CN217777411U - Power transmission mechanism for quartz wafer processing - Google Patents
Power transmission mechanism for quartz wafer processing Download PDFInfo
- Publication number
- CN217777411U CN217777411U CN202221477208.9U CN202221477208U CN217777411U CN 217777411 U CN217777411 U CN 217777411U CN 202221477208 U CN202221477208 U CN 202221477208U CN 217777411 U CN217777411 U CN 217777411U
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- Prior art keywords
- wall
- shaft
- plate
- sleeved
- top end
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- 230000005540 biological transmission Effects 0.000 title claims abstract description 59
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 title claims abstract description 38
- 239000010453 quartz Substances 0.000 title claims abstract description 34
- 230000007246 mechanism Effects 0.000 title claims abstract description 14
- 238000005498 polishing Methods 0.000 claims abstract description 17
- 235000012431 wafers Nutrition 0.000 claims description 28
- 230000000670 limiting effect Effects 0.000 claims description 14
- 239000013078 crystal Substances 0.000 claims description 8
- 238000013016 damping Methods 0.000 claims description 6
- 230000009467 reduction Effects 0.000 abstract description 3
- 238000005516 engineering process Methods 0.000 abstract description 2
- 230000000694 effects Effects 0.000 abstract 1
- 230000001360 synchronised effect Effects 0.000 abstract 1
- 235000012239 silicon dioxide Nutrition 0.000 description 22
- 238000000034 method Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 2
- 230000003139 buffering effect Effects 0.000 description 2
- 244000309464 bull Species 0.000 description 2
- 229910052500 inorganic mineral Inorganic materials 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 239000011707 mineral Substances 0.000 description 2
- 230000035939 shock Effects 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 229910052592 oxide mineral Inorganic materials 0.000 description 1
- 229910052646 quartz group Inorganic materials 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 241000894007 species Species 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
Abstract
The utility model discloses a power transmission mechanism is used in quartz wafer processing relates to quartz wafer processing technology field, including processing platform 1, curb plate 2, spacing axle 3, mobile unit 4 and the drive unit 5 that has the quartz wafer holder. The utility model discloses a set up mobile unit 4 and drive unit 5, when realizing starting that biax motor 404 drives the disc 405 pivoted of polishing, biax motor 404 drives transmission shaft 501 and rotates, transmission shaft 501 drives pinion 502, gear wheel 503 rotates, thereby it rotates to drive axis of rotation 504, transmission cover 505 drives driving pulley 506 and rotates, the connection transmission effect through belt 508, when making synchronous rotation of driven pulley 507, drive reciprocal lead screw 401 and rotate, move down speed reduction and fixed back when mounting bracket 403, the polishing is ground to the quartz wafer that is fixed in the grip slipper top to the disc 405 of polishing.
Description
Technical Field
The utility model relates to a quartz wafer processing technology field specifically is a power transmission mechanism is used in quartz wafer processing.
Background
The main component of the quartz wafer is silicon dioxide, which is called a wafer as glass because of the ordered arrangement of silicon dioxide, thereby forming crystals, the material has directionality and stable properties, the most important applications are crystal oscillator and optical infrared window, the crystals belong to trigonal oxide mineral, namely low-temperature quartz (a-quartz), which is one of the most widely distributed mineral species in quartz group minerals, and the cutting and grinding of the silicon crystal bar generally adopt a wire cutting machine to cut crystal blocks and a plane grinder to grind the cut crystal blocks.
In the process of processing the quartz wafer, the grinding process is very important, the existing grinding process is usually that an operator manually adjusts a grinding disc to move downwards to be in contact with the quartz wafer, the operation is complex, the working strength is high, and the grinding quality of the quartz wafer is not high.
SUMMERY OF THE UTILITY MODEL
The utility model aims to provide a: in order to solve the problems of complex polishing operation and high working strength of the quartz wafer, the power transmission mechanism for processing the quartz wafer is provided.
In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a power transmission mechanism is used in quartz wafer processing, is including processing platform, curb plate, the spacing axle that has the quartz wafer holder, the curb plate is located the top of processing platform, spacing axle fixed weld in the top of processing platform, and be located one side of curb plate, the top of processing platform is located one side of curb plate still is provided with the mobile unit, the mobile unit includes reciprocal lead screw, movable plate, mounting bracket, double-shaft motor and the polishing dish, reciprocal lead screw rotate install in the top of processing platform, the movable plate cup joint in the outer wall of reciprocal lead screw, mounting bracket slidable mounting in the inside of movable plate, double-shaft motor fixed mounting in the inside top of mounting bracket, the polishing dish install in through the pivot in double-shaft motor's bottom, double-shaft motor's top still is provided with the drive unit, the bottom of mounting bracket is located outer wall one side of curb plate is provided with the buffer unit.
