CN217788339U - Cleaning device for wet-process wafer - Google Patents
Cleaning device for wet-process wafer Download PDFInfo
- Publication number
- CN217788339U CN217788339U CN202220913153.5U CN202220913153U CN217788339U CN 217788339 U CN217788339 U CN 217788339U CN 202220913153 U CN202220913153 U CN 202220913153U CN 217788339 U CN217788339 U CN 217788339U
- Authority
- CN
- China
- Prior art keywords
- spring
- wafer
- workstation
- improving
- favorable
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Cleaning Or Drying Semiconductors (AREA)
- Cleaning In General (AREA)
Abstract
The utility model provides a belt cleaning device for wet process wafer relates to wafer equipment technical field, comprises a workbench, install the shower nozzle on the workstation, the spout has been seted up on the workstation, be provided with the washing subassembly on the workstation, it includes the cleaning brush to wash the subassembly, one side that the workstation is close to the shower nozzle is installed first spring and telescopic link. The utility model discloses, through starting the water pump, then place the wafer in the spout, make and slide in the spout, then through the shower nozzle water spray at through the cleaning brush, then make first spring of cleaning brush extrusion and telescopic link, wafer striking blotter extrusion buffer board after the washing, be favorable to improving the effect that the device cushioned, be favorable to improving the device cleaning ability, convenient operation uses, be favorable to improving the work efficiency who washs the wafer and fall, be favorable to improving the abluent effect of wafer, thereby be favorable to improving the work efficiency of device, and then be favorable to improving the user experience degree of device.
Description
Technical Field
The utility model relates to a wafer equipment technical field especially relates to a belt cleaning device for wet process wafer.
Background
The wafer refers to a silicon wafer used for manufacturing a silicon semiconductor integrated circuit, and is called a wafer because the shape is circular; various circuit device structures can be fabricated on silicon wafers to produce IC products with specific electrical functions, and the wafers often need a cleaning device during use.
However, in the prior art, the existing wet wafer cleaning equipment generally performs plane cleaning during cleaning, and after one surface is cleaned, the other surface is cleaned in a turnover manner, so that the cleaning time is delayed, the operation is inconvenient, the work efficiency of cleaning the wafer is reduced, the wafer cleaning effect is affected, the work efficiency of the device is reduced, and the user experience of the device is further reduced.
SUMMERY OF THE UTILITY MODEL
The utility model aims at solving the general plane washing when wasing that exists among the prior art, the one side is washed and is washd the another side at the turn-over after having been up, hinders the inconvenient operation of cleaning time, leads to the work efficiency who washs the wafer to reduce, influences the abluent effect of wafer to the work efficiency of reduction device, and then the shortcoming of the user experience degree of having reduced the device.
In order to achieve the above purpose, the utility model adopts the following technical scheme: the utility model provides a belt cleaning device for wet process wafer, includes the workstation, install the shower nozzle on the workstation, the spout has been seted up on the workstation, be provided with the washing subassembly on the workstation, it includes the cleaning brush to wash the subassembly, one side that the workstation is close to the shower nozzle is installed first spring and telescopic link, the telescopic link is kept away from the one end of shower nozzle and is installed the mounting panel, set up the recess on the mounting panel, the cleaning brush is close to one side of recess and is installed the lug, the lug is installed in the recess, the header tank is installed to one side that the shower nozzle was kept away from to the workstation.
In a preferred embodiment, the end of the first spring remote from the spray head is mounted on the mounting plate, and the first spring is nested on the outer surface of the telescopic rod.
The technical effect of adopting the further scheme is as follows: first spring plays the effect that drives mounting panel elasticity and reset, is favorable to reciprocal washing, is favorable to improving the user experience degree of device.
In a preferred embodiment, a water guide groove is formed in one side of the workbench close to the cleaning brush.
The technical effect of adopting the further scheme is as follows: the water guiding groove is used for collecting cleaned water, so that the water guiding groove is convenient to recycle and is beneficial to improving the user experience degree of the device.
As a preferable embodiment, a through hole is formed in one side of the water guide groove close to the water collecting tank, and a filter plate is slidably mounted on the workbench at the position of the through hole.
The technical effect of adopting the further scheme is as follows: the filter plate plays a role in filtering impurities, and the filtering capacity of the device is improved.
