CN217802136U

CN217802136U - Board separator

Info

Publication number: CN217802136U
Application number: CN202221913990.4U
Authority: CN
Inventors: 陈亚东
Original assignee: Dongguan Yindinai Electronic Technology Co ltd
Current assignee: Dongguan Yindinai Electronic Technology Co ltd
Priority date: 2022-07-21
Filing date: 2022-07-21
Publication date: 2022-11-15
Anticipated expiration: 2032-07-21

Abstract

The utility model discloses a board separator for dividing a circuit board to be cut into a plurality of sub-circuit boards, which comprises a board separator, wherein the board separator comprises a limiting mechanism and a breaking mechanism, and the limiting mechanism is used for limiting the circuit board to be cut; the punching and breaking mechanism is arranged on one side of the board surface of the circuit board limited by the limiting mechanism and used for punching the circuit board to be divided limited by the limiting mechanism and punching and breaking the circuit board to be divided into a plurality of sub circuit boards. Therefore, the effect of manually breaking the circuit board to be segmented is simulated through the matching of the limiting mechanism and the punching and breaking mechanism, and the problem of insufficient precision in the process of segmenting the circuit board by the cutter is solved.

Description

Board separator

Technical Field

The utility model relates to an automatic technical field, in particular to board separator.

Background

Printed Circuit Boards (PCBs), also known as circuit boards, are providers of electrical connections for electronic components. Mass production of circuits using PCBs is cheaper and faster than other wiring methods during manufacture of the circuit board because components are mounted and wired in one operation. A large number of circuit boards can be manufactured simultaneously, the layout only having to be performed once.

In the process of mass production of circuit boards, a plurality of small circuit boards need to be printed on a complete large circuit board, and then the large circuit board is divided into a plurality of small circuit boards, so that mass processing is realized. In the prior art, in order to avoid damaging a circuit structure on a circuit board, the requirement on the processing precision of the operation of dividing the circuit board is high, the circuit board is not divided by cutting with a cutter, and the circuit board can only be manually broken off, so that the efficiency of processing the circuit board in batches is low.

Therefore, the above problems in the prior art have yet to be solved.

SUMMERY OF THE UTILITY MODEL

The utility model aims at providing a board separator aims at solving the manual lower problem of board efficiency of breaking off with the fingers and thumb of in-process is cut apart to the circuit board.

In order to achieve the above object, the present invention provides a board separator for separating a circuit board to be separated into a plurality of sub-circuit boards, comprising a limiting mechanism and a breaking mechanism, wherein the limiting mechanism is used for limiting the circuit board to be separated; the punching and breaking mechanism is arranged on one side of the board surface of the circuit board to be cut limited by the limiting mechanism and used for punching the circuit board to be cut limited by the limiting mechanism and punching and breaking the circuit board to be cut into a plurality of sub circuit boards.

Preferably, the board dividing device comprises a first board dividing device, the first board dividing device comprises a first limiting mechanism and a first punching mechanism, and the first limiting mechanism is used for limiting the first end of the circuit board to be divided; the first punching and breaking mechanism is used for punching the second end of the circuit board to be divided so that the sub-circuit board positioned at the second end is broken off from the circuit board to be divided.

Preferably, the first limiting mechanism comprises a pressing plate cylinder, wherein an output shaft of the pressing plate cylinder is provided with a first pressing block, and the first pressing block is used for pressing and limiting the first end of the circuit board to be divided under the driving of the pressing plate cylinder.

Preferably, the first punching and severing mechanism includes a first punching and severing cylinder, and an output shaft of the first punching and severing cylinder is provided with a second pressing block for punching the second end of the circuit board to be separated under the driving of the first punching and severing cylinder.

Preferably, a rolling member is arranged on one side of the second pressing block facing the circuit board to be separated, and the rolling member is used for rolling the circuit board to be separated in the process of stamping the second pressing block.

Preferably, the circuit board to be divided is integrally provided with a plurality of rows of small circuit boards to be divided in the length direction, and a plurality of rows of small circuit boards to be divided in the width direction, and seams are arranged between the small circuit boards at the adjacent positions in the width direction and the length direction; the sub circuit boards which are broken off each time by the first punching and breaking mechanism comprise a row of small circuit boards; the first plate dividing device also comprises a first punching and breaking cutter, wherein the first punching and breaking cutter is arranged below the first punching and breaking mechanism; in the process that the first punching and severing mechanism punches the sub circuit board, the first punching and severing knife abuts against the joint of the row of small circuit boards.

Preferably, the cutting edge of the first breaking-off knife has an acute included angle with respect to the plane where the circuit board to be separated is located.

Preferably, the circuit boards to be divided are integrally provided with a plurality of rows in the length direction, a plurality of rows of small divided circuit boards are arranged in the width direction, and seams are formed between the small circuit boards at the adjacent positions in the width direction and the length direction; the sub circuit boards which are broken off each time by the first breaking mechanism comprise a row of small circuit boards; the board dividing device also comprises a second board dividing device, wherein the second board dividing device comprises a second limiting mechanism and a second punching and breaking mechanism, and the second limiting mechanism is used for limiting the sub-circuit board; the second punching and snapping mechanism is used for punching joints among a row of small circuit boards in the sub circuit boards.

Preferably, this second stop gear includes the spacing groove, and this second is dashed and is broken off with the fingers and thumb the mechanism and include that the second is dashed and is broken off with the fingers and thumb the cylinder, and this second is dashed and is broken off with the fingers and thumb the cylinder output shaft and be equipped with the second and dash and break off with the fingers and thumb the sword, wherein: the limiting groove is arranged below the first punching and breaking mechanism and used for receiving the sub circuit board which falls off after being punched and broken by the first punching and breaking mechanism so as to limit the sub circuit board in the limiting groove; the first surface wall of the limiting groove is provided with an opening, at least part of the sub-circuit board is exposed from the opening, and the cutting edge of the second punching and breaking cutter is positioned in the opening and used for punching and breaking the joint under the driving of the second punching and breaking cylinder.

Preferably, the second face wall of the limiting groove is provided with an avoiding position, the second face wall is opposite to the first face wall, and a retaining edge used for limiting the sub-circuit board is arranged between the first face wall and the second face wall; a material box is arranged below the limiting groove; in the process that the second punching and snapping cutter punches and breaks the joint, the second punching and snapping cutter penetrates into the opening and penetrates out of the avoiding position; one side of the small circuit board, which is far away from the joint, is limited by the flange in the punching and snapping process, and one side of the small circuit board, which is close to the joint, moves to the avoiding position in the punching and snapping process; after the second punching and severing knife finishes punching and severing, the small circuit board falls into the material box through the avoiding position.

Preferably, a guide plate is arranged below the first punching and breaking mechanism, and a guide groove is arranged between the limiting groove and the first punching and breaking mechanism; when the first punching and breaking mechanism breaks the sub-circuit boards from the circuit boards to be cut, the sub-circuit boards fall into the guide groove under the guide of the guide plate, fall into the limiting groove under the guide of the guide groove and are limited by the limiting groove.

Preferably, the plate separator further comprises a feeding device and a working platform; the first board dividing device is arranged on the working platform, and the working platform is provided with a feeding guide rail for conveying the circuit board to be divided to the first board dividing device; the feeding device is arranged above the working platform and used for storing the circuit boards to be cut and placing the circuit boards to be cut on the feeding guide rail.

Preferably, a driving device is arranged below the working platform, and comprises a motion guide rail and a driving plate moving along the motion guide rail; the feeding guide rail is provided with a strip-shaped through hole along the conveying direction of the circuit board to be divided, and the upper end of the driving plate extends into the feeding guide rail through the strip-shaped through hole; when the driving plate moves along the moving guide rail, the circuit board to be divided positioned on the feeding guide rail is driven to move towards the first board dividing device.