As the utility model discloses further scheme again: the transmission unit includes transmission shaft, pinion, gear wheel, axis of rotation, transmission cover, driving pulley, driven pulleys and belt, the transmission shaft is located the top of biax motor, pinion welded fastening in the top of transmission shaft, the gear wheel is located outer wall one side of pinion, the axis of rotation is located the inside of gear wheel, the transmission cover cup joint in the outer wall of axis of rotation, driving pulley cup joints and is fixed in the outer wall of transmission cover, driven pulleys cup joints and is fixed in the outer wall of reciprocal lead screw, the belt cup joint in driving pulley with driven pulleys's outer wall.
As a further aspect of the present invention: the buffer unit comprises a damping block, two fixing seats, two moving shafts, a connecting plate and a buffer spring, wherein the damping block is arranged at the bottom end of the mounting frame, the two fixing seats are arranged on one side of the outer wall of the side plate, the moving shafts are slidably arranged inside the fixing seats, the connecting plate is arranged at the top end of the moving shafts, and the buffer spring is sleeved on the outer wall of the moving shafts.
As the utility model discloses further scheme again: the movable plate is provided with a guide block matched with the outer wall of the reciprocating screw rod at the joint of the movable plate and the reciprocating screw rod, the movable plate is further sleeved on the outer wall of the limiting shaft in a sliding mode, and the top end of the limiting shaft is provided with a fixing block fixedly connected with the side plate.
As the utility model discloses further scheme again: the outer wall of reciprocal lead screw is located the below cover of driven pulleys has connect first rotation seat, the outer wall of transmission cover is located the below cover of driving pulley has connected the second and has rotated the seat, the inner wall one end of mounting bracket is provided with the fixed plate.
As a further aspect of the present invention: the top of movable plate is located the both ends symmetry of mounting bracket is provided with the guiding axle, the guiding axle runs through the mounting bracket, the outer wall of guiding axle has cup jointed connecting spring.
As the utility model discloses further scheme again: the inside of movable plate is provided with T type groove, the outer wall of mounting bracket with the inner wall phase-match in T type groove.
Compared with the prior art, the beneficial effects of the utility model are that:
1. through the arrangement of the moving unit and the transmission unit, when the double-shaft motor is started to drive the polishing disc to rotate, the double-shaft motor drives the transmission shaft to rotate, the transmission shaft drives the pinion to rotate and simultaneously drives the gearwheel to rotate, so that the rotation shaft is driven to rotate, the transmission sleeve drives the driving belt wheel to rotate, the driven belt wheel synchronously rotates and simultaneously drives the reciprocating screw rod to rotate through the connection transmission action of the belt, the movable plate reciprocates along the outer wall of the reciprocating screw rod while rotating, the movable plate drives the mounting frame to reciprocate up and down, and when the mounting frame moves down, decelerates and is fixed, the polishing disc polishes and polishes the quartz wafers fixed to the top end of the clamping seat;
2. through setting up the buffer unit, when realizing that the movable plate drives the mounting bracket and moves down, after the bottom of snubber block contacted with the top of connecting plate, when the snubber block pressed the connecting plate downstream downwards, the connecting plate promoted to move the axle and moved down to make the buffer spring atress shrink, move down the mounting bracket and carry out spacing fixed after carrying out the speed reduction buffering and to the mounting bracket, at this moment, the bottom of the polishing dish contacted with quartz wafer's top, made the polishing dish polish to quartz wafer.
Drawings
Fig. 1 is a schematic structural view of the present invention;
fig. 2 is an enlarged schematic view of the utility model at a in fig. 1;
fig. 3 is an enlarged schematic view of the utility model at the point B in fig. 1;
fig. 4 is an enlarged schematic view of the present invention at C in fig. 1;
fig. 5 is a schematic view of the moving plate structure of the present invention.
In the figure: 1. a processing table; 2. a side plate; 3. a limiting shaft; 4. a mobile unit; 401. a reciprocating screw rod; 402. moving the plate; 403. a mounting frame; 404. a double-shaft motor; 405. grinding disc; 5. a transmission unit; 501. a drive shaft; 502. a pinion gear; 503. a bull gear; 504. a rotating shaft; 505. a transmission sleeve; 506. a driving pulley; 507. a driven pulley; 508. a belt; 6. a buffer unit; 601. a damper block; 602. a fixed seat; 603. a movable shaft; 604. a connecting plate; 605. a buffer spring; 7. a guide shaft; 8. a connecting spring; 9. a fixing plate; 10. a first rotating base; 11. a second rotating base; 12. t-shaped groove.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts all belong to the protection scope of the present invention.
