CN217788897U

CN217788897U - Semiconductor memory device

Info

Publication number: CN217788897U
Application number: CN202221921002.0U
Authority: CN
Inventors: 王欢; 连国炜; 安俊颖; 陈瑞丽
Original assignee: Shenzhen Lianchuang Goldman Sachs Technology Co ltd
Current assignee: Shenzhen Lianchuang Goldman Sachs Technology Co ltd
Priority date: 2022-07-25
Filing date: 2022-07-25
Publication date: 2022-11-11
Anticipated expiration: 2032-07-25

Abstract

The utility model belongs to the technical field of semiconductor memory, especially, be a semiconductor memory device, including the semiconductor memory body, have a plurality of data line connecting jacks at the terminal surface of semiconductor memory body, still include shell body, protective cover, L type swivelling joint board, a spliced pole and reset spring No. one, the semiconductor memory body is installed in the shell body, the protective cover is located the open end of shell body; the utility model discloses a semiconductor memory device, through the shell body and the protective cover that set up, in idle time, utilize the spring action of reset spring No. one, can be through a spliced pole with the stable lid of protective cover establish the port position at the shell body for carry out safety protection to data line connecting jack, avoid external dust to get into in the data line connecting jack; the protective cover is rotatable formula design, and the simple operation is convenient for cover data line connection jack and protect, also is convenient for dodge data line connection jack and use.

Description

Semiconductor memory device

Technical Field

The utility model belongs to the technical field of semiconductor memory, concretely relates to semiconductor memory device.

Background

A solid-state electronic device for storing data information, semiconductor memory for short, is made up of a lot of identical memory cells and input and output circuits, each memory cell has two different characteristic states '0' and '1' for storing different information, the semiconductor memory is an important part of computer, compared with magnetic memory, it has the advantages of fast access speed, large storage capacity, small volume, etc., and the memory cell array is compatible with main peripheral logic circuit, and can be made on the same chip, making the input and output interface greatly simplified, therefore, in the aspect of computer high-speed storage, the semiconductor memory has completely replaced the past magnetic memory.

One or more data line connection jacks are usually arranged on the semiconductor memory, however, when the semiconductor memory is idle, the traditional semiconductor memory lacks the protection measures for the data line connection jacks, and external dust easily enters the data line connection jacks during the period, which is not beneficial to the safe use of the semiconductor memory; also some users can add the rubber buffer and inject in the data line connection jack and be used for the protection, but the effect is not good, and the rubber buffer drops easily.

SUMMERY OF THE UTILITY MODEL

For solving the above-mentioned problem that exists among the prior art, the utility model provides a semiconductor memory device has convenient to use, barrier propterty is good and stable good characteristics.

In order to achieve the above purpose, the utility model provides a following technical scheme: a semiconductor memory device comprises a semiconductor memory body, a shell, a protective cover, an L-shaped rotary connecting plate, a first connecting column and a first return spring, wherein a plurality of data line connecting jacks are formed in the end face of the semiconductor memory body; two L type swivelling joint board utilizes the pivot symmetry to install the open end both sides of shell body the outer wall of protective cover is fixed with the connecting block that two symmetries distribute, the one end of spliced pole with connecting block fixed connection, the other end run through L type swivelling joint board, just the one end that the connecting block was kept away from to a spliced pole is fixed with spacing dish No. one, a reset spring cover is established just be in on a spliced pole spacing dish with between the L type swivelling joint board.

As a preferred technical scheme of the utility model, the internal diameter size of protective cover equals the external diameter size of shell body.

As an optimized technical scheme of the utility model, the inner wall bonding of protective cover is fixed with the rubber buffer and can imbeds in the data line connection jack.