Preferably, the feeding device comprises a storage bin, the cross section of the storage bin is matched with the circuit boards to be divided, and the storage bin is used for vertically stacking a plurality of circuit boards to be divided; the bottom of the storage bin is provided with a first switch part and a second switch part, wherein the first switch part is arranged above the second switch part; when the second switch part is opened, the last circuit board to be divided positioned at the bottom of the storage bin falls onto the feeding guide rail, and the first switch part is kept in a closed state when the second switch part is opened so as to limit other circuit boards to be divided above the first switch part from falling; when the second switch part is closed, the first switch part is opened, so that the circuit board to be divided above the storage bin integrally falls down.

Preferably, the first switch part is arranged on the side wall of the storage bin; the first switch part comprises a first switch cylinder and a pressure head arranged on an output shaft of the first switch cylinder, a through hole is formed in the side wall of the storage bin, and the pressure head extends into the storage bin through the through hole; when the first switch part is closed, the pressure head is driven by the first switch cylinder to extrude the circuit board to be divided so as to limit the circuit board to be divided from falling.

Preferably, the second switch part is arranged at the bottom of the storage bin; the second switch part comprises a second switch cylinder and a limiting plate connected with the second switch cylinder; when the second switch part is closed, the second switch cylinder drives the end part of the limiting plate to extend into the bottom opening of the storage bin so as to limit the circuit board to be divided to fall from the bottom opening.

The utility model discloses the board separator that technical scheme provided for cut apart the circuit board into a plurality of sub-circuit boards, including the board separator, the board separator includes stop gear and dashes and breaks off with the fingers and thumb the mechanism, wherein, stop gear is used for spacing the circuit board of waiting to cut apart; the punching and breaking mechanism is arranged on one side of the board surface of the circuit board limited by the limiting mechanism and used for punching the circuit board to be divided limited by the limiting mechanism and punching and breaking the circuit board to be divided into a plurality of sub circuit boards. Therefore, the effect of manually breaking the circuit board to be segmented is simulated through the matching of the limiting mechanism and the punching and breaking mechanism, and the problem of insufficient precision in the process of segmenting the circuit board by the cutter is solved.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the embodiments or the prior art descriptions will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.

Fig. 1 is a schematic view of a circuit board to be cut by the board separator according to the present invention;

fig. 2 is a schematic view of a board separator according to the present invention;

FIG. 3 is a schematic view of portion A of FIG. 2;

fig. 4 is a schematic view of at least a part of the structure of the plate separator provided by the present invention;

FIG. 5 is a schematic view of portion B of FIG. 4;

fig. 6 is a schematic view of at least a part of the structure of the plate separator provided by the present invention;

FIG. 7 is a schematic view of portion C of FIG. 6;

fig. 8 is a schematic view of at least a part of the structure of the plate separator provided by the present invention;

FIG. 9 is a schematic view of portion D of FIG. 8;

fig. 10 is a bottom view of at least a portion of the mechanism of the plate separator provided by the present invention;

fig. 11 is a bottom view of portion E of fig. 10;

fig. 12 is a partial schematic view of at least some components of the plate separator provided by the present invention;

fig. 13 is a partial schematic view of at least a part of the mechanism of the plate separator provided by the present invention;

fig. 14 is a schematic view of a board separator according to the present invention;

FIG. 15 is a schematic view of portion G of FIG. 14;

fig. 16 is a schematic view of the plate separator according to the present invention with the loading device removed;

fig. 17 is another schematic view of the plate separator provided by the present invention with the feeding device removed;

FIG. 18 is a schematic view of portion F of FIG. 17;

fig. 19 is a schematic view illustrating a state change of a circuit board to be cut during a first punching process of the board separator according to the present invention;

fig. 20 is a schematic view illustrating a state change of the circuit board to be cut during the second punching process of the board separator according to the present invention;

fig. 21 is a schematic view of a feeding device in a plate separator according to the present invention;

fig. 22 is a cross-sectional view of the bottom of the feeding device of the plate separator provided by the present invention;

fig. 23 is a partial bottom view of a feeding device of a plate separator according to the present invention.

The reference numbers illustrate:

the objects, features and advantages of the present invention will be further described with reference to the accompanying drawings.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.

It should be noted that, if directional indications (such as up, down, left, right, front, and back … …) are involved in the embodiment of the present invention, the directional indications are only used to explain the relative position relationship between the components, the motion situation, etc. in a specific posture (as shown in the drawings), and if the specific posture is changed, the directional indications are changed accordingly.

In addition, if there is a description relating to "first", "second", etc. in the embodiments of the present invention, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, the technical solutions in the embodiments may be combined with each other, but it must be based on the realization of those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should not be considered to exist, and is not within the protection scope of the present invention.

Printed Circuit Boards (PCBs) are providers of electrical connections for electronic components. Mass production of circuits using PCBs is cheaper and faster than other wiring methods during manufacture of the circuit board because components are mounted and wired in one operation. A large number of circuit boards can be manufactured simultaneously, the layout only having to be performed once.

Referring to fig. 1, fig. 1 is a schematic view of a circuit board to be separated of a board separator according to an embodiment of the present invention, in a process of mass production of the circuit board, as shown in fig. 1, a plurality of small circuit boards 111 need to be printed on a complete circuit board 100 to be separated, and then the circuit board 100 to be separated is separated into a plurality of small circuit boards 111, so as to implement mass processing. At present, in order to avoid damaging a circuit structure on a circuit board, the operation of dividing the circuit board has high requirements on the processing precision, and there is no way to divide the circuit board by cutting with a cutter, and the circuit board can only be manually broken, so that the efficiency of processing the circuit board in batches is low.

Therefore, in order to solve the problem, the embodiment of the present application provides a board separator, which aims to solve the problem of low efficiency of manual board breaking in the circuit board dividing process.

The following detailed description of embodiments of the present application will be made with reference to the accompanying drawings.

As shown in fig. 1, the board separator provided in the embodiment of the present application is used for separating a circuit board 100 to be separated into a plurality of sub-circuit boards 110, and includes a board separator including a limiting mechanism and a punching and severing mechanism, where the limiting mechanism is used for limiting the circuit board 100 to be separated; the punching and breaking mechanism is arranged on one side of the board surface of the circuit board limited by the limiting mechanism and used for punching the circuit board 100 to be divided limited by the limiting mechanism and punching and breaking the circuit board 100 to be divided into a plurality of sub circuit boards 110.

In this embodiment, the limiting mechanism is used to limit at least a partial region of the circuit board 100 to be divided, and the punching and snapping mechanism is disposed on one side of the board surface of the circuit board to be divided, so that the punching and snapping mechanism can punch and snap the circuit board 100 to be divided, which is limited by the limiting mechanism, and the circuit board 100 to be divided is punched and snapped into a plurality of sub-circuit boards 110. Therefore, the effect of manually breaking the circuit board 100 to be cut off is simulated through the matching of the limiting mechanism and the punching and breaking mechanism, and the problem of insufficient precision in the process of cutting the circuit board by the cutter is solved.

It should be noted that, the limiting mechanism and the punching and snapping mechanism may be implemented in various ways, and for this reason, the embodiments of the present application are not limited, and for convenience of understanding, a specific implementation manner is provided below.

