CN217825589U - Circuit board bonding wire device - Google Patents
Circuit board bonding wire device Download PDFInfo
- Publication number
- CN217825589U CN217825589U CN202221548940.0U CN202221548940U CN217825589U CN 217825589 U CN217825589 U CN 217825589U CN 202221548940 U CN202221548940 U CN 202221548940U CN 217825589 U CN217825589 U CN 217825589U
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- circuit board
- welding
- seat
- dust
- bonding wire
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Abstract
The utility model belongs to the circuit board field, specific circuit board bonding wire device that says so, comprises a workbench, be provided with the mount pad on the workstation, swing joint has the welding stent on the mount pad, the last dust collector that is provided with of welding stent. This circuit board bonding wire device through being provided with the mount pad on the workstation, carries out relative rotation through rotating electrical machines and pivot between mount pad and the welding support, and nimble adjusting position drives through lead screw and servo motor and removes the seat and carry out relative movement to make the soldered connection be convenient for carry out the bonding wire to the circuit board, be provided with the dust absorption hole simultaneously around the soldered connection, dust removal pipe and aspirator pump discharge smog gas, thereby improve circuit board bonding wire yield.
Description
Technical Field
The utility model relates to a circuit board field specifically is a circuit board bonding wire device.
Background
The circuit Board PCB is an english (Printed circuit Board) Printed PCB, and is abbreviated as a circuit Board. Conductive patterns formed by making printed circuits, printed components, or a combination of both, on an insulating material in a predetermined design are commonly referred to as printed circuits.
And a large amount of smoke can appear when the existing circuit board is subjected to wire welding, and the smoke contains a large amount of particles which can be polluted on the circuit board when not treated, so that the quality of welding wires of the circuit board is poor, and the product quality is influenced.
Therefore, a wire bonding apparatus for a circuit board is proposed to solve the above problems.
SUMMERY OF THE UTILITY MODEL
In order to compensate prior art's not enough, solve present circuit board and be carrying out the bonding wire in-process, can appear a large amount of flue gases, and wherein contain a large amount of particulate matters, do not do the processing and can be infected with on the circuit board to cause circuit board bonding wire quality relatively poor, influence product quality's problem, the utility model provides a circuit board bonding wire device.
The utility model provides a technical scheme that its technical problem adopted is: a circuit board bonding wire device, comprises a workbench, be provided with the mount pad on the workstation, swing joint has the welding stent on the mount pad, the last dust collector that is provided with of welding stent.
Preferably, the mounting seat is provided with a rotating motor, the rotating motor is provided with a rotating shaft connected with the rotating motor, the welding support is provided with a rotating seat connected with the rotating shaft, and the rotating motor drives the rotating seat to rotate so as to rotate the welding support.
Preferably, the welding support is provided with a fixed seat, the fixed seat is provided with a screw rod, one end of the screw rod is connected with the servo motor, and the outer wall of the screw rod is provided with a movable seat, so that the flexibility of the circuit board welding wires is improved.
Preferably, a sliding seat is arranged on the moving seat, a sliding groove connected with the sliding seat is arranged on the welding support, and the sliding groove plays a certain limiting role in moving the sliding seat.
Preferably, be provided with the locating hole on the removal seat, and the downthehole swing joint of locating has the locating lever, the locating lever is connected with the welded seat in the removal seat outside, and the welded seat is connected through electric telescopic handle with removing between the seat, and electric telescopic handle is favorable to butt joint to reciprocate, satisfies the bonding wire user demand.
Preferably, the locating lever sets up to "T" font, and is connected the face and set up to smooth structure between locating lever and the locating hole, is convenient for ensure soldered connection welding effect.
Preferably, be provided with the soldered connection on the welded seat, and the welded seat is provided with the dust absorption hole around the soldered connection, is favorable to improving the flue gas and gets rid of efficiency, and the dust absorption hole can play refrigerated effect to the welded part under certain action simultaneously, improves the bonding wire effect.
