CN217771484U - Heating element and aerosol generating device - Google Patents
Heating element and aerosol generating device Download PDFInfo
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- CN217771484U CN217771484U CN202123344167.4U CN202123344167U CN217771484U CN 217771484 U CN217771484 U CN 217771484U CN 202123344167 U CN202123344167 U CN 202123344167U CN 217771484 U CN217771484 U CN 217771484U
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- 238000010438 heat treatment Methods 0.000 title claims abstract description 128
- 239000000443 aerosol Substances 0.000 title abstract description 15
- 239000000758 substrate Substances 0.000 claims description 59
- 230000001681 protective effect Effects 0.000 claims description 25
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 18
- 238000003780 insertion Methods 0.000 claims description 17
- 230000037431 insertion Effects 0.000 claims description 17
- 239000011521 glass Substances 0.000 claims description 16
- 229910052751 metal Inorganic materials 0.000 claims description 11
- 239000002184 metal Substances 0.000 claims description 11
- 239000000919 ceramic Substances 0.000 claims description 9
- 229910052759 nickel Inorganic materials 0.000 claims description 7
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 4
- 229910001069 Ti alloy Inorganic materials 0.000 claims description 4
- 229910052709 silver Inorganic materials 0.000 claims description 4
- 239000004332 silver Substances 0.000 claims description 4
- 229910001316 Ag alloy Inorganic materials 0.000 claims description 3
- 229910000990 Ni alloy Inorganic materials 0.000 claims description 3
- 229910001260 Pt alloy Inorganic materials 0.000 claims description 3
- 238000000034 method Methods 0.000 abstract description 12
- 238000009529 body temperature measurement Methods 0.000 abstract description 4
- 208000021760 high fever Diseases 0.000 abstract description 2
- 239000010410 layer Substances 0.000 description 24
- 238000012360 testing method Methods 0.000 description 11
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 5
- 238000004140 cleaning Methods 0.000 description 5
- 239000002131 composite material Substances 0.000 description 5
- 238000001035 drying Methods 0.000 description 5
- 239000011159 matrix material Substances 0.000 description 5
- 238000005240 physical vapour deposition Methods 0.000 description 5
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 239000010935 stainless steel Substances 0.000 description 4
- 229910001220 stainless steel Inorganic materials 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- -1 iron-chromium-aluminum Chemical compound 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 239000010936 titanium Substances 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000003571 electronic cigarette Substances 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Substances [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 239000002033 PVDF binder Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000002485 combustion reaction Methods 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 239000008358 core component Substances 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 238000005566 electron beam evaporation Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000011068 loading method Methods 0.000 description 1
- 238000001755 magnetron sputter deposition Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 229910000623 nickel–chromium alloy Inorganic materials 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 229920002981 polyvinylidene fluoride Polymers 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 239000000779 smoke Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
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Abstract
The application provides a heat-generating body and aerosol generating device, the heat-generating body includes: the electrode comprises a base body, a first electrode and a second electrode, wherein the base body comprises a main body part and two connecting parts; the conductive heating film is at least uniformly covered and formed on the upper surface and/or the lower surface of the base body, and the thickness of the conductive heating film is 0.5-20 mu m. The application provides a heat-generating body, through the base member surface at the heat-generating body form the electrically conductive heating film, do not have the orbit of generating heat, generate heat evenly, can not produce local high fever. And the conductive heating film can realize heating and temperature control sharing, the temperature of the heating body can be converted according to the resistance change after the power-on temperature changes to realize temperature measurement, the temperature control is accurate and timely, the process is simple, and the user experience is improved.
Description
Technical Field
The application relates to the technical field of electronic cigarettes, in particular to a heating body and an aerosol generating device.
Background
At present, with the rapid development of a heating non-combustible aerosol generating device, a heating body of the aerosol generating device becomes a core component, and the overall design and performance quality level of the aerosol generating device are determined. The heating element for the existing non-combustion heating type electronic cigarette usually separately prints a heating circuit and a temperature measuring circuit, namely, the heating circuit is prepared on one surface of a base body, the temperature measuring circuit is prepared on the other surface of the base body, and a certain distance exists between a temperature measuring part and the heating part, so that the temperature control accuracy is not high, and the preparation process is complex. Meanwhile, the heating circuit for heating has poor temperature field uniformity, which affects the user experience.