Referring to fig. 1 to 3, fig. 2 is a schematic view of a board separator according to an embodiment of the present disclosure, and fig. 3 is a schematic view of a portion a in fig. 2. As shown in fig. 1 to 3, the board dividing apparatus includes a first board dividing apparatus 10, the first board dividing apparatus 10 includes a first limiting mechanism 200 and a first punching and breaking mechanism 300, wherein the first limiting mechanism 200 is used for limiting a first end of the circuit board 100 to be divided; the first punching and breaking mechanism 300 is used for punching the second end of the circuit board 100 to be divided so that the sub-circuit boards 110 at the second end are broken off from the circuit board 100 to be divided.

In this embodiment, the matching manner of the limiting mechanism and the breaking mechanism may be various, as one implementation manner, the first limiting mechanism 200 limits the first end of the circuit board 100 to be divided, at this time, the second end that is not limited by the first limiting mechanism 200 is a free end, so that when the first breaking mechanism 300 presses the second end of the circuit board 100 to be divided, the sub circuit board 110 at the second end is broken off from the circuit board 100 to be divided. Therefore, through the matching relationship between the first limiting mechanism 200 and the first punching and breaking mechanism 300, the circuit board 100 to be divided is punched and broken.

Based on the above working principle, the first limiting mechanism 200 and the first punching and breaking mechanism 300 may be implemented in various ways, and the embodiment of the present application is not limited thereto. For ease of understanding, a preferred embodiment is provided as follows.

Referring to fig. 4 and fig. 5, fig. 4 is a schematic view of at least a partial structure of a board separator according to an embodiment of the present disclosure; fig. 5 is a schematic view of portion B of fig. 4. As shown in fig. 4 and 5, for the first limiting mechanism 200, the first limiting mechanism 200 includes a pressure plate cylinder 210, and a first pressing block 220 is disposed on an output shaft of the pressure plate cylinder 210, and the first pressing block 220 is used for pressing and limiting a first end of the circuit board 100 to be divided under the driving of the pressure plate cylinder 210.

In this embodiment, as shown in fig. 5, a supporting portion 230 is optionally disposed on a surface of the plate separator opposite to the first pressing block 220. The output shaft of the pressing plate cylinder 210 is driven by the pressing plate cylinder 210 to perform telescopic motion, and when the output shaft extends out, the first pressing block 220 is driven to press the first end of the circuit board 100 to be divided against the bearing part 230, so that the first end of the circuit board 100 to be divided is fixed. When the output shaft is contracted, the first pressing block 220 is driven to leave the circuit board 100 to be divided.

Alternatively, a surface of the first press block 220 facing the circuit board 100 to be divided may be provided with a soft cushion material, such as a rubber cushion or the like, or the first press block 220 itself may be provided with a soft material. Alternatively, the first pressing member 220 may be integrally provided with the output shaft, or the end of the output shaft of the pressing plate cylinder 210 may itself constitute the first pressing member 220. The present embodiment is not limited to this.

Referring to fig. 6 and fig. 7, fig. 6 is a schematic view of at least a partial structure of a board separator according to an embodiment of the present disclosure; fig. 7 is a schematic view of portion C of fig. 6. As shown in fig. 6 and 7, for the first punching and separating mechanism 300, the first punching and separating mechanism 300 includes a first punching and separating cylinder 310, and a second pressing block 320 is disposed on an output shaft of the first punching and separating cylinder 310, and the second pressing block 320 is used for pressing a second end of the circuit board 100 to be separated under the driving of the first punching and separating cylinder 310.

In this embodiment, optionally, the output shaft of the first punching and snapping cylinder 310 is driven by the first punching and snapping cylinder 310 to perform a telescopic motion, and when the output shaft extends out, the second pressing block 320 is driven to punch the second end of the circuit board 100 to be divided, so as to punch and snap the circuit board 100 to be divided, so that the second end of the circuit board 100 to be divided is bent relative to the first end, and the sub-circuit board 110 located at the second end is broken from the circuit board 100 to be divided.

Optionally, since the second pressing block 320 may rub against the circuit board 100 to be separated during the process of punching and breaking the circuit board 100 to be separated, in order to prevent the second pressing block 320 from scratching the circuit board, a cushion or a rolling structure may be disposed on the second pressing block 320, and in order to facilitate understanding, the embodiments of the present application further provide the following preferred solutions.

Referring to fig. 7, as shown in fig. 7, a rolling member 330 is disposed on a side of the second press block 320 facing the circuit board 100 to be divided, and the rolling member 330 is used for rolling the circuit board 100 to be divided during the process of pressing the second press block 320.

In this embodiment, since the rolling member 330 is disposed on the second pressing block 320, the rolling member 330 can roll during the process of pressing the circuit board 100 to be separated by the second pressing block 320, so as to protect the circuit board from being scratched by the second pressing block 320 during the process of pressing and breaking. It should be noted that, for the specific implementation manner of the rolling member 330, the embodiment of the present application is not limited. Preferably, as shown in fig. 7, the rolling member 330 includes a roller 331, a rotating shaft 332 and a mounting position 333, wherein the roller 331 is disposed on the mounting position 333 and is rotatably connected to the second pressing block 320 via the rotating shaft 332, so that when the second pressing block 320 presses the circuit board, the roller 331 contacts the circuit board 100 to be divided, and the roller 331 rotates relative to the second pressing block 320 via the rotating shaft 332 during the pressing process. Therefore, the friction between the second pressing block 320 and the circuit board 100 to be divided in the stamping process is lubricated, and the circuit board is protected from being scratched.

It should be noted that, alternatively, one sub circuit board 110 may include only one small circuit board 111, or may include a plurality of small circuit boards 111. When the daughter circuit board 110 includes only one small circuit board 111, the structure can meet the working requirement of board splitting. Further, as shown in fig. 1, if the sub circuit board 110 includes a plurality of small circuit boards 111, another mechanism is further required to separate the small circuit boards 111 on the sub circuit board 110.

Alternatively, the circuit board to be divided 100 is integrally provided with a plurality of rows of small circuit boards to be divided 111 in the longitudinal direction, and a plurality of rows of small circuit boards to be divided 111 in the width direction, and seams are provided between the plurality of small circuit boards 111 at the junctions in the width direction and the longitudinal direction. For example, as shown in fig. 1, the circuit boards 100 to be divided are integrally provided with 2 rows in the longitudinal direction and 8 columns in the width direction. As shown in fig. 7, the first limiting mechanism 200 limits the first end of the circuit board 100 to be divided during the stamping process, and the first punching-breaking mechanism 300 punches the sub-circuit board 110, it can be seen that the sub-circuit board 110 that is punched off each time by the first punching-breaking mechanism 300 includes a row of small circuit boards 111, and in order to further divide the sub-circuit board 110 into a plurality of small circuit boards 111, various ways can be adopted, including but not limited to: in the first mode, the first board dividing apparatus 10 divides the sub-circuit board 110 into a plurality of small circuit boards 111 while breaking off the sub-circuit board 110. In the second mode, a second board dividing device 20 is additionally provided to further divide the sub-circuit board 110 into small circuit boards 111. For ease of understanding, each is described in detail below.

In the first mode, the first board dividing apparatus 10 divides the sub-circuit board 110 into a plurality of small circuit boards 111 while breaking off the sub-circuit board 110.

Referring to fig. 8 and 9, fig. 8 is a schematic view of at least a partial structure of a board separator according to an embodiment of the present disclosure; fig. 9 is a schematic view of portion D of fig. 8. As shown in fig. 8 and 9, the first plate dividing device 10 further includes a first punching and breaking knife 400, wherein the first punching and breaking knife 400 is disposed below the first punching and breaking mechanism 300; during the process of punching the sub-circuit board 110 by the first punching and breaking mechanism 300, the first punching and breaking knife 400 abuts against the seam of the row of small circuit boards 111.