As a preferred technical solution of the present invention, the semiconductor memory further comprises an auxiliary stabilizing assembly, wherein the auxiliary stabilizing assembly comprises a T-shaped block, a movable plate and a positioning assembly, the movable plate is distributed in the outer shell, the T-shaped block is fixed at the tail end of the semiconductor memory body, the left and right ends of the T-shaped block are isosceles triangle structures, and two sets of positioning assemblies matched with the T-shaped block are mounted on the movable plate; the positioning assembly comprises a triangular block and a third reset spring, a fixed plate is fixed on the movable plate, a third connecting column penetrating through the fixed plate is fixed on the outer wall of the triangular block, and the third reset spring is sleeved on the third connecting column and is positioned between the triangular block and the fixed plate; and a third limiting disc is fixed at one end of the third connecting column, which is far away from the triangular block.

As a preferred technical scheme of the utility model, still include reset spring No. two still be fixed with the spliced pole No. two on the fly leaf, just No. two one ends that the fly leaf was kept away from to the spliced pole are run through and are extended to the outside of shell body No. two stretching out of spliced pole is served and is fixed with No. two spacing dishes, no. two reset spring cover are established just be in on No. two spliced poles No. two spacing dishes with between the shell body.

Compared with the prior art, the beneficial effects of the utility model are that: the utility model discloses a semiconductor memory device, through the shell body and the protective cover that set up, when idle, utilize the spring action of reset spring No. one, can cover the protective cover through the spliced pole No. one and stabilize the port position at the shell body for carry out safety protection to data line connection jack, avoid external dust to get into in the data line connection jack; the protective cover is rotatable formula design, and the simple operation is convenient for cover data line connection jack and protect, also is convenient for dodge data line connection jack and use.

Drawings

The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention, and together with the description serve to explain the invention and not to limit the invention. In the drawings:

fig. 1 is a schematic structural view of the present invention;

FIG. 2 is a schematic view of the axial measurement structure of the present invention;

fig. 3 is an enlarged schematic view of the positioning assembly of fig. 2 according to the present invention;

in the figure: 1. a semiconductor memory body; 2. the data line is connected with the jack; 3. an outer housing; 4. a protective cover; 5. a rubber plug; 6. an L-shaped rotating connecting plate; 7. a first connecting column; 8. connecting blocks; 9. a first limiting disc; 10. a first return spring; 11. a secondary stabilizing assembly; 12. a T-shaped block; 13. a movable plate; 14. a positioning assembly; 15. a second connecting column; 16. a second limiting disc; 17. a second return spring; 18. a triangular block; 19. a fixing plate; 20. a connecting column III; 21. a third return spring; 22. third limiting disc.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts all belong to the protection scope of the present invention.

Referring to fig. 1-3, the present invention provides the following technical solutions: a semiconductor memory device comprises a semiconductor memory body 1, a shell 3, a protective cover 4, an L-shaped rotary connecting plate 6, a first connecting column 7 and a first return spring 10, wherein a plurality of data line connecting jacks 2 are formed in the end face of the semiconductor memory body 1, the semiconductor memory body 1 is installed in the shell 3, the protective cover 4 is positioned at the opening end of the shell 3, and the inner diameter of the protective cover 4 is equal to the outer diameter of the shell 3; two L-shaped rotary connecting plates 6 are symmetrically arranged at two sides of the opening end of the shell body 3 by utilizing a rotating shaft, two connecting blocks 8 which are symmetrically distributed are fixed on the outer wall of the protective cover 4, one end of a first connecting column 7 is fixedly connected with the connecting blocks 8, the other end of the first connecting column passes through the L-shaped rotary connecting plates 6, one end of the first connecting column 7, which is far away from the connecting blocks 8, is fixed with a first limiting disc 9, a first reset spring 10 is sleeved on the first connecting column 7 and is positioned between the first limiting disc 9 and the L-shaped rotary connecting plates 6, a rubber plug 5 is fixedly bonded on the inner wall of the protective cover 4 and can be embedded into the data line connecting jack 2, when the data line connecting jack 2 is needed to be used, the protective cover 4 is pulled outwards, so that the protective cover 4 is far away from the shell body 3, the rubber plug 5 is separated from the data line connecting jack 2, then the protective cover 4 can be turned upwards or downwards, the L-shaped rotary connecting plates 6 can rotate, and when the protective cover 4 avoids the data line connecting jack 2, the data line connecting jack 2 can be used; at the time of the idle, draw protective cover 4 outward when rotating protective cover 4, stop rotatory protective cover 4 behind the just data line jack 2 as rubber buffer 5, because when drawing protective cover 4 outward, spliced pole 7 also can remove and through a spacing dish 9 and L type swivelling joint board 6 cooperation compression reset spring 10 No. one, rubber buffer 5 is just loosening protective cover 4 behind the data line jack 2, reset spring 10 releases elasticity so that protective cover 4 resets, protective cover 4 lid is at the open end of shell 3, rubber buffer 5 also can imbed in the data line jack 2 simultaneously, reliably avoid external dust to get into in the data line jack 2.