In a preferred embodiment, a water pump is installed on the side of the workbench close to the water collecting tank, and a first water pipe and a second water pipe are installed on the water pump.
The technical effect of adopting the further scheme is as follows: the water collecting tank is used for collecting and storing used water, and is convenient to save and recycle.
As a preferred embodiment, the end of the first water pipe far away from the water pump is installed on the water collecting tank, and the end of the second water pipe far away from the water pump is installed on the workbench.
The technical effect of adopting the further scheme is as follows: the water pump is convenient for take out the water in the header tank and recycle, is favorable to improving the environmental protection ability of the device.
Compared with the prior art, the utility model has the advantages and positive effects that,
the utility model discloses, through starting the water pump, then place the wafer in the spout, make and slide in the spout, then through the shower nozzle water spray through the cleaning brush, then make first spring of cleaning brush extrusion and telescopic link, wafer striking blotter after the washing, extrude the fourth spring, extrude the buffer board simultaneously, make buffer board extrusion second spring and third spring, make the guide bar slide in the backup pad simultaneously, conveniently cushion the shock attenuation, be favorable to improving device buffering absorbing effect, be favorable to improving device cleaning ability, convenient operation is used, be favorable to improving the work efficiency who washs the wafer and fall, be favorable to improving the abluent effect of wafer, thereby be favorable to improving the work efficiency of device, and then be favorable to improving the user experience degree of device.
Drawings
Fig. 1 is an exploded schematic view of a cleaning apparatus for wet-process wafer according to the present invention;
fig. 2 is a schematic side view of a cleaning apparatus for wet-process wafer according to the present invention;
fig. 3 is an enlarged schematic structural diagram of a point a in fig. 1 of a cleaning apparatus for wet process wafers according to the present invention;
fig. 4 is an enlarged schematic structural diagram of a cleaning apparatus for wet-process wafers according to the present invention at B in fig. 1.
Illustration of the drawings:
1-a workbench; 2-a water chute; 3-a spray head; 4-cleaning the component; 41-a telescopic rod; 42-a first spring; 43-a mounting plate; 44-cleaning brushes; 45-bumps; 46-a groove; 5-a filter plate; 6, a water collecting tank; 7-a water pump; 8-a buffer component; 81-a support plate; 82-a second spring; 83-a guide bar; 84-a third spring; 85-a buffer plate; 86-a fourth spring; 87-a cushion; 9-a chute; 10-a first water pipe; 11-second water pipe.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts all belong to the protection scope of the present invention.
Example 1
As shown in fig. 1-3, the utility model provides a technical solution: a cleaning device for wet process wafers comprises a workbench 1, a spray head 3 is installed on the workbench 1, the workbench 1 is a table with a certain inclination angle, the wafers roll in a chute 9 under the action of gravity, the spray head 3 is used for spraying water to clean the wafers, the chute 9 is formed in the workbench 1, the chute 9 is a motion track for cleaning the wafers, the operation and the use are convenient, a cleaning component 4 is arranged on the workbench 1, the cleaning component 4 comprises a cleaning brush 44, a first spring 42 and a telescopic rod 41 are installed on one side of the workbench 1 close to the spray head 3, the telescopic rod 41 plays a role in stable guiding, the first spring 42 plays a role in driving a mounting plate 43 to extrude and reset, the cleaning capability of the device is improved, a mounting plate 43 is installed at one end of the telescopic rod 41 far away from the spray head 3, a groove 46 is formed in the mounting plate 43, and a bump 45 is installed on one side of the cleaning brush 44 close to the groove 46, the lug 45 is arranged in the groove 46, the cleaning brush 44 is convenient to replace and disassemble, the service life of the device is prolonged, the water collecting tank 6 is arranged on one side of the workbench 1 far away from the spray head 3, one end of the first spring 42 far away from the spray head 3 is arranged on the mounting plate 43, the first spring 42 is nested on the outer surface of the telescopic rod 41, the water guiding groove 2 is arranged on one side of the workbench 1 close to the cleaning brush 44 and used for collecting used water, the water circulation is facilitated, the through hole is arranged on one side of the water guiding groove 2 close to the water collecting tank 6, the filter plate 5 is arranged on the workbench 1 in a sliding mode on the through hole, the filter plate 5 plays a role of filtering impurities, the water pump 7 is arranged on one side of the workbench 1 close to the water collecting tank 6, the first water pipe 10 and the second water pipe 11 are arranged on the water pump 7, one end of the first water pipe 10 far away from the water pump 7 is arranged on the water collecting tank 6, one end of the second water pipe 11, which is far away from the water pump 7, is installed on the workbench 1, one end of the workbench 1, which is close to the water collecting tank 6, is provided with a buffer assembly 8, which is convenient for buffering and protecting the device, and is favorable for improving the safety of the device, when the device is used, the water pump 7 is firstly started, so that water in the water collecting tank 6 is sprayed out through the spray head 3, then the wafer is placed in the chute 9, so that the wafer slides in the chute 9 under the action of gravity, and then the water is sprayed out through the spray head 3, and then the cleaning brush 44 drives the bump 45 to be inserted into the groove 46, and then the cleaning brush 44 extrudes the first spring 42 and the telescopic rod 41, so that the first spring 42 and the telescopic rod 41 are contracted, so as to facilitate reciprocating cleaning, thereby being favorable for improving the cleaning capability of the device, being convenient for operation and use, and being favorable for improving the working efficiency of wafer cleaning, thereby being favorable for improving the working efficiency of the device, and further being favorable for improving the user experience degree of the device.