In this embodiment, the position of the first punching and severing knife 400 corresponds to the joint between the small circuit boards 111 in the sub circuit boards 110, when the first punching and severing mechanism 300 punches the sub circuit boards 110, the sub circuit boards 110 are bent downward relative to the circuit boards 100 to be separated, at this time, the first punching and severing knife 400 corresponding to the joint abuts against the joint between the small circuit boards 111, and as the first punching and severing mechanism 300 further punches the sub circuit boards 110, the first punching and severing knife 400 abutting against the joint breaks the joint, so as to separate the sub circuit boards 110 into a plurality of small circuit boards 111.

Alternatively, as shown in fig. 1, two adjacent sub circuit boards 110 are arranged side by side on the sub circuit boards 110, and as shown in fig. 9, two rollers 331 are correspondingly arranged on the second pressing block 320 of the first punching and severing mechanism 300, wherein one roller 331 is correspondingly used for punching a small circuit board 111, so as to punch the sub circuit board 110 from the circuit board 100 to be cut. In this process, the first breaking-off knife 400 abuts against the joint between the two small circuit boards 111, and presses the two small circuit boards 111 to move downwards along with the two rollers 331, so as to drive the two small circuit boards 111 to be broken off along the joint, and as a result, the circuit boards are still essentially divided by the first breaking-off knife 400 in a breaking-off manner, and the problem of insufficient precision caused by cutting the circuit boards by the knife is avoided.

Optionally, in order to ensure that the sub-circuit boards 110 are broken only along the joints and do not damage other parts in the above-mentioned breaking process, the cutting edge of the first breaking knife 400 has an acute angle with respect to the plane where the circuit boards 100 to be separated are located. Through the included angle, a movement stroke of the first punching and breaking mechanism 300 in the process of punching and breaking the circuit board 100 to be divided is formed, so that after the first punching and breaking mechanism 300 firstly punches the sub-circuit board 110 from the circuit board 100 to be divided, the cutting edge of the first punching and breaking knife 400 abuts against the seam on the sub-circuit board 110. The sub circuit board 110 is prevented from collapsing due to a plurality of stresses during the punching process.

In the present embodiment, the sub circuit boards 110 are further divided into a plurality of small circuit boards 111 by the first punching and breaking knife 400 while the sub circuit boards 110 are broken off from the circuit boards 100 to be divided by providing the first punching and breaking knife 400 on the first board dividing apparatus 10. Therefore, the first board dividing device 10 can realize the division of two dimensions in the length and width directions by only performing one punching and breaking operation, and directly divide the circuit board 100 to be divided into a plurality of small circuit boards 111.

In the second mode, a second board dividing device 20 is additionally provided to further divide the sub-circuit board 110 into small circuit boards 111.

Referring to fig. 10 and fig. 11, fig. 10 is a bottom view of at least a part of the mechanism of the plate separator according to the embodiment of the present application, and fig. 11 is a bottom view of a part E in fig. 10. As shown in fig. 10 and fig. 11, the second board dividing device 20 includes a second limiting mechanism 500 and a second punching and breaking mechanism 600, wherein the second limiting mechanism 500 is used for limiting the sub circuit boards 110; the second punching and severing mechanism 600 is used to punch the joints between the rows of small circuit boards 111 in the sub-circuit boards 110.

In this embodiment, an additional set of second board dividing apparatus 20 is provided, and after the first board dividing apparatus 10 completes the first board dividing, the second board dividing is further performed, so as to divide the circuit board 100 to be divided into a plurality of small circuit boards 111. The second limiting mechanism 500 is used for limiting the sub-circuit boards 110 obtained by punching and breaking the first board dividing mechanism, and on the basis, the second punching and breaking mechanism 600 punches the seams in the limited sub-circuit boards 110, so that the sub-circuit boards 110 are further divided into a plurality of small circuit boards 111.

For convenience of understanding, the following examples of the embodiments of the present application are described by taking the above-described mode two as examples. But are not intended to limit the technical solutions of the present application.

It should be noted that there are many implementations of the second plate dividing device 20, and the present embodiment is not limited thereto, and for convenience of understanding, the present embodiment provides a preferred implementation as follows.

Referring to fig. 8, 10 and 11, the second limiting mechanism 500 includes a limiting groove 510, the second punching and breaking mechanism 600 includes a second punching and breaking cylinder 610, and an output shaft of the second punching and breaking cylinder 610 is provided with a second punching and breaking knife 620, wherein: the limiting groove 510 is disposed below the first punching and snapping mechanism 300, and is configured to receive the sub circuit boards 110 that drop after being punched by the first punching and snapping mechanism 300, so that the sub circuit boards 110 are limited in the limiting groove 510; the first wall of the limiting groove 510 is opened with an opening 511, at least a portion of the sub-circuit board 110 is exposed from the opening 511, and the cutting edge of the second punching-breaking cutter 620 is located at the opening 511 and is used for punching-breaking the joint under the driving of the second punching-breaking cylinder 610.

In this embodiment, optionally, the limiting groove 510 may be configured to be cylindrical, when the first punching and snapping mechanism 300 punches the sub-circuit board 110 off from the circuit board 100 to be divided, the sub-circuit board 110 falls into the cylindrical limiting groove 510, and the shape of the cylindrical limiting groove 510 is adapted to the shape of the sub-circuit board 110, so that the sub-circuit board 110 is limited in the limiting groove 510. The limiting groove 510 has a first surface wall with an opening 511, and during the punching process, the second punching blade 620 protrudes into the opening 511, so as to punch the seam between the sub-circuit boards 110. In this operation, since the sub circuit board 110 is accurately limited by the limiting groove 510, the punching precision of the second punching and severing knife 620 is ensured.

Alternatively, the manner of limiting the sub circuit board 110 by the limiting groove 510 may be various, including but not limited to the following.

Referring to fig. 10 and 11, as shown in fig. 10 and 11, the sub circuit board 110 includes two small circuit boards 111 arranged side by side, when the sub circuit board 110 falls into the limiting groove 510, two sides of the sub circuit board 110 are limited by the limiting groove 510, and the opening 511 is located at a seam between the two small circuit boards 111, so that the seam is exposed from the opening 511.

In this embodiment, the joint between the two small circuit boards 111 is exposed from the opening 511, and when the second punching-breaking cutter 620 protrudes from the opening 511, the joint between the two small circuit boards 111 is punched, thereby completing the division of the small circuit boards 111.

In the second mode, the sub circuit board 110 includes three small circuit boards 111 arranged side by side, two small circuit boards 111 on the sub circuit board 110 are connected by a seam, when the sub circuit board 110 is transferred into the limiting groove 510, one small circuit board 111 in the middle of the sub circuit board 110 is limited by the limiting groove 510, the opening 511 is located at the position of two small circuit boards 111 at two sides, and at this time, the number of the second punching and snapping cutters 620 is two, and the two seams are respectively punched.

In this embodiment, since one sub circuit board 110 includes 3 small circuit boards 111, the limiting groove 510 limits the middle one small circuit board 111, the two small circuit boards 111 on the two sides are exposed from the openings 511 on the left and right sides, and the two second punching and severing knives 620 work in parallel to punch off the two joints, thereby cutting the circuit board 100 to be cut, which has three small circuit boards 111 on one sub circuit board 110.

It should be noted that, based on the above principle, the matching between the opening 511 of the limiting groove 510 and the second punching-breaking knife 620 may also be achieved in other ways, and this application is not limited to this embodiment, and for ease of understanding, the above way is taken as an example for the following description.