Specifically, as shown in fig. 1, fig. 2 and fig. 3, in this embodiment, an auxiliary stabilizing assembly 11 is further included, and the auxiliary stabilizing assembly 11 includes a T-shaped block 12, a movable plate 13 and a positioning assembly 14, and the movable plate 13 is distributed in the outer shell 3, the T-shaped block 12 is fixed at the tail end of the semiconductor memory body 1, and both the left and right ends of the T-shaped block 12 are of an isosceles triangle structure, and two sets of positioning assemblies 14 matched with the T-shaped block 12 are mounted on the movable plate 13; the positioning assembly 14 comprises a triangular block 18 and a third return spring 21, a fixed plate 19 is fixed on the movable plate 13, a third connecting column 20 penetrating through the fixed plate 19 is fixed on the outer wall of the triangular block 18, and the third return spring 21 is sleeved on the third connecting column 20 and is positioned between the triangular block 18 and the fixed plate 19; a third limiting disc 22 is fixed at one end of the third connecting column 20, which is far away from the triangular block 18, when the semiconductor memory body 1 is installed, the semiconductor memory body 1 is directly pushed into the outer shell 3, when the inclined surface of the T-shaped block 12 contacts the inclined surface of the triangular block 18, the semiconductor memory body 1 is continuously pushed, component force moving towards the outer side is generated on the triangular block 18, the third reset spring 21 is compressed, when the T-shaped block 12 crosses the triangular block 18, the third reset spring 21 releases elastic force, the triangular block 18 resets and forms clamping fit with the T-shaped block 12, and the installation stability of the semiconductor memory body 1 is further improved; because the left end and the right end of the T-shaped block 12 are both in an isosceles triangle structure, the semiconductor memory body 1 is more labor-saving to disassemble.

Specifically, as shown in fig. 1 and fig. 2, in this embodiment, the semiconductor memory device further includes a second return spring 17, a second connection column 15 is further fixed on the movable plate 13, one end of the second connection column 15, which is far away from the movable plate 13, penetrates through and extends to the outside of the outer shell 3, a second limiting disc 16 is fixed on the extending end of the second connection column 15, the second return spring 17 is sleeved on the second connection column 15 and is located between the second limiting disc 16 and the outer shell 3, in an initial state, due to the elastic force of the second return spring 17, the movable plate 13 abuts against the inner wall of the outer shell 3, when the semiconductor memory device body 1 needs to be detached, the second limiting disc 16 is pushed, the semiconductor memory device body 1 is pushed out towards the outside by using the movable plate 13, and when the semiconductor memory device body 1 extends out of the outer shell 3 by a certain length, the semiconductor memory device body 1 can be pulled out from the outer shell 3, so that maintenance is facilitated.

