CN217822747U - Heat dissipation type semiconductor packaging piece - Google Patents

Abstract

The utility model discloses a heat dissipation type semiconductor package, including the base plate, it has the apron to peg graft on the base plate, and the bottom of apron is equipped with heat dissipation mechanism and fixed establishment, and the both sides of base plate all are equipped with first spring, and the one end of first spring is equipped with the stripper bar, and the one end of stripper bar runs through the base plate, and the slot has all been seted up to the inner wall both sides of base plate, and heat dissipation mechanism includes the motor, and motor fixed mounting is equipped with the carousel in the bottom of apron, the pivot end of motor. The utility model discloses a be provided with heat dissipation mechanism, play the purpose that improves semiconductor packaging part radiating effect, do benefit to semiconductor packaging part's use, the utility model discloses a be provided with fixed establishment, play the purpose of conveniently dismantling the apron, do benefit to and carry out the testing and maintenance to the component on the base plate.

Description

Heat dissipation type semiconductor packaging piece

Technical Field

The utility model relates to the field of semiconductor technology, specifically a heat dissipation type semiconductor package spare.

Background

A semiconductor: the conductive performance of the material is between that of a conductor and an insulator at normal temperature, and the semiconductor is widely applied to radio, television and temperature measurement.

The existing semiconductor packaging part is internally provided with heat dissipation holes and a heat conduction plate for heat dissipation, the heat dissipation effect is not ideal, and the cover plate is fixed on the base plate through bolts, so that the disassembly is inconvenient.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a heat dissipation type semiconductor package to solve the problem that above-mentioned background art provided.

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a heat dissipation type semiconductor package, includes the base plate, it has the apron to peg graft on the base plate, the bottom of apron is equipped with heat dissipation mechanism and fixed establishment, through being provided with heat dissipation mechanism, plays the purpose that improves semiconductor package radiating effect, does benefit to semiconductor package's use, through being provided with fixed establishment, plays the purpose of conveniently dismantling the apron, does benefit to and detects the maintenance to the component on the base plate, the both sides of base plate all are equipped with first spring, the one end of first spring is equipped with the stripper bar, through being provided with the stripper bar, is convenient for drive the inserted block and slides along the inner wall of spring pocket, the base plate is run through to the one end of stripper bar, the slot has all been seted up to the inner wall both sides of base plate, through being provided with the slot, the grafting of the inserted block of being convenient for, heat dissipation mechanism includes the motor, motor fixed mounting is in the bottom of apron, the pivot end of motor is equipped with the carousel, through being provided with the motor, is convenient for drive the carousel and rotates.

Preferably, the bottom of apron is equipped with the stop collar, the inner wall sliding connection of stop collar has the gag lever post, and the setting of stop collar plays the purpose spacing to the gag lever post motion.

Preferably, the one end of gag lever post is equipped with the bar frame, the inner wall of bar frame slides and is provided with the round bar, through being provided with bar frame and round bar, when the carousel rotates, plays and drives the gliding purpose of gag lever post along the stop collar.

Preferably, the one end of round bar rotates with the carousel to be connected, the both sides of bar frame all are equipped with the mounting panel, be equipped with the fan on the mounting panel, through being provided with the fan, be convenient for to the component on the base plate heat dissipation of blowing.

Preferably, the fixing mechanism comprises two spring grooves, the spring grooves are formed in the bottom end of the cover plate, and the number of the spring grooves is two.

Preferably, the spring slot is provided with an inserting block in a sliding manner, one end of the inserting block penetrates through the cover plate, and the inserting block is arranged to be convenient to insert into the slot.

Preferably, one side of the inserting block is provided with a second spring, the other end of the second spring is fixedly connected with the spring groove, and the second spring is in a compressed state.

Compared with the prior art, the beneficial effects of the utility model are that:

1. the utility model discloses a be provided with heat dissipation mechanism, play the purpose that improves semiconductor package spare radiating effect, do benefit to semiconductor package spare's use.

2. The utility model discloses a be provided with fixed establishment, play the purpose of conveniently dismantling the apron, do benefit to and carry out the testing and maintenance to the component on the base plate.

Drawings

FIG. 1 is a schematic view of the overall structure of the present invention;

fig. 2 is a bottom view of the cover plate of the present invention;

fig. 3 is an enlarged view of the position a of the present invention.

In the figure: 1. a substrate; 2. a cover plate; 3. a fan; 4. a bar frame; 5. a motor; 6. a turntable; 7. a limiting sleeve; 8. a limiting rod; 9. inserting a block; 10. a second spring; 11. a spring slot; 12. mounting a plate; 13. a slot; 14. a first spring; 15. an extrusion stem; 16. a round bar.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Example 1

Please refer to fig. 1 and 2, a heat dissipation type semiconductor package in the figure, which includes a substrate 1, a cover plate 2 is inserted on the substrate 1, a heat dissipation mechanism and a fixing mechanism are disposed at a bottom end of the cover plate 2, the purpose of improving the heat dissipation effect of the semiconductor package is achieved by the heat dissipation mechanism, which is beneficial for the use of the semiconductor package, the fixing mechanism is disposed, which achieves the purpose of conveniently detaching the cover plate 2, which is beneficial for detecting and maintaining components on the substrate 1, a first spring 14 is disposed at both sides of the substrate 1, an extrusion rod 15 is disposed at one end of the first spring 14, the extrusion rod 15 is disposed to facilitate the sliding of the insert block 9 along an inner wall of the spring groove 11, one end of the extrusion rod 15 penetrates through the substrate 1, slots 13 are disposed at both sides of the inner wall of the substrate 1, the insertion slots 13 are convenient for the insertion of the insert block 9 by the arrangement, the heat dissipation mechanism includes a motor 5, the motor 5 is fixedly mounted at the bottom end of the cover plate 2, a rotating shaft end of the motor 5 is provided with a turntable 6, and the motor 5 is convenient for driving the turntable 6 to rotate.