Preferably, dust collector includes dust suction box, dust removal pipe, aspirator pump, be provided with the dust suction box on the welding stent, and be provided with the dust removal pipe between dust suction box and the dust absorption hole, install the aspirator pump on the dust removal pipe, be convenient for adsorb the flue gas that produces among the welding process, improve circuit board bonding wire shaping quality.
Preferably, the dust absorption holes are distributed in a circular ring shape around the welding head, and the connection position between the dust absorption holes and the dust removal pipe is in sealing connection, so that the dust removal effect is guaranteed.
The utility model discloses an useful part lies in:
the utility model discloses a be provided with the mount pad on the workstation, carry out relative rotation through rotating electrical machines and pivot between mount pad and the welding support, nimble adjusting position drives through lead screw and servo motor and removes the seat and carry out relative movement to make the soldered connection be convenient for carry out the bonding wire to the circuit board, be provided with the dust absorption hole all around at the soldered connection simultaneously, dust removal pipe and aspirator pump discharge smog gas, thereby improve circuit board bonding wire yield.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without inventive exercise.
FIG. 1 is a schematic view of the overall structure of the embodiment;
FIG. 2 is an enlarged schematic view of the embodiment at A in FIG. 1;
FIG. 3 is a schematic view showing a distribution structure of dust suction holes according to the embodiment.
In the figure: 1. a work table; 2. a mounting base; 3. welding a bracket; 4. an electric telescopic rod; 5. a rotating electric machine; 6. a rotating shaft; 7. a rotating base; 8. a fixed seat; 9. a screw rod; 10. a servo motor; 11. a movable seat; 12. a slide base; 13. a chute; 14. positioning holes; 15. positioning a rod; 16. welding a base; 17. welding a head; 18. a dust collection hole; 19. a dust collection box; 20. a dust removal pipe; 21. a getter pump.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
Referring to fig. 1-3, a circuit board wire bonding apparatus includes a worktable 1, a mounting base 2 is disposed on the worktable 1, a welding support 3 is movably connected to the mounting base 2, and a dust removing device is disposed on the welding support 3.
In this embodiment, be provided with rotating electrical machines 5 on the mount pad 2, be provided with the pivot 6 rather than being connected on the rotating electrical machines 5, be provided with the roating seat 7 that pivot 6 is connected on the welding stent 3, rotating electrical machines 5 makes pivot 6 drive roating seat 7 and rotates to rotate welding stent 3.
In this embodiment, be provided with fixing base 8 on the welding stent 3, install lead screw 9 on the fixing base 8, and lead screw 9 one end is connected with servo motor 10, is provided with on the lead screw 9 outer wall and removes seat 11, is favorable to improving circuit board bonding wire flexibility.
In this embodiment, a sliding seat 12 is disposed on the moving seat 11, a sliding groove 13 connected to the sliding seat 12 is disposed on the welding support 3, and the sliding groove 13 plays a certain limiting role in the movement of the sliding seat 12.
In this embodiment, be provided with locating hole 14 on the removal seat 11, and swing joint has locating lever 15 in the locating hole 14, and locating lever 15 is connected with welded seat 16 in removing the seat 11 outside, and welded seat 16 is connected through electric telescopic handle 4 with removing between the seat 11, and electric telescopic handle 4 is favorable to reciprocating butt joint 17, satisfies the bonding wire user demand.
In this embodiment, the positioning rod 15 is arranged in a shape like a "T", and the connecting surface between the positioning rod 15 and the positioning hole 14 is arranged in a smooth structure, so that the welding effect of the welding head 17 is ensured.
In this embodiment, be provided with soldered connection 17 on the welded seat 16, and welded seat 16 is provided with dust absorption hole 18 around soldered connection 17, is favorable to improving flue gas and gets rid of efficiency, and dust absorption hole 18 can play refrigerated effect to the welded part under certain effect simultaneously, improves the bonding wire effect.
In this embodiment, the dust removing device includes a dust collection box 19, a dust collection pipe 20, and a suction pump 21, the dust collection box 19 is provided on the welding support 3, and the dust collection pipe 20 is provided between the dust collection box 19 and the dust collection hole 18, and the suction pump 21 is installed on the dust collection pipe 20, so as to facilitate the absorption of the flue gas generated in the welding process, and improve the quality of the circuit board welding wire.
