CN217822713U - Chip positioning device for electronic component - Google Patents
Chip positioning device for electronic component Download PDFInfo
- Publication number
- CN217822713U CN217822713U CN202221989992.1U CN202221989992U CN217822713U CN 217822713 U CN217822713 U CN 217822713U CN 202221989992 U CN202221989992 U CN 202221989992U CN 217822713 U CN217822713 U CN 217822713U
- Authority
- CN
- China
- Prior art keywords
- slider
- wall
- chip
- device main
- fixedly connected
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model relates to a chip processing technology field specifically is a chip positioner for electronic components, the device comprises a device main body, the hand rocker is installed to the outer wall of device main part, the tip fixedly connected with two-way threaded rod of hand rocker, the outer wall threaded connection of two-way threaded rod has first slider. This chip positioner for electronic components, the convenience slows down impact and resistance to compression to the bottom of chip, in subsequent course of working, the rubber pad is hugged closely to the lower surface of chip, the rubber pad has good resistance to compression physical property for the setting of wave appearance, and the buffer block sets up for honeycomb, good resistance to compression buffering effect has equally, when the chip receives the extrusion, the buffer block atress shifts down the extrusion second spring, the second spring is compressed this moment, the third guide bar upwards alternates into the dashpot and slides, offset pressure, the problem of the structure of impact and resistance to compression is not slowed down in the bottom setting of chip to existing positioner has been solved.
Description
Technical Field
The utility model relates to a chip processing equipment technical field specifically is a chip positioner for electronic components.
Background
Electronic components are components of electronic components and small-sized machines and instruments, and are usually composed of a plurality of parts, electronic component chips are integrated circuits, also called thin film integrated circuits, which manufacture circuits on the surfaces of semiconductor chips, and chip positioning devices are required to be used for positioning the chips in the processing process of electronic components.
The prior patent (publication number: CN 213796122U) discloses a chip positioning groove dish of preventing wearing and tearing, including positioning groove dish main part, head rod and regulation pole, the mounting panel is installed to the preceding terminal surface of positioning groove dish main part, and the equidistant kicking block that is provided with of the preceding terminal surface of mounting panel to the rear end face of positioning groove dish main part installs the supporting shoe, the internal connection of mounting panel has the regulation pole, and the lower extreme of adjusting the pole is provided with the regulating wheel, the left end connection control wheel of regulating wheel, and the upper end of control wheel is connected with the head rod, the head rod is installed to the right-hand member of head rod, and the outside of head rod is connected with the installation piece, and the inventor is realizing the utility model discloses an in-process discovery prior art has following problem: 1. when the positioning device is used, the four sides of the chip cannot be clamped and fixed at the same time, so that the longitudinal two sides of the chip are not limited, and the chip is easy to longitudinally slide or displace in the processing process, so that the processing precision is reduced; 2. because positioner does not set up the structure that slows down impact and resistance to compression to the bottom of chip after the location, lead to the chip to receive the pressure easily and damage in the course of working.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a chip positioner for electronic components to it can not carry out the centre gripping simultaneously to the four sides of chip and fix to provide in solving above-mentioned background art, does not set up the problem that slows down the structure of impact and resistance to compression to the bottom of chip. In order to achieve the above object, the utility model provides a following technical scheme: a chip positioning device for electronic components comprises a device main body, wherein a hand-operated rod is installed on the outer wall of the device main body, a bidirectional threaded rod is fixedly connected to the end of the hand-operated rod, and a first sliding block is connected to the outer wall of the bidirectional threaded rod in a threaded manner;
the utility model discloses a device, including first slider, the inside sliding connection of first slider has first guide bar, the both ends of first guide bar and the inner wall fixed connection of device main part, the first grip block of outer wall fixedly connected with of first slider, the tip swing joint of first slider has the second slider, the tip of first slider and second slider is the angle of inclination setting, the tip angle of inclination of first slider and second slider matches, the second slider passes through conducting piece and device main part fixed connection, the outer wall fixedly connected with second grip block of second slider, the inner wall fixedly connected with bolster of device main part.
Preferably, the conduction piece includes telescopic link, first spring and second guide bar, the inner wall fixed connection of telescopic link and device main part, the tip and the first spring fixed connection of telescopic link, the inner wall fixed connection of first spring and second slider, the tip of second guide bar and the inner wall fixed connection of device main part, the tip and the second slider of second guide bar alternate and are connected.