Wherein, the bottom of apron 2 is equipped with stop collar 7, the inner wall sliding connection of stop collar 7 has gag lever post 8, the setting of stop collar 7, play the purpose spacing to 8 motions of gag lever post, the one end of gag lever post 8 is equipped with bar frame 4, the inner wall of bar frame 4 slides and is provided with round bar 16, through being provided with bar frame 4 and round bar 16, when carousel 6 rotates, play and drive gag lever post 8 along the gliding purpose of gag lever post 7, the one end and the carousel 6 rotation of round bar 16 are connected, the both sides of bar frame 4 all are equipped with mounting panel 12, be equipped with fan 3 on mounting panel 12, through being provided with fan 3, be convenient for blow the heat dissipation to the component on the base plate 1.

When the semiconductor packaging piece is used: starting motor 5, motor 5 drive carousel 6 rotates, and carousel 6 drives bar frame 4 through round bar 16 and removes, and bar frame 4 will carry out sharp back and forth movement under the limiting displacement of gag lever post 8 and stop collar 7, and bar frame 4 will drive fan 3 through mounting panel 12 and carry out sharp back and forth movement, and fan 3 will come and go the heat dissipation of blowing to the component on the base plate 1, does benefit to the improvement radiating effect.

Example 2

Referring to fig. 1 and fig. 3, in this embodiment, a further description is given to embodiment 1, and a heat dissipation type semiconductor package is illustrated in the drawings, where the heat dissipation type semiconductor package includes a substrate 1, a cover plate 2 is inserted onto the substrate 1, a heat dissipation mechanism and a fixing mechanism are disposed at a bottom end of the cover plate 2, and the heat dissipation mechanism is disposed to improve a heat dissipation effect of the semiconductor package, so as to facilitate use of the semiconductor package, and the fixing mechanism is disposed to facilitate detachment of the cover plate 2, thereby facilitating detection and maintenance of components on the substrate 1, and both sides of the substrate 1 are provided with first springs 14, and one end of each first spring 14 is provided with a squeezing rod 15, so as to facilitate driving of the insertion block 9 to slide along an inner wall of the spring slot 11, and one end of the squeezing rod 15 penetrates through the substrate 1, and both sides of the inner wall of the substrate 1 are provided with slots 13, thereby facilitating insertion of the insertion block 9, and the heat dissipation mechanism includes a motor 5, the motor 5 is fixedly disposed at the bottom end of the cover plate 2, and a rotating shaft end of the motor 5 is provided with a rotating disc 6, thereby facilitating driving of the rotating disc 6 to rotate.

Wherein, fixed establishment includes spring groove 11, spring groove 11 sets up in the bottom of apron 2, the number of spring groove 11 is two, it is provided with inserted block 9 to slide in spring groove 11, the one end of inserted block 9 is for becoming forty-five degrees angle inclined planes with the horizontal plane, apron 2 is run through to the one end of inserted block 9, through being provided with inserted block 9, be convenient for peg graft in slot 13, one side of inserted block 9 is equipped with second spring 10, the other end and the spring groove 11 fixed connection of second spring 10, second spring 10 is in compression state.

In this embodiment, when the component overhauls on needs are to base plate 1, press extrusion stem 15 in opposite directions, the one end of extrusion stem 15 will contact inserted block 9 to will drive inserted block 9 and slide along the inner wall of spring groove 11, leave slot 13 until the one end of inserted block 9, can take off apron 12, through the aforesaid setting, play the purpose of conveniently dismantling apron 2, do benefit to and detect the maintenance to the component on the base plate 1.

It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims (7)

1. A heat dissipation semiconductor package, comprising:

the base plate (1), it has apron (2) to peg graft on base plate (1), the bottom of apron (2) is equipped with heat dissipation mechanism and fixed establishment, the both sides of base plate (1) all are equipped with first spring (14), the one end of first spring (14) is equipped with stripper bar (15), base plate (1) is run through to the one end of stripper bar (15), slot (13) have all been seted up to the inner wall both sides of base plate (1), heat dissipation mechanism includes motor (5), motor (5) fixed mounting is in the bottom of apron (2), the pivot end of motor (5) is equipped with carousel (6).

2. A heat dissipating semiconductor package in accordance with claim 1, wherein: the bottom of apron (2) is equipped with stop collar (7), the inner wall sliding connection of stop collar (7) has gag lever post (8).

3. A heat dissipating semiconductor package in accordance with claim 2, wherein: one end of the limiting rod (8) is provided with a bar-shaped frame (4), and the inner wall of the bar-shaped frame (4) is provided with a round rod (16) in a sliding manner.

4. A heat dissipating semiconductor package in accordance with claim 3, wherein: the one end and the carousel (6) of round bar (16) rotate to be connected, the both sides of bar frame (4) all are equipped with mounting panel (12), be equipped with fan (3) on mounting panel (12).

5. A heat dissipating semiconductor package in accordance with claim 1, wherein: the fixing mechanism comprises a spring groove (11), and the spring groove (11) is arranged at the bottom end of the cover plate (2).

6. The heat dissipation semiconductor package according to claim 5, wherein: an inserting block (9) is arranged in the spring groove (11) in a sliding mode, and one end of the inserting block (9) penetrates through the cover plate (2).

7. The heat dissipation semiconductor package according to claim 6, wherein: one side of the inserting block (9) is provided with a second spring (10), and the other end of the second spring (10) is fixedly connected with the spring groove (11).

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