Optionally, since the thickness of the limiting groove 510 is usually set to be thinner for limiting the sub-circuit board 110, and the moving stroke of the second breaking-off knife 620 is limited after the second breaking-off knife 620 enters the limiting groove 510 from the opening 511, in order to solve this problem, the embodiment of the present application further provides the following solution, in which the avoiding position 512 is arranged on the other side of the limiting groove 510, so as to increase the breaking stroke of the second breaking-off knife 620. For the sake of understanding, the following detailed description is made with reference to the accompanying drawings.

Referring to fig. 11 and 12, fig. 12 is a partial schematic view of at least part of components of the board separator according to the embodiment of the present disclosure, as shown in fig. 11 and 12, a second surface wall of the limiting groove 510 is provided with an avoiding portion 512, the second surface wall is opposite to the first surface wall, as shown in fig. 11, a rib 513 for limiting the sub circuit board 110 is disposed between the first surface wall and the second surface wall; as shown in fig. 8, a magazine 700 is disposed below the stopper groove 510; in the process of punching the seam by the second punching and snapping cutter 620, the second punching and snapping cutter 620 penetrates through the opening 511 and penetrates out of the avoiding position 512; one side of the small circuit board 111, which is far away from the joint, is limited by the flange 513 in the punching and snapping process, and one side of the small circuit board 111, which is close to the joint, moves to the avoiding position 512 in the punching and snapping process; after the second breaking blades 620 complete the breaking, the small circuit board 111 falls into the magazine 700 through the escape position 512.

In this embodiment, as shown in fig. 11 and 12, one sub circuit board 110 includes two small circuit boards 111 arranged side by side, and when the sub circuit board 110 falls into the limiting groove 510, two sides of the sub circuit board 110 (i.e., a side of the small circuit board 111 away from the seam) are connected by the rib 513 of the limiting groove 510, so as to limit the sub circuit board 110 in the limiting groove 510. At this time, the second punching and snapping cutter 620 enters the limiting groove 510 from the opening 511 and then passes through the escape position 512. Therefore, in the process of cutting the joint by the second cutting tool 620, one side of the small circuit board 111 close to the joint moves to the avoiding position 512 (i.e. the outer side of the limiting groove 510) along with the cutting of the second cutting tool 620, so that the stroke of the second cutting tool 620 is increased, and the joint can be sufficiently cut by the second cutting tool 620. Further, the magazine 700 is arranged below the limiting groove 510, after the seam on the sub-circuit board 110 is cut off, the rib 513 of the limiting groove 510 can no longer limit the two cut-off small circuit boards 111, and at the moment, the two small circuit boards 111 fall into the magazine 700 below under the action of gravity, so that the collection of the processed finished products is realized.

Optionally, as shown in fig. 6, an inclined guide groove 710 may be disposed between the magazine 700 and the limit groove 510, and the small circuit boards 111 falling from the limit groove 510 first fall into the guide groove 710, and then fall into the magazine 700 under the guidance of the guide groove 710, so as to prevent the small circuit boards 111 from splashing out of the magazine 700 during the falling process, and on the other hand, buffer the small circuit boards 111 to prevent the small circuit boards 111 from directly falling and breaking the small circuit boards 111.

It should be noted that, in order to limit the sub circuit board 110, the shape of the limiting groove 510 must be matched with the sub circuit board 110 to accurately engage and limit. The thickness of the sub-circuit board 110 is relatively thin, which causes the thickness of the limiting groove 510 to be relatively thin, and the sub-circuit board 110 broken by the first breaking mechanism 300 is difficult to accurately fall into the limiting groove 510. Therefore, in order to solve this problem, the embodiment of the present application provides a guide device between the first punching and snapping mechanism 300 and the limiting groove 510, and the sub circuit board 110 is dropped into the limiting groove 510 by the guide of the guide device. For ease of understanding, this aspect is described in detail below with reference to the accompanying drawings.

Referring to fig. 13, fig. 13 is a partial schematic view of at least part of the mechanism of the plate separator according to the embodiment of the present disclosure, as shown in fig. 13, a guide plate 340 is disposed below the first punching-breaking mechanism 300, and a guide groove 520 is disposed between the limiting groove 510 and the first punching-breaking mechanism 300; alternatively, the guide groove 520 may be formed in a funnel shape, or may be formed in an inclined plate shape as shown in fig. 13. When the first punching-breaking mechanism 300 breaks the sub-circuit board 110 from the circuit board 100 to be divided, the sub-circuit board 110 falls into the guide groove 520 under the guide of the guide plate 340, and falls into the limiting groove 510 under the guide of the guide groove 520 and is limited by the limiting groove 510.

In this embodiment, the position of the guide plate 340 is the same as the position of the first punching-breaking knife 400, and the difference between the two positions is that the included angle of the guide plate 340 is larger and has no knife edge, so that when the first punching-breaking mechanism 300 punches the daughter circuit board 110 onto the circuit board 100 to be cut, the fallen daughter circuit board 110 contacts the guide plate 340 and falls into the funnel-shaped guide groove 520 under the guidance of the guide plate 340, and the guide groove 520 guides the daughter circuit board 110 to slide into the limiting groove 510, so as to be limited by the limiting groove 510. Therefore, the dropped sub circuit boards 110 are guided by the matching of the guide plates 340 and the guide grooves 520, so that the sub circuit boards 110 can accurately fall into the limiting grooves 510, and the problem that the openings of the limiting grooves 510 are narrow is solved.

The above-mentioned board dividing work flow and mechanism of the board dividing machine provided in the embodiment of the present application are described in detail, and in the specific work process, the board dividing machine provided in the embodiment of the present application further has a feeding mechanism for storing the circuit board 100 to be divided and placing the circuit board 100 to be divided on the board dividing device. For the purpose of understanding, the following detailed description is to be read in connection with the accompanying drawings.

Referring to fig. 5, 14 and 15, fig. 14 is a schematic view of a board separator according to an embodiment of the present application, and fig. 15 is a schematic view of a portion G in fig. 14, as shown in fig. 5, 14 and 15, the board separator further includes a feeding device 800 and a working platform 900; the first board dividing device 10 is disposed on the working platform 900, fig. 5 is a schematic view of the feeding device 800 removed, and as shown in fig. 5, a feeding guide rail 910 for conveying the circuit board 100 to be divided to the first board dividing device 10 is disposed on the working platform 900; as shown in fig. 14 and 15, the feeding device 800 is disposed above the work platform 900, and the feeding device 800 is used for storing the circuit boards 100 to be singulated and placing the circuit boards 100 to be singulated on the feeding guide 910.

In this embodiment, the feeding device 800 is disposed on the working platform 900, a feeding guide rail 910 is disposed on the working platform 900, the feeding device 800 is configured to store the circuit board 100 to be divided, and place the circuit board 100 to be divided on the feeding guide rail 910, so that the circuit board 100 to be divided moves to the position of the first board dividing device 10 in the feeding guide rail 910. Optionally, as shown in fig. 5, a mounting support 920 is disposed on the working platform 900, the pressing plate cylinder 210 is disposed on the mounting support 920, an output shaft of the pressing plate cylinder 210 faces the working platform 900 and is perpendicular to a plane where the working platform 900 is located, a first pressing block 220 is disposed on the output shaft of the pressing plate cylinder 210, the feeding guide rail 910 and a bottom wall of a portion corresponding to the first pressing block 220 form a bearing portion 230, and the first pressing block 220 is driven by the output shaft of the pressing plate cylinder 210 to press the first end of the circuit board 100 to be divided to the bottom wall of the feeding guide rail 910, so as to form a limit for the first end of the circuit board 100 to be divided.