Preferably, the bolster includes fixed block, second spring, buffer block, rubber pad and third guide bar, the inner wall fixed connection of fixed block and device main part, the bottom fixed connection of fixed block and second spring, the upper surface of second spring and the inner wall fixed connection of buffer block, the lower surface of rubber pad and the last fixed surface of buffer block are connected, the bottom of third guide bar and the inner wall fixed connection of device main part, the dashpot has been seted up to the lower surface of buffer block, the upper end and the dashpot interlude of third guide bar are connected.
Preferably, the buffer block is arranged in a honeycomb structure, and the rubber pad is arranged in a wave shape.
Preferably, the two-way threaded rod is the horizontal direction setting with first guide bar, the inner wall interlude of two-way threaded rod and device main part is connected.
Preferably, the first clamping plate and the second clamping plate are perpendicular to each other, and the first clamping plate and the second clamping plate are both formed by compounding silicon rubber and teflon materials.
Compared with the prior art, the beneficial effects of the utility model are that:
the utility model discloses in, at first place the chip that needs the location at the cushion upper surface, hand rocking hand pole afterwards, hand pole drives the rotation of two-way threaded rod, its outer wall threaded connection's first slider removes along two-way threaded rod when two-way threaded rod rotates, receive the guide effect of first guide bar when first slider removes, along with the removal of first slider, the tip angle of inclination of first slider promotes second slider tip angle of inclination, second slider both sides angle of inclination is to device main part central direction atress this moment, make the second slider remove to the central direction of device main part, the telescopic link is flexible this moment, receive the guide effect of second guide bar when the second slider removes, along with the removal of first slider and second slider, first grip block and second grip block carry out the four sides centre gripping operation to middle chip, prevent that it from coming off in follow-up existing course of working, the positioner who has solved can not carry out the fixed problem of centre gripping to the four sides of chip simultaneously.
The utility model discloses in, in follow-up course of working, the rubber pad is hugged closely to the lower surface of chip, the rubber pad has good resistance to compression physical characteristic for the setting of wave appearance, and the buffer block sets up for honeycomb, has good resistance to compression buffering effect equally, when the chip received the extrusion, the buffer block atress moved down and extrudees the second spring, the second spring was compressed this moment, the third guide bar upwards alternates the dashpot and slides, offset pressure, the problem of current positioner not setting up the structure that slows down impact and resistance to compression to the bottom of chip has been solved.
Drawings
Fig. 1 is a sectional view of a top view of the present invention;
fig. 2 is an enlarged schematic structural view of a point a in fig. 1 of the present invention;
fig. 3 is a schematic top view of the present invention;
fig. 4 is a front view of the present invention.
In the figure: 1. a device main body; 2. a hand lever; 3. a bidirectional threaded rod; 4. a first slider; 5. a first guide bar; 6. a first clamping plate; 7. a second slider; 8. a second clamping plate; 9. a telescopic rod; 10. a first spring; 11. a second guide bar; 12. a fixed block; 13. a second spring; 14. a buffer block; 15. a rubber pad; 16. a third guide bar; 17. a buffer tank.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by the staff with ordinary skill in the art without creative work all belong to the protection scope of the present invention.