Please refer to fig. 1-5, in the embodiment of the utility model, a power transmission mechanism is used in quartz wafer processing, including the processing platform 1 that has the quartz wafer grip slipper, curb plate 2, spacing axle 3, the top of processing platform 1 is located to curb plate 2, spacing axle 3 fixed welding is in the top of processing platform 1, and be located one side of curb plate 2, one side that the top of processing platform 1 is located curb plate 2 still is provided with mobile unit 4, mobile unit 4 includes reciprocating screw rod 401, movable plate 402, mounting bracket 403, biaxial motor 404 and polishing disc 405, reciprocating screw rod 401 rotates and installs in the top of processing platform 1, movable plate 402 cup joints in reciprocating screw rod 401's outer wall, mounting bracket slidable mounting is in the inside of movable plate 402, biaxial motor 404 fixed mounting is on the inside top of mounting bracket 403, polishing disc 405 installs in biaxial motor 404's bottom through the pivot, the top of biaxial motor 404 still is provided with drive unit 5, the bottom of mounting bracket 403 is located outer wall one side of curb plate 2 and is provided with buffer unit 6.
In this embodiment: when starting double-shaft motor 404 and driving the disc 405 of polishing pivoted, limiting displacement and the transmission linkage of drive unit 5 through spacing axle 3, make reciprocal lead screw 401 pivoted in the time, movable plate 402 is along reciprocal lead screw 401's outer wall reciprocating motion, movable plate 402 drives the reciprocal reciprocating up-and-down motion of mounting bracket 403, through setting up buffer unit 6, when making mounting bracket 403 move down the assigned position, move down the speed reduction and fix mounting bracket 403, make the disc 405 of polishing polish to the quartz wafer that is fixed in the grip slipper top.
Please refer to fig. 1, fig. 2 and fig. 3, the transmission unit 5 includes a transmission shaft 501, a pinion 502, a gearwheel 503, a rotation shaft 504, a transmission sleeve 505, a driving pulley 506, a driven pulley 507 and a belt 508, the transmission shaft 501 is disposed on the top end of the dual-shaft motor 404, the pinion 502 is welded and fixed on the top end of the transmission shaft 501, the gearwheel 503 is disposed on one side of the outer wall of the pinion 502, the rotation shaft 504 is disposed inside the gearwheel 503, the transmission sleeve 505 is sleeved on the outer wall of the rotation shaft 504, the driving pulley 506 is sleeved and fixed on the outer wall of the transmission sleeve 505, the driven pulley 507 is sleeved and fixed on the outer wall of the reciprocating screw 401, and the belt 508 is sleeved and fixed on the outer walls of the driving pulley 506 and the driven pulley 507.
In this embodiment: the transmission shaft 501 is driven to rotate by the double-shaft motor 404, the transmission shaft 501 drives the pinion 502 to rotate and simultaneously drives the bull gear 503 to rotate, the transmission sleeve 505 drives the driving belt wheel 506 to rotate while driving the rotation of the rotation shaft 504, the driven belt wheel 507 synchronously rotates and simultaneously drives the reciprocating screw rod 401 to rotate through the transmission function of the reciprocating screw rod 401, the movable plate 402 drives the mounting frame 403 to move downwards while the rotation shaft 504 drives the transmission sleeve 505 to rotate, and the rotation shaft 504 moves downwards along the inner wall of the transmission sleeve 505.
Please refer to fig. 1 and 4, the buffer unit 6 includes a damping block 601, two fixing bases 602, two moving shafts 603, a connecting plate 604 and a buffer spring 605, the damping block 601 is disposed at the bottom end of the mounting frame 403, the two fixing bases 602 are disposed at one side of the outer wall of the side plate 2, the moving shafts 603 are slidably mounted inside the fixing bases 602, the connecting plate 604 is disposed at the top end of the moving shafts 603, and the buffer spring 605 is sleeved on the outer wall of the moving shafts 603.