Optionally, the first punching and breaking cylinder 310 is also disposed on the mounting bracket 920, and the press plate cylinder 210 and the first punching and breaking cylinder 310 are respectively disposed at two ends of the mounting bracket 920, so that the first pressing block 220 connected to the press plate cylinder 210 can press the first end of the circuit board 100 to be divided, and the second pressing block 320 connected to the first punching and breaking cylinder 310 can punch the second end of the circuit board 100 to be divided.

Optionally, in the above solution, when the feeding device 800 places the circuit board 100 to be singulated on the feeding rail 910, the feeding rail 910 may convey the circuit board 100 to be singulated to the position of the first board dividing device 10 in various ways, for example, the feeding rail 910 may be provided with a conveyor belt for conveying the circuit board 100 to be singulated, or the feeding rail 910 may be provided with a material pushing mechanism for pushing the circuit board 100 to be singulated, which is not limited in this embodiment. For ease of understanding, a specific implementation of the loading rail 910 is provided below.

Referring to fig. 16 to 18, in which fig. 16 is a schematic view of the plate separator according to the embodiment of the present application after the feeding device is removed, and fig. 17 is another schematic view of the plate separator according to the embodiment of the present application after the feeding device is removed; fig. 18 is a schematic view of portion F of fig. 17. As shown in fig. 16 to 17, a driving device 930 is provided below the work platform 900, the driving device 930 including a moving rail 931 and a driving plate 932 moving along the moving rail 931; the feeding guide rail 910 is provided with a strip-shaped through hole 911 along the conveying direction of the circuit board 100 to be cut, optionally, the strip-shaped through hole 911 may be opened on the bottom wall of the feeding guide rail 910, or may be opened on the side wall of the feeding guide rail 910; the upper end of the driving plate 932 extends into the feeding guide rail 910 through the strip-shaped through hole 911; when the driving plate 932 moves along the moving rail 931, the circuit board 100 to be separated located on the loading rail 910 is driven to move toward the first board dividing device 10.

In this embodiment, optionally, a driving motor (not shown) is disposed in the motion rail 931, and the driving motor is used for driving the driving plate 932 to move along the motion rail 931. Further, as shown in fig. 4, 5, 16 to 18, the driving plate 932 includes a connecting portion 932A, a reinforcing plate 932B, a driving plate 932C and a driving hook 932D, wherein the connecting portion 932A is connected to the moving rail 931 and can slide along the moving rail 931 under the driving of the driving motor, the reinforcing plate 932B is arranged in a triangular shape, the reinforcing plate 932B is parallel to the length direction of the moving rail 931, the driving plate 932C is connected to the reinforcing plate 932B and is perpendicular to the reinforcing plate 932B, and the driving hook 932D is arranged at the upper end of the driving plate 932C and extends into the strip-shaped through hole 911 at the bottom wall of the loading rail 910. During specific work, driving motor drive connecting portion 932A moves along motion guide 931, and connecting portion 932A drives reinforcing plate 932B motion, because reinforcing plate 932B sets up to triangle-shaped and the length direction who is on a parallel with motion guide 931, has played the stabilizing action in connecting portion 932A motion process, and this driving plate 932C is connected with reinforcing plate 932B, and drive hook 932D is connected with driving plate 932C to move in the bar through-hole 911 of material loading guide 910 diapire.

In this way, the driving plate 932 pushes the circuit board 100 to be separated, which is located in the feeding rail 910, to the position of the first board dividing device 10. It should be noted that, as shown in fig. 1, a plurality of sub circuit boards 110 are included on one tape separating circuit board along the pushing direction of the driving board 932, and after the driving board 932 pushes the circuit board 100 to be separated to the position of the first board dividing device 10, the circuit board is pushed forward by the distance of one sub circuit board 110 each time. For example, the circuit board 100 to be divided initially includes 8 rows of sub-circuit boards 110, and the specific working process is as follows:

referring to fig. 19 in the first punching process, fig. 19 is a schematic view illustrating a state change of a circuit board to be separated during the first punching process of the board separator according to the embodiment of the present application, as shown in fig. 19, a first limiting mechanism 200 presses a penultimate sub-circuit board 110 (a shaded portion) at a first end, or the first limiting mechanism 200 presses all sub-circuit boards 110 at the first end. At this time, the first punching and snapping mechanism 300 punches the last sub circuit board 110 located at the second end. Thereafter, as shown in fig. 18, the driving board 932 pushes the circuit boards 100 to be divided forward by a distance of one sub-circuit board 110, ready for the second punching.

Referring to fig. 20 in the second punching process, fig. 20 is a schematic diagram illustrating a state change of a circuit board to be separated during the second punching process of the board separator according to the embodiment of the present application, as shown in fig. 20, the first limiting mechanism 200 presses the third last sub-circuit board 110 (shaded portion) at the first end, or the first limiting mechanism 200 presses all the remaining sub-circuit boards 110 at the first end. At this time, the first punching and snapping mechanism 300 punches the currently last sub circuit board 110 located at the second end. Thereafter, as shown in fig. 18, the driving board 932 pushes the circuit board 100 to be divided forward by a distance of one sub-circuit board 110, in preparation for the third punching.

The subsequent punching and severing steps are the same as the two punching and severing steps until the last punching and severing is completed, and when only the last sub circuit board 110 remains on the feeding guide rail 910, the driving plate 932 is further pushed by the distance of one sub circuit board 110, so that the current last sub circuit board 110 is pushed into the guide groove 520. At this time, the moving rail 931 drives the driving plate 932 to return to the initial position, and the next circuit board 100 to be separated, which is dropped by the feeding device 800, is ready to be transported.

It should be noted that, in the process that the driving plate 932 pushes the to-be-divided circuit board 100 to move, in order to prevent the to-be-divided circuit board 100 from tilting from the feeding guide rail 910 due to the pushing of the driving plate 932, referring to fig. 18, as shown in fig. 18, the pressing mechanism 940 includes a fixing block 941 and a pressing plate 942, wherein the fixing block 941 is fixedly installed above the feeding guide rail 910, and the pressing plate 942 is disposed in the feeding guide rail 910 and is connected to the lower surface of the fixing block 941 through a connecting arm 943, so that in the process that the driving plate 932 pushes the to-be-divided circuit board 100, the pressing mechanism 940 presses the upper surface of the to-be-divided circuit board 100 to prevent the to-be-divided circuit board 100 from tilting away from the feeding guide rail 910 along with the pushing of the driving plate 932.

It should be noted that, in the embodiment of the present application, the feeding device 800 is used for storing the circuit boards 100 to be singulated, and simultaneously, one circuit board 100 to be singulated is dropped onto the feeding rail 910 at a time. Based on the solutions provided in the embodiments of the present application, a person skilled in the art may select multiple implementation manners of the feeding device 800, and thus, the embodiments of the present application are not limited thereto. For the purposes of understanding, a preferred implementation is provided below in connection with the appended drawings.

Referring to fig. 21, fig. 21 is a schematic view of a feeding device in a plate separator according to an embodiment of the present application. As shown in fig. 21, the feeding device 800 includes a storage bin 810, the storage bin 810 has a cross section matched with the circuit board 100 to be divided, and the storage bin 810 is used for vertically stacking a plurality of circuit boards 100 to be divided; the bottom of the storage bin 810 is provided with a first switch part 820 and a second switch part 830, wherein the first switch part 820 is arranged above the second switch part 830; when the second switch portion 830 is turned on, the last circuit board 100 to be divided located at the bottom of the storage bin 810 falls onto the feeding guide rail 910, and the first switch portion 820 keeps a closed state when the second switch portion 830 is turned on, so as to limit the falling of other circuit boards 100 to be divided above; when the second switch portion 830 is closed, the first switch portion 820 is opened, so that the circuit board 100 to be divided above the storage bin 810 falls down as a whole.