Referring to fig. 1 to 4, the present invention provides a technical solution: a chip positioning device for electronic components comprises a device main body 1, wherein a hand rocker 2 is mounted on the outer wall of the device main body 1, a bidirectional threaded rod 3 is fixedly connected to the end of the hand rocker 2, and a first sliding block 4 is connected to the outer wall of the bidirectional threaded rod 3 in a threaded manner;
the inner part of the first sliding block 4 is connected with a first guide rod 5 in a sliding way, two ends of the first guide rod 5 are fixedly connected with the inner wall of the device main body 1, the outer wall of the first sliding block 4 is fixedly connected with a first clamping plate 6, the end part of the first sliding block 4 is movably connected with a second sliding block 7, the end parts of the first sliding block 4 and the second sliding block 7 are arranged at inclined angles, the inclined angles of the end parts of the first sliding block 4 and the second sliding block 7 are matched, the second sliding block 7 is fixedly connected with the device main body 1 through a conducting piece, the outer wall of the second sliding block 7 is fixedly connected with a second clamping plate 8, the inner wall of the device main body 1 is fixedly connected with a buffer piece, a chip positioning device is required to be used for positioning a chip in the production process of an electronic component, the chip required to be positioned is firstly placed on the upper surface of a buffer pad, then a hand-operated rocking rod 2 drives a bidirectional threaded rod 3 to rotate, when the bidirectional threaded rod 3 rotates, the first sliding block 4 in threaded connection with the outer wall of the bidirectional threaded rod 3 moves along the bidirectional threaded rod 3, the first sliding block 4 is guided by the first guide rod 5 when moving, the end inclined angle of the first sliding block 4 pushes the end inclined angle of the second sliding block 7 along with the movement of the first sliding block 4, the inclined angles at two sides of the second sliding block 7 are stressed towards the center direction of the device main body 1, the second sliding block 7 is driven to move towards the center direction of the device main body 1, the telescopic rod 9 stretches, the second sliding block 7 is guided by the second guide rod 11 when moving, along with the movement of the first sliding block 4 and the second sliding block 7, the first clamping plate 6 and the second clamping plate 8 carry out four-side clamping operation on a middle chip to prevent the chip from falling off in a subsequent processing process, the lower surface of the chip clings to the rubber pad 15 in a subsequent processing process, the rubber pad 15 has good compression-resistant physical properties due to a wavy shape, and the buffer block 14 is arranged in a honeycomb structure, and has a good compression-resistant buffering effect, when the chip is extruded, the buffer block 14 is forced to move downwards to extrude the second spring 13, at the moment, the second spring 13 is compressed, and the third guide rod 16 penetrates upwards into the buffer groove 17 to slide, so that the pressure is transferred.
In this embodiment, as shown in fig. 1, fig. 2, fig. 3, and fig. 4, the conducting member includes an expansion link 9, a first spring 10, and a second guide rod 11, the expansion link 9 is fixedly connected to the inner wall of the device main body 1, the end of the expansion link 9 is fixedly connected to the first spring 10, the first spring 10 is fixedly connected to the inner wall of the second slider 7, the end of the second guide rod 11 is fixedly connected to the inner wall of the device main body 1, the end of the second guide rod 11 is connected to the second slider 7 in an inserting manner, a chip to be positioned is first placed on the upper surface of the cushion pad, then the hand lever 2 is manually swung, the hand lever 2 drives the bidirectional threaded rod 3 to rotate, the first slider 4, which is connected to the outer wall of the bidirectional threaded rod 3 in a threaded manner, moves along the bidirectional threaded rod 3 when the bidirectional threaded rod 3 rotates, the first slider 4 moves under the guiding action of the first guide rod 5, with the movement of the first slider 4, the end tilting angle of the first slider 4 pushes the end of the second slider 7 to tilt towards the center direction of the device main body 1, the second slider 7 moves along with the center direction of the second slider 7, the second slider 7 moves along with the clamping action of the second slider, the clamping operation of the second slider, the second slider 7, the second slider and the second slider 7, the clamping plate in the clamping operation of the second slider 7, the clamping plate, and the clamping operation plate in the clamping operation process.
In this embodiment, as shown in fig. 1, fig. 2, fig. 3, and fig. 4, the buffer includes a fixed block 12, a second spring 13, a buffer block 14, a rubber pad 15, and a third guide rod 16, the fixed block 12 is fixedly connected to the inner wall of the apparatus main body 1, the fixed block 12 is fixedly connected to the bottom end of the second spring 13, the upper surface of the second spring 13 is fixedly connected to the inner wall of the buffer block 14, the lower surface of the rubber pad 15 is fixedly connected to the upper surface of the buffer block 14, the bottom end of the third guide rod 16 is fixedly connected to the inner wall of the apparatus main body 1, a buffer groove 17 is formed in the lower surface of the buffer block 14, the upper end of the third guide rod 16 is inserted into the buffer groove 17, in the subsequent processing process, the lower surface of the chip is tightly attached to the rubber pad 15, the rubber pad 15 has a good compression-resistant physical property for a wave shape, and the buffer block 14 has a good compression-resistant buffering effect, when the chip is pressed, the buffer block 14 is pressed downward moved to press the second spring 13 to be compressed, and the third guide rod 16 is inserted into the buffer groove 17 to slide to transfer the pressure.