In this embodiment: when the moving plate 402 drives the mounting frame 403 to move downwards, after the bottom end of the shock absorption block 601 is contacted with the top end of the connecting plate 604, the shock absorption block 601 presses the connecting plate 604 downwards to move downwards, the connecting plate 604 pushes the moving shaft 603 to move downwards, the buffer spring 605 is forced to contract, the mounting frame 403 moves downwards to perform deceleration buffering and limit fixing on the mounting frame 403, at the moment, the bottom end of the polishing disc 405 is contacted with the top end of a quartz wafer, the polishing disc 405 polishes the quartz wafer, the reciprocating screw rod 401 drives the moving plate 402 to move downwards along the outer wall of the reciprocating screw rod 401, the moving plate 402 moves along the outer wall of the mounting frame 403, after being polished for a period of time, the moving plate 402 moves to the bottom end of the thread groove of the reciprocating screw rod 401, and the guide block drives the moving plate 402 to move upwards along the outer wall of the reciprocating screw rod 401 to reset.
Please refer to fig. 1, a guide block matched with the outer wall of the reciprocating screw 401 is disposed at the joint of the moving plate 402 and the reciprocating screw 401, the moving plate 402 is further slidably sleeved on the outer wall of the limiting shaft 3, and the top end of the limiting shaft 3 is provided with a fixing block fixedly connected with the side plate 2.
In this embodiment: a guide block matched with the outer wall of the reciprocating screw rod 401 is arranged at the joint of the moving plate 402 and the reciprocating screw rod 401, the moving plate 402 is further sleeved on the outer wall of the limiting shaft 3 in a sliding mode, a fixing block fixedly connected with the side plate 2 is arranged at the top end of the limiting shaft 3, and when the reciprocating screw rod 401 rotates, the moving plate 402 reciprocates up and down along the outer wall of the reciprocating screw rod 401 under the limiting effect of the limiting shaft 3.
Please refer to fig. 1 and fig. 2, the first rotating base 10 is sleeved on the outer wall of the reciprocating screw 401 below the driven pulley 507, the second rotating base 11 is sleeved on the outer wall of the transmission sleeve 505 below the driving pulley 506, and the fixing plate 9 is disposed at one end of the inner wall of the mounting frame 403.
In this embodiment: through first rotation seat 10 and curb plate 2 fixed connection, and reciprocal lead screw 401 passes through the bearing with first rotation seat 10 and is connected, realize supporting the installation of the spacing rotation of reciprocal lead screw 401, it is fixed with curb plate 2 to rotate seat 11 through the second, driving sleeve 505 rotates seat 11 with the second and has used the bearing to be connected, realize that the spacing rotation of driving sleeve 505 is installed in one side of curb plate 2, through setting up fixed plate 9, and transmission shaft 501 and axis of rotation 504 pass through the bearing with fixed plate 9 and be connected, realize supporting the installation of the spacing rotation of axis of rotation 504, outer wall through axis of rotation 504 is provided with the turning block, and the inner wall of driving sleeve 505 and the outer wall phase-match of axis of rotation 504 and turning block, when realizing that axis of rotation 504 drives transmission sleeve 505 pivoted, axis of rotation 504 reciprocates along the inner wall of driving sleeve 505.
Please refer to fig. 1, fig. 2 and fig. 3, the guide shafts 7 are symmetrically disposed at two ends of the top end of the moving plate 402, which are located at the mounting frame 403, the guide shafts 7 penetrate the mounting frame 403, the outer wall of the guide shafts 7 is sleeved with the connecting springs 8, the moving plate 402 is internally provided with the T-shaped groove 12, and the outer wall of the mounting frame 403 is matched with the inner wall of the T-shaped groove 12.
In this embodiment: through setting up guiding axle 7 and coupling spring 8, the inside of movable plate 402 is provided with T type groove 12, and the outer wall of mounting bracket 403 and the inner wall phase-match of T type groove 12 make mounting bracket 403 downstream and fixed back, and when movable plate 402 moved down along the outer wall of mounting bracket 403, guiding axle 7 was along the spacing removal of mounting bracket 403.
The above-mentioned, only be the embodiment of the preferred of the present invention, nevertheless the utility model discloses a protection scope is not limited to this, and any technical personnel familiar with this technical field is in the technical scope of the utility model discloses an according to the utility model discloses a technical scheme and utility model design in addition the replacement of equality or change, all should be covered within the protection scope of the utility model.
Claims (7)
1. A power transmission mechanism for processing quartz crystal wafers is provided with a processing table (1) of a quartz crystal wafer clamping seat, a side plate (2) and a limiting shaft (3), characterized in that the side plate (2) is arranged at the top end of the processing table (1), the limiting shaft (3) is fixedly welded at the top end of the processing table (1), and is positioned at one side of the side plate (2), a moving unit (4) is also arranged at one side of the top end of the processing platform (1) positioned at the side of the side plate (2), the moving unit (4) comprises a reciprocating screw rod (401), a moving plate (402), a mounting frame (403), a double-shaft motor (404) and a polishing disc (405), the reciprocating screw rod (401) is rotatably arranged at the top end of the processing table (1), the moving plate (402) is sleeved on the outer wall of the reciprocating screw rod (401), the mounting rack (403) is slidably mounted inside the moving plate (402), the double-shaft motor (404) is fixedly arranged at the top end of the inner part of the mounting frame (403), the grinding disc (405) is arranged at the bottom end of the double-shaft motor (404) through a rotating shaft, the top end of the double-shaft motor (404) is also provided with a transmission unit (5), the bottom end of the mounting rack (403) is located on one side of the outer wall of the side plate (2) and is provided with a buffer unit (6).
