail ends of the damping rods 7 to rotate along with the downward movement of the movable die 3, torsion is generated by the rotation of the buffering guide plates 8 through the torsional springs, the buffering effect is achieved on the downward movement of the movable die 3, along with the continuous downward movement of the movable die 3, sliding balls 9 on the surfaces of the buffering guide plates 8 are attached to the outer wall of the movable die 3 to be matched with the movement of the movable die 3, the buffering guide plates 8 abut against the damping cylinder seats 6, the damping rods 7 against the damping cylinder seats 6, the resistance generated by the damping cylinder seats 6 to move downwards to a certain buffering effect, so that the impact force generated on the movable die 3 and the excessive displacement of the fixed die 3 and the movable die 2 is reduced, and the safety of the injection molding product is increased;
the movable die 3 is provided with an injection molding tube 12 communicated with a screw joint seat 15 on the cover plate 13, and the injection molding tube 12 is tightly attached to the inner wall of the top end of the injection molding tube 12 through a guide tube 14, so that injection molding raw materials output by an injection molding raw material output tube screwed in the screw joint seat 15 are directly led out to a molding cavity of the fixed die 2 through the injection molding tube 12, and the leakage probability of the injection molding raw materials is reduced.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions on some technical features, and any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of the present invention.
Claims (6)
1. The utility model provides an electronic product connector stamping die with buffering effect, includes unable adjustment base (1), cover half (2) and movable mould (3), its characterized in that: the fixed die (2) is fixedly arranged on the fixed base (1), an injection upper die (5) is arranged at the top end of a telescopic guide rod (4) fixed at four corners on the fixed base (1), and the movable die (3) is fixedly arranged on the bottom surface of the injection upper die (5) and above the fixed die (2);
the inner sides of the lower parts of the telescopic guide rods (4) are respectively provided with a damping cylinder seat (6), damping rods (7) are arranged in the damping cylinder seats (6), the tail ends of the damping rods (7) are provided with buffer guide plates (8) in a matched mode through rotating shafts with torsional springs, and sliding balls (9) are arranged on the buffer guide plates (8);
the utility model discloses a mould, including movable mould (3) and the mould of moulding plastics (5) on the equipartition have a plurality of through-hole (10), the injection molding pipe (12) on the terminal top of moulding plastics in port (11) the interior spiro union of moulding plastics (3) bottom surface has, the fixed bottom that is equipped with apron (13) and apron (13) of the last top surface of the mould of moulding plastics (5) is equipped with and inlays stand pipe (14) of adorning in injection molding pipe (12) inner wall, be equipped with on apron (13) and connect with screw socket (15) that stand pipe (14) put through mutually.
2. The electronic product connector stamping die with the buffering effect as claimed in claim 1, wherein: the lower part of the fixed die (2) is embedded in an installation groove (16) on the fixed base (1) and is fixed through a locking bolt (17), and the locking bolt (17) is arranged at the bottom of the fixed base (1).
3. The electronic product connector stamping die with buffering effect as claimed in claim 1, wherein: the damping cylinder seats (6) are at least provided with two groups of damping cylinder seats (6) which are respectively arranged at the lower parts of the two opposite telescopic guide rods (4).
4. The electronic product connector stamping die with buffering effect as claimed in claim 1, wherein: the buffering guide plate (8) is obliquely arranged on the outer side below the fixed die (2).
5. The electronic product connector stamping die with the buffering effect as claimed in claim 1, wherein: the connecting plate at the top end of the damping rod (7) is rotatably connected with the connecting block at the back of the buffering guide plate (8) in a matching mode through a rotating shaft.
6. The electronic product connector stamping die with the buffering effect as claimed in claim 1, wherein: buffering deflector (8) adopt the rubber slab to make slip ball (9) on buffering deflector (8) are equipped with three groups, three groups both ends and the middle part on buffering deflector (8) surface are located respectively to slip ball (9).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221760945.XU CN217834546U (en) | 2022-07-08 | 2022-07-08 | Electronic product connector stamping die with buffering effect |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221760945.XU CN217834546U (en) | 2022-07-08 | 2022-07-08 | Electronic product connector stamping die with buffering effect |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217834546U true CN217834546U (en) | 2022-11-18 |
Family
ID=84035379
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202221760945.XU Active CN217834546U (en) | 2022-07-08 | 2022-07-08 | Electronic product connector stamping die with buffering effect |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217834546U (en) |
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2022
- 2022-07-08 CN CN202221760945.XU patent/CN217834546U/en active Active
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