Example 2
As shown in fig. 1 to 4, the buffer assembly 8 includes a buffer plate 85, a support plate 81 is installed on a side of the workbench 1 close to the washing brush 44, a second spring 82 is installed on a side of the support plate 81 close to the spray head 3, the buffer plate 85 is installed on an end of the second spring 82 far from the support plate 81, a guide rod 83 is installed on an inner wall of the chute 9 in a sliding and penetrating manner, the guide rod 83 plays a role in stabilizing the guide and is beneficial to improving the safety and stability of the device, an end of the guide rod 83 far from the support plate 81 is installed on the buffer plate 85, a third spring 84 is installed on a side of the buffer plate 85 close to the guide rod 83, the second spring 82 and the third spring 84 both play a role in buffering and damping, the third spring 84 is nested on an outer surface of the guide rod 83, buffer board 85 is kept away from one side of second spring 82 and is installed fourth spring 86, buffer board 87 is installed to the one end that buffer board 85 was kept away from to fourth spring 86, buffer board 87 cooperates fourth spring 86 to have played preliminary buffering absorbing effect, wafer striking buffer board 87 after the washing, extrude fourth spring 86, make the shrink of fourth spring 86, extrude buffer board 85 simultaneously, make buffer board 85 extrude second spring 82 and third spring 84, make second spring 82 and the shrink of third spring 84, make guide bar 83 slide on backup pad 81 simultaneously, conveniently cushion the shock attenuation, be favorable to improving the absorbing effect of device buffering, convenient operation uses, be favorable to improving the protection safety nature of device, be favorable to improving the user experience degree of device.
The working principle is as follows:
as shown in fig. 1 to 4, when the device is used, the water pump 7 is firstly started to spray water from the water collecting tank 6 through the spray head 3, then the wafer is placed in the chute 9, the wafer slides in the chute 9 under the action of gravity, then the water is sprayed through the spray head 3, the cleaning brush 44 drives the bump 45 to be inserted into the groove 46 through the cleaning brush 44, then the cleaning brush 44 extrudes the first spring 42 and the telescopic rod 41 to shrink the first spring 42 and the telescopic rod 41, the cleaned wafer impacts the cushion pad 87 to extrude the fourth spring 86 to shrink the fourth spring 86, and simultaneously extrude the cushion plate 85 to extrude the cushion plate 85, so that the cushion plate 85 extrudes the second spring 82 and the third spring 84 to shrink the second spring 82 and the third spring 84, and simultaneously the guide rod 83 slides on the support plate 81, thereby facilitating the buffering and the shock absorption and being beneficial to improving the effect of the buffering and shock absorption of the device.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the present invention in other forms, and any person skilled in the art may apply the equivalent embodiments modified or modified by the above technical contents disclosed as equivalent variations to other fields, but any simple modifications, equivalent changes and modifications made to the above embodiments according to the technical spirit of the present invention will still fall within the protection scope of the technical solution of the present invention.