In this embodiment, the storage bin 810 is perpendicular to the circuit board 100 to be divided, so that the board dividing machine occupies the minimum space, and the cross section of the storage bin 810 is adapted to the circuit board 100 to be divided, thereby reducing the probability of turning over during the falling process of the circuit board 100 to be divided, and ensuring that the processing of the circuit board 100 to be divided is not affected by the falling of the circuit board from the feeding device 800. Meanwhile, in order to ensure that only one circuit board 100 to be cut off falls down in the storage bin 810 at a time, the first switch portion 820 and the second switch portion 830 are arranged at the bottom of the storage bin 810, and the circuit board 100 to be cut off is controlled to fall down through the cooperation of the first switch portion 820 and the second switch portion 830, and the specific working process is as follows.

Referring to fig. 22, fig. 22 is a cross-sectional view of the bottom of the feeding device of the board separator according to the embodiment of the present disclosure, as shown in fig. 22, when the feeding device 800 needs to put the circuit boards 100 to be separated into the feeding rail 910, the second switch portion 830 is opened, so that the last circuit board 100 to be separated located at the opening of the storage bin 810 falls into the feeding rail 910 under the action of gravity, during this process, the first switch portion 820 remains closed, and the other circuit boards 100 to be separated above are limited, so that the other circuit boards 100 to be separated do not fall along with the last circuit board 100 to be separated. After the feeding is completed, the second switch portion 830 is closed, the first switch portion 820 is opened, and at this time, all the circuit boards 100 to be divided in the storage bin 810 fall down integrally, so that the next feeding is waited. Therefore, through the combination of the two switch parts, the feeding mechanism is ensured to only put one circuit board 100 to be divided at a time, and the circuit board dividing mechanism is simple in structure and reliable in use.

It should be noted that the first switch portion 820 and the second switch portion 830 may be switched between an on state and an off state, wherein the circuit board 100 to be divided is allowed to pass through when the first switch portion is in the on state. When in the closed state, the passage of the circuit board 100 to be divided is restricted. Based on the utility model, a person skilled in the art can select various implementation manners, and for this reason, the embodiments of the present application are not limited thereto, and for the convenience of understanding, for the first switch portion 820 and the second switch portion 830, the embodiments of the present application respectively provide a preferred embodiment as follows.

Referring to fig. 21 to 23, fig. 23 is a partial bottom view of a feeding device of a plate separator according to an embodiment of the present application. As shown in fig. 21 to 23, for the first switch portion 820, the first switch portion 820 is disposed on the sidewall of the storage bin 810, and preferably, the number of the first switch portions 820 is two and symmetrically disposed on two sidewalls of the storage bin 810; the first switch part 820 comprises a first switch cylinder 821 and a pressure head 822 arranged on an output shaft of the first switch cylinder 821, a through hole 811 is formed in the side wall of the storage bin 810, and the pressure head 822 extends into the storage bin 810 through the through hole 811; when the first switching section 820 is closed, the pressing head 822 presses the circuit board 100 to be divided by the driving of the first switching cylinder 821 to restrict the circuit board 100 to be divided from falling. When the number of the first switching parts 820 is two, the two pressing heads 822 symmetrically press the circuit board 100 to be divided from both sides, respectively, thereby restricting the circuit board 100 to be divided from falling.

In this embodiment, since the first switch portion 820 is disposed above the second switch portion 830, the space thereof is narrow, and thus the falling of the circuit board 100 to be divided is limited by the pressing of the pressing head 822, thereby realizing the opening and closing of the first switch portion 820.

For the second switch part 830, the second switch part 830 is disposed at the bottom of the storage bin 810; the second switching part 830 comprises a second switching cylinder 831 and a limit plate 832 connected with the second switching cylinder 831; when the second switch portion 830 is closed, the second switch cylinder 831 drives the end of the limiting plate 832 to extend into the bottom opening of the storage bin 810 to limit the circuit board 100 to be cut from falling from the bottom opening.

In this embodiment, optionally, the number of the second switch portions 830 is two and the second switch portions are symmetrically disposed at the bottom opening of the storage bin 810, and when the end of the limiting plate 832 extends into the bottom opening of the storage bin 810, the opening is blocked, so that the circuit board 100 to be cut off is limited to fall from the bottom opening, and the switch function is achieved.

Optionally, an installation manner between the second switch cylinder 831 and the limiting plate 832 is further provided in an embodiment of the present application, referring to fig. 23, as shown in fig. 23, the second switch portion 830 further includes a transmission mechanism 833, and the transmission mechanism 833 is configured to transmit power of the second switch cylinder 831 to achieve movement of the limiting plate 832. Optionally, the transmission mechanism 833 includes an installation block 833A, a sliding rail rod 833B and a sliding block 833C, wherein the installation block 833A is disposed on an outer sidewall of the storage bin 810, an end of an output shaft of the second switch cylinder 831 is connected to the installation block 833A, further, the sliding rail rod 833B is disposed on an outer wall of the installation block 833A, the sliding block 833C is sleeved on the sliding rail rod 833B, and a body of the second switch cylinder 831 and the limiting plate 832 are respectively connected to the sliding block 833C.

In this embodiment, the output shaft of the second switching cylinder 831 performs telescopic movement. When the second switch portion 830 is opened, the second switch portion Guan Qigang drives the output shaft to extend, because the end portion of the output shaft is connected with the mounting block 833A, when the output shaft extends, the body of the second switch cylinder 831 is reversely driven to move in the direction away from the mounting block 833A, because the body of the second switch cylinder 831 is connected with the slider 833C, the body of the second switch cylinder 831 drives the slider 833C to move in the direction away from the opening of the storage bin 810, because the slider 833C is connected with the 832 limit plate, the end portion of the limit plate 832 is finally driven to be away from the opening of the storage bin 810, and the opening of the second switch portion 830 is realized. On the contrary, when the second switch portion 830 is closed, the second switch cylinder 831 drives the output shaft to contract, so that the end portion far away from the driving limit plate 832 moves towards the opening close to the storage bin 810, and the closing of the second switch portion 830 is realized. Thus, only one second switch cylinder 831 is required on each side to actuate the plurality of parallel restriction plates 832 to open or close the bottom opening of the storage bin 810.

Optionally, as shown in fig. 5, a shallow groove 912 is provided on the upper surface of the work platform 900, and when the loading device 800 is installed on the work platform 900, the limiting plate 832 located at the bottom outlet of the loading device 800 is embedded in the shallow groove 912, and on one hand, the shallow groove 912 allows the work platform 900 to avoid the limiting plate 832, and on the other hand, the shallow groove 912 may form a guide rail to guide the movement of the limiting plate 832.

To sum up, the board dividing machine provided by the embodiment of the present application is used for dividing a circuit board to be divided into a plurality of sub-circuit boards, and includes a board dividing device, where the board dividing device includes a limiting mechanism and a punching and severing mechanism, where the limiting mechanism is used for limiting the circuit board to be divided; the punching and breaking mechanism is arranged on one side of the board surface of the circuit board limited by the limiting mechanism and used for punching the circuit board to be divided limited by the limiting mechanism and punching and breaking the circuit board to be divided into a plurality of sub circuit boards. Therefore, the effect of manually breaking the circuit board to be divided is simulated through the matching of the limiting mechanism and the punching and breaking mechanism, and the problem of insufficient precision in the process of cutting the circuit board by the cutter is solved.