The utility model discloses a theory of operation and use flow: the utility model discloses a semiconductor memory body 1, when needing to use data line connecting jack 2, pull outward protective cover 4, make protective cover 4 keep away from shell body 3, and rubber buffer 5 breaks away from data line connecting jack 2, later the protective cover 4 all can be turned over upwards or downwards, L type swivelling joint board 6 is rotatory, after protective cover 4 dodges out data line connecting jack 2, can utilize the data transmission line to connect the plug-in data line connecting jack 2 and use;

at the time of the idle, draw protective cover 4 outward when rotating protective cover 4, stop rotatory protective cover 4 behind the just data line jack 2 as rubber buffer 5, because when drawing protective cover 4 outward, spliced pole 7 also can remove and through a spacing dish 9 and L type swivelling joint board 6 cooperation compression reset spring 10 No. one, rubber buffer 5 is just loosening protective cover 4 behind the data line jack 2, reset spring 10 releases elasticity so that protective cover 4 resets, protective cover 4 lid is at the open end of shell 3, rubber buffer 5 also can imbed in the data line jack 2 simultaneously, reliably avoid external dust to get into in the data line jack 2.

In all examples shown and described herein, any particular value should be construed as merely exemplary, and not as a limitation, and thus other examples of example embodiments may have different values.

It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined or explained in subsequent figures.

In addition, in the description of the embodiments of the present invention, unless otherwise explicitly specified or limited, the terms "mounted," "connected," "disposed," "provided," and the like are to be construed broadly and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; the two elements may be directly connected or indirectly connected through an intermediate medium, and the two elements may be connected through an intermediate medium.

Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described above, or equivalents may be substituted for elements thereof. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A semiconductor memory device comprising a semiconductor memory body (1) having a plurality of data line connection jacks (2) at an end face of the semiconductor memory body (1), characterized in that: the semiconductor memory comprises a semiconductor memory body (1) and is characterized by further comprising an outer shell (3), a protective cover (4), an L-shaped rotary connecting plate (6), a first connecting column (7) and a first return spring (10), wherein the semiconductor memory body (1) is installed in the outer shell (3), and the protective cover (4) is located at the opening end of the outer shell (3); two L type swivelling joint board (6) utilize the pivot symmetry to install the open end both sides of shell body (3) the outer wall of protective cover (4) is fixed with connecting block (8) that two symmetries distribute, the one end of spliced pole (7) with connecting block (8) fixed connection, the other end run through L type swivelling joint board (6), and the one end of keeping away from connecting block (8) for spliced pole (7) is fixed with spacing dish (9) No. one, reset spring (10) cover is established just be in on spliced pole (7) spacing dish (9) with between L type swivelling joint board (6).

2. A semiconductor memory device according to claim 1, wherein: the inner diameter of the protective cover (4) is equal to the outer diameter of the outer shell (3).

3. A semiconductor memory device according to claim 1, wherein: the inner wall of protective cover (4) bonds and is fixed with rubber buffer (5) and can imbed in data line connection jack (2).

4. A semiconductor memory device according to claim 1, wherein: the auxiliary stabilizing assembly (11) comprises a T-shaped block (12), a movable plate (13) and a positioning assembly (14), the movable plate (13) is distributed in the outer shell (3), the T-shaped block (12) is fixed at the tail end of the semiconductor memory body (1), the left end and the right end of the T-shaped block (12) are both in an isosceles triangle structure, and two groups of positioning assemblies (14) matched with the T-shaped block (12) are mounted on the movable plate (13); the positioning assembly (14) comprises a triangular block (18) and a third return spring (21), a fixing plate (19) is fixed on the movable plate (13), a third connecting column (20) penetrating through the fixing plate (19) is fixed on the outer wall of the triangular block (18), and the third return spring (21) is sleeved on the third connecting column (20) and is positioned between the triangular block (18) and the fixing plate (19); and a third limiting disc (22) is fixed at one end of the third connecting column (20) far away from the triangular block (18).

5. A semiconductor memory device according to claim 4, wherein: still include reset spring (17) No. two still be fixed with spliced pole (15) No. two on fly leaf (13), just No. two one end that fly leaf (13) were kept away from in spliced pole (15) is run through and is extended to the outside of shell body (3) be fixed with No. two spacing dishes (16) on the end of stretching out of spliced pole (15), no. two reset spring (17) cover are established on No. two spliced poles (15) and be in No. two spacing dishes (16) with between shell body (3).