In this embodiment, the dust suction holes 18 are distributed around the welding head 17 in a circular ring shape, and the connection between the dust suction holes 18 and the dust removal pipe 20 is hermetically connected, which is beneficial to ensuring the dust removal effect.
In conclusion, according to the circuit board welding device, the installation seat 2 is arranged on the workbench 1, the installation seat 2 and the welding support 3 rotate relatively through the rotating motor 5 and the rotating shaft 6, the position is adjusted flexibly, the screw rod 9 and the servo motor 10 drive the moving seat 11 to move relatively, so that the welding head 17 is convenient for welding a circuit board, meanwhile, the dust suction holes 18 are formed in the periphery of the welding head 17, the dust removal pipe 20 and the suction pump 21 discharge smoke gas, and the yield of the circuit board welding is improved.
The foregoing shows and describes the basic principles, essential features, and advantages of the invention. It will be understood by those skilled in the art that the present invention is not limited to the above embodiments, and that the foregoing embodiments and descriptions are provided only to illustrate the principles of the present invention without departing from the spirit and scope of the present invention.
Claims (8)
1. The utility model provides a circuit board bonding wire device, includes workstation (1), its characterized in that: be provided with mount pad (2) on workstation (1), swing joint has welding stent (3) on mount pad (2), be provided with dust collector on welding stent (3), dust collector includes suction box (19), dust removal pipe (20), aspirator pump (21), be provided with suction box (19) on welding stent (3), and be provided with between suction box (19) and dust absorption hole (18) dust removal pipe (20), install aspirator pump (21) on dust removal pipe (20).
2. The circuit board wire bonding apparatus according to claim 1, wherein: the welding support is characterized in that a rotating motor (5) is arranged on the mounting seat (2), a rotating shaft (6) connected with the rotating motor is arranged on the rotating motor (5), and a rotating seat (7) connected with the rotating shaft (6) is arranged on the welding support (3).
3. The apparatus of claim 2, wherein: be provided with fixing base (8) on welding stent (3), install lead screw (9) on fixing base (8), and lead screw (9) one end is connected with servo motor (10), be provided with on lead screw (9) outer wall and remove seat (11).
4. The circuit board wire bonding apparatus according to claim 3, wherein: a sliding seat (12) is arranged on the moving seat (11), and a sliding groove (13) connected with the sliding seat (12) is arranged on the welding support (3).
5. The circuit board wire bonding apparatus according to claim 3, wherein: the movable seat (11) is provided with a positioning hole (14), a positioning rod (15) is movably connected in the positioning hole (14), the positioning rod (15) is connected with a welding seat (16) on the outer side of the movable seat (11), and the welding seat (16) is connected with the movable seat (11) through an electric telescopic rod (4).
6. The circuit board wire bonding apparatus according to claim 5, wherein: the positioning rod (15) is T-shaped, and the connecting surface between the positioning rod (15) and the positioning hole (14) is of a smooth structure.
7. The circuit board wire bonding apparatus according to claim 5, wherein: a welding head (17) is arranged on the welding seat (16), and dust absorption holes (18) are formed in the welding seat (16) around the welding head (17).
8. The circuit board bonding apparatus according to claim 1, wherein: the dust absorption holes (18) are distributed around the welding head (17) in a circular ring shape, and the connection part between the dust absorption holes (18) and the dust removal pipe (20) is in sealing connection.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221548940.0U CN217825589U (en) | 2022-06-21 | 2022-06-21 | Circuit board bonding wire device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221548940.0U CN217825589U (en) | 2022-06-21 | 2022-06-21 | Circuit board bonding wire device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217825589U true CN217825589U (en) | 2022-11-15 |
Family
ID=83993673
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202221548940.0U Active CN217825589U (en) | 2022-06-21 | 2022-06-21 | Circuit board bonding wire device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217825589U (en) |
-
2022
- 2022-06-21 CN CN202221548940.0U patent/CN217825589U/en active Active
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