Claims (6)
1. A cleaning device for wet-process wafers comprises a workbench (1), and is characterized in that: install shower nozzle (3) on workstation (1), spout (9) have been seted up on workstation (1), be provided with on workstation (1) and wash subassembly (4), it includes cleaning brush (44) to wash subassembly (4), first spring (42) and telescopic link (41) are installed to one side that workstation (1) is close to shower nozzle (3), mounting panel (43) are installed to the one end that shower nozzle (3) were kept away from in telescopic link (41), recess (46) have been seted up on mounting panel (43), lug (45) are installed to one side that cleaning brush (44) are close to recess (46), lug (45) are installed in recess (46), one side that shower nozzle (3) were kept away from in workstation (1) is installed header tank (6).
2. A cleaning apparatus for wet processing wafers as claimed in claim 1, wherein: one end of the first spring (42) far away from the spray head (3) is arranged on the mounting plate (43), and the first spring (42) is nested on the outer surface of the telescopic rod (41).
3. A cleaning apparatus for wet processing wafers as claimed in claim 1, wherein: one side of the workbench (1) close to the cleaning brush (44) is provided with a water chute (2).
4. A cleaning apparatus for wet processing wafers according to claim 3, wherein: a through hole is formed in one side, close to the water collecting tank (6), of the water guide groove (2), and a filter plate (5) is installed on the position, on the through hole, of the workbench (1) in a sliding mode.
5. A cleaning device for wet wafers according to claim 4, characterized in that: the water pump (7) is installed in one side that workstation (1) is close to header tank (6), install first water pipe (10) and second water pipe (11) on water pump (7).
6. A cleaning apparatus for wet processing wafers according to claim 5, wherein: one end of the first water pipe (10) far away from the water pump (7) is installed on the water collecting tank (6), and one end of the second water pipe (11) far away from the water pump (7) is installed on the workbench (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220913153.5U CN217788339U (en) | 2022-04-20 | 2022-04-20 | Cleaning device for wet-process wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220913153.5U CN217788339U (en) | 2022-04-20 | 2022-04-20 | Cleaning device for wet-process wafer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217788339U true CN217788339U (en) | 2022-11-11 |
Family
ID=83908754
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202220913153.5U Active CN217788339U (en) | 2022-04-20 | 2022-04-20 | Cleaning device for wet-process wafer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217788339U (en) |
-
2022
- 2022-04-20 CN CN202220913153.5U patent/CN217788339U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN215239908U (en) | Automobile parts's grinding device | |
| CN217788339U (en) | Cleaning device for wet-process wafer | |
| CN208912592U (en) | A kind of mobile phone screen swab | |
| CN206565514U (en) | Multifunctional cleaning hairbrush | |
| CN218194442U (en) | Artificial joint spherical surface polishing equipment with self-cleaning function | |
| CN217194365U (en) | Semiconductor silicon wafer grinding device | |
| CN216989508U (en) | Stamping die convenient to wash mold core | |
| CN105499176A (en) | Handheld vehicle cleaning equipment | |
| CN108511329A (en) | A kind of device for cleaning chip | |
| CN209174555U (en) | Cleaning device is used in a kind of processing of Schottky chip | |
| CN209810723U (en) | Use belt cleaning device behind glass edging | |
| CN210159385U (en) | Dust collector of coal unloader | |
| CN208637382U (en) | A kind of device for cleaning chip | |
| CN218651605U (en) | Telescopic glass brush | |
| CN207608024U (en) | A kind of feeding platform with long service life | |
| CN221288820U (en) | Semiconductor cleaning device | |
| CN216397440U (en) | Plug cleaning device with rotary scraping assembly for ginger seedling detoxification | |
| CN216291645U (en) | Surface dirt cleaning device is used in production of harmless formula integrated circuit board | |
| CN211359818U (en) | Chip washing unit | |
| CN110037636A (en) | Screw cup cleaning device | |
| CN217659650U (en) | Anti-collision device of floor washing machine | |
| CN220507829U (en) | Flushing device of plate-type preheater | |
| CN216728469U (en) | Washing device for silicon-manganese alloy processing production | |
| CN220902935U (en) | Silicon wafer grinding device | |
| CN212020142U (en) | Chip washing device of machining center |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20230717 Address after: No. 21, Nanhai Road, Yi'an District, Tongling City, Anhui Province 244151 Patentee after: Anhui fulede Changjiang semiconductor material Co.,Ltd. Address before: 201900 No. 181, Shanlian Road, Baoshan City Industrial Park, Baoshan District, Shanghai Patentee before: Shanghai Shenhe Investment Co.,Ltd. |