2. The power transmission mechanism for quartz wafer processing according to claim 1, wherein the transmission unit (5) comprises a transmission shaft (501), a pinion (502), a gearwheel (503), a rotation shaft (504), a transmission sleeve (505), a driving pulley (506), a driven pulley (507) and a belt (508), the transmission shaft (501) is arranged at the top end of the biaxial motor (404), the pinion (502) is welded and fixed at the top end of the transmission shaft (501), the gearwheel (503) is arranged at one side of the outer wall of the pinion (502), the rotation shaft (504) is arranged inside the gearwheel (503), the transmission sleeve (505) is sleeved and connected on the outer wall of the rotation shaft (504), the driving pulley (506) is sleeved and fixed on the outer wall of the transmission sleeve (505), the driven pulley (507) is sleeved and fixed on the outer wall of the reciprocating lead screw (401), and the belt (508) is sleeved and connected on the outer walls of the driving pulley (506) and the driven pulley (507).
3. The power transmission mechanism for processing the quartz wafer as claimed in claim 1, wherein the buffer unit (6) comprises a damping block (601), two fixed seats (602), two moving shafts (603), a connecting plate (604) and two buffer springs (605), the damping block (601) is arranged at the bottom end of the mounting frame (403), the two fixed seats (602) are arranged at one side of the outer wall of the side plate (2), the moving shafts (603) are slidably mounted inside the fixed seats (602), the connecting plate (604) is arranged at the top end of the moving shafts (603), and the buffer springs (605) are sleeved on the outer wall of the moving shafts (603).
4. The power transmission mechanism for processing the quartz wafer as claimed in claim 1, wherein a guide block matched with the outer wall of the reciprocating screw rod (401) is arranged at the joint of the moving plate (402) and the reciprocating screw rod (401), the moving plate (402) is further sleeved on the outer wall of the limiting shaft (3) in a sliding manner, and a fixing block fixedly connected with the side plate (2) is arranged at the top end of the limiting shaft (3).
5. The power transmission mechanism for quartz wafer processing as claimed in claim 2, wherein the outer wall of the reciprocating screw rod (401) is sleeved with a first rotating seat (10) below the driven pulley (507), the outer wall of the transmission sleeve (505) is sleeved with a second rotating seat (11) below the driving pulley (506), and one end of the inner wall of the mounting frame (403) is provided with a fixing plate (9).
6. The power transmission mechanism for processing the quartz wafer as claimed in claim 1, wherein the top end of the moving plate (402) is symmetrically provided with guide shafts (7) at two ends of the mounting frame (403), the guide shafts (7) penetrate through the mounting frame (403), and the outer wall of the guide shafts (7) is sleeved with a connecting spring (8).
7. The power transmission mechanism for quartz wafer processing as claimed in claim 1, wherein the moving plate (402) is provided with a T-shaped groove (12) inside, and the outer wall of the mounting frame (403) is matched with the inner wall of the T-shaped groove (12).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221477208.9U CN217777411U (en) | 2022-06-14 | 2022-06-14 | Power transmission mechanism for quartz wafer processing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221477208.9U CN217777411U (en) | 2022-06-14 | 2022-06-14 | Power transmission mechanism for quartz wafer processing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217777411U true CN217777411U (en) | 2022-11-11 |
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ID=83934911
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202221477208.9U Expired - Fee Related CN217777411U (en) | 2022-06-14 | 2022-06-14 | Power transmission mechanism for quartz wafer processing |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217777411U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115910903A (en) * | 2023-02-06 | 2023-04-04 | 天津视骏科技有限公司 | Quartz wafer nozzle suction device |
-
2022
- 2022-06-14 CN CN202221477208.9U patent/CN217777411U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115910903A (en) * | 2023-02-06 | 2023-04-04 | 天津视骏科技有限公司 | Quartz wafer nozzle suction device |
| CN115910903B (en) * | 2023-02-06 | 2023-06-16 | 天津视骏科技有限公司 | Quartz wafer mouth suction device |
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20221111 |