In this embodiment, as shown in fig. 1, fig. 2, fig. 3 and fig. 4, the buffer block 14 is arranged in a honeycomb structure, the rubber pad 15 is arranged in a wave shape, the buffer block 14 is arranged in a honeycomb structure, and has a good compression-resistant buffering effect, and the rubber pad 15 has good compression-resistant physical properties for the wave shape.
In this embodiment, as shown in fig. 1, 2, 3, and 4, the bidirectional threaded rod 3 and the first guide rod 5 are arranged in a horizontal direction, the bidirectional threaded rod 3 is inserted into and connected to the inner wall of the device body 1, and the horizontal direction arrangement increases stability between the bidirectional threaded rod 3 and the first guide rod 5.
In this embodiment, as shown in fig. 1, fig. 2, fig. 3, and fig. 4, the first clamping plate 6 and the second clamping plate 8 are disposed in a perpendicular manner, the first clamping plate 6 and the second clamping plate 8 are both formed by compounding silicone rubber and a teflon material, the perpendicular manner increases stability between the first clamping plate 6 and the second clamping plate 8, the silicone rubber is relatively soft and does not damage the chip, and the teflon material has a smooth low friction coefficient characteristic, so that the chip is not damaged by friction force generated during extrusion.
The utility model discloses a use method and advantage: this kind of chip positioner for electronic components is at the during operation, the working process as follows:
as shown in fig. 1, 2, 3 and 4, in the production process of electronic components, a chip positioning device is required to be used for positioning chips, the chips to be positioned are firstly placed on the upper surface of a buffer pad, then a hand-operated rod 2 is manually shaken, the hand-operated rod 2 drives a bidirectional threaded rod 3 to rotate, when the bidirectional threaded rod 3 rotates, a first slider 4 in threaded connection with the outer wall of the bidirectional threaded rod moves along the bidirectional threaded rod 3, the first slider 4 is guided by a first guide rod 5 when moving, the end inclined angle of the first slider 4 pushes the end inclined angle of a second slider 7 along with the movement of the first slider 4, at this time, the inclined angles of two sides of the second slider 7 are stressed towards the center of the device body 1, so that the second slider 7 moves towards the center of the device body 1, the telescopic rod 9 stretches, when the second slider 7 moves, the second slider 7 is guided by a second guide rod 11, as the first slider 4 and the second slider 7 move, the first clamping plate 6 and the second clamping plate 8 clamp the middle chips to clamp the middle chips, so as to prevent the chips from falling off in the subsequent processing process, the chips are inserted into a buffer pad 15, the buffer pad 14, the buffer pad is pressed by a second clamping spring, and the buffer pad 14, and the buffer pad is pressed by the buffer pad, and the buffer pad 13.
The foregoing shows and describes the general principles, essential features, and advantages of the invention. It should be understood by those skilled in the art that the present invention is not limited by the above embodiments, and the description in the above embodiments and the description is only preferred examples of the present invention, and is not intended to limit the present invention, and that there may be various changes and modifications without departing from the spirit and scope of the present invention, and these changes and modifications all fall within the scope of the claimed invention. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (6)
1. The utility model provides a chip positioner for electronic components, includes device main part (1), its characterized in that: the outer wall of the device main body (1) is provided with a hand lever (2), the end part of the hand lever (2) is fixedly connected with a bidirectional threaded rod (3), and the outer wall of the bidirectional threaded rod (3) is in threaded connection with a first sliding block (4);
the utility model discloses a device, including first slider (4), the inside sliding connection of first slider (4) has first guide bar (5), the both ends of first guide bar (5) and the inner wall fixed connection of device main part (1), the first grip block of outer wall fixedly connected with (6) of first slider (4), the tip swing joint of first slider (4) has second slider (7), the tip of first slider (4) and second slider (7) is angle of inclination setting, the tip angle of inclination of first slider (4) and second slider (7) matches, second slider (7) are through conduction piece and device main part (1) fixed connection, the outer wall fixedly connected with second grip block (8) of second slider (7), the inner wall fixedly connected with bolster of device main part (1).