The above only be the preferred embodiment of the utility model discloses a not consequently restriction the patent scope of the utility model, all be in the utility model discloses a under the design, utilize the equivalent structure transform of what the content of the description and the attached drawing was done, or direct/indirect application all includes in other relevant technical field the utility model discloses a patent protection is within range.

Claims

1. A board separator is used for separating a circuit board to be separated into a plurality of sub-circuit boards and is characterized by comprising a board separating device, wherein the board separating device comprises a limiting mechanism and a punching and breaking mechanism,

the limiting mechanism is used for limiting the circuit board to be cut;

the punching and breaking mechanism is arranged on one side of the board surface of the segmented circuit board limited by the limiting mechanism and used for punching the circuit board to be segmented limited by the limiting mechanism and punching and breaking the circuit board to be segmented into a plurality of sub circuit boards.

2. The board separator of claim 1, wherein the board separator includes a first board separator including a first limiting mechanism and a first punching mechanism, wherein,

the first limiting mechanism is used for limiting the first end of the circuit board to be divided;

the first punching and breaking mechanism is used for punching the second end of the circuit board to be divided so as to break the sub circuit board at the second end off from the circuit board to be divided.

3. The board separator as claimed in claim 2, wherein the first limiting mechanism comprises a pressing plate cylinder, and the output shaft of the pressing plate cylinder is provided with a first pressing block which is used for pressing and limiting the first end of the circuit board to be separated under the driving of the pressing plate cylinder.

4. The board separator according to claim 2, wherein the first punching and separating mechanism comprises a first punching and separating cylinder, and a second pressing block is arranged on an output shaft of the first punching and separating cylinder and is used for punching the second end of the circuit board to be separated under the driving of the first punching and separating cylinder.

5. The board separator as claimed in claim 4, wherein a side of the second press block facing the circuit board to be separated is provided with a rolling member for rolling the circuit board to be separated during the pressing of the second press block.

6. The board separator according to any one of claims 2 to 5, wherein the boards to be separated are integrally provided with a plurality of rows in the longitudinal direction and a plurality of rows in the width direction, and the plurality of small boards have seams between the adjacent portions in the width direction and the longitudinal direction; the sub circuit boards which are broken off each time by the first punching and breaking mechanism comprise a row of small circuit boards; the first plate dividing device also comprises a first punching and breaking knife, wherein,

the first punching and breaking cutter is arranged below the first punching and breaking mechanism; and in the process of stamping the sub circuit boards by the first stamping and severing mechanism, the first stamping and severing knife is abutted against the joint of the row of small circuit boards.

7. The board separator of claim 6, wherein the cutting edge of the first punching-severing knife has an acute angle with respect to the plane of the circuit board to be separated.

8. The board separator according to any one of claims 2 to 5, wherein the boards to be separated are integrally provided with a plurality of rows in the longitudinal direction and a plurality of rows in the width direction, and the plurality of small boards have seams between the adjacent portions in the width direction and the longitudinal direction; the sub circuit boards which are broken off each time by the first breaking mechanism comprise a row of small circuit boards; the plate dividing device also comprises a second plate dividing device, the second plate dividing device comprises a second limiting mechanism and a second punching and breaking mechanism, wherein,

the second limiting mechanism is used for limiting the sub circuit board;

and the second punching and snapping mechanism is used for punching the seams among a row of small circuit boards in the sub circuit boards.

9. The board separator according to claim 8, wherein the second limiting mechanism comprises a limiting groove, the second punching and separating mechanism comprises a second punching and separating cylinder, and the output shaft of the second punching and separating cylinder is provided with a second punching and separating knife, wherein:

the limiting groove is arranged below the first punching and breaking mechanism and used for receiving the sub-circuit board which falls off after being punched by the first punching and breaking mechanism, so that the sub-circuit board is limited in the limiting groove;

an opening is formed in the first surface wall of the limiting groove, at least part of the sub-circuit board is exposed out of the opening, and the cutting edge of the second punching and breaking cutter is located in the opening and used for punching and breaking the joint under the driving of the second punching and breaking cylinder.

10. The board separator according to claim 9, wherein a second face wall of the limiting groove is provided with an avoiding position, the second face wall is opposite to the first face wall, and a retaining edge for limiting the sub-circuit board is arranged between the first face wall and the second face wall; a material box is arranged below the limiting groove;

in the process that the second punching and snapping cutter punches and breaks the joint, the second punching and snapping cutter penetrates into the opening and penetrates out of the avoiding position;

one side of the small circuit board, which is far away from the joint, is limited by the flange in the punching and snapping process, and one side of the small circuit board, which is close to the joint, moves to the avoidance position in the punching and snapping process; after the second punching and severing knife finishes punching and severing, the small circuit board falls into the material box through the avoiding position.

11. The board separator according to claim 9, wherein a guide plate is provided below the first punching-breaking mechanism, and a guide groove is provided between the limiting groove and the first punching-breaking mechanism;

when the first punching and breaking mechanism breaks the sub-circuit boards from the circuit boards to be cut, the sub-circuit boards fall into the guide grooves under the guide of the guide plates, fall into the limiting grooves under the guide of the guide grooves and are limited by the limiting grooves.

12. The board separator of any one of claims 2 to 5, wherein the board separator further comprises a loading device and a working platform;

the first board dividing device is arranged on the working platform, and the working platform is provided with a feeding guide rail for conveying the circuit board to be divided to the first board dividing device;

the feeding device is arranged above the working platform and used for storing the circuit boards to be cut and placing the circuit boards to be cut on the feeding guide rails.

13. The board separator of claim 12, wherein a drive device is disposed below the work platform, the drive device including a motion rail and a drive plate that moves along the motion rail;

the feeding guide rail is provided with a strip-shaped through hole along the conveying direction of the circuit board to be segmented, and the upper end of the driving board extends into the feeding guide rail through the strip-shaped through hole; when the driving plate moves along the moving guide rail, the circuit board to be divided positioned on the feeding guide rail is driven to move towards the first board dividing device.

14. The board separator according to claim 12, wherein the loading device comprises a storage bin, the cross section of the storage bin is matched with the circuit boards to be separated, and the storage bin is used for vertically stacking a plurality of circuit boards to be separated; the bottom of the storage bin is provided with a first switch part and a second switch part, wherein,

the first switch part is arranged above the second switch part;

when the second switch part is opened, the last circuit board to be divided positioned at the bottom of the storage bin falls to the feeding guide rail, and the first switch part is kept in a closed state when the second switch part is opened so as to limit other circuit boards to be divided above the first switch part from falling;

when the second switch part is closed, the first switch part is opened, so that the circuit board to be cut above the storage bin integrally falls downwards.

15. The board separator of claim 14, wherein the first switch portion is disposed on a sidewall of the storage bin; wherein the content of the first and second substances,

the first switch part comprises a first switch cylinder and a pressure head arranged on an output shaft of the first switch cylinder, a through hole is formed in the side wall of the storage bin, and the pressure head extends into the storage bin through the through hole; when the first switch part is closed, the pressure head is driven by the first switch cylinder to extrude the circuit board to be divided so as to limit the circuit board to be divided from falling.

16. The board separator of claim 14, wherein the second switch portion is disposed at the bottom of the storage bin; wherein the content of the first and second substances,

the second switch part comprises a second switch cylinder and a limiting plate connected with the second switch cylinder; when the second switch portion is closed, the second switch cylinder drives the end portion of the limiting plate to extend into the bottom opening of the storage bin, so that the circuit board to be divided is limited to fall from the bottom opening.