SUMMERY OF THE UTILITY MODEL
The application provides a heat-generating body and aerosol generate device through at the surperficial electrically conductive heating film that forms of base member, can improve the homogeneity that generates heat of heat-generating body, promotes user experience.
In a first aspect, the present application provides a heat-generating body, the heat-generating body including:
the electrode lead comprises a base body, a plurality of lead wires and a plurality of lead wires, wherein the base body comprises a main body part and two connecting parts;
the conductive heating film is at least uniformly covered on the upper surface and/or the lower surface of the base body, and the thickness of the conductive heating film is 0.5-20 mu m.
In a possible embodiment, the conductive heat generating film is formed on the entire surface of the base body.
In a possible embodiment, the heating element further includes a protective film, the protective film covers the conductive heating film on the surface of the main body, and the protective film does not cover the conductive heating films on the surfaces of the two connecting portions.
In a possible embodiment, the base is an electrically conductive base, and the heat generating body further includes an insulating film formed on a surface of the electrically conductive base, and the electrically conductive heat generating film is formed on at least a part of a surface of the insulating film.
In a possible embodiment, the conductive heating film is one of a nickel film, a nickel alloy film, a platinum alloy film, a titanium alloy film, a silver film, and a silver alloy film.
In a feasible embodiment, the substrate is a conductive substrate, and the temperature coefficient of resistance of the conductive heating film is more than or equal to 1000 ppm/DEG C.
In a possible embodiment, the substrate is one of a metal substrate, a ceramic substrate, and a high temperature resistant glass substrate.
In a possible embodiment, the base body is provided with a through groove along the longitudinal direction, and the two connecting parts are arranged on two sides of the through groove.
In a possible embodiment, the body portion is integrally formed with the two connecting portions, the body portion having an insertion end for insertion into an aerosol-forming substrate of an aerosol-generating device.
In a second aspect, the present application provides an aerosol-generating device comprising a heat-generating body according to the first aspect described above.
The technical scheme provided by the application has the following beneficial effects at least:
the application provides a heat-generating body and aerosol generate device, through the base member surface at the heat-generating body form the electrically conductive heating film, do not have the orbit of generating heat, generate heat evenly, can not produce local high fever. And the conductive heating film can realize heating and temperature control sharing, the temperature of the heating body can be converted according to the resistance change after the power-on temperature changes to realize temperature measurement, the temperature control is accurate and timely, the process is simple, and the user experience is improved.
[ description of the drawings ]
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to these drawings without inventive labor.
FIG. 1 is a schematic view of an overall structure of a heat-generating body provided in an embodiment of the present application;
FIG. 2 is a bottom view of a heat-generating body provided in an embodiment of the present application;
FIG. 3 is a front view of the entire structure of a heat-generating body provided in the embodiment of the present application;
FIG. 4 is a schematic view of an entire structure of a heat-generating body of another structure provided in an embodiment of this application;
FIG. 5 is a temperature-rise rate graph of the average temperature on the surface of a heating element provided in example 2 of the present application;
FIG. 6 is a graph showing a comparison of the rate of temperature rise of the average surface temperature of the heat-generating body provided in example 2 of the present application and that of the heat-generating body of comparative example 1.
The attached drawings are as follows:
1-a heating element;
10-a substrate;
11-a body; 111-through slots; 112-an insertion end;
12-a connecting part;
20-a conductive heating film;
30-protective film.
Detailed Description
In order to make the objects, technical solutions and advantages of the present application more apparent, the present application is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.
In the description of the present specification, unless explicitly stated or limited otherwise, the terms "first", "second", and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance; the term "plurality" means two or more unless specified or indicated otherwise; the terms "connected," "fixed," and the like are to be construed broadly and may, for example, be fixed or removable, integral or electrical; may be directly connected or indirectly connected through an intermediate.
The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.
In the description of the present application, it should be understood that the terms "upper" and "lower" used in the description of the embodiments of the present application are used in a descriptive sense only and not for purposes of limitation. In addition, in this context, it will also be understood that when an element is referred to as being "on" or "under" another element, it can be directly on "or" under "the other element or be indirectly on" or "under" the other element through intervening elements.
In a first aspect, the present application provides a heat-generating body, including: the base body comprises a main body part and two connecting parts, and the two connecting parts are used for connecting electrode leads; the conductive heating film at least uniformly covers the upper surface and/or the lower surface of the base body, and the thickness of the conductive heating film is 0.5-20 mu m.
In the scheme, the conductive heating film is formed on the surface of the substrate of the heating body, so that heating tracks do not exist, heating is uniform, and local high heat cannot be generated. And the conductive heating film can realize heating and temperature control sharing, the temperature of the heating body can be converted according to the resistance change after the power-on temperature changes to realize temperature measurement, the temperature control is accurate and timely, the process is simple, and the user experience is improved.
Fig. 1 is a schematic view showing an overall structure of a heat-generating body according to an embodiment of the present application, and fig. 2 is a bottom view of the heat-generating body according to the embodiment of the present application, and as shown in fig. 1 and fig. 2, the heat-generating body includes a base, a conductive heat-generating film, and a protective film.
Specifically, the base body 10 constitutes a carrier of the heat generating body 1 for loading the conductive heat generating film 20. The substrate 10 is arrow-shaped and is conveniently butted with an aerosol generating device.
The substrate 10 may be divided into a conductive substrate and a non-conductive substrate according to the conductive properties. The conductive substrate comprises a metal substrate, and the non-conductive substrate is one of a ceramic substrate and a high-temperature-resistant glass substrate. Specifically, the conductive substrate is an iron-chromium-aluminum alloy substrate, a stainless steel substrate, a nickel-chromium alloy substrate, a nickel metal substrate, a titanium metal substrate, and the like. The substrate 10 needs to have the characteristics of high temperature resistance, stable physical and chemical properties at high temperature, no harmful substance release at high temperature and the like, and the substrate 10 can be determined according to actual needs without limitation.
As an optional technical solution of the present application, the substrate 10 may also be a composite substrate, that is, a composite ceramic substrate formed by co-sintering a ceramic substrate and a metal substrate, and the composite ceramic substrate has the advantages of corrosion resistance, high temperature resistance, long service life, high efficiency, energy saving, uniform temperature, good heat conductivity, fast thermal compensation speed, and the like.
It should be noted that, when the base 10 is a conductive base, an insulating film needs to be prepared on the outer surface of the conductive base in the using process, so as to prevent the conductivity of the conductive base from affecting the use of the conductive heating film 20. Specifically, the insulating film may be an organic insulating film or an inorganic insulating film, wherein the inorganic insulating film is one of a silicon oxide insulating film, a silicon nitride insulating film, an aluminum oxide insulating film and an aluminum nitride insulating film, and the organic insulating film is one of a polyimide insulating film, a polyethylene insulating film, a polyvinylidene fluoride insulating film and a polytetrafluoroethylene insulating film. In some embodiments, the slurry containing the organic insulating material may be coated on the surface of the conductive substrate and then dried. Of course, the insulating film may be selected according to actual needs, and is not limited herein.
Fig. 3 is a front view of the entire structure of the heat-generating body 1 according to the embodiment of the present application, and as shown in fig. 3, the base 10 includes a main body portion 11 and two connection portions 12, and the main body portion 11 and the two connection portions 12 are integrally molded. The two connecting portions 12 are respectively used for connecting electrode leads, namely, the positive electrode and the negative electrode of the power supply, so that the conductive heating function of the heating body 1 is realized.
In order to form the conductive loop, the base body 10 is provided with a through groove 111 in the longitudinal direction, and two connection portions 12 are provided on both sides of the through groove 111 so that the base body 10 can form a loop in a power-on state. Wherein, insulating materials can be filled in the through groove 111.
The insertion end 112 is provided in the body portion 11, and the insertion end 112 is inserted into the aerosol-forming substrate of the aerosol-generating device so that the heat of the heating element 1 can cause the aerosol-forming substrate to form aerosol. In this embodiment, the insertion end 112 is an inverted V-shaped tip, which facilitates insertion of the heat-generating body 1 into the aerosol-forming substrate. The insertion end 112 may be further sharpened at its two side edges to facilitate insertion into the aerosol-forming substrate.
It should be noted that the insertion end 112 may have a structure other than an inverted V-shaped tip, for example, fig. 4 is a schematic view of an overall structure of another heating element provided in the embodiment of the present application, and as shown in fig. 4, the insertion end 112 may have a trapezoidal structure, and in addition, the insertion end 112 may have an arc structure. The insertion end 112 with different structures can be completely butted with the aerosol generating device, and is not limited herein and can be specifically selected according to actual needs.
In practical application, after the two connecting parts 12 are connected to the positive electrode and the negative electrode of the power supply, the heating element 1 generates heat, and the generated heat is transmitted to the aerosol generating device through the insertion end 112 of the main body part 11, so that aerosol simulating smoke is generated.
The base 10 used in the present application has an integrated sheet structure, that is, the main body 11 and the connecting portion 12 have a sheet structure with a uniform thickness, and specifically, the thickness of the base 10 is 0.2mm to 1.5mm. Alternatively, the thickness of the substrate 10 may be 0.2mm, 0.4mm, 0.6mm, 0.9mm, 1.3mm, 1.5mm, and the like, which is not limited herein. The thickness of the substrate 10 is too thick, which causes the product size to be too large and the cost of the preparation process to be increased; if the thickness of the substrate 10 is too thin, the strength is insufficient, and the substrate is likely to break during use.
In the present application, a conductive heat generating film 20 for supplying heat to the heat generating body 1 is loaded on the base body 10, the conductive heat generating film 20 is formed on at least a part of the surface of the base body 10, and the conductive heat generating film 20 extends from the main body portion 11 to the two connection portions 12.
Specifically, the conductive heating film 20 uniformly covers the surface of the base 10, and when the connection portion 12 is connected to the positive electrode and the negative electrode of the power supply, the conductive heating film 20 generates heat, and the heat is transferred to the aerosol generating device through the insertion end 112 of the main body portion 11.
When the base 10 is a conductive base, the conductive heat generating film 20 is formed on at least a part of the surface of the insulating film.
As an optional technical solution of the present application, the conductive heating film 20 may be formed on the entire surface of the base 10, so that the entire heating body 1 can uniformly heat, and local over-temperature is avoided. In other embodiments, the conductive heating film 20 may be formed only on the upper surface and the lower surface of the base 10, that is, the side surface of the base 10 is not provided with the conductive heating film 20, so that the cost can be reduced appropriately. Of course, the coverage area of the conductive heating film 20 can be specifically selected according to actual needs, and is not limited herein.
Specifically, electrically conductive heating film 20 adopts the resistance heating principle to produce heat, and electrically conductive heating film 20 that this application used is the membrane of high resistance temperature coefficient, along with electrically conductive heating film 20 circular telegram time's increase promptly, electrically conductive heating film 20's temperature constantly risees to electrically conductive heating film 20's resistance value also can the relative change, thereby can calculate the temperature of heating plate according to electrically conductive heating film 20's resistance temperature coefficient, realizes the realization of heating and temperature measurement function.
The temperature coefficient of resistance of the conductive heating film 20 used in the present application is greater than or equal to 1000 ppm/deg.C, and specifically may be 1000 ppm/deg.C, 2000 ppm/deg.C, 3000 ppm/deg.C, 4000 ppm/deg.C, 5000 ppm/deg.C, 6000 ppm/deg.C, etc., and is not limited herein. Alternatively, the conductive heat generating film 20 is one of a nickel film, a nickel alloy film, a platinum alloy film, a titanium alloy film, a silver film, and a silver alloy film. The conductive heating film 20 can be selected according to actual needs, and is not limited herein.
Specifically, the conductive heating film 20 may have a single-layer structure or a composite structure. For example, when the conductive heating film 20 has a single-layer structure, the conductive heating film 20 may be a nickel film or the like, and when the conductive heating film 20 has a composite structure, the conductive heating film 20 may be a nickel film and a silver film, a nickel film and a titanium alloy film, or the like, which are stacked.
The initial resistance value of the conductive heat emitting film 20 is 0.2 Ω to 1.6 Ω at room temperature of 25 ℃. Alternatively, the initial resistance of the conductive heating film 20 may be specifically 0.2 Ω, 0.4 Ω, 0.6 Ω, 0.8 Ω, 1 Ω, 1.2 Ω, 1.4 Ω, 1.6 Ω, and the like, which is not limited herein. The initial resistance of the conductive heating film 20 is too large, and a certain power can be tested only by a large voltage, so that the booster circuit is complex and the cost is high; the initial resistance of the conductive heating film 20 is too small, and the current is too large under a certain power, resulting in a large related loss. Preferably, the resistance of the conductive heating film 20 may be 0.6 Ω.
The thickness of the conductive heat generating film 20 is 0.5 μm to 20 μm, and optionally, the thickness of the conductive heat generating film 20 may be specifically 0.5 μm, 3 μm, 5 μm, 7 μm, 9 μm, 11 μm, 13 μm, 15 μm, 17 μm, 19 μm, 20 μm, and the like, which is not limited herein. The conductive heating film 20 has an excessively thick thickness, is high in cost and is likely to generate cracks, and the conductive heating film 20 has an excessively thin thickness, is likely to have uneven thickness and is likely to be blown during use.
In practical applications, the conductive heat generating film 20 may be formed on the base 10 by at least one of a physical vapor deposition process, an electroless plating process, or an electroplating process. Preferably, the conductive heat generating film 20 is formed on at least a portion of the surface of the base 10 using a physical vapor deposition process.
Further, at least one layer of protective film 30 is formed on the conductive heating film 20 on the surface of the base 10, the protective film 30 is used for protecting the conductive heating film 20, and the protective film 30 coated on the conductive heating film 20 has good insulating effect and heat resistance, so as to adapt to resistance heating of the conductive heating film 20 and ensure the service life of the heating element 1. In the present application, the protective film 30 may be a glass glaze layer.
The protective film 30 may cover only the conductive heat generating film 20 on the surface of the main body 11, or may cover the entire main body 11. However, the protective film 30 does not cover the conductive heating film 20 on the surface of the two connecting portions 12, and since the glass glaze layer is an insulator, it is difficult to form a loop when the connecting portions 12 are powered on, which affects the electrical connection between the conductive heating film 20 and the power supply electrode, so that the heating element 1 cannot normally operate.
In the present application, the thickness of the protective film 30 is 10 μm to 500 μm. Alternatively, the thickness of the protective film 30 may be 10 μm, 50 μm, 100 μm, 200 μm, 300 μm, 500 μm, or the like, which is not limited herein. The thickness of the protective film 30 is too high, the manufacturing cost is increased, and the thickness of the protective film 30 is too thin, which does not have a good protection effect on the conductive heating film 20, and affects the service life of the heating element 1. Alternatively, the thickness of the protective film 30 may be 200 μm.
In order to make those skilled in the art better understand the technical solutions of the present application, the present application will be described in further detail with reference to specific embodiments.
Example 1:
the substrate of the embodiment 1 is a stainless steel substrate, the conductive heating film is a Ni metallic ink film, the insulating film and the protective film are glass glaze layers, and the method comprises the following specific steps:
cleaning and drying a stainless steel substrate;
preparing a glass glaze layer on the surface of a stainless steel substrate as an insulating film;
conducting treatment is carried out on the whole matrix, then an electroplating process is adopted to prepare Ni metal into a conductive heating film, and the thickness of the conductive heating film is 20 microns;
and preparing a glass glaze layer as a protective film on the main body area of the substrate.
The obtained heating element had an initial resistance value of 0.2. Omega. At 25 ℃ and a temperature coefficient of resistance of 5800 ppm/DEG C.
And (3) testing:
the conductive layer is covered on the connecting part area, the external circuit supplies power through the conductive layer to enable the conductive heating film to heat, the circuit detects the resistance value at the same time, the temperature of the heating piece can be converted according to the resistance temperature coefficient, and the temperature control is realized by combining a software algorithm.
And (3) testing results:
the heating element prepared in the embodiment 1 has uniform integral temperature, and the temperature difference is less than 10 ℃.
Example 2:
the base member of this embodiment 2 chooses for use alumina ceramics, and the conductive heating film chooses for use the Pt metallic film, and the protection film adopts the glass glaze layer, and concrete step is as follows:
cleaning and drying the alumina ceramic matrix;
preparing a conductive heating film from Pt metal only on the front side and the back side of a substrate by adopting magnetron sputtering in PVD, wherein the thickness of the conductive heating film is 6 microns;
preparing a glass glaze layer as a protective film on the main body area of the substrate.
The obtained heating element had an initial resistance value of 1. Omega. At 25 ℃ and a temperature coefficient of resistance of 3700 ppm/DEG C.
And (3) testing:
the conductive layer is covered on the connecting part area, the external circuit supplies power through the conductive layer to enable the conductive heating film to heat, the circuit detects the resistance value at the same time, the temperature of the heating piece can be converted according to the resistance temperature coefficient, and the temperature control is realized by combining a software algorithm.
And (3) testing results:
FIG. 5 is a temperature-rise rate graph showing the average temperature on the surface of the heat-generating body provided in example 2 of the present application, and as shown in FIG. 5, the temperature-rise rate on the surface of the heat-generating body prepared in example 2 was uniform.
Example 3:
the base body of the embodiment 3 is made of silica glass, the conductive heating film is made of an Ag metal film, the protective film is made of a glass glaze layer, and the method comprises the following specific steps:
cleaning and drying the silica glass substrate;
preparing Ag metal into a conductive heating film by adopting chemical plating on the whole substrate, wherein the thickness of the conductive heating film is 0.5 micron;
preparing a glass glaze layer as a protective film on the main body area of the substrate.
The obtained heating element had an initial resistance value of 1.6. Omega. At 25 ℃ and a temperature coefficient of resistance of 3100 ppm/DEG C.
And (3) testing:
the conductive layer is covered on the connecting part area, the external circuit supplies power through the conductive layer to enable the conductive heating film to heat, the circuit detects the resistance value at the same time, the temperature of the heating piece can be converted according to the resistance temperature coefficient, and the temperature control is realized by combining a software algorithm.
And (3) testing results:
in the heating element prepared in the embodiment 3, when the power supply is 30W, the temperature of the heating element can be increased to 300 ℃ within 5 seconds, and the whole temperature of the heating element is uniform, and the temperature difference is less than 10 ℃.
Example 4:
the heating body of this embodiment 4 removes the closed angle of base member, and zirconia ceramic is chooseed for use to the base member, and electrically conductive heating film is the Ti metallic film, and the protection film adopts the glass glaze layer, and concrete step is as follows:
cleaning and drying the alumina ceramic matrix;
preparing Ti metal into a conductive heating film by adopting electron beam evaporation in PVD (physical vapor deposition), wherein the thickness of the conductive heating film is 15 microns;
preparing a glass glaze layer as a protective film on the main body area of the substrate.
The obtained heating element had an initial resistance value of 1.6. Omega. At 25 ℃ and a temperature coefficient of resistance of 4000 ppm/DEG C.
And (3) testing:
the conductive layer is covered on the connecting part area, the external circuit supplies power through the conductive layer to enable the conductive heating film to heat, the circuit detects the resistance value at the same time, the temperature of the heating piece can be converted according to the resistance temperature coefficient, and the temperature control is realized by combining a software algorithm.
And (3) testing results:
the heating element prepared by the embodiment 4 has uniform integral temperature, and the temperature difference is less than 10 ℃.
Example 5:
in this example 5, the heating element has a base with a sharp corner removed, the base is made of alumina ceramic, and the conductive heating film is made of Fe 79 Ni 21 The alloy film and the protective film adopt a glass glaze layer, and the method comprises the following specific steps:
cleaning and drying the alumina ceramic matrix;
the whole matrix is firstly subjected to conductive treatment and then is plated to prepare Fe 79 Ni 21 Preparing the alloy into a conductive heating film, wherein the thickness of the conductive heating film is 12 microns;
preparing a glass glaze layer as a protective film on the main body area of the substrate.
The obtained heating element had an initial resistance value of 0.6. Omega. At 25 ℃ and a temperature coefficient of resistance of 1000 ppm/DEG C.
And (3) testing:
the conductive layer is completely covered in the connecting part area, the external circuit supplies power through the conductive layer to enable the conductive heating film to heat, the circuit detects the resistance value at the same time, the temperature of the heating piece can be converted according to the resistance temperature coefficient, and the temperature control is realized by combining a software algorithm.
And (3) testing results:
the heating element prepared by the embodiment 10 has uniform integral temperature, and the temperature difference is less than 10 ℃.
Comparative example 1:
unlike example 2, comparative example 1 prepared a heat emitting trace on a zirconia ceramic substrate.
And (3) testing results:
FIG. 6 is a graph showing the temperature increase rate of the average surface temperature of the heat-generating body of example 2 of the present application compared with that of the heat-generating body of comparative example 1, and as shown in FIG. 6, the temperature increase rate of the heat-generating body prepared using the conductive heat-generating film was higher than that of the heat-generating body using the conductive heat-generating trace.
Claims (10)
1. A heat-generating body, characterized in that the heat-generating body comprises:
the electrode lead comprises a base body, a plurality of lead wires and a plurality of lead wires, wherein the base body comprises a main body part and two connecting parts; and
the conductive heating film is at least uniformly covered on the upper surface and/or the lower surface of the base body, and the thickness of the conductive heating film is 0.5-20 mu m.
2. A heat-generating body as described in claim 1, characterized in that the conductive heat-generating film is formed on the entire surface of the base body.
3. A heat-generating body as described in claim 1, further comprising a protective film which covers the conductive heat-generating film of the surface of the main body portion, and which does not cover the conductive heat-generating films of the surfaces of the two connection portions; the thickness of the protective film is 10 μm to 500 μm.
4. A heat-generating body as described in claim 1, wherein said base is a conductive base, said heat-generating body further comprising an insulating film formed on a surface of said conductive base, said conductive heat-generating film being formed on at least a part of a surface of said insulating film.
5. A heat-generating body as described in claim 1, wherein the conductive heat-generating film is one of a nickel film, a nickel alloy film, a platinum alloy film, a titanium alloy film, a silver film, and a silver alloy film.
6. A heat-generating body as described in claim 1, wherein the temperature coefficient of resistance of the conductive heat-generating film is not less than 1000ppm/° c.
7. A heat-generating body as described in claim 1, wherein said substrate is one of a metal substrate, a ceramic substrate and a high-temperature resistant glass substrate.
8. A heat-generating body as described in claim 7, wherein said base is provided with a through groove in the longitudinal direction, and said two connection portions are provided on both sides of said through groove.
9. A heat-generating body as described in claim 1, wherein the main body portion is integrally molded with the two connection portions, the main body portion having an insertion end for insertion into an aerosol-forming substrate of an aerosol-generating device.
10. An aerosol-generating device characterized by comprising the heat-generating body according to any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123344167.4U CN217771484U (en) | 2021-12-28 | 2021-12-28 | Heating element and aerosol generating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123344167.4U CN217771484U (en) | 2021-12-28 | 2021-12-28 | Heating element and aerosol generating device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217771484U true CN217771484U (en) | 2022-11-11 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202123344167.4U Active CN217771484U (en) | 2021-12-28 | 2021-12-28 | Heating element and aerosol generating device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217771484U (en) |
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2021
- 2021-12-28 CN CN202123344167.4U patent/CN217771484U/en active Active
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