2. The chip positioning device for an electronic component as claimed in claim 1, wherein: the conduction piece comprises a telescopic rod (9), a first spring (10) and a second guide rod (11), the telescopic rod (9) is fixedly connected with the inner wall of the device main body (1), the end part of the telescopic rod (9) is fixedly connected with the first spring (10), the first spring (10) is fixedly connected with the inner wall of the second sliding block (7), the end part of the second guide rod (11) is fixedly connected with the inner wall of the device main body (1), and the end part of the second guide rod (11) is connected with the second sliding block (7) in a penetrating manner.
3. The chip positioning device for an electronic component as claimed in claim 1, wherein: the bolster includes fixed block (12), second spring (13), buffer block (14), rubber pad (15) and third guide bar (16), the inner wall fixed connection of fixed block (12) and device main part (1), the bottom fixed connection of fixed block (12) and second spring (13), the upper surface of second spring (13) and the inner wall fixed connection of buffer block (14), the lower surface of rubber pad (15) and the last fixed surface of buffer block (14) are connected, the bottom of third guide bar (16) and the inner wall fixed connection of device main part (1), buffer slot (17) have been seted up to the lower surface of buffer block (14), the upper end and buffer slot (17) of third guide bar (16) alternate and are connected.
4. The chip positioning device for an electronic component as claimed in claim 3, wherein: the buffer block (14) is arranged in a honeycomb structure, and the rubber pad (15) is arranged in a wave shape.
5. The chip positioning device for an electronic component as claimed in claim 1, wherein: the bidirectional threaded rod (3) is arranged in the horizontal direction with the first guide rod (5), and the bidirectional threaded rod (3) is connected with the inner wall of the device main body (1) in an inserting mode.
6. The chip positioning device for an electronic component as claimed in claim 1, wherein: the clamping device is characterized in that the first clamping plate (6) and the second clamping plate (8) are perpendicular to each other, and the first clamping plate (6) and the second clamping plate (8) are both formed by compounding silicon rubber and Teflon materials.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221989992.1U CN217822713U (en) | 2022-07-29 | 2022-07-29 | Chip positioning device for electronic component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221989992.1U CN217822713U (en) | 2022-07-29 | 2022-07-29 | Chip positioning device for electronic component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217822713U true CN217822713U (en) | 2022-11-15 |
Family
ID=83970305
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202221989992.1U Active CN217822713U (en) | 2022-07-29 | 2022-07-29 | Chip positioning device for electronic component |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217822713U (en) |
-
2022
- 2022-07-29 CN CN202221989992.1U patent/CN217822713U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2017209982A (en) | Workpiece operation device, workpiece operation method, curved surface jig, manufacturing method of curved surface jig and screen printing apparatus | |
| CN217822713U (en) | Chip positioning device for electronic component | |
| CN220455382U (en) | Switching clamp for flexible circuit board production test | |
| CN218632711U (en) | Cable fixing mechanism for socket connection | |
| CN214814382U (en) | Chip pin adjusting device for integrated circuit design | |
| CN111447746B (en) | Flexible line way board processing fixing device | |
| CN112222603B (en) | Static gantry workbench clamping and fixing plate for friction welding based on elastic action | |
| CN103578890A (en) | Automatic bulb installing mechanism for aging machine | |
| CN221246772U (en) | Stable full-automatic steel wire bending device | |
| CN207175981U (en) | A kind of special shaping clamp of leatherware | |
| CN218946199U (en) | Building construction reinforcing bar bending device | |
| CN212531715U (en) | Foam double-sided adhesive tape not prone to deformation | |
| CN217331904U (en) | Thrust test fixture | |
| CN114023661B (en) | Integrated circuit chip packaging and processing device | |
| CN220156955U (en) | PCB (printed circuit board) clamping device of chip mounter | |
| CN218771010U (en) | Wire fixing platform support | |
| CN114828444B (en) | Chip pin adjusting device for integrated chip design | |
| CN217903083U (en) | Chip production is with splitting machine | |
| CN215988422U (en) | Device for processing arc of magnet end face of wireless earphone charging box | |
| CN214436119U (en) | Leg pressing device for dance education teaching | |
| CN216528820U (en) | A disjunctor clamping jaw for production of photovoltaic cell piece | |
| CN221829370U (en) | Flexible circuit board chip mounter | |
| CN207238952U (en) | A kind of bend pipe mould | |
| CN111156389A (en) | Lifting type communication equipment supporting device | |
| CN208728573U (en) | Metal-oxide-semiconductor assists